User's Guide
SLAU678B – March 2016 – Revised September 2019
MSP430FR5994 LaunchPad™ Development Kit
(MSP‑EXP430FR5994)
The MSP-EXP430FR5994 LaunchPad™ development kit is an easy-to-use evaluation module (EVM) for
the MSP430FR5994 microcontroller (MCU). It contains everything needed to start developing on the ultralow-power MSP430FRx FRAM microcontroller platform, including onboard debug probe for programming,
debugging, and energy measurements. Figure 1 shows the development kit.
Figure 1. MSP-EXP430FR5994 LaunchPad Development Kit
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Contents
Getting Started ............................................................................................................... 3
Hardware...................................................................................................................... 5
Software Examples ........................................................................................................ 16
Resources ................................................................................................................... 25
FAQ .......................................................................................................................... 32
Schematics .................................................................................................................. 33
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MSP-EXP430FR5994 LaunchPad Development Kit .................................................................... 1
2
MSP-EXP430FR5994 Overview ........................................................................................... 5
3
MSP-EXP430FR5994 Block Diagram..................................................................................... 6
4
MSP430FR5994 Pinout ..................................................................................................... 7
5
eZ-FET Debug Probe ....................................................................................................... 8
6
eZ-FET Isolation Jumper Block Diagram
List of Figures
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...............................................................................
Application Backchannel UART in Device Manager ...................................................................
MSP-EXP430FR5994 Power Block Diagram...........................................................................
MSP-EXP430FR5994 Super Cap Power Block Diagram .............................................................
BoosterPack Plug-in Module Checker Tool .............................................................................
LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout ..................................
MSP-EXP430FR5994 Out-of-Box Demo GUI ..........................................................................
Live Temperature Mode ...................................................................................................
FRAM Log Mode ...........................................................................................................
Record .......................................................................................................................
Playback .....................................................................................................................
Alternate Microphone Configuration .....................................................................................
EEPROM SPI Interface Block Diagram .................................................................................
EEPROM I2C Interface Block Diagram ..................................................................................
TI Resource Explorer Cloud ..............................................................................................
CCS Cloud ..................................................................................................................
Directing the Project>Import Function to the Demo Project ..........................................................
When CCS Has Found the Project ......................................................................................
Using TI Resource Explorer to Browse MSP-EXP430FR5994 in MSPWare ......................................
Schematics (1 of 7) ........................................................................................................
Schematics (2 of 7) ........................................................................................................
Schematics (3 of 7) ........................................................................................................
Schematics (4 of 7) ........................................................................................................
Schematics (5 of 7) ........................................................................................................
Schematics (6 of 7) ........................................................................................................
Schematics (7 of 7) ........................................................................................................
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Trademarks
LaunchPad, BoosterPack, Code Composer Studio, MSP430, EnergyTrace++, EnergyTrace, E2E are
trademarks of Texas Instruments.
IAR Embedded Workbench, C-SPY are registered trademarks of IAR Systems.
All other trademarks are the property of their respective owners.
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Getting Started
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1
Getting Started
1.1
Introduction
The MSP-EXP430FR5994 LaunchPad development kit is an easy-to-use evaluation module (EVM) for the
MSP430FR5994 microcontroller (MCU). The LaunchPad development kit contains everything needed to
start developing on the ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard
debug probe for programming, debugging and energy measurements. The board features onboard buttons
and LEDs for quick integration of a simple user interface, a microSD card port to interface with microSD
cards, and a super capacitor (super cap) to enable stand-alone applications without an external power
supply.
The MSP430FR5994 MCU features 256KB of embedded FRAM (Ferroelectric Random Access Memory),
a nonvolatile memory known for its ultra-low power, high endurance, and high speed write access. The
device also features 8KB of SRAM, supports CPU speeds of up to 16 MHz and has integrated peripherals
for communication, ADC, timers, AES encryption, low-energy accelerator (LEA) (a new hardware module
for the FRAM family that is designed for fast, efficient, and low-power vector math), and more—plenty to
get you started in your development.
Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide
range of available BoosterPack modules. Quickly add features like wireless connectivity, graphical
displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or
choose among many already available from TI and third-party developers.
Free software development tools are also available, such as the TI Eclipse-based Code Composer
Studio™ IDE (CCS) and the IAR Embedded Workbench® for MSP430™ IDE (EW430). Both of these IDEs
support EnergyTrace++™ technology for real-time power profiling and debugging when paired with the
MSP430FR5994 LaunchPad kit.
1.2
Key Features
•
•
•
•
•
•
•
MSP ULP FRAM technology based MSP430FR5994 16-bit MCU
EnergyTrace++ Technology available for ultra-low-power debugging
40-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem
Onboard eZ-FET debug probe
Two buttons and two LEDs for user interaction
Onboard microSD card
Super capacitor (0.22 F)
1.3
What's Included
1.3.1
Kit Contents
• MSP-EXP430FR5994 LaunchPad development kit
• Micro-USB cable
• Quick start guide
1.3.2
•
•
•
•
•
Software Examples
Out-of-box software
Blink LED
Audio BoosterPack plug-in module record and playback
Low-energy accelerator for signal processing
EEPROM emulation
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First Steps: Out-of-Box Experience
An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. It demonstrates
some key features from a user level.
1.4.1
Connecting to the Computer
Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED
should illuminate. For proper operation, drivers are needed. TI recommends installing the drivers by
installing an IDE such as TI CCS or IAR EW430. Drivers are also available at ti.com/MSPdrivers.
1.4.2
Running the Out-of-Box Demo
When connected to the computer, the LaunchPad development kit powers up. Press and hold the S1 and
S2 buttons simultaneously to select a new mode. See Section 3.1 for a detailed explanation of each
mode.
1.4.2.1
Live Temperature Mode
This mode provides live temperature data streaming to the PC GUI. You can influence the temperature of
the device and see changes on the GUI.
