MSP-EXP430FR5969

User's Guide SLAU535B – February 2014 – Revised July 2015 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) The MSP-EXP430FR5969 (or the "FR5969 LaunchPad") is an easy-to-use evaluation module (EVM) for the MSP430FR5969 microcontroller. It contains everything needed to start developing on the MSP430 FRAM platform, including on-board emulation for programming, debugging, and energy measurements. The board features buttons and LEDs for quick integration of a simple user interface as well as a super capacitor (super cap) that enables standalone applications without an external power supply. Figure 1. MSP-EXP430FR5969 MSP430, LaunchPad, BoosterPack, Code Composer Studio, EnergyTrace++, EnergyTrace are trademarks of Texas Instruments. IAR Embedded Workbench is a trademark of IAR Systems. Sharp is a registered trademark of Sharp Corporation. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 1 www.ti.com 1 2 3 4 5 6 Contents Getting Started ............................................................................................................... 3 Hardware...................................................................................................................... 5 Software Examples ........................................................................................................ 22 Additional Resources ...................................................................................................... 34 FAQs ......................................................................................................................... 36 Schematics .................................................................................................................. 37 1 MSP-EXP430FR5969 ....................................................................................................... 1 2 EVM Overview 3 Block Diagram ................................................................................................................ 6 4 MSP430FR5969 Pinout ..................................................................................................... 7 5 eZ-FET Emulator............................................................................................................. 9 6 Application Backchannel UART in Device Manager ................................................................... 10 7 EnergyTrace Technology Settings ....................................................................................... 11 8 Debug Properties ........................................................................................................... 12 9 Debug Session With EnergyTrace++ Windows ........................................................................ 13 10 eZ-FET Isolation Jumper Block Diagram................................................................................ 14 11 MSP430FR5969 LaunchPad Power Domain Block Diagram List of Figures 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 ............................................................................................................... ........................................................ Debugger Power Configuration – USB eZ-FET and JTAG ........................................................... External Power Configuration – External and BoosterPack .......................................................... Super Cap Power Configuration – Charging and Running Standalone ............................................. FR5969 LaunchPad to BoosterPack Connector Pinout ............................................................... Program .bat .................................................................................................. Directing the Project→Import Function to the Demo Project ......................................................... When CCS Has Found the Project ...................................................................................... Live Temperature Mode ................................................................................................... FRAM Log Mode ........................................................................................................... FRAM Unified Memory With Dynamic Partitioning..................................................................... MSP-EXP430FR5969 Software Examples in TI Resource Explorer ................................................ Schematic 1 of 5 ........................................................................................................... Schematic 2 of 5 ........................................................................................................... Schematic 3 of 5 ........................................................................................................... Schematic 4 of 5 ........................................................................................................... Schematic 5 of 5 ........................................................................................................... 5 16 17 18 20 21 23 24 25 26 27 33 35 37 38 39 40 41 List of Tables 2 1 EnergyTrace++ Debug Windows ......................................................................................... 12 2 EnergyTrace™ Technology Control Bar Icons ......................................................................... 13 3 Isolation Block Connections............................................................................................... 14 4 Hardware Change Log..................................................................................................... 22 5 Software Examples 6 IDE Minimum Requirements for MSP430FR5969 ..................................................................... 23 7 Source Files and Folders .................................................................................................. 26 8 Source Files and Folders .................................................................................................. 28 9 FRAM Endurance Calculation for 1KB Block of FRAM 10 How MSP430 Device Documentation is Organized ................................................................... 34 ........................................................................................................ ............................................................... MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) 22 30 SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Getting Started www.ti.com 1 Getting Started 1.1 Introduction MSP430™ ultra-low-power (ULP) MCUs with embedded Ferroelectric Random Access Memory (FRAM) technology now join the MCU LaunchPad™ Development Kit ecosystem. The MSP-EXP430FR5969 (or the "FR5969 LaunchPad") is an easy-to-use evaluation module (EVM) for the MSP430FR5969 microcontroller. It contains everything needed to start developing on the MSP430 FRAM platform, including on-board emulation for programming, debugging, and energy measurements. The board features buttons and LEDs for quick integration of a simple user interface as well as a super capacitor (super cap) that enables standalone applications without an external power supply. Rapid prototyping is simplified by the 20-pin BoosterPack™ plug-in module headers, which support a wide range of available BoosterPacks. You can quickly add features like wireless connectivity, graphical displays, environmental sensing, and much more. You can either design your own BoosterPack or choose among many already available from TI and third-party developers. The MSP430FR5969 device features 64KB of embedded FRAM, a nonvolatile memory known for its ultralow power, high endurance, and high-speed write access. The device supports CPU speeds up to 16 MHz and has integrated peripherals for communication, ADC, timers, AES encryption, and more – plenty to get you started in your development. Free software development tools are also available - TI's Eclipse-based Code Composer Studio™ IDE (CCS) and IAR Embedded Workbench™ IDE (IAR), and the community-driven Energia open-source code editor. More information about the LaunchPad including documentation and design files can be found on the tool page at www.ti.com/tool/msp-exp430fr5969. 1.2 Key Features • • • • • • 1.3 Kit Contents • • • 1.4 MSP430 ultra-low-power FRAM technology based MSP430FR5969 16-bit MCU 20-pin LaunchPad standard that leverages the BoosterPack ecosystem 0.1-F super capacitor for standalone power Onboard eZ-FET emulation with EnergyTrace++™ Technology Two buttons and two LEDs for user interaction Backchannel UART through USB to PC 1 x MSP-EXP430FR5969 1 x Micro USB cable 1 x Quick Start Guide First Steps – Out-of-Box Experience An easy way to get familiar with the EVM is by using its pre-programmed out-of-box demo code, which demonstrates some key features of the MSP-EXP430FR5969 LaunchPad. The out-of-box demo showcases MSP430FR5969's ultra-low power FRAM by utilizing the device's internal temperature sensor while running only off of the on-board Super Capacitor. First step is to connect the LaunchPad to the computer using the included Micro-USB cable. The RED and GREEN LEDs near the bottom of the LaunchPad toggle a few times to indicate the preprogrammed out-of-box demo is running. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 3 Getting Started www.ti.com Using the out-of-box demo GUI, included in the MSP-EXP430FR5969 Software Examples, the user can place the LaunchPad into two different modes: • Live Temperature Mode This mode provides live temperature data streaming to the PC GUI. The user is able to influence the temperature of the device and see the changes on the GUI. • FRAM Logging Mode This mode shows the FRAM data logging capabilities of the MSP430FR5969. After starting this mode, the LaunchPad will wake up every five seconds from sleep mode (indicated by LED blink) to log both temperature and input voltage values. After reconnecting to the GUI, these values can be uploaded and graphed in the GUI. A more detailed explanation of each mode can be found in Section 3. 