MSP430™ Hardware Tools
User’s Guide
Literature Number: SLAU278AH
MAY 2009 – REVISED MARCH 2021
www.ti.com
Table of Contents
Table of Contents
Read This First...........................................................................................................................................................................7
How to Use This Manual.......................................................................................................................................................... 7
Information About Cautions and Warnings...............................................................................................................................8
Related Documentation From Texas Instruments.................................................................................................................... 8
If You Need Assistance............................................................................................................................................................ 9
1 Get Started Now!................................................................................................................................................................... 11
1.1 Kit Contents, MSP-TS430xx............................................................................................................................................ 12
1.2 Kit Contents, MSP-FET430xx.......................................................................................................................................... 14
1.3 Kit Contents, MSP-FET....................................................................................................................................................14
1.4 Kit Contents, MSP-FET430UIF........................................................................................................................................ 14
1.5 Kit Contents, MSP-FET430PIF........................................................................................................................................ 14
1.6 Kit Contents, eZ430-F2013.............................................................................................................................................. 14
1.7 Kit Contents, eZ430-T2012.............................................................................................................................................. 14
1.8 Kit Contents, eZ430-RF2500........................................................................................................................................... 15
1.9 Kit Contents, eZ430-RF2500T......................................................................................................................................... 15
1.10 Kit Contents, eZ430-RF2500-SEH.................................................................................................................................15
1.11 Kit Contents, eZ430-Chronos-xxx.................................................................................................................................. 15
1.12 Kit Contents, FET430F6137RF900................................................................................................................................16
1.13 Kit Contents, EM430Fx1x7RF900..................................................................................................................................16
1.14 Hardware Installation, MSP-FET and MSP-FET430UIF................................................................................................ 16
1.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900.......................17
1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529........................... 17
1.17 Important MSP430 Documents on the Web...................................................................................................................17
2 Design Considerations for In-Circuit Programming..........................................................................................................19
2.1 Signal Connections for In-System Programming and Debugging....................................................................................20
2.2 External Power.................................................................................................................................................................24
2.3 Bootloader (BSL)..............................................................................................................................................................24
A Frequently Asked Questions and Known Issues..............................................................................................................25
A.1 Hardware FAQs............................................................................................................................................................... 26
A.2 Known Issues.................................................................................................................................................................. 28
MSP-FET430UIF................................................................................................................................................................ 28
MSP-FET430PIF................................................................................................................................................................ 28
B Hardware...............................................................................................................................................................................29
B.1 MSP-TS430D8.................................................................................................................................................................31
B.2 MSP-TS430PW14........................................................................................................................................................... 34
B.3 MSP-TS430L092............................................................................................................................................................. 37
B.4 MSP-TS430L092 Active Cable........................................................................................................................................ 40
B.5 MSP-TS430PW20........................................................................................................................................................... 43
B.6 MSP-TS430RHL20.......................................................................................................................................................... 48
B.7 MSP-TS430PW24........................................................................................................................................................... 51
B.8 MSP-TS430RGE24A....................................................................................................................................................... 54
B.9 MSP-TS430DW28........................................................................................................................................................... 57
B.10 MSP-TS430PW28......................................................................................................................................................... 60
B.11 MSP-TS430PW28A....................................................................................................................................................... 63
B.12 MSP-TS430RHB32A..................................................................................................................................................... 66
B.13 MSP-TS430DA38.......................................................................................................................................................... 69
B.14 MSP-TS430QFN23x0....................................................................................................................................................72
B.15 MSP-TS430RSB40........................................................................................................................................................75
B.16 MSP-TS430RHA40A..................................................................................................................................................... 78
B.17 MSP-TS430DL48...........................................................................................................................................................81
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Table of Contents
B.18 MSP-TS430PT48...........................................................................................................................................................84
B.19 MSP-TS430PT48A........................................................................................................................................................ 88
B.20 MSP-TS430RGZ48B..................................................................................................................................................... 92
B.21 MSP-TS430RGZ48C..................................................................................................................................................... 95
B.22 MSP-TS430PM64..........................................................................................................................................................98
B.23 MSP-TS430PM64A..................................................................................................................................................... 101