1.4.2.2
FRAM Data Log Mode
This mode shows the FRAM data logging capabilities of the MSP430FR5994. After starting this mode, the
LaunchPad development kit wakes up every five seconds from sleep mode (indicated by LED blink) to log
both temperature and input voltage values. After reconnecting to the GUI, these values can be uploaded
and graphed in the GUI.
1.4.2.3
SD Card Data Log Mode
This mode shows the data logging capabilities of the MSP430FR5994 while interfacing with an SD card.
After starting this mode, the LaunchPad development kit wakes up every five seconds from sleep mode
(indicated by LED blink) to log both temperature and input voltage values. After reconnecting to the GUI,
these values can be uploaded and graphed in the GUI.
1.5
Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It's time to open an integrated
development environment and start editing the code examples. See Section 4 for available IDEs and
where to download them.
The quickest way to get started using the LaunchPad development kit is to use TI's Cloud Development
Tools. The cloud-based Resource Explorer provides access to all of the examples and resources in
MSPWare. Code Composer Studio Cloud is a simple cloud-based IDE that enables developing and
running applications on the LaunchPad development kit.
The out-of-box source code and more code examples are provided and available on the download page.
Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.
Section 3 describes all functions in detail and provides a project structure to help familiarize you with the
code.
With the onboard eZ-FET debug probe debugging and downloading new code is simple. A USB
connection between the EVM and a PC through the provided USB cable is all that is needed.
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Hardware
Figure 2 shows an overview of the MSP-EXP430FR5994 hardware.
Figure 2. MSP-EXP430FR5994 Overview
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Block Diagram
Figure 3 shows the block diagram.
Micro-B
USB
LED
red, green
ESD
protection
Crystal
4 MHz
Debug
MCU
EnergyTrace
UART, SBW to target
Power to target
3.3-V
LDO
Reset
button
Super capacitor
Crystal
32.768 kHz
User interface
2 buttons, 2 LEDs
Target device
MSP430FR5994
40-pin LaunchPad
standard headers
microSD Card
Figure 3. MSP-EXP430FR5994 Block Diagram
2.2
2.2.1
Hardware Features
MSP430FR5994 MCU
The MSP430FR5994 is the next device in TI's new ULP FRAM technology platform. FRAM is a cuttingedge memory technology that combines the best features of flash and RAM into one nonvolatile memory.
For more information on FRAM, see www.ti.com/fram.
Device features include:
• 1.8-V to 3.6-V operation
• 16-bit RISC architecture up to 16-MHz system clock and 8-MHz FRAM access
• 256KB of FRAM and 8KB of SRAM
• 16-channel 12-bit ADC
• 16-channel analog comparator
• Six 16-bit timers with seven capture/compare registers each
• 6-channel direct memory access (DMA)
• 128-bit or 256-bit AES
• 32-bit hardware multiplier (MPY)
• 68 GPIOs
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DVCC1
P2.7
P2.3/TA0.0/UCA1STE/A6/C10
P5.4/UCA2TXD/UCA2SIMO/TB0OUTH
P2.4/TA1.0/UCA1CLK/A7/C11
P5.5/UCA2RXD/UCA2SOMI/ACLK
P5.6/UCA2CLK/TA4.0/SMCLK
P6.4/UCB3SIMO/UCB3SDA
P5.7/UCA2STE/TA4.1/MCLK
P6.6/UCB3CLK
P6.5/UCB3SOMI/UCB3SCL
AVSS3
P6.7/UCB3STE
PJ.6/HFXIN
AVSS2
PJ.7/HFXOUT
PJ.4/LFXIN
AVSS1
PJ.5/LFXOUT
AVCC1
Figure 4 shows the pinout of the MSP430FR5994 MCU in the 80-pin PN package.
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
60
1
53
P5.0/UCB1SIMO/UCB1SDA
9
52
P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0
P6.2/UCA3CLK
10
51
P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0
P6.3/UCA3STE
11
50
P3.7/TB0.6
P4.7
12
49
P3.6/TB0.5
P7.0/UCB2SIMO/UCB2SDA
13
48
P3.5/TB0.4/COUT
P7.1/UCB2SOMI/UCB2SCL
14
47
P3.4/TB0.3/SMCLK
P8.0
15
46
P8.3
P1.3/TA1.2/UCB0STE/A3/C3
16
45
P8.2
P1.4/TB0.1/UCA0STE/A4/C4
17
44
P8.1
P1.5/TB0.2/UCA0CLK/A5/C5
18
43
P2.2/TB0.2/UCB0CLK
DVSS2
19
42
P2.1/TB0.0/UCA0RXD/UCA0SOMI
DVCC2
20
41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK
DVCC3
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6
DVSS3
8
P6.1/UCA3RXD/UCA3SOMI
RST/NMI/SBWTDIO
P5.2/UCB1CLK/TA4CLK
P5.1/UCB1SOMI/UCB1SCL
TEST/SBWTCK
54
P2.6/TB0.1/UCA1RXD/UCA1SOMI
55
7
P4.3/A11
6
P3.3/A15/C15
P6.0/UCA3TXD/UCA3SIMO
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P3.2/A14/C14
P4.1/A9
P5.3/UCB1STE
P4.2/A10
56
P4.0/A8
5
P7.7/A19
P4.4/TB0.5
P3.1/A13/C13
P7.6/A18
P4.5
57
P7.5/A17
58
4
P7.4/TA4.0/A16
3
P3.0/A12/C12
P7.3/UCB2STE/TA4.1
P1.2/TA1.1/TA0CLK/COUT/A2/C2
P7.2/UCB2CLK
DVSS1
P4.6
PJ.3/TCK/SRCPUOFF/C9
59
PJ.2/TMS/ACLK/SROSCOFF/C8
2
PJ.1/TDI/TCLK/MCLK/SRSCG0/C7
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF-
Figure 4. MSP430FR5994 Pinout
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eZ-FET Onboard Debug Probe With EnergyTrace++ Technology
To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard
debug probe, which eliminates the need for expensive programmers. The MSP-EXP430FR5994 has the
eZ-FET debug probe (see Figure 5), which is a simple and low-cost debugger that supports all MSP430
device derivatives.