1.5 Next Steps – Looking Into the Provided Code After the out-of-box demo, more features can be explored. The hardware features on the LaunchPad are shown in Section 2, and the provided code examples and how to use them are in Section 3. More details and documentation can be found at http://www.ti.com/tool/msp-exp430fr5969. Code is licensed under BSD and TI encourages reuse and modifications to fit your needs. 4 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Hardware www.ti.com 2 Hardware Figure 2 shows an overview of the LaunchPad hardware. Figure 2. EVM Overview SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 5 Hardware 2.1 www.ti.com Block Diagram Figure 3 shows the block diagram. Micro-B USB LED Red, Green ESD Protection Crystal 4 MHz Debug MCU 3.3-V LDO UART, SBW to Target Power to Target 14-pin JTAG header 100-mF SuperCap Power Selection Reset button Crystals HF (MHz) and 32.768 kHz Target Device MSP430FR5969 20-pin LaunchPad standard headers User Interface 2 buttons and 2 LEDs Figure 3. Block Diagram 2.2 MSP430FR5969 The MSP430FR5969 is the first device in TI's new ULP FRAM technology platform. FRAM is a cutting edge memory technology, combining the best features of flash and RAM into one nonvolatile memory. More information on FRAM can be found at www.ti.com/fram. Device features include: • 1.8-V to 3.6-V operation • Up to 16-MHz system clock and 8-MHz FRAM access • 64KB FRAM and 2KB SRAM • Ultra-low-power operation • Five timer blocks and up to three serial interfaces (SPI, UART, or I2C) • Analog: 16-channel 12-bit differential ADC and 16-channel comparator • Digital: AES256, CRC, DMA, and hardware MPY32 6 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Hardware DVCC P2.7 P2.3/TA0.0/UCA1STE/A6/C10 P2.4/TA1.0/UCA1CLK/A7/C11 AVSS PJ.6/HFXIN PJ.7/HFXOUT AVSS PJ.4/LFXIN PJ.5/LFXOUT AVSS AVCC www.ti.com 48 47 46 45 44 43 42 41 40 39 38 37 P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF- 1 36 DVSS P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+ 2 35 P4.6 P1.2/TA1.1/TA0CLK/COUT/A2/C2 3 34 P4.5 P3.0/A12/C12 4 33 P4.4/TB0.5 P3.1/A13/C13 5 32 P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0 P3.2/A14/C14 6 31 P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0 P3.3/A15/C15 7 30 P3.7/TB0.6 P4.7 8 29 P3.6/TB0.5 P1.3/TA1.2/UCB0STE/A3/C3 9 28 P3.5/TB0.4/COUT P1.4/TB0.1/UCA0STE/A4/C4 10 27 P3.4/TB0.3/SMCLK P1.5/TB0.2/UCA0CLK/A5/C5 11 26 P2.2/TB0.2/UCB0CLK P2.1/TB0.0/UCA0RXD/UCA0SOMI/TB0.0 P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK RST/NMI/SBWTDIO TEST/SBWTCK P2.6/TB0.1/UCA1RXD/UCA1SOMI P2.5/TB0.0/UCA1TXD/UCA1SIMO P4.3/A11 P4.1/A9 P4.2/A10 P4.0/A8 PJ.3/TCK/SRCPUOFF/C9 PJ.2/TMS/ACLK/SROSCOFF/C8 12 25 13 14 15 16 17 18 19 20 21 22 23 24 PJ.1/TDI/TCLK/MCLK/SRSCG0/C7 PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6 Figure 4. MSP430FR5969 Pinout To compare the various MSP430 derivatives, download the MSP430 Product Brochure (SLAB034), which is also available from http://www.ti.com/msp430. The brochure has a table that lets you see, at a glance, how the families compare, and their pricing. This document is frequently updated, as new MSP430 derivatives become available. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 7 Hardware 2.2.1 www.ti.com Measure MSP430 Current Draw A specific jumper J9 is placed on the LaunchPad to allow for measuring current draw of the MSP430FR5969 device. The current measured includes the FR5969, and any current drawn through the BoosterPack headers and jumper J1. To measure ultra-low power, follow these steps: 1. Remove the J9 jumper; attach an ammeter across this jumper. 2. Consider the effect that the backchannel UART and any circuitry attached to the FR5969 may have on current draw. Maybe these should be disconnected at the isolation jumper block, or their current sinking and sourcing capability at least considered in the final measurement. 3. Make sure there are no floating input I/Os. These cause unnecessary extra current draw. Every I/O should either be driven out or, if an input, should be pulled or driven to a high or low level. 4. Begin target FR5969 execution. 5. Measure the current. (Keep in mind that if the current levels are fluctuating, it may be difficult to get a stable measurement. It is easier to measure quiescent states.) 2.2.2 Clocking The FR5969 LaunchPad provides external clocks in addition to the internal clocks in the device. • Y4: a 32-kHz crystal • Y1: an unpopulated region that supports HF crystal or resonator (4 to 24 MHz) The 32-kHz crystal allows for lower LPM3 sleep currents than do the other low-frequency clock sources. Therefore, the presence of the crystal allows the full range of low-power modes to be used. For more information about internal clocks and how to use the 32-kHz or HF crystal, see the MSP430FR59xx family user's guide. 8 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Hardware www.ti.com 2.3 eZ-FET Onboard Emulator With EnergyTrace™ Technology To keep development easy and cost effective, TI's LaunchPad development tools integrate an onboard emulator, eliminating the need for expensive programmers. The FR5969 LaunchPad has the new eZ-FET emulator (see Figure 5), a simple and low-cost debugger that supports almost all MSP430 device derivatives. Figure 5. eZ-FET Emulator The eZ-FET provides many features that make debugging an easy experience. Included is a "backchannel" UART-over-USB connection with the host, EnergyTrace Technology, and a distinct isolation from the target side microcontroller. The eZ-FET hardware can be found in the schematics in Section 6 and in the accompanying hardware design files. The eZ-FET software and more information about the debugger can be found at the eZ-FET lite wiki. 2.3.1 Emulator/Debugger The eZ-FET is an on-board emulation solution for MSP430 microcontrollers. It allows direct interfacing to a PC for easy programming, debugging, and evaluation. The eZ-FET uses Spy-Bi-Wire (SBW) two-wire protocol to interface with the MSP430 devices. These pins are the SBW RST and SBW TST pins located on the emulator isolation block. More details on the isolation block can be found in Section 2.3.4. The eZ-FET on-board emulation is supported by the MSP430 DLL and can be used with IAR Embedded Workbench for MSP430 Integrated Development Environment (IDE) or Code Composer Studio (CCS) IDE to write, download, and debug applications. The debugger is unobtrusive and allows the user to run an application at full speed with hardware breakpoints and single stepping available while consuming no extra hardware resources. The firmware for the eZ-FET is field undatable, so any updates can be received as needed. More information on SBW can be found in the MSP430 Hardware Tools User's Guide (SLAU278), and information on the MSP430 DLL can be found at www.ti.com/mspds. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 9 Hardware 2.3.2 www.ti.com Application (or "Backchannel") UART The backchannel UART allows communication with the USB host that isn't part of the target application's main functionality. This is very useful during development, and also provides a communication channel to the PC host side. This can be used to create GUIs and other programs on the PC that communicate with the FR5969 LaunchPad. The pathway of the backchannel UART is shown in Figure 10. The backchannel UART (USCI_A0) is independent of the UART on the 20-pin BoosterPack connector (USCI_A1). On the host side, a virtual COM port for the application backchannel UART is generated when the LaunchPad enumerates on the host. You can use any PC application that interfaces with COM ports, including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the target application. You need to identify the COM port for the backchannel. On Windows PCs, Device Manager can assist (see Figure 6). Figure 6. Application Backchannel UART in Device Manager The backchannel UART is the "MSP Application UART1" port. In this case, Figure 6 shows COM13, but this varies from one host PC to the next. After you identify the correct COM port, configure it in your host application, according to its documentation. You can then open the port and begin talking to it from the host. On the target FR5969 side, the backchannel is connected to the USCI_A0 module. The eZ-FET has a configurable baud rate, therefore, it is important that the PC application configures the baud rate to be the same as the rate configured on the USCI_A0. The eZ-FET also supports hardware flow control, if desired. Hardware flow control (CTS/RTS handshaking) allows the target FR5969 and the emulator to tell each other to wait before sending more data. At low baud rates and with simple target applications, flow control may not be necessary. Applications with faster baud rates and more interrupts to service have a higher likelihood that they cannot read the USCI_A0's RXBUF register in time, before the next byte arrives. If this happens, the USCI_A0's UCA0STATW register will report an overrun error. 