Figure 5. eZ-FET Debug Probe
The MSP-EXP430FR5994 LaunchPad development kit features full EnergyTrace++ technology. The
EnergyTrace™ functionality varies across the MSP portfolio (see Table 1).
Table 1. EnergyTrace Technology
Features
Current Monitoring
EnergyTrace™ Technology
EnergyTrace++™ Technology
✓
✓
✓
CPU State
✓
Peripheral and System State
Devices Supported
Development Tool Required
All MSP430 MCUs
FR59xx and FR69xx MCUs
MSP-FET or eZ-FET
MSP-FET or eZ-FET
In Figure 5, the dotted line through J101 divides the eZ-FET debug probe from the target area. The
signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. For more
details on the isolation jumper block, see Section 2.2.3.
The eZ-FET also provides a "backchannel" UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC. For more details, see Section 2.2.4.
Details of the eZ-FET hardware can be found in the schematics in Section 6 and in the hardware design
files download page. The software and more information about the debugger can be found on the eZ-FET
wiki.
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2.2.3
Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 can connect or disconnect signals that cross from the eZ-FET
domain into the MSP430FR5994 target domain. This includes eZ-FET Spy-Bi-Wire signals, application
UART signals, and 3.3-V and 5-V power (see Table 2 and Figure 6).
Reasons to open these connections:
• To remove any and all influence from the eZ-FET debug probe for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the eZ-FET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the eZ-FET so that it can be used for devices other
than the onboard MCU.
Table 2. Isolation Block Connections
Jumper
GND
Description
Ground
5V
5-V VBUS from USB
3V3
3.3-V rail, derived from VBUS in the eZ-FET domain
RXD >
Backchannel UART: The target MSP430FR5994 sends data through this signal. The arrows indicate the direction
of the signal.
SBW RST
Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as the RST signal (active low).
SBW TST
Spy-Bi-Wire debug: SBWTCK clock signal. This pin also functions as the TST signal.
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USB Connector
USB
eZ-FET
in
eZ-FET Debug
Probe
out
LDO
EnergyTrace
BoosterPack Header
Spy-Bi-Wire (SBW)
Emulation
Application UART
3.3-V Power
BoosterPack Header
MSP430 Target
5-V Power
Isolation
Jumper Block
Target MSP430 MCU
Figure 6. eZ-FET Isolation Jumper Block Diagram
2.2.4
Application (or Backchannel) UART
The backchannel UART allows communication with the USB host that is not part of the target application's
main functionality. This is very useful during development, and also provides a communication channel to
the PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the
PC that communicate with the LaunchPad development kit.
Figure 6 shows the pathway of the backchannel UART. The backchannel UART is the UART on
eUSCI_A0. This UART channel is separate from the UART on the 40-pin BoosterPack plug-in module
connector (eUSCI_A3).
On the host side, a virtual COM port for the application backchannel UART is generated when the
LaunchPad development kit enumerates on the host. You can use any PC application that interfaces with
COM ports, including terminal applications like Hyperterminal or Docklight, to open this port and
communicate with the target application. You need to identify the COM port for the backchannel. On
Windows PCs, Device Manager can assist (see Figure 7).
Figure 7. Application Backchannel UART in Device Manager
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The backchannel UART is the MSP Application UART1 (COM13) port. In this case, Figure 7 shows
COM13, but this port can vary from one host PC to the next. Identify the correct COM port and configure it
in the host application according to its documentation. Then open the port and begin communication to it
from the host.
On the target MSP430FR5994 side, the backchannel is connected to the eUSCI_A0 module. The eZ-FET
has a configurable baud rate; therefore, it is important that the PC application configures the baud rate to
be the same as what is configured on the eUSCI_A0.
2.2.5
Special Features
2.2.5.1
microSD Card
The MSP430FR5994 LaunchPad development kit features an onboard microSD card. With an SD card,
there is another method of cheap data logging available for users. The Out-Of-Box experience comes with
an SD Card Library that helps users interface the MSP430FR5994 with the SD card. The library lets users
store data in files with a name of their choice, so that the data can be used later in conjunction with a PC.
The slot can detect if a card is present. If a card is inserted while the MSP430FR5994 is on, an interrupt
for the MCU is generated. Table 3 lists the SD Card Detect pin and the rest of the pin assignments that
are used to communicate with the SD card.
Table 3. microSD Card to MCU Connections
microSD Card Function
MSP430FR5994 Pin
SD Card Detect
P7.2
SD SPI MOSI
P1.6
SD SPI MISO
P1.7
SD SPI CS
P4.0
SD SPI CLK
P2.2
R7 on the MSP430FR5994 LaunchPad development kit is not populated on the board to ensure accurate
LPM current measurements. Use the internal MSP pullup resistor in software, or populate R7.
R5 is also not populated. In the SD Card library, the SPI CS line is driven high or low. Often why a pullup
resistor like R5 is included is for during system startup. Before the MSP430FR5994 fully starts and outputs
a high signal on the CS line, it is possible that CS may be floating, and the SD card may interpret other
floating SPI lines as communication. It is a good practice to populate this resistor in an application where
the exact startup conditions are not controlled. For the LaunchPad development kit, this resistor is
removed for precise current measurements when all GPIO are set low.
2.2.5.2
220-mF Super Capacitor
A 220-mF (0.22-F) capacitor is mounted onboard and allows powering the system without any external
power. The super cap can be used in the following ways: charging, using (direct connection to 3V3 rail),
and disconnected. For more details on these use modes and how to use them, see Section 2.3.
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Power
The board is designed to accommodate various powering methods, including through the onboard eZ-FET
and external or BoosterPack plug-in module power (see Figure 8).
Figure 8. MSP-EXP430FR5994 Power Block Diagram
2.3.1
eZ-FET USB Power
The most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the
target side of the LaunchPad development kit. Power from the eZ-FET is controlled by jumper J101. For
3.3 V, make sure that a jumper is connected across the J101 3V3 terminal.
2.3.2
BoosterPack Plug-in Module and External Power Supply
Header J6 on the board supplies external power directly. Comply with the device voltage operation
specifications when supplying external power. The MSP430FR5994 has an operating range of 1.8 V to 3.6
V. More information can be found in the MSP430FR5994 data sheet.
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Figure 9. MSP-EXP430FR5994 Super Cap Power Block Diagram
2.3.3
Super Cap (C1)
A 220-mF (0.22-F) super cap is mounted onboard and allows powering the system without any external
power. This demonstrates the ultra-low power of the MSP430FR5994 target MCU. See how long you can
run your application on the super cap alone!
2.3.3.1
Charging the Super Cap
The super cap can be charged when the EVM is plugged into the PC or when the board is externally
powered. During charging, set J8 to the Charge setting, which adds a current limiting resistor for charging.
To charge the super cap, power must be coming from the eZ-FET debug probe, external power through
J5, or a BoosterPack plug-in module powering through J1. Allow two to three minutes for the super cap to
charge (time may vary depending on initial charge of the super cap and the power source) to full VCC.
2.3.3.2
Using the Super Cap
After charging of the super cap, move the J8 jumper to the Use setting and unplug power. This connects
the super cap to the 3V3 rail without the charging resistor. Now, the LaunchPad development kit is being
powered completely by the C1 super capacitor.
For the lowest-power operation, make sure to disconnect the J101 jumpers and remove the microSD card
if it is not in use. Removing J101 jumpers prevents the super cap from powering the eZ-FET circuitry and
consuming additional power. The microSD card has approximately 100 µA of current draw just being
plugged into the system, even when not in use. Taking these steps allows your application to be powered
longer from only the super cap.
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Disabling the Super Cap
The super cap can be completely decoupled from the board by removing the J8 jumper. Hang this jumper
off only one pin to prevent losing the jumper.
2.4
Measure MSP430 Current Draw
To measure the current draw of the MSP430FR5994 using a multimeter, use the 3V3 jumper on the J101
jumper isolation block. The current measured includes the target device and any current drawn through
the BoosterPack plug-in module headers.
To measure ultra-low power, follow these steps:
1. Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper.
2. Consider the effect that the backchannel UART and any circuitry attached to the MSP430FR5994 may
have on current draw. Consider disconnecting these at the isolation jumper block, or at least consider
their current sinking and sourcing capability in the final measurement.
3. Make sure there are no floating inputs or outputs (I/Os) on the MSP430FR5994. These cause
unnecessary extra current draw. Every I/O should either be driven out or, if it is an input, should be
pulled or driven to a high or low level.
4. Begin target execution.
5. Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
stable measurement. It is easier to measure quiescent states.
Alternatively, EnergyTrace++ technology can be used to measure the same current, and see energy
profiles through integrated GUI in CCS and IAR. EnergyTrace allows you to compare various current
profiles and better optimize the energy performance.
2.5
Clocking
The MSP-EXP430FR5994 provides external clocks in addition to the internal clocks in the device.
• Q1: 32-kHz Epson crystal (FC-135R)
• Q2: DNP high-frequency crystal footprint
The 32-kHz crystal allows for lower LPM3 sleep currents than do the other low-frequency clock sources.
Therefore, the presence of the crystal allows the full range of low-power modes to be used.
The high-frequency crystal is not populated by default, but the footprint for a crystal is provided. Populate
a high-frequency crystal for applications that need more precise high-frequency clock sources than the
internal DCO.
The internal clocks in the device default to the following configuration:
• MCLK: DCO 1 MHz
• SMCLK: DCO 1 MHz
• ACLK: REFO 32.768 kHz
For more information about configuring internal clocks and using the external oscillators, see the
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide.
2.6
Using the eZ-FET Debug Probe With a Different Target
The eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 derivative
devices, not just the onboard MSP430FR5994 target device.
To do this, disconnect every jumper in the isolation jumper block. This is necessary, because the debug
probe cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.
Next, make sure the target board has proper connections for SBW. To be compatible with SBW, the
capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430
JTAG interface circuitry is the MSP430 Hardware Tools User's Guide.
Finally, wire together these signals from the debug probe side of the isolation jumper block to the target
hardware:
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•
•
•
•
•
•
•
5 V (if 5 V is needed)
3.3 V
GND
SBWTDIO
SBWTCK
TXD (if the UART backchannel is to be used)
RXD (if the UART backchannel is to be used)
This wiring can be done either with jumper wires or by designing the board with a connector that plugs into
the isolation jumper block.
2.7
BoosterPack Plug-in Module Pinout
This LaunchPad development kit complies with the 40-pin LaunchPad development kit pinout standard.
This standard was created to aid compatibility between LaunchPad development kits and BoosterPack
plug-in modules across the TI ecosystem.
The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPad development
kit like the MSP-EXP430FR4133. This allows some subset of functionality of 40-pin BoosterPack plug-in
modules to be used with 20-pin LaunchPad development kits.
While most BoosterPack plug-in modules are compliant with the standard, some are not. The MSPEXP430FR5994 LaunchPad development kit is compatible with all 40-pin BoosterPack plug-in module that
comply with the standard. If the reseller or owner of the BoosterPack plug-in module does not explicitly
indicate compatibility with the MSP-EXP430FR5994 LaunchPad development kit, compare the schematic
of the candidate BoosterPack plug-in module with the LaunchPad development kit to ensure compatibility.
Keep in mind that sometimes conflicts can be resolved by changing the MSP430FR5994 MCU pin
function configuration in software.
To check the compatibility of your desired BoosterPack plug-in module for your design, with a LaunchPad
development kit of your choice, you can use the BoosterPack Checker tool (see Figure 10). This allows
you to select any LaunchPad development kit we offer and determine its compatibility with any number of
BoosterPack plug-in module that we offer. You can also add your own BoosterPack plug-in module to
check its compatibility as you prototype that next design.
Figure 10. BoosterPack Plug-in Module Checker Tool
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Figure 11 shows the 40-pin pinout of the MSP430FR5994 LaunchPad development kit.