10 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Hardware www.ti.com 2.3.3 EnergyTrace™ Technology EnergyTrace™ Technology is an energy-based code analysis tool set that is useful for measuring and viewing the application’s energy profile and optimizing it for ultra-low power consumption. The MSP430FR5969 device supports EnergyTrace++ (EnergyTrace + [CPU State] + [Peripheral States]) for full access to the application energy profile as well as CPU and peripheral states. By default, EnergyTrace technology is disabled in CCS. To enable EnergyTrace, click Window → Preferences → Code Composer Studio → Advanced Tools → EnergyTrace™ Technology. Select the "Enable" checkbox and the EnergyTrace++ setting for full functionality (see Figure 7). Figure 7. EnergyTrace Technology Settings SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 11 Hardware www.ti.com To fully enable the EnergyTrace++ setting, the ultra-low-power debug mode must be enabled. Right click on the active project in the project explorer and click Properties. In the Debug section, enable "Ultra Low Power debug/ Debug LPMx.5" option in the Low Power Mode Settings (see Figure 8). If this option is not enabled, the EnergyTrace++ mode cannot capture data from the device. Figure 8. Debug Properties After the correct settings are chosen, the EnergyTrace window automatically opens when debug is started. The EnergyTrace++ window has four separate tabs: Profile, States, Power, and Energy. Table 1. EnergyTrace++ Debug Windows 12 EnergyTrace++ Debug Window Description Profile Displays a compressed view of captured data and allows comparison with previous data States Real-time trace of the target microcontroller's internal states captured. Includes power modes and peripheral on/off states. Power Dynamic power consumption of the target over time. A previous trace profile for comparison is yellow in color. Energy Accumulated energy of the target over time. A previous trace profile for comparison is yellow in color. MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Hardware www.ti.com These tabs allow you to see exactly what is happening in your application, and find power black holes. An example application with the EnergyTrace++ windows is shown in Figure 9. Figure 9. Debug Session With EnergyTrace++ Windows After the EnergyTrace window is active, it can be controlled with the buttons in Table 2. Table 2. EnergyTrace™ Technology Control Bar Icons Enable or disable EnergyTrace Technology. When disabled, icon turns gray. Set capture period: 5 sec, 10 sec, 30 sec, 1 min, or 5 min. Data collection stops after time has elapsed. However, the program continues to execute until the Pause button in the debug control window is clicked. Save profile to project directory. When saving an EnergyTrace++ profile, the default filename will start with "MSP430_D" followed by a timestamp. When saving an EnergyTrace profile, the default filename will start with "MSP430" followed by a timestamp. Load previously saved profile for comparison. Restore graphs or open Preferences window. Switch between EnergyTrace++ mode and EnergyTrace mode An example application using the MSP-EXP430FR5969 with EnergyTrace++ Technology is provided in the application note: MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology (SLAA603). For more details on EnergyTrace, refer to the Code Composer Studio v6.0 for MSP430 User's Guide (SLAU157). SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 13 Hardware 2.3.4 www.ti.com Emulator Connection – Isolation Jumper Block The isolation jumper block at Jumper J13 allows the user to connect/disconnect signals that cross from the eZ-FET domain into the FR5969 target domain. This includes eZ-FET Spy-Bi-Wire signals, application UART signals, and 3V3 and 5V power (see Table 3). Reasons to open these connections: • To remove any and all influence from the eZ-FET emulator for high accuracy target power measurements • To control 3-V and 5-V power flow between eZ-FET and target domains • To expose the target MCU pins for other use than onboard debugging and application UART communication • To expose programming and UART interface of the eZ-FET so it can be used for devices other than the onboard MCU. Table 3. Isolation Block Connections Jumper GND V+ Description Ground 3.3-V rail, derived from VBUS by an LDO in the eZ-FET domain RTS >> Backchannel UART: Ready-To-Send, for hardware flow control. The target can use this to indicate whether 'it is ready to receive data from the host PC. The arrows indicate the direction of the signal. CTS Backchannel UART: the target FR5969 sends data through this signal. The arrows indicate the direction of the signal. RST Spy-Bi-Wire emulation: SBWTDIO data signal. This pin also functions as the RST signal (active low) TST Spy-Bi-Wire emulation: SBWTCK clock signal. This pin also functions as the TST signal USB Connector eZ-FET USB in out LDO eZ-FET Emulator MCU Target MSP430FR5969 MCU BoosterPack Header Spy-Bi-Wire (SBW) Emulation Application UART USCI A0 3.3V Power 5V Power BoosterPack Header MSP430FR5969 Target Isolation Jumper Block Figure 10. eZ-FET Isolation Jumper Block Diagram 14 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Hardware www.ti.com 2.3.5 14-Pin JTAG Connector This EVM contains a footprint for TI's standard 14-pin MSP430 JTAG header. This connector can be used as needed. For debug purposes, this connector offers 4-wire JTAG compared to the 2-wire Spy-Bi-Wire from the eZ-FET. In certain use cases this can be advantageous. The MSP-FET or another MSP430 external debug tool such as MSP-FET430UIF or third-party tool can be used. This JTAG connector can be used to power the system directly or can be used with external power. The MSP-FET tool supports EnergyTrace™ technology and can perform the same measurements as the eZ-FET onboard emulator. See Section 2.4 for more details on the JTAG system power requirements. 2.3.6 Using the eZ-FET Emulator With a Different Target The eZ-FET emulator on the FR5969 LaunchPad can interface to most MSP430 derivative devices, not just the on-board FR5969 target device. To do this, disconnect every jumper in the isolation jumper block. This is necessary because the emulator cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection. Next, make sure the target board has proper connections for Spy-Bi-Wire. Note that to be compatible with SBW, the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430 JTAG interface circuitry is the MSP430 Hardware Tools User's Guide (SLAU278). Finally, wire together these signals from the emulator's side of the isolation jumper block to the target hardware: • 3.3 V (V+) • GND • SBWTDIO • SBWTCK • TXD (if the UART backchannel is to be used) • RXD (if the UART backchannel is to be used) • CTS (if hardware flow control is to be used) • RTS (if hardware flow control is to be used) This wiring can be done either with jumper wires or by designing the board with a connector that plugs into the isolation jumper block. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 15 Hardware 2.4 www.ti.com Power The board is designed to support five different power scenarios. The board can be powered by the eZFET or JTAG debugger, external power, BoosterPack power, or standalone super cap power. Legend eZ-FET J3 J13 V+ Debug Power Domain JTAG Use J2 J11 Super Cap J9 Super Cap Power Domain Target and BoosterPack Power Domain J4 External Charge Bypass Debugger VCC J12 GND GND External Measure Current External Power Domain J10 J5 Target MSP430FR5969 Device MSP430FR5969 target and BoosterPack GND J1 GND VCC Figure 11. MSP430FR5969 LaunchPad Power Domain Block Diagram 16 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Hardware www.ti.com 2.4.1 eZ-FET USB Power The most common scenario is power from USB through the eZ-FET debugger. This provides 5-V power from USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the target side of the LaunchPad. Power from the eZ-FET is controlled by jumper J13. For 3.3 V, ensure that a jumper is connected across the J13 "V+" terminal. The eZ-FET is a debugger, so J10 must be set to debugger for power to reach the target MSP430FR5969 device. For the power configuration diagram, see Figure 12. 2.4.2 14-Pin JTAG When powering directly from the JTAG connector through the MSP-FET430UIF or other MSP430 debugger tool, ensure that jumper J10 is set to "Debugger." JTAG debugging can also be used with an external power source, when J10 is set to "External," and some external power source is connected through J12. In this case the JTAG debugger will sense the external power and debug the system without providing its own power. For power configuration diagram, see Figure 12. USB (eZ-FET) Power Configuration JTAG Power Configuration eZ-FET J3 Use J2 J11 Debugger JTAG External Bypass Use J2 VCC J12 J10 J11 GND Charge Bypass Charge J10 J13 V+ J13 V+ J3 Debugger External VCC J12 GND GND J9 J5 J4 Target MSP430FR5969 Device MSP430FR5969 target and BoosterPack Measure Current J9 J4 Measure Current GND J5 Target MSP430FR5969 Device GND J1 GND VCC MSP430FR5969 target and BoosterPack GND J1 GND VCC Figure 12. Debugger Power Configuration – USB eZ-FET and JTAG SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 17 Hardware 2.4.3 www.ti.com External Power Supply An extra header J12 is present on the board to supply external power. When supplying external power, jumper J10 must be set to "External." It is important to understand the device voltage operation specifications when supplying external power. The MSP430FR5969 has an operating range of 1.8 V to 3.6 V. More information can be found in the device data sheet. For power configuration diagram, see Figure 13. 2.4.4 BoosterPack In some use cases it might be required to power the board from a BoosterPack. When powered from a BoosterPack, the BoosterPack voltage should be across J4 Pin 1 (Vcc) and J5 Pin 20 (GND). This complies with the BoosterPack pinout shown in Section 2.5. These pins are connected directly to the FR5969 target device, and do not require any specific jumper configuration. Header J1 also provides power directly to the target device. Because J1 and the BoosterPack headers are connected directly to the target device Vcc, there are two primary consequences: • The super cap cannot charge through J11. Use of the super cap with this power scenario is not recommended. • Current of the target device through J9 cannot be measured. It is best to remove J9 in this scenario to prevent back-powering of any additional circuitry such as the eZ-FET. For power configuration diagram, see Figure 13. J13 J3 Bypass Use J2 J11 Charge J10 J13 Debugger J10 External Bypass J2 VCC J12 Use J11 GND Charge V+ J3 BoosterPack Power Configuration V+ External Power Source Configuration Debugger External VCC J12 GND GND GND J9 J5 J4 VCC Measure Current J9 J4 Measure Current External Target MSP430FR5969 Device MSP430FR5969 target and BoosterPack J5 GND Target MSP430FR5969 Device GND J1 GND VCC MSP430FR5969 target and BoosterPack GND J1 GND VCC Figure 13. External Power Configuration – External and BoosterPack 18 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Hardware www.ti.com 2.4.5 Super Cap A 100-mF (0.1-F) super cap is mounted onboard and allows powering the system without any external power. This highlights the ultra-low power of the MSP430FR5969 target device. See how long you can run your application on the super cap alone! 