Software configuration of the pin functions plays a role in compatibility. The LaunchPad development kit
side of the dashed line shows only the applicable function for conforming to the standard. However, each
pin has other functionality that can be configured by the software. See the MSP430FR5994 data sheet for
more details on individual pin functions.
Figure 11. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout
2.8
2.8.1
Design Files
Hardware
See Section 6 for schematics. All design files including schematics, layout, bill of materials (BOM), Gerber
files, and documentation are available on the MSP-EXP430FR5994 Design File Download Page.
2.8.2
Software
All design files including TI-TXT object-code firmware images, software example projects, and
documentation are available on the MSP-EXP430FR5994 Design File Download Page.
2.9
Hardware Change Log
Table 4 lists the change history for all released hardware revisions.
Table 4. Hardware Change Log
PCB Revision
Rev 1.1
3
Description
Initial Release
Software Examples
Software examples are included with the MSP430FR5994 LaunchPad development kit (see Table 5), and
can be found in the MSP430FR5994 LaunchPad development kit Download Page and are also available
in MSP430Ware for MSP Microcontrollers.
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Table 5. Software Examples
Demo Name
BoosterPack Required
Description
More Details
OutOfBox_FR5994
None
The out-of-box demo pre-programmed on the LaunchPad
from the factory. Demonstrates features of
MSP430FR5994 MCU.
BlinkLED_FR5994
None
Blinks an LED on the LaunchPad at a fixed interval.
Section 3.2
Section 3.1
BOOSTXL-AUDIO_
RecordPlayback_
MSP430FR5994
• MSPEXP430FR5994
• BOOSTXL-AUDIO
Demonstrates how to record and playback audio from
FRAM memory using DMA.
Section 3.3
BOOSTXL-AUDIO_
LEA_MSP430FR5994
• MSPEXP430FR5994
• BOOSTXL-AUDIO
• 430BOOSTSHARP96 or
BOOSTXLSHARP128
Demonstrates the performance of the MSP low-energy
accelerator (LEA) by performing FFT and FIR.
Section 3.4
EEPROM Emulation
reference design
• MSPEXP430FR5994
Emulates EEPROM using FRAM technology on MSP
supporting both I2C and SPI
Section 3.5
To use any of the software examples with the LaunchPad kit, you must have an integrated development
environment (IDE) that supports the MSP430FR5994 MCU. Table 6 lists the minimum requirements for
IDEs.
Table 6. IDE Minimum Requirements for MSP-EXP430FR5994
Code Composer Studio™ IDE
IAR Embedded Workbench® IDE
Code Composer Studio IDE v6.1.3 or later
IAR Embedded Workbench for MSP430 v6.40.2 or later
For more details on how to get started quickly, and where to download the latest Code Composer Studio
and IAR Embedded Workbench IDEs, see Section 4.
3.1
Out-of-Box Software Example
This section describes the functionality and structure of the out-of-box software that is preloaded on the
EVM.
3.1.1
Source File Structure
The project is organized in multiple files. This organization makes it easier to navigate and to reuse parts
of it for other projects. Table 7 describes each file in the project
Table 7. Source File and Folders
Name
Description
main.c
The out-of-box demo main function, initializations, shared ISRs, and more
LiveTempMode.c
Contains functions for the live temperature streaming mode
FRAMLogMode.c
Contains functions for the FRAM data logging mode
SDCardLogMode.c
Contains function for the SD card data logging mode
Library: Driverlib
Device driver library
Library: FatFs
Generic FAT file system module for small embedded systems (FatFs)
HAL/HAL_SDCard.c
Hardware abstraction layer for board/device to SD card connection
Library: SDCardLib
Wrapper library to provide higher-level SD card APIs
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Out-of-Box Demo GUI
The out-of-box demo GUI (see Figure 12) is required to control the out-of-box application running on the
MSP-EXP430FR5994 LaunchPad development kit. The GUI can be found in the latest MSPWare
installation or in MSP-EXP430FR5994_Software_Examples.zip, available on the MSP-EXP430FR5994
Design File Download Page.
Figure 12. MSP-EXP430FR5994 Out-of-Box Demo GUI
Establish connection to the LaunchPad development kit by first clicking the Connect button, followed by
selecting the correct Serial COM Port (MSP Application UART1) and clicking the Open button. On
Windows, open Device Manager → Ports (COM & LPT) to verify the corresponding COM port of the
backchannel UART.
After connection has been established, the GUI pings the LaunchPad development kit every few seconds
to make sure that it is still present and to keep the serial port open. If no response is received from the
LaunchPad development kit, the GUI automatically closes the serial port connection.
3.1.3
Power Up and Idle
When the LaunchPad development kit powers up after being connected to a computer, the red and green
LEDs toggle several times to indicate that the out-of-box demo is running. The MSP430FR5994 then
enters low-power mode 3 to wait for UART commands from the PC GUI.
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3.1.4
Live Temperature Mode
To enter the live temperature mode, click the Start button below Live Temp Mode in the GUI Application
Controls panel (see Figure 13).
Figure 13. Live Temperature Mode
The MSP430FR5994 first sends two ADC calibration constants for the temperature sensor to the PC GUI.
It then sets up its 12-bit ADC for sampling and converting the signals from its internal temperature sensor.
A hardware timer is also configured to trigger the ADC conversion every 0.125 seconds before the device
enters low-power mode 3 to conserve power. As soon as the ADC sample and conversion is complete,
the raw ADC data is sent the through the UART backchannel to the PC GUI.
As the raw ADC data is received by the PC GUI, Celsius and Fahrenheit units are calculated first. The PC
GUI keeps a buffer of the most recent 100 temperature measurements, which are graphed against the
current time of the PC on the Incoming Data panel.
A red horizontal line is drawn across the data plot to indicate the moving average of the incoming data.
To exit this mode, click the Stop button under Live Temp Mode. You must exit this mode before starting
the other modes.
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FRAM Log Mode
To enter the FRAM Log Mode, click the Start button under FRAM Log Mode in the GUI Application
Controls panel. The PC GUI also sends its current timestamp over UART to be stored in the LaunchPad
development kit. This timestamp is later used to extrapolate the X-axis time values when the FRAM
logged data are transferred to the GUI (see Figure 14).
Figure 14. FRAM Log Mode
When the MSP430FR5994 receives the UART command from the GUI, it starts the entry sequence by
initializing the Real-Time Clock to trigger an interrupt every 5 seconds. The red LED blinks three times to
indicate successful entry into FRAM Log Mode.
The MSP430FR5994 wakes up every 5 seconds from low-power mode 3 to perform data logging before
going back to low-power mode 3. The GUI automatically disconnects from the LaunchPad development kit
after entering FRAM Log Mode. Each time the device wakes up, the green LED lights up to indicate a data
point is stored. Two 10000 long FRAM array buffers are allocated to store the raw ADC output data.
Because the device can be powered solely with the onboard Super Cap, the 12-bit ADC is set up to
sample and convert the signals from its internal temperature sensor and battery monitor (super cap
voltage).
The board allows powering the application with the USB cable or the onboard super cap. See
Section 2.3.3 for more detail on the super cap. To switch to the super cap:
1. While board is powered through USB, configure the jumper to Charge on J8. Wait 2 to 3 minutes.
2. Start FRAM Logging.
3. Switch the jumper on J8 to Use.
4. Disconnect the SBWTDIO and 3v3 jumpers on J101 (to prevent back powering the eZ-FET).
5. Disconnect the USB.
NOTE: Remove the SD card from the holder to reduce power consumption and extend application
run time when using the super cap.
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To exit the FRAM Log Mode, press the S2 (right) push button on the LaunchPad development kit. The red
LED turns on briefly to indicate successful exit and return to the Power up and Idle state. Reattach the
jumpers to the default positions and connect USB. Re-open the serial port to the LaunchPad development
kit in the GUI. Click the Transfer FRAM Data button to transmit the logged temperature and voltage data
from the device FRAM to the PC.
3.1.6
SD Card Log Mode
The SD card mode works similarly to the FRAM Log Mode, except that the temperature and voltage data
are stored into .txt files on the SD card. Each time the SD card log mode is started, a new LOG_#.TXT (#
increments for the next file) is created under /root/DATA_LOG/.
Enter and exit SD card log mode the same way that you enter and exit FRAM log mode. Click Show SD
Card Data to transfer the data from the most recently created LOG_#.TXT to the PC.
NOTE: The super cap cannot power the SD card log mode for long periods of time, because the SD
card consumes significantly more power.
3.2
Blink LED Example
This simple software example demonstrates how to software toggle a GPIO to blink an LED on the
LaunchPad kit.
3.2.1
Source File Structure
The project is split into multiple files (see Table 8). This makes it easier to navigate and reuse parts of it
for other projects.
Table 8. Source File and Folders
Name
Description
main.c
The Blink LED main function
Library: Driverlib
Device driver library
The main code uses the MSP430 Driver Library to halt the watchdog timer and to configure/toggle the
P1.0 GPIO pin connected to the LED inside a software loop.
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BOOSTXL-AUDIO Audio Record and Playback Example
This section describes the functionality and structure of the BOOSTXLAUDIO_RecordPlayback_MSP430FR5994 demo that is included in the MSP-EXP430FR5994 Software
Examples download, or that is more easily accessible through MSPWare (see Section 4.3).
3.3.1
Source File Structure
The project is split into multiple files (see Table 9). This makes it easier to navigate and reuse parts of it
for other projects.
Table 9. Source File and Folders
Name
3.3.2
Description
main.c
The demo's clock, GPIO, DAC and interrupt configurations.
application/application.c
Main application loop and interrupt service routines
application/audio_collect.c
Setup, start, stop and shutdown audio collect functions
application/audio_playback.c
Setup, start and stop playback functions and interrupt service routines
application/dac8311.c
Operating modes/functions of the onboard SPI DAC
application/global.h
Global variables definitions
Library: driverlib
Device driver library
Operation
This demo uses the built-in ADC12 on the MSP430FR5994 MCU to sample from the output of the analog
microphone on the Audio Signal Processing BoosterPack plug-in module. Using direct memory access
(DMA), the 12-bit microphone data is stored and retrieved from FRAM memory. During playback, the
microphone data is sent through SPI to the onboard DAC to drive the audio output of the onboard speaker
or headphones.
To begin recording an audio sample, press switch S1 on the MSP-EXP430FR5994 (see Figure 15). LED1
turns on while audio is being recorded and turns off when the recording phase is complete. Headphones
with an inline microphone can be used to record audio. The BoosterPack plug-in module automatically
detects the inline microphone when the headphones are plugged into the provided jack (J6) and records
from it instead of the onboard microphone.
Figure 15. Record
To play back the recorded audio sample, press switch S2 on the MSP-EXP430FR5994 LaunchPad
development kit (see Figure 16). LED2 turns on during playback and turns off when the playback phase is
complete. To use headphones to listen to the audio playback, plug headphones into the provided jack J6.
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Figure 16. Playback
3.4
Filtering and Signal Processing With LEA Reference Design Example
This section describes the functionality and structure of the Filtering and Signal Processing With LEA
reference design. Its software can be downloaded from TIDM-FILTERING-SIGNALPROCESSING-LEA
Software.
3.4.1
Source File Structure
The project is split into multiple files (see Table 10). This makes it easier to navigate and reuse parts of it
for other projects.