2.4.5.1 Charging the Super Cap To charge the super cap, jumper J11 is used. By default there is no jumper across J11. Place a jumper across J11 to charge the super cap. If another jumper is not handy, the GND jumper on the isolation jumper block can be used- as this jumper doesn't actually disconnect the GND connection. To charge the super cap, power must be coming from a debugger (eZ-FET or JTAG) or external power through J10. External power through J1 or a BoosterPack will not charge the super cap through J11. Placing a jumper across J11 will charge the super cap when there is 3.3-V Vcc present, regardless of the state of the Bypass/Use J2 jumper, however if J2 is in the "Bypass" state, changing it over to the "Use" state will remove power from the target MSP430FR5969 and it will be reset. 2.4.5.2 Using the Super Cap To use the super cap to power the LaunchPad, first change the J2 jumper to select "Use" and then set a jumper on J11 to charge the super cap. After waiting for it to charge, any external power can be removed from the system, and it will be powered completely by the super cap. To remove any additional power drain from the super cap, remove any jumper to disconnect power to any external source. This can be J11, J10, or J13 depending on the power configuration. This prevents the super cap from back-powering the debug circuitry or any external power circuitry connected. The most effective method for charging the capacitor is outlined in the following steps. These steps assume the LaunchPad is powered by USB cable through the eZ-FET debugger. 1. Set "Power Selector" jumper (J10) to "Debugger" position. 2. Set jumper J2 to "Use" super cap position. 3. Set jumper J11 to "Charge" super cap position. 4. Set "V+" jumper J13. 5. Connect board to PC with USB cable. 6. Allow two to three minutes for the super cap to charge (time may vary depending on initial charge of the super cap) to full VCC. 7. Remove the "V+" jumper J13. For power configuration diagram, see Figure 14. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 19 Hardware www.ti.com Super Cap Charging Configuration Super Cap Running Standalone Configuration eZ-FET J2 J11 J9 J4 External Bypass Use J2 VCC J12 J11 GND Super Cap GND External J9 J5 J4 Debugger External VCC J12 GND GND J5 Target MSP430FR5969 Device Target MSP430FR5969 Device MSP430FR5969 target and BoosterPack V+ J10 Debugger Measure Current Super Cap J13 Charge Use Charge J10 J3 Measure Current JTAG Bypass *Power from Debugger or External J13 V+ J3 GND J1 GND VCC MSP430FR5969 target and BoosterPack GND J1 GND VCC Figure 14. Super Cap Power Configuration – Charging and Running Standalone 2.4.5.3 Disabling the Super Cap To disable the super cap, change J2 to "Bypass," and remove jumper J11 to prevent additional current for charging the super cap. With these two jumper selections, the super cap is completely disconnected from the system. 2.5 BoosterPack Plug-in Module Headers The BoosterPack headers allow for a variety of applications to be created by plugging BoosterPacks onto the LaunchPad. BoosterPacks cover a wide range of possible applications including wireless connectivity, environmental sensing, and LCD displays. Leverage the growing BoosterPack ecosystem to rapidly prototype nearly any application with the LaunchPad rapid prototyping platform. Available BoosterPacks can be found at www.ti.com/boosterpacks. The FR5969 LaunchPad adheres to the 20-pin LaunchPad pinout standard. A standard was created to aid compatibility between LaunchPad and BoosterPack tools across the TI ecosystem. The 20-pin standard is compatible with the 40-pin standard used by other LaunchPads like the MSPEXP430F5529LP. This allows some subset of functionality of 40-pin BoosterPacks to be used with 20-pin LaunchPads. 20 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Hardware www.ti.com While most BoosterPacks are compliant with the standard, some are not. The FR5969 LaunchPad is compatible with all 20-pin BoosterPacks that are compliant with the standard. If the reseller or owner of the BoosterPack does not explicitly indicate compatibility with the FR5969 LaunchPad, you should compare the schematic of the candidate BoosterPack with the LaunchPad to ensure compatibility. Keep in mind that sometimes conflicts can be resolved by changing the FR5969 device pin function configuration in software. More information about compatibility can be found at http://www.ti.com/launchpad. Figure 15 shows the 20-pin pinout of the FR5969 LaunchPad. Note that software's configuration of the pin functions plays a role in compatibility. The FR5969 LaunchPad side of the dashed line shows all of the functions for which the FR5969 device's pins can be configured. This can also be seen in the MSP430FR5969 data sheet. The BoosterPack side of the dashed line shows the standard. The FR5969 function whose color matches the BoosterPack function shows the specific software-configurable function by which the FR5969 LaunchPad adheres to the standard. Below are the pins exposed at the BoosterPack connector Also shown are functions that map with the BoosterPack standard. * Note that to comply with the I2C channels of the BoosterPack standard, a software-emulated I2C must be used. ** Some LaunchPads do not 100% comply with the standard. Please check your LaunchPad to ensure compatability. (!) Denotes I/O pins that are interrupt-capable. BoosterPack Standard MSP-EXP430FR5969 Pin Map +3.3V Analog In RX UART TX GPIO (!) Analog In SPI CLK GPIO (!) SCL I2C* SDA UCA1SOMI UCA1RXD UCA1SIMO UCA1TXD C11 A7 UCA1CLK UCB0CLK SMCLK COUT A1h TB0.1 TB0.0 A11 TA1.0 TB0.2 TB0.3 TB0.4 TB0.5 (!) (!) (!) (!) (!) (!) (!) (!) (!) +3.3V P4.2 P2.6 P2.5 P4.3 P2.4 P2.2 P3.4 P3.5 P3.6 MSP-EXP430FR5969 Pin Map GND P1.2 P3.h NC RST P1.6 P1.7 P1.5 P1.4 P1.3 (!) TA1.1 (!) A12 (!) (!) (!) (!) (!) TA0CLK C12 COUT A2 BoosterPack Standard C2 TB0.3 UCB0SIMO UCB0SDA TA0.1 TB0.4 UCB0SOMI UCB0SCL TA1.0 A5 C5 TB0.2 UCA0CLK A4 C4 TB0.1 UCA0STE A3 C3 TA1.2 UCB0STE PWM Out SPI CS Wireless SPI CS Display SPI CS Other GND GPIO (!) GPIO (!) GPIO** RST MOSI SPI MISO GPIO (!) GPIO (!) GPIO (!) Figure 15. FR5969 LaunchPad to BoosterPack Connector Pinout 2.6 Design Files A complete schematic is available in Section 6. All hardware design files including schematics, layout, bill of materials (BOM), and Gerber files are available in the MSP-EXP430FR5969 Hardware Design Files. The software examples are made available in the MSP-EXP430FR5969 Software Examples. For more information on the software examples, see Section 3. The MSP-EXP430FR5969 LaunchPad was designed in Mentor Graphics PADS schematic and layout. A free viewer is available to see both the schematic and layout files on the Mentor Graphics website at http://www.mentor.com/pcb/downloads/pads-pcb-viewer. A full time-limited version of PADS is available online for free. This version has complete functionality until the 30 day license expires. This version can be downloaded directly from http://www.mentor.com/pcb/product-eval/pads-download-evaluation. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 21 Hardware 2.7 www.ti.com Hardware Change log Table 4 shows the hardware revision history. Table 4. Hardware Change Log PCB Revision 3 Description Rev 1.6 Initial Release Rev 2.0 Added EnergyTrace functionality, extended PCB dimensions, added mounting holes, updated isolation block order, added 5V BP pin, updated silkscreen Software Examples There are three software examples included with the FR5969 LaunchPad, which can be found in the MSP-EXP430FR5969 Software Examples. Table 5 describes these examples. Table 5. Software Examples Demo Name BoosterPack Required OutOfBox_FR5969 3.1 Description More Details The out-of-box demo pre-programmed on the LaunchPad from the factory. Its function was described in Section 1.4. Demonstrates features of MSP430FR5969 ULP FRAM device. Section 3.3 430BOOSTSHARP96_ULP_FRAM 430BOOST-SHARP96 Demonstrates features of MSP430FR5969 ULP FRAM device with various application modes. Section 3.4 430BOOSTSHARP96_GrlibDisplay 430BOOST-SHARP96 A very simple example showing how to use MSP430 Graphics Library (grlib) to display graphics primitives and images. Section 3.5 MSP430 Software: Driver Library, Graphics Library, and Capacitive Touch Library The examples are built upon three MSP430 libraries available from TI shown below. All three libraries are available as part of MSP430Ware. Downloading CCS will include MSP430Ware along with TI Resource Explorer. • Driver library (driverlib): a foundational MSP430 software library, useful for interfacing with all MSP430 core functions and peripherals, especially clocks and power. • Graphics library (grlib): a library for interfacing MSP430 devices to dot-matrix LCD displays. Contains primitives for simple drawing as well as images and more. • Capacitive Touch Library: a library for capacitive touch sensing applications. This library supports the use of buttons, sliders, wheels and more. Highly configurable for each application. When you begin your own development, you will need more information about these libraries than can be included in this User's Guide. All the information you need is in MSP430Ware or specific library documentation linked above. 22 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Software Examples www.ti.com 3.2 Development Environment Requirements To use any of the below software examples with the MSP430FR5969 LaunchPad, you must have an integrated development environment (IDE) that supports the MSP430FR5969 device. Table 6. IDE Minimum Requirements for MSP430FR5969 Code Composer Studio™ IDE IAR Embedded Workbench™ IDE CCS v5.5 or later IAR EW430 v5.60 or later For more details on where to download the latest IDE, see Section 4.3. 