Table 10. Source File and Folders
Name
Description
main.c
The demo's clock, GPIO, display and interrupt configurations.
application/application.c
Main application loop and interrupt service routines
application/audio_collect.c
Setup, start, stop and shutdown audio collect functions
application/audio_playback.c
Setup, start and stop playback functions and interrupt service routines
application/dac8311.c
Operating modes/functions of the onboard SPI DAC
application/global.h
Global variables definitions
application/fir.c
FIR filtering functions
application/FFT.c
Fast Fourier Transform filtering functions
application/FFT_430.asm
MSP430 Fast Fourier Transform filtering functions in assembly
application/benchmark.c
Performance benchmark timer and interrupt service routines
application/fir_coefficient
FIR coefficient definitions
Library: DSPLib
MSP430 DSP Library
Library: grlib
MSP430 Graphics Library
Library: driverlib
Device driver library
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Operation
This demo is a TI reference design that highlights the signal processing capabilities and performance of
the MSP430FR5994 MCU and its integrated low-energy accelerator (LEA). This example also uses the
430BOOST-SHARP96 or the BOOSTXL-SHARP128 BoosterPack plug-in modules to display the filtered
output of the audio signal and act as a user interface. To use this code example user's must configure the
Audio BoosterPack plug-in module to use its alternate microphone power and output pins by moving the
0-ohm resistor on R1 to R3 and R4 to R5 as shown in Figure 17. For more information on this example,
visit the reference design page.
Figure 17. Alternate Microphone Configuration
3.5
Emulating EEPROM Reference Design Example
This section describes the functionality and structure of the Emulating EEPROM reference design. Its
software can be downloaded from TIDM-FRAM-EEPROM Software.
3.5.1
Source File Structure
The project is split into multiple files (see Table 11). This makes it easier to navigate and reuse parts of it
for other projects.
Table 11. Source File and Folders
Name
24
Description
main.c
The demo's clock, GPIO, EEPROM initialization and interrupt configurations.
eeprom_interface/eeprom_i2c.c
EEPROM I2C interface initialization and functions
eeprom_interface/eeprom_spi.c
EEPROM SPI interface initialization and functions
eeprom_definitions.h
Global variables definitions
eeprom.c
EEPROM standard functions
sensing_proc.c
Functions for sampling temperature and voltage
Library: driverlib
Device driver library
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3.5.2
Operation
The EEPROM emulation is configured to use I2C or SPI protocol in Slave mode as indicated by Figure 18
and Figure 19. It would typically be connected to a host processor which would act as the master. This
implementation, unlike traditional EEPROM, requires no caching after several hundred bytes. The host
could continuously write data to memory once the communication is initiated. And the data is immediately
written to memory. This means that the application could continuously stream data with much higher
throughput. The SPI operation also includes DMA.
MSP430FR5994
SCLK
MOSI
FRAM EEPROM
Host Processor
MISO
VCC Measure/
Sensing
CS
WP
TIDM-FRAM-EEPROM
Figure 18. EEPROM SPI Interface Block Diagram
VCC
MSP430FR5994
SCL
SDA
FRAM EEPROM
Host Processor
VCC Measure
and Sensing
WP
TIDM-FRAM-EEPROM
Figure 19. EEPROM I2C Interface Block Diagram
This reference design also emulates industry standard EEPROM protocols such as I2C and SPI, as well
as a write protection pin to ensure that the device is protected from any writes. On top of EEPROM
emulation, the reference design periodically samples the ADC for the latest VCC and temperature and
stores it in FRAM at a low priority. When the host application requests the data, it is immediately available.
The sensor data is currently configured to periodically sample every second and can be custom tailored
for the application. The sensor reading does not block the EEPROM emulation. The EEPROM emulation
is the highest priority function. For more information on this example, visit the reference design page.
4
Resources
4.1
Integrated Development Environments
Although the source files can be viewed with any text editor, more can be done with the projects if they're
opened with a development environment like Code Composer Studio IDE and IAR Embedded Workbench
IDE.
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Resources
4.1.1
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TI Cloud Development Tools
TI's Cloud-based software development tools provide instant access to MSPWare content and a webbased IDE.
4.1.1.1
TI Resource Explorer Cloud
TI Resource Explorer Cloud provides a web interface for browsing examples, libraries and documentation
found in MSPWare without having to download files to your local drive (see Figure 20).
Learn more about TI Resource Explorer Cloud now at dev.ti.com.
Figure 20. TI Resource Explorer Cloud
4.1.1.2
Code Composer Studio Cloud
Code Composer Studio Cloud (CCS Cloud) is a web-based IDE that enables you to quickly create, edit,
build and debug applications for your LaunchPad development kit (see Figure 21). No need to download
and install large software packages, simply connect your LaunchPad development kit and begin. You can
choose to select from a large variety of examples in MSPWare software and Energia or develop your own
application. CCS Cloud supports debug features such as execution control, breakpoints and viewing
variables.
A full comparison between CCS Cloud and CCS Desktop is available here.
Learn more about Code Composer Studio Cloud now at dev.ti.com.
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Figure 21. CCS Cloud
4.1.2
Code Composer Studio™ IDE
Code Composer Studio Desktop is a professional integrated development environment that supports TI's
Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools
used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code
editor, project build environment, debugger, profiler, and many other features.
Learn more about CCS and download it from the Code Composer Studio (CCS) Integrated Development
Environment (IDE) page.
CCS v6.1.3 or higher is required. When CCS has been launched, and a workspace directory chosen, use
Project>Import Existing CCS Eclipse Project. Direct it to the desired demo's project directory that contains
main.c (see Figure 22).
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Figure 22. Directing the Project>Import Function to the Demo Project
Selecting the \CCS subdirectory also works. The CCS-specific files are located there.
When you click OK, CCS should recognize the project and allow you to import it. The indication that CCS
has found it is that the project appears in the box shown in 19, and it has a checkmark to the left of it.
Figure 23. When CCS Has Found the Project
Sometimes CCS finds the project but does not show a checkmark. This might mean that the workspace
already has a project by that name. Resolve this conflict by renaming or deleting that project. Even if you
do not see it in the CCS workspace, check the workspace directory on the file system.
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4.1.3
IAR Embedded Workbench for MSP430
IAR Embedded Workbench for MSP430 is another very powerful integrated development environment that
allows you to develop and manage complete embedded application projects. It integrates the IAR C/C++
Compiler, IAR Assembler, IAR ILINK Linker, editor, project manager, command line build utility, and IAR
C-SPY® Debugger.
Learn more about IAR Embedded Workbench for MSP430 and download it at
http://supp.iar.com/Download/SW/?item=EW430-EVAL.