3.2.1 Pre-Compiled Binary The /Binary/ folder inside the MSP-EXP430FR5969 Software Examples includes pre-compiled TI-TXT binary files for each of the above projects that are ready to be flashed onto the LaunchPad. A copy of the MSP430Flasher tool is also shipped to interface with the eZ-FET Emulator. To quickly program a demo onto the LaunchPad, simply navigate into the corresponding demo project's directory and double click the "Program .bat" file. Figure 16. Program .bat If desired, the "Program .bat" file can be modified to point to your own project's binary file. NOTE: After importing and compiling the software source code in an IDE such as CCS or IAR, the TI-TXT binary files located in the /Binary/ folder will not be updated automatically. You must copy your newly compiled binary from your IDE's /Workspace/Project/ directory and replace the ".txt" in /Binary/ for the batch file to program your own binary file. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 23 Software Examples 3.2.2 www.ti.com CCS CCS v5.5 or higher is required. When CCS has been launched, and a workspace directory chosen, use Project→Import Existing CCS Eclipse Project. Direct it to the desired demo's project directory containing main.c. This is one of the OutOfBox_FR5969, 430BOOST-SHARP96_ULP_FRAM, or 430BOOSTSHARP96_GrlibDisplay projects (see Figure 17). Figure 17. Directing the Project→Import Function to the Demo Project Selecting the \CCS or \CCS_Code_Size_Limited folder also works. The CCS-specific files are located there. When you click "OK", CCS should recognize the project and allow you to import it. The indication that CCS has found it is that the project appears in the box shown in Figure 18, and it has a checkmark to the left of it. 24 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Software Examples www.ti.com Figure 18. When CCS Has Found the Project Sometimes CCS finds it but does not have a checkmark; this might mean that a project by that name is already in the workspace. Rename or delete that project to resolve this conflict. (Even if you don't see it in the CCS workspace, be sure to check the workspace's directory on the file system.) 3.2.3 IAR IAR Embedded Workbench™ IDE v5.60 or higher is required. To open the demo in IAR, simply choose File→Open→Workspace…, and direct it to the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is contained within this file. The subdirectory also has an *.ewp project file; this file can be opened into an existing workspace, using Project→Add-Existing-Project…. Although the software examples have all the code required to run them, IAR users may wish to download and install MSP430Ware, which contains driverlib, grlib, capacitive touch library, and the TI Resource Explorer. These are already included in a CCS installation (unless the user selected otherwise). 3.3 Out-of-Box Software Example This section describes the functionality and structure of the out-of-box software that is preloaded on the EVM. The full out-of-box demo cannot be built with the free version of CCS or IAR (IAR Kickstart) due to the code size limit. To bypass this limitation, a code-size-limited CCS version is provided, that has most functionality integrated into a library. The code that is built into the library is able to be viewed by the user, but it cannot be edited. For full functionality download the full version of either CCS or IAR. There are two modes in the out-of-box software, which can only be interacted with using the provided GUI in the MSP-EXP430FR5969 Software Examples. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 25 Software Examples 3.3.1 www.ti.com Source File Structure The project is organized in multiple files. This makes it easier to navigate and reuse parts of it for other projects. Table 7 describes each file in the project. Table 7. Source Files and Folders 3.3.2 Name Description main.c The out-of-box demo main function, initializations, shared ISR's, etc LiveTempMode.c Main function file for live temperature streaming mode FRAMLogMode.c Main function file for FRAM data logging mode Library: Driverlib Device driver library (MSP430DRIVERLIB) Power Up and Idle When the out-of-box demo powers up, the red and green LEDs toggle several times. The MSP430FR5969 then enters low-power mode 3 to wait for UART commands from the PC GUI. The GUI that is included in the MSP-EXP430FR5969 Software Examples download is required to connect to the serial port that the LaunchPad's UART communication uses. Follow the "Setup" instructions in the GUI to establish the connection. After connection has been established, the GUI pings the LaunchPad every few seconds to make sure that it is still present. If no response is received from the LaunchPad, the GUI automatically closes the serial port connection. 3.3.3 Live Temperature Mode To enter the live temperature mode, click the "Start" button below "Live Temp Mode" in the GUI's Application Controls panel (see Figure 19). Figure 19. Live Temperature Mode 26 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Software Examples www.ti.com The MSP430FR5969 first sends two calibration constants for the temperature sensor to the PC GUI. It then sets up its 12-bit ADC for sampling and converting the signals from its internal temperature sensor. A hardware timer is also configured to trigger the ADC conversion every 0.125 seconds before the device enters low-power mode 3 to conserve power. As soon as the ADC sample and conversion is complete, the raw ADC data is sent the through the UART backchannel to the PC GUI. As the raw ADC data is received by the PC GUI, Celsius and Fahrenheit units are calculated first. The PC GUI keeps a buffer of the most recent 100 temperature measurements, which are graphed against the PC's current time on the Incoming Data panel. A red horizontal line is drawn across the data plot to indicate the moving average of the incoming data. To exit this mode, click the "Stop" button under "Live Temp Mode". You must exit this mode before starting the FRAM Log Mode. 3.3.4 FRAM Log Mode To enter the FRAM Log Mode, click the "Start" button under "FRAM Log Mode" in the GUI's Application Controls panel. The PC GUI immediately sends the current system timestamp to be stored in the LaunchPad. This timestamp is later used to extrapolate the X-axis time values when the FRAM logged data are transferred to the GUI (see Figure 20). Figure 20. FRAM Log Mode When the MSP430FR5969 receives the UART command from the GUI, it starts the entry sequence by initializing the Real-Time Clock to trigger an interrupt every 5 seconds. The red LED blinks three times to indicate successful entry into FRAM Log Mode. Unlike in the Live Temperature Mode, the MSP430FR5969 enters low-power mode 3.5 to further decrease power consumption and wakes up every 5 seconds to perform data logging. Because the UART communication module does not retain power in LPM3.5, the GUI automatically disconnects from the LaunchPad after entry into FRAM Log Mode. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 27 Software Examples www.ti.com Each time the device wakes up, the green LED lights up to indicate its state to the user. The 12-bit ADC is set up to sample and convert the signals from its internal temperature sensor and battery monitor (Super Cap voltage). A section of the device's FRAM is allocated to store the raw ADC output data (address 0x9000 to 0xEFFF). This allows the demo to store up to 6144 temperature and voltage data points (5 seconds/sample is approximately 8.5 hours of data). The FRAM Log Mode also provides the option to log temperature data while powered either through the USB cable or only by the on-board Super Cap. The PC GUI contains step-by-step instructions in its side panel for configuring the jumpers on the LaunchPad to power the device with the Super Cap. See Section 2.4.5 for more detail on the Super Cap. To exit the FRAM Log Mode, press the S2 (right) push button on the LaunchPad. The red LED turns on briefly to indicate successful exit. The LaunchPad returns to the Power up and Idle state, and you can reconnect the LaunchPad with the GUI to transfer the logged data from FRAM to the PC. Click the "Transfer FRAM Data" button in the GUI to begin transfer. A progress bar shows progress until the transfer completes, and the temperature and voltage data are plotted in the Incoming Data panel. 3.4 430BOOST-SHARP96 ULP FRAM Demo This section describes the functionality and structure of the 430BOOST-SHARP96 ULP FRAM demo that is included in the MSP-EXP430FR5969 Software Examples. NOTE: The 430BOOST-SHARP96 ULP FRAM demo relies on the 430BOOST-SHARP96 BoosterPack and has a very limited use without it. The full demo source code cannot be built with the free version of CCS or IAR (IAR KickStart) because of the code size limit. To bypass this limitation, a code-size-limited CCS version is provided that has most functionality integrated into a library. The code that is built into the library can be viewed by the user, but it cannot be edited. For full functionality, download the full version of either CCS or IAR. There are five applications in the demo software. All of them are in one project and the different applications can be cycled through in the user interface. 3.4.1 Source File Structure The project is split into multiple files. This makes it easier to navigate and reuse parts of it for other projects. Table 8. Source Files and Folders Name 28 Description Main.c The user experience demo main function, shared ISRs, and other functions ActivePowerMeasure.c Main function file for Active Mode Power app ClockApp.c Main function file for Clock app FR59xx_EXP.c File for handling system init, main menu, and button operations FRAMSpeedApp.c Main function file for FRAM Speed app Game.c Main function file for SliderBall video game app SYS.c Functions to enter and exit LPM3.5 myTimer.c Contains all timer-based functions and interrupts ULPMeter.c Main function file for Battery Free Stopwatch app Library: CTS Capacitive Touch Software Library (CAPSENSELIBRARY) Library: Driverlib Device driver library (MSP430DRIVERLIB) Library: grlib Graphics library for the SHARP LCD (MSP430-GRLIB) Folder: Preloaded images Images for the LCD screen MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Software Examples www.ti.com 3.4.2 Navigation and Main Menu Upon powering up the demo, the title screens appear on the LCD, and are followed by the main selection menu. The main menu displays all the applications available in the demo. The application options in the menu are highlighted by using the left capacitive touch slider. NOTE: Only the left capacitive touch slider is activated for navigation. After an application is selected, the right button (S2) is used to enter the application. To change the application or exit, use the left button (S1) and then navigate the main menu to switch to a different application. 3.4.3 Clock Application NOTE: This application relies on the operation of the 32.768-kHz clock crystal that is pre-populated on the LaunchPad. To enter this application, highlight the "Clock" option on the main menu and then push the right button (S2). Immediately upon entering the Clock app, the user is expected to set the date and time details before the clock starts running. This needs to be done every time the application is entered, because the clock values are not maintained when running any of the other applications. To set the time and data parameters use the following steps: 1. When the app starts, the parameter being modified begins to blink. 2. The left capacitive touch slider can be used to increment or decrement the blinking parameter by placing a finger on the top or bottom portion, respectively, of the slider. 3. The value of the blinking parameter can be locked by placing a finger in the middle of the left capacitive touch slider. 4. The parameter that is being modified can be changed with the right button (S2). 5. Repeat steps 2 to 4 until all parameters have been set, after which the clock resets the seconds and begins to track the time from the set time and date. When the clock begins to run, note that an option to turn on or off the seconds display is provided using the left button (S1). This is useful when attempting to measure power. The device spends most of the time in standby (LPM3), waking up every one second to update the RTC values. However if the display is updated every second, the average power is much higher than just the LPM3 power due to time and energy required to modify the LCD through SPI. If the SecON option is turned off, the device continues to provide a one second wakeup to update the RTC values but the display is updated only once a minute to save power. In this configuration the device power will be similar to power in LPM3 (refer device data sheet for exact values). When attempting to measure power using the Current jumper J9, ensure that the meter is in place before the board is powered up. Removing this jumper while the application is running results in a power cycle of the device (because the connection to VCC is broken), and the clock parameters must be re-entered. 3.4.4 FRAM Speed Application To enter the FRAM Speed app, the "FRAM Speed" option on the main menu must be highlighted and the right button (S2) then pushed. In this application, the FRAM write speed (in kilobytes per second), the total data written to FRAM (in kilobytes), and the FRAM endurance (in percentage) is tracked and displayed on the LCD. No user interaction is required. The application uses Direct Memory Access (DMA) to transfer data to a 1KB block of FRAM. The starting address of this block is defined and can be modified within the FRAMSpeedApp.h file. Note that changing this location can cause an overlap with other application code. This is not advised, because code may be overwritten while running the application. Hence special care needs to be taken to evaluate the size of the code to ensure that it is not over-written while measuring the FRAM write speed. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 29 Software Examples www.ti.com It should be noted that this application is optimized for speed rather than power. The speed of this application is approximately 7500KB (7.5MB) per second. On a flash device, the achievable speed would be approximately 13KB per second. Larger blocks of data can be written, which results in faster write speeds but also higher power consumption. For more information on how to optimize FRAM write speeds, refer to the application report Maximizing FRAM Write Speed on the MSP430FR57xx (SLAA498). In this application, the system main clock is configured to use the DCO at 8 MHz. The application configures the DMA transfer of data and continuously executes it while remaining in LPM0. Each time the DMA writes the 1KB block, a count variable is incremented and the next DMA transfer is triggered. A timer is set up to interrupt the FRAM writing every 0.25 second to calculate the speed, total the kilobytes of data written, update the endurance, and then output these parameters on the LCD. Note that the FRAM endurance percentage is retained after a power cycle. To exit the application and stop the FRAM writes, the left button (S1) can be pushed allowing the user to return to the main menu. 3.4.4.1 Understanding the Numbers Behind the FRAM Speed Application The LCD is updated every 250 ms with an updated percentage change in the FRAM endurance. To calculate the endurance, some approximations were made in order to provide a meaningful output on the LCD. Every 250 ms, 1.8MB of FRAM are programmed with a pattern. Hence the speed of FRAM writes is calculated as 7.564 MB/s. The FRAM is written to in blocks of 1K bytes; it is this 1KB block that is subject to the lifetime FRAM endurance specification. FRAM endurance of block = E = 1015 write cycles. This is a minimum specification for FRAM endurance found in the device data sheet. Table 9. FRAM Endurance Calculation for 1KB Block of FRAM Derived From Value E FRAM endurance Variable Data sheet 1015 writes W Write speed Application 7.564 MB/second B FRAM block size Application 1KB (1024 bytes) N Number of writes to a unique byte/sec N=W/B 7386 writes/second TLCD Time between LCD updates Application 250 ms TLIFE Time until endurance specification is met TLIFE = E / N 1.35 × 1011 seconds (more than 4000 years) L Lifetime percentage reduction per LCD update L = (TLCD / TLIFE) × 100 1.85 × 10-10% The calculated value of L is rounded up to 2 × 10-10%, or 0.0000000002%. This is the amount the FRAM endurance is decremented on the LCD every 250 ms. Note that the FRAM endurance percentage is retained during on a power cycle. This parameter is preserved by storing it in FRAM and preventing the variable from being overwritten on a power cycle. Refer to the NO INIT and LOCATION pragmas in the CCS compiler documentation for more details. This parameter will be reset when the device is reprogrammed, and the address overwritten. 3.4.5 Battery Free Application To enter the Battery Free Stopwatch application, select the "Battery Free" option on the main menu and then press the right button (S2). This mode is intended to be used when running from the super cap only. See Section 2.4.5 for more information on how to power the LaunchPad from the super cap. When the application is entered, a submenu appears showing two possible actions to be taken. The first action is to "Run App," which starts the Battery Free Stopwatch application and log . The other option is to "Transmit Data", which transmits all logged data from previous runs through the MSP430 UART to a PC. 30 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Software Examples www.ti.com The "Run App" selection has four modes: 1. Title Mode (Warning Page) 2. Deep Sleep -LPM3.5 Mode 3. Display Mode 4. Low Battery Indicator Mode When in Title mode or Display mode, press the right button (S2) to put the device into LPM3.5 (Deep Sleep Mode). Also in these two modes, press the left button (S1) at any time to exit the app and return to the main menu. When in Deep Sleep mode, the device remains in LPM3.5, and only the RTC is active. The left button (S1) is deactivated while in this mode, and the right button (S2) can be used to wake the device from LPM3.5 and send the device into Display mode. Also, in this mode the RTC wakes up the device periodically to allow the ADC to sample the supply voltage before returning to LPM3.5. These ADC samples of the supply voltage are logged into FRAM and can be transmitted back to a PC in the "Transmit Data" mode. The Display mode shows the stopwatch display and also the charge consumed while in LPM3.5. The stopwatch is started when the device enters LPM3.5 and stopped on exit. Hence the total time spent in LPM3.5 is displayed in HH:MM:SS format. The charge indicator is a reflection of the most recent ADC sample of supply voltage. If the device is left inactive at the "Display Mode" screen for more than ten seconds, the app times out, and control reverts to the main menu. Low Battery mode is entered conditionally following an ADC measurement of the supply voltage. When VCC < 2.2 V, the device displays a "Low Battery" warning screen. The screen recommends that the device be plugged into the PC through USB for charging. In this mode, the left button (S1) is deactivated, and the right button (S2) is used to check if USB has been plugged in or not. If the device has not been plugged into USB and the right button (S2) is pushed, the device remains in Low Battery mode. If the device has been plugged into USB and the right button (S2) is pushed, the device enters Deep Sleep mode again. When running this application, the ADC measurements are logged in FRAM while the device is running from the super cap indicating that the ADC sampling and FRAM write have a very low-power footprint. These logged values can then be sent to the PC and the data processed to analyze the reduction of charge over time. The transfer of data can be done in the UART transmit mode. The basic operation of the UART transmit mode is outlined below. 