IAR 6.30 or higher is required. To open the demo in IAR, click File>Open>Workspace…, and browse to
the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is
contained within this file.
The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace by
clicking Project>Add-Existing-Project….
Although the software examples have all of the code required to run them, IAR users may download and
install MSPWare, which contains MSP430 libraries and the TI Resource Explorer. By default, these are
already included in a CCS installation.
4.2
LaunchPad Websites
For more information about the LaunchPad development kit, supported BoosterPack plug-in modules, and
available resources, visit:
• MSP-EXP430FR5994 tool folder: Resources specific to this particular LaunchPad development kit
• TI LaunchPad portal: Information about all LaunchPad kits from TI
4.3
MSPWare and TI Resource Explorer
TI Resource Explorer is a tool integrated into CCS that allows you to browse through available design
resources (see Figure 24). TI Resource Explorer helps you quickly find what you need inside packages
including MSPWare, ControlSuite, TivaWare, and more. TI Resource Explorer is well organized to find
everything quickly, and you can import software projects into your workspace in one click.
TI Resource Explorer Cloud is one of the TI Cloud Development tools, and it is tightly integrated with CCS
Cloud. See Section 4.1.1 for more information.
MSPWare is a collection of code examples, software libraries, data sheets, and other design resources for
all MSP devices delivered in a convenient package–essentially everything developers need to become
MSP experts.
In addition to providing a complete collection of existing MSP design resources, MSPWare also includes a
high-level API called MSP Driver Library. This library makes it easy to program MSP hardware. For more
information, visit MSP430Ware for MSP Microcontrollers.
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Figure 24. Using TI Resource Explorer to Browse MSP-EXP430FR5994 in MSPWare
Inside TI Resource Explorer, these examples and many more can be found, and easily imported into CCS
with one click.
4.4
FRAM Utilities
The Texas Instruments™ FRAM Utilities is a collection of embedded software utilities that leverage the
ultra-low-power and virtually unlimited write endurance of FRAM. The utilities are available for
MSP430FRxx FRAM microcontrollers and provide example code to help start application development.
4.4.1
Compute Through Power Loss (CTPL)
CTPL is a utility API set that enables ease of use with LPMx.5 low-power modes and a powerful shutdown
mode that allows an application to save and restore critical system components when a power loss is
detected.
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4.5
4.5.1
MSP430FR5994 MCU
Device Documentation
At some point, you will probably need more information about the MSP430FR5994 MCU. For every MSP
device, the documentation is organized as shown in Table 12.
Table 12. How MSP Device Documentation is Organized
Document
4.5.2
For MSP430FR5994
Description
Device family
user's guide
MSP430FR58xx, MSP430FR59xx, and
MSP430FR6xx Family User's Guide
Architectural information about the device,
including all modules and peripherals such as
clocks, timers, ADC, and so on.
Device-specific
data sheet
MSP430FR599x, MSP430FR596x Mixed-Signal
Microcontrollers
Device-specific information and all parametric
information for this device
MSP430FR5994 Code Examples
MSP430FR599x, MSP430FR596x Code Examples is a set of simple C examples that demonstrate how to
use the entire set of MSP430 peripherals (including serial communication, ADC12, LCD_C, Timer_A,
Timer_B, and others) through direct register access.
Every MSP derivative has a set of these code examples. When starting a new project or adding a new
peripheral, these examples serve as a great starting point. There are also MSP Driver Library based code
examples available in MSPWare.
4.5.3
MSP430 Application Notes and TI Reference Designs
Visit www.ti.com/msp430 for many application notes and reference designs with practical design examples
and topics.
4.6
4.6.1
Community Resources
TI E2E™ Support Forums
Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the TI experts.
4.6.2
Community at Large
Many online communities focus on the LaunchPad development kits (for example, http://www.43oh.com).
You can find additional tools, resources, and support from these communities.
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FAQ
5
www.ti.com
FAQ
Q: I can't get the backchannel UART to connect. What's wrong?
A:
•
•
•
Check the following:
Do the baud rate in the host terminal application and the eUSCI settings match?
Are the appropriate jumpers in place, on the isolation jumper block?
Probe on RXD and send data from the host. If you don't see data, it might be a problem on the host
side.
• Probe on TXD while sending data from the MSP. If you don't see data, it might be a configuration
problem with the eUSCI module.
• Consider the use of the hardware flow control lines (especially for higher baud rates).
Q: The MSP G2 LaunchPad had a socket, allowing me change the target device. Why doesn't this
LaunchPad kit use one?
A: This LaunchPad development kit provides more functionality, and this means using a device with more
pins. Sockets for devices with this many pins are too expensive for the target price of the LaunchPad
development kits.
32
MSP430FR5994 LaunchPad™ Development Kit (MSP‑EXP430FR5994)
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Schematics
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6
Schematics
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Figure 25. Schematics (1 of 7)
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Schematics
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Figure 26. Schematics (2 of 7)
34
MSP430FR5994 LaunchPad™ Development Kit (MSP‑EXP430FR5994)
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Schematics
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Figure 27. Schematics (3 of 7)
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Schematics
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Figure 28. Schematics (4 of 7)
36
MSP430FR5994 LaunchPad™ Development Kit (MSP‑EXP430FR5994)
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Figure 29. Schematics (5 of 7)
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Schematics
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Figure 30. Schematics (6 of 7)
38
MSP430FR5994 LaunchPad™ Development Kit (MSP‑EXP430FR5994)
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Schematics
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Figure 31. Schematics (7 of 7)
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Revision History
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from April 27, 2016 to September 3, 2019 ....................................................................................................... Page
•
•
•
•
40
Added BOOSTXL-SHARP128 as a supported BoosterPack module in Table 5, Software Examples .......................
Changed required IAR Embedded Workbench IDE version to v6.40.2 in Table 6, IDE Minimum Requirements for MSPEXP430FR5994 ..........................................................................................................................
Added BOOSTXL-SHARP128 as a supported BoosterPack module in Section 3.4.2, Operation ............................
Updated all figures in Section 6, Schematics ........................................................................................
Revision History
17
17
24
33
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