1. The eUSCI-UART and DMA modules are set up to transfer the data from FRAM. 2. "Sending Data – Please Wait" screen is displayed while the operation is in progress. 3. On completion "Data Send Complete" screen is displayed. 4. The data can be viewed using any hyperterminal application on the PC. 3.4.6 Active Power Application The active power of the MSP430FR5969 device is directly dependent on the code and data cache hit ratio and the clock speed of the CPU. The Active Power application shows the impact of both these factors on overall system power. To measure the power consumption of the MSP430FR5969 for the different frequencies and cache hit ratios, the following steps should be followed: 1. Remove the "Measure Current" jumper from the LaunchPad 2. Use an ammeter set to the "mA" range and connect the leads of the ammeter to the nodes of the "Measure Current" jumper 3. Navigate the main menu to the "Active Mode" app 4. Choose a frequency and cache hit ratio from the subsequent menus 5. Press the right button (S2) to enter the cache hit code 6. Tune the ammeter range to obtain the most accurate current measurement values 7. Prior to exiting the cache hit code, ensure that ammeter is in "mA" range, then press right button (S2) to exit cache hit code SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 31 Software Examples 3.4.7 www.ti.com SliderBall Game This application was designed to show the functioning ability of the two Capacitive Touch sliders in conjunction with the LCD from the 430BOOST-SHARP96 BoosterPack. To enter the application, the SliderBall game option on the main menu must be highlighted and the right button (S2) then pushed. The SliderBall game requires the player to use a sliding paddle to keep the ball in play. The goal of the game is to keep the ball alive and on the screen by having it hit off of the two paddles at each end of the screen. Users start off with five lives to accumulate as many points as possible. For each time that the ball is blocked by the paddle, points are awarded. The higher the difficulty, the more points are awarded for each hit. Each time the ball reaches the end of the screen and the paddle has not hit the ball, the user loses a life. After the life is lost, the ball automatically starts again for another round. This repeats until all lives are exhausted, and the game is over. If the high score has been achieved, a congratulations screen will be displayed to notify the user. At this point the final score, as well as the board high score will be displayed and the user may then choose a new level of difficulty to play once again. To navigate the user levels menu and choose an option, the left capacitive touch slider and right button are used similar to all previous menus. The user may choose between the following: easy, normal, hard, and Insane. After selecting a difficulty, the game will begin to start, with the ball moving to the right-hand side first. Both capacitive touch sliders are used to control their respective paddles along the side of the screen. When the user misses the ball, it will be held in place for a few cycles before starting to move again to give the user a chance to regroup following losing a life. To create "easier" versions of the game, sleep cycles are added to slow down the game play. The high score for each user level is stored in FRAM and is retained on subsequent power cycles. This value is erased only when the device is re-programmed. 3.4.8 Special Notes: Inverting the Display Color Scheme A feature that has been built in to the demo code is the ability to invert the display colors. This can be a useful feature for times when the original display color settings are difficult to read. To invert the colors edit the file 'sharp96x96.h' within the 'grlib' directory. In the 'User Configuration for the LCD Driver' section under 'Invert Display Option' use either one of the # defines 'NORMAL_DISPLAY' or 'INVERT_DISPLAY' as needed. When INVERT_DISPLAY is defined it allows the demo to display with a black background and white foreground once the demo code is re-downloaded onto the MSP-EXP430FR5969 board. 3.5 430BOOST-SHARP96 Graphics Library Demo NOTE: This graphics library demo is dependent on the 430BOOST-SHARP96 BoosterPack that comes with the MSP-BNDL-FR5969LCD bundle. The grlib demo shows how to use the MSP430 Graphics Library http://www.ti.com/tool/msp430-grlib or "grlib," in a project with the Sharp® display. This demo cycles screens without user interaction to show simple graphics primitives. • Pixels • Lines • Circles • Rectangles • Text • Images The demo introduces the functions to configure grlib such as initialization, color inversion, and using foreground and background colors properly. 32 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Software Examples www.ti.com FRAM memory devices like the MSP430FR5969 are touted for ultra-low power, but in some applications the FRAM memory can provide additional benefits such as dynamic memory allocation. In applications with dot matrix LCD displays, it is often advantageous to keep a RAM buffer of the contents currently on the display. For a smaller display such as the Sharp display on the 430BOOST-SHARP96 BoosterPack, this doesn't require much RAM to keep the display contents. 96 LETAHO/NKS 4#/ >UPAO NAMQENA@ = × 96 NKSO = 1152 >UPAO 8 LETAHO/>UPA (1) But in displays with more pixels or color displays, these RAM buffers can quickly become very large. If the Sharp display was a color display with 16 bits or color per pixel, (common in color displays) this buffer would be significantly larger. 96 LETAHO/NKS 4#/ >UPAO NAMQENA@ = × 96 NKSO = 18432 >UPAO 0.5 LETAHO/>UPA (2) When selecting a microcontroller for an application with a display like this would require a very large memory device for a typical RAM/Flash microcontroller. Typical RAM memory cutoffs would likely require a 32KB RAM device with around 128KB or 256KB of Flash. This may be significantly more memory than the application requires. FRAM's unified memory block can be dynamically partitioned into data or code memory, providing unmatched flexibility. Applications like this can be easily supported with a 32KB or 64KB FRAM device. Figure 21. FRAM Unified Memory With Dynamic Partitioning SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 33 Additional Resources www.ti.com 4 Additional Resources 4.1 LaunchPad Websites More information about the FR5969 LaunchPad, supported BoosterPacks, and available resources can be found at: • FR5969 LaunchPad tool page: resources specific to this particular LaunchPad • TI's LaunchPad portal: information about all LaunchPads from TI for all MCUs 4.2 Information on the MSP430FR5969 At some point, you will probably want more information about the FR5969 device. For every MSP430 device, the documentation is organized as shown in Table 10. Table 10. How MSP430 Device Documentation is Organized Document 4.3 For FR5969 Description Device family user's guide MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx Family User's Guide (SLAU367) Architectural information about the device, including clocks, timers, ADC, and other peripherals. Device-specific data sheet MSP430FR59xx, MSP430FR58xx Mixed Signal Microcontroller data sheet (SLAS704) Device-specific information and all parametric information for this device Download CCS, IAR, or MSPGCC Although the files can be viewed with any text editor, 'more can be done with the projects if they're opened with a development environment like Code Composer Studio (CCS), IAR, or Energia. CCS and IAR are each available in a full version, or a free, code-size-limited version. The full source code for some of the included example projects cannot be built with the free version of CCS or IAR (IAR KickStart) due to the code size limit. To bypass this limitation, a code-size-limited CCS version is provided, that has most functionality integrated into a library. The code that is built into the library is able to be viewed by the user, but it cannot be edited. For full functionality download the full version of either CCS or IAR. See the MSP430 software tools page to download them, and for instructions on installation. 34 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Additional Resources www.ti.com 4.4 MSP430Ware and TI Resource Explorer MSP430Ware is a complete collection of libraries and tools. It includes a driver library (driverlib) and the graphics library (grlib) used in the software demo. By default, MSP430Ware is included in a CCS installation. IAR users must download it separately. MSP430Ware includes the TI Resource Explorer, for easily browsing tools. For example, all the software examples are shown in the tree below. Figure 22. MSP-EXP430FR5969 Software Examples in TI Resource Explorer Inside TI Resource Explorer, these examples and many more can be found, and easily imported into CCS with one click. 4.5 MSP430FR5969 Code Examples This is a set of very simple code examples that demonstrate how to use the MSP430's entire set of peripherals: ADC12, Timer_A, Timer_B, and so on. These do not use driverlib, rather they access the MSP430 registers directly. Every MSP430 derivative has a set of these code examples. When writing code that uses a peripheral, they can often serve as a starting point. There are also code examples available that use driver library. These code examples are part of the driverlib download included with MSP430Ware. To access these code examples, navigate into the driverlib folder or use the TI Resource Explorer to import into CCS. 4.6 MSP430 Application Notes There are many application notes at www.ti.com/msp430 with practical design examples and topics. SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 35 Additional Resources 4.7 www.ti.com The Community 4.7.1 TI E2E Community Search the forums at e2e.ti.com. If you cannot find an answer, post your question to the community. 4.7.2 Community at Large Many online communities focus on the LaunchPad – for example, http://www.43oh.com. You can find additional tools, resources, and support from these communities. 5 FAQs Q: I can't get the backchannel UART to connect. What's wrong? A: • • • Check the following: Do the baud rate in the host's terminal application and the USCI_A0 settings match? Are the appropriate jumpers in place on the isolation jumper block? Probe on RXD and send data from the host; if you don't see data, it might be a problem on the host side. • Probe on TXD while sending data from the MSP430. If you don't see data, it might be a configuration problem on the USCI_A0 module. • Consider the use of the hardware flow control lines (especially for higher baud rates) Q: So the onboard emulator is really open source? And I can build my own onboard emulator? A: Yes! We encourage you to do so, using the design files. Q: The MSP430 G2 LaunchPad had a socket, allowing me change the target device. Why doesn't this LaunchPad use one? A: This LaunchPad provides more functionality, and this means using a device with more pins. Sockets for devices with this many pins are too expensive for the LaunchPad's target price. 36 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Schematics www.ti.com 6 Schematics A B C MSP430FR5969 LaunchPad Main MCU 1 TDO TMS TDI JTAG TCK TEST RST RST CTS_TARGETIN TX_TARGETOUT RX_TARGETIN 1 RTS_TARGETOUT APPLICATION_UART D JTAG VCC J4 J5 BP1-VCC 25 P2.1/TB0.0 BP7 26 P2.2/TB0.2 BP8 BP9 PJ.1/TDI13 PJ.3/TCK15 P4.0/A8 16 P4.1/A9 17 P4.3/A11 19 P4.2/A1018 PJ.2/TMS/ACLK14 BP6 P2.5/TB0.020 BP5 P2.6/TB0.121 BP4 TEST/SBWTCK22 BP18 P2.0/TB0.624 BP19 BP3 NMI/SBWTDIO/RST 23 BP16-RST PJ.0/TDO12 BP15 BP14 27 P3.4/TB0.3/SMCLK P1.4/TB0.110 BP13 28 P3.5/TB0.4/COUT P1.3/TA1.2 9 BP12 29 P3.6/TB0.5 P4.7 8 30 P3.7/TB0.6 U1 31 P1.6/TB0.3 46 PJ.5/LFXOUT S2 P1.0/TA0.1/DMAE01 47 AVSS C9 44 AVSS C2 45 PJ.4/LFXIN 100n 41 AVSS VCC 1u 42 PJ.6/HFXIN J6 39 P2.3/TA0.0 36 DVSS Low Current Red Basic User Interface (left) P1.1/TA0.2 2 37 DVCC 470 P1.2/TA1.1 3 35 P4.6 40 P2.4/TA1.0 R3 P3.0/A12/C12 4 34 P4.5 38 P2.7 LED1 P3.1/A13/C13 5 33 P4.4/TB0.5 3 LaunchPad Header (right) P3.2/A14/C14 6 MSP430FR5969RGZ 32 P1.7/TB0.4 S1 BP11 P3.3/A15/C15 7 R6 49 PWPD LaunchPad Header (left) 48 AVCC BP10 Y1 4 MHz (DNP) Low Current Green R4 10p10p C3 27p (DNP) C4 27p (DNP) 0 Expand functionality with BoosterPacks: VCC 100n C8 Crystals Texas Instruments R5 Title 0 www.ti.com/LaunchPad Size Connect Analog and Digital Power Supply Engineer A LED2 Basic User Interface (right) 32.7638 kHz, 7.0pF Y4 C5 C6 3 390 Place Jumper 4 2 BP17-TEST P1.5/TB0.211 43 PJ.7/HFXOUT 2 BP20-GND BP2 B C D.Schneider B 4 MSP430 LaunchPad FR5969 Number Rev MSP-EXP430FR5969 2.0 Date Drawn by D.Schneider 6/17/2014 1 5 of Filename LaunchPad-MSP430FR5969.sch Sheet D 6/17/2014 Figure 23. Schematic 1 of 5 SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 37 Schematics www.ti.com A C B D Main MCU - Debugger and Power Connections 1 1 External Power Supply J21 1 RX_TARGETIN 2 V_DEBUGGER V_EXT 3 2 3 TEST 1 4 RST J12 5 6 TX_TARGETOUT Measure Current J10 dnp V_EXT 1 eZ430 50mil header Power Selection2 V_DEBUGGER 3 Bypass External V_CHARGE R2 Debugger 10 Place Jumper R7 Cap Selection VCC 1 VCC 1 Place Jumper J11 Current Limiter 3 + Charge Cap EZFET_SBWNC C7 J8 dnp EEC-S0HD104H 0.1F Place Jumper EZFET_SBWTCK TEST EZFET_SBWTDIO RST EZFET_UARTRXD TX_TARGETOUT EZFET_UARTTXD RX_TARGETIN EZFET_UARTRTS CTS_TARGETIN EZFET_UARTCTS RTS_TARGETOUT EZFET_VCCTARGET 2 3 Place Jumper J13 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 2 V_CAP Use 10 Measure Voltage J9 2 3 2 eZ-FET J2 Super Cap EZFET_VBUS J7 5V_VBUS JTAG 3 LaunchPad Power Hooks (bottom right) VCC VCC 1 VCC J3 2 J1 TMS RST TCK TEST C1 TX_TARGETOUT RST 1n Reset S3 Texas Instruments Title CTS_TARGETIN dnp 3 TDI RX_TARGETIN 4 R1 47k TDO RTS_TARGETOUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 14 pin JTAG Size B APPLICATION_UART Engineer A B C D.Schneider 4 MSP430 LaunchPad FR5969 Number Rev MSP-EXP430FR5969 2.0 Date Drawn by D.Schneider 6/17/2014 2 5 Filename of LaunchPad-MSP430FR5969.sch Sheet D 6/17/2014 Figure 24. Schematic 2 of 5 38 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Schematics www.ti.com A C B D eZ-FET - USB Interface and Power Supply eZ-FET Rev1.2 1 7 6 1 CONN_USB_ZX62R-B-5P 5 PGND 4 3 2 R104 27 EZFET_DP EZFET_PU.0/DP EZFET_DM EZFET_PU.1/DM 1 13 12 2 R103 27 IC102 EZFET_VBUS PGND 1 IO1 VCC 6 2 IO2 IO4 5 3 GND IO3 4 R123 R106 C110 C111 10p 10p EZFET_PUR PGND PGND R105 1M 33k TPD4E004DRY 1k4 PGND 2 PGND ezFET - DEBUG 1 1 TP-038 1 1 TP101 TP-038 IC101 EZFET_VCC TP102 PGND C108 1 1 TP-038 1 1 TP103 TP-038 TP104 3 100n EZFET_VBUS 1 IN EN 6 2 GND NC 5 3 OUT NC 4 TLV70036DSE EZFET_VCC 3 PGND PGND PGND 1 1 TP-038 1 1 TP-038 1 1 TP-038 1 1 TP-038 1 1 TP-038 1 1 TP105 TP-038 C105 100n EZFET_TEST TP106 EZFET_TDO TP107 PGND EZFET_TDI TP108 EZFET_TMS TP109 EZFET_TCK TP110 EZFET_RST Texas Instruments 4 Title 4 MSP430 LaunchPad FR5969 1 1 TP-038 1 1 TP113 TP-038 Size EZFET_DCDCRST TP114 B EZFET_DCDCTEST Engineer A B C D.Schneider Number Rev MSP-EXP430FR5969 2.0 Date Drawn by D.Schneider 6/17/2014 3 5 Filename of LaunchPad-MSP430FR5969.sch Sheet D 6/17/2014 Figure 25. Schematic 3 of 5 SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 39 Schematics www.ti.com A C B D eZ-FET - Host MCU for emulation Q101 PIEZO_CSTCR4M00G15L992 EZFET_TEST PJ.0/TDO 60 TEST/SBWTCK 59 EZFET_VBUS EZFET_TDI EZFET_TDO PJ.1/TDI/TCLK 61 EZFET_TCK EZFET_TMS EZFET_RST PJ.3/TCK 63 R109 47k PJ.2/TMS 62 EZFET_VCC EZFET_PU.0/DP 1 EZFET_PU.1/DM 3 1 EZFET_PUR eZ-FET Rev1.2 C102 C107 220n 220n 1 EZFET_RST C112 1 P6.0/CB0/A0 2 R125 150k VSSU 49 PU.0/DP 50 PUR 51 VBUS 53 PU.1/DM 52 V18 55 VUSB 54 AVSS2 56 P5.2/XT2IN 57 P5.3/XT2OUT 58 PWPD 65 R124 240k NMI-SBWTDIO/RST64 1n EZFET_VBUS P4.7/PM_NONE 48 C123EZFET_AVCCOUT2ADC 2 P6.1/CB1/A1 P4.6/PM_NONE 47 33p 3 P6.2/CB2/A2 46 P4.5/PM_UCA1RXD/PM_UCA1SOMI 4 P6.3/CB3/A3 45 P4.4/PM_UCA1TXD/PM_UCA1SIMO EZFET_SBWNC EZFET_DCDCIO0 5 P6.4/CB4/A4 44 P4.3/PM_UCB1CLK/PM_UCA1STE EZFET_SBWTCK EZFET_DCDCIO1 6 P6.5/CB5/A5 43 P4.2/PM_UCB1SOMI/PM_UCB1SCL EZFET_SBWTDIO EZFET_DCDCRST 7 P6.6/CB6/A6 EZFET_DCDCTEST 42 P4.1/PM_UCB1SIMO/PM_UCB1SDA MSP101 8 P6.7/CB7/A7 MSP430F5528IRGC 9 P5.0/A8/VREF+/VEREF+ 41 P4.0/PM_UCB1STE/PM_UCA1CLK DVCC2 40 10 P5.1/A9/VREF-/VEREF- C103 C121 11 AVCC1 P3.4/UCA0RXD/UCA0SOMI38 EZFET_UARTRXD 100n 12 P5.4/XIN P3.3/UCA0TXD/UCA0SIMO37 EZFET_UARTTXD R102 LED101 LED102 Red Green 31 P2.5/TA2.2 32 P2.6/RTCCLK/ 30 P2.4/TA2.1 28 P2.2/TA2CLK/SMCLK 29 P2.3/TA2.0 27 P2.1/TA1.2 26 P2.0/TA1.1 3 Texas Instruments EZFET_UARTCTS EZFET_DCDCPULSE 390 EZFET_VCCEN2 470n 4 24 P1.6/TA1CLK/CBOUT R101 470 EZFET_VCCEN1 C101 25 P1.7/TA1.0 EZFET_UARTRTS 22 P1.4/TA0.3 P2.7/UCB0STE/UCA0CLK33 16 DVSS1 23 P1.5/TA0.4 100n EZFET_HOSTSDA 21 P1.3/TA0.2 10u EZFET_HOSTSCL P3.0/UCB0SIMO/UCB0SDA34 20 P1.2/TA0.1 C113 P3.1/UCB0SOMI/UCB0SCL35 15 DVCC1 18 P1.0/TA0CLK/ACLK C104 14 AVSS1 19 P1.1/TA0.0 EZFET_VCC 100n P3.2/UCB0CLK/UCA0STE36 17 VCORE(2) 3 Title Size B Engineer A EZFET_VCC DVSS2 39 13 P5.5/XOUT + 2 B C D.Schneider 4 MSP430 LaunchPad FR5969 Number Rev MSP-EXP430FR5969 2.0 Date Drawn by D.Schneider 6/17/2014 4 5 Filename of LaunchPad-MSP430FR5969.sch Sheet D 6/17/2014 Figure 26. Schematic 4 of 5 40 MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Schematics www.ti.com A C B D eZ-FET - MCU controlled DCDC converter eZ-FET Rev1.2 1 1 EZFET_VCC + C106 C124 4.7u 100n AVSS 13 DVSS 14 AVCC 15 PWPD R112 220k DVCC 16 17 EZFET_VCCOUT EZFET_AVCCOUT 1 P1.0 2 P1.1 3k3 EZFET_DCDCPULSE 3 P1.2 2k2 EZFET_VCCOUT 6k8 TEST 10 EZFET_DCDCTEST 5 P1.7 EZFET_DCDCRST 2 8 P1.4 2 R117 4k7 EZFET_VCCOUT 4 P1.3MSP430G2452RSARST 9 EZFET_DCDCIO0 R114 220k R128 XOUT 11 MSP102 P1.5 33p R127 P1.6 EZFET_VCCOUT 7 C115 6 R113 220k R116 4k7 R126 XIN 12 EZFET_HOSTSDA EZFET_HOSTSDA EZFET_DCDCIO1 EZFET_HOSTSCL R115 220k EZFET_AVCC C116 EZFET_HOSTSCL 33p EZFET_VCCEN1 EZFET_VBUS EZFET_VBUS + R120 470 C109 C117 C118 4.7u 4.7u 100n EZFET_VCC 2 GND 6 4 COM2 NO2 5 EZFET_VCCEN2 R108 47k EZFET_VCCTARGET 3 DMG1013UW-7 T101 D 3 D101 BAS40-05W IN2 7 3 IN1 47k G 3 EZFET_DCDCPULSE 2 V+ COM1 8 TS5A21366RSE R107 S 1 3 EZFET_VCCEN2 IC103 1 NO1 2 1 L101 1 B 820 2.2uH D102 BAS40-05W 1 R121 220k 2 E EZFET_VCCOUT C119 4.7u C120 100n R119 0 EZFET_AVCCOUT2ADC 4 T102 BC850CW-115 3 TARGET VCC SENSE 2 EZFET_VCCOUT C R118 C122 R122 220k Texas Instruments 33p Title Size Energy Measurement Method protected under U.S. Patent Application 13/329,073 Engineer A B C D.Schneider B 4 MSP430 LaunchPad FR5969 Number Rev MSP-EXP430FR5969 2.0 Drawn by D.Schneider Date 6/17/2014 5 5 Filename of LaunchPad-MSP430FR5969.sch Sheet D 6/17/2014 Figure 27. Schematic 5 of 5 SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback MSP430FR5969 LaunchPad™ Development Kit (MSP‑EXP430FR5969) Copyright © 2014–2015, Texas Instruments Incorporated 41 Revision History www.ti.com Revision History Changes from June 24, 2014 to July 20, 2015 ................................................................................................................. Page • • Throughout the document, changed the link destinations for the MSP-EXP430FR5969 Software Examples and the MSP‑EXP430FR5969 Hardware Design Files ........................................................................................ 1 Changed arrangement of subsections in Section 2................................................................................... 5 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 42 Revision History SLAU535B – February 2014 – Revised July 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated STANDARD TERMS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. 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Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User): 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 3.4 European Union 3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures. 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2018, Texas Instruments Incorporated IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. 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