B.24 MSP-TS430PM64D..................................................................................................................................................... 104
B.25 MSP-TS430PM64F......................................................................................................................................................107
B.26 MSP-TS430RGC64B................................................................................................................................................... 110
B.27 MSP-TS430RGC64C................................................................................................................................................... 113
B.28 MSP-TS430RGC64USB.............................................................................................................................................. 117
B.29 MSP-TS430PN80........................................................................................................................................................ 122
B.30 MSP-TS430PN80A......................................................................................................................................................125
B.31 MSP-TS430PN80B......................................................................................................................................................128
B.32 MSP-TS430PN80C......................................................................................................................................................131
B.33 MSP-TS430PN80USB.................................................................................................................................................135
B.34 MSP-TS430PZ100.......................................................................................................................................................140
B.35 MSP-TS430PZ100A.................................................................................................................................................... 143
B.36 MSP-TS430PZ100B.................................................................................................................................................... 146
B.37 MSP-TS430PZ100C.................................................................................................................................................... 149
B.38 MSP-TS430PZ100D.................................................................................................................................................... 152
B.39 MSP-TS430PZ100E.................................................................................................................................................... 156
B.40 MSP-TS430PZ5x100...................................................................................................................................................160
B.41 MSP-TS430PZ100USB............................................................................................................................................... 163
B.42 MSP-TS430PZ100AUSB.............................................................................................................................................168
B.43 MSP-TS430PEU128....................................................................................................................................................173
B.44 EM430F5137RF900.................................................................................................................................................... 176
B.45 EM430F6137RF900.................................................................................................................................................... 180
B.46 EM430F6147RF900.................................................................................................................................................... 184
C Hardware Installation Guide..............................................................................................................................................189
Revision History.................................................................................................................................................................... 190
List of Figures
Figure 2-1. Signal Connections for 4-Wire JTAG Communication.............................................................................................21
Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx, MSP430G2xx,
and MSP430F4xx Devices.....................................................................................................................................................22
Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBW-Capable
Devices That are Not Part of F2xx, G2xx, F4xx Families...................................................................................................... 23
Figure B-1. MSP-TS430D8 Target Socket Module, Schematic................................................................................................. 31
Figure B-2. MSP-TS430D8 Target Socket Module, PCB...........................................................................................................32
Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic............................................................................................ 34
Figure B-4. MSP-TS430PW14 Target Socket Module, PCB..................................................................................................... 35
Figure B-5. MSP-TS430L092 Target Socket Module, Schematic..............................................................................................37
Figure B-6. MSP-TS430L092 Target Socket Module, PCB....................................................................................................... 38
Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic.........................................................................40
Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB.................................................................................. 41
Figure B-9. UART BSL Signal Select.........................................................................................................................................43
Figure B-10. MSP-TS430PW20 Target Socket Module, Schematic.......................................................................................... 44
Figure B-11. MSP-TS430PW20 Target Socket Module, PCB....................................................................................................45
Figure B-12. MSP-TS430RHL20 Target Socket Module, Schematic.........................................................................................48
Figure B-13. MSP-TS430RHL20 Target Socket Module, PCB.................................................................................................. 49
Figure B-14. MSP-TS430PW24 Target Socket Module, Schematic.......................................................................................... 51
Figure B-15. MSP-TS430PW24 Target Socket Module, PCB................................................................................................... 52
Figure B-16. MSP-TS430RGE24A Target Socket Module, Schematic......................................................................................54
Figure B-17. MSP-TS430RGE24A Target Socket Module, PCB............................................................................................... 55
Figure B-18. MSP-TS430DW28 Target Socket Module, Schematic..........................................................................................57
Figure B-19. MSP-TS430DW28 Target Socket Module, PCB................................................................................................... 58
Figure B-20. MSP-TS430PW28 Target Socket Module, Schematic.......................................................................................... 60
Figure B-21. MSP-TS430PW28 Target Socket Module, PCB................................................................................................... 61
Figure B-22. MSP-TS430PW28A Target Socket Module, Schematic........................................................................................63
Figure B-23. MSP-TS430PW28A Target Socket Module, PCB (Red)....................................................................................... 64
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Figure B-24. MSP-TS430RHB32A Target Socket Module, Schematic......................................................................................66
Figure B-25. MSP-TS430RHB32A Target Socket Module, PCB............................................................................................... 67
Figure B-26. MSP-TS430DA38 Target Socket Module, Schematic...........................................................................................69
Figure B-27. MSP-TS430DA38 Target Socket Module, PCB.................................................................................................... 70
Figure B-28. MSP-TS430QFN23x0 Target Socket Module, Schematic.................................................................................... 72
Figure B-29. MSP-TS430QFN23x0 Target Socket Module, PCB..............................................................................................73
Figure B-30. MSP-TS430RSB40 Target Socket Module, Schematic........................................................................................ 75
Figure B-31. MSP-TS430RSB40 Target Socket Module, PCB..................................................................................................76
Figure B-32. MSP-TS430RHA40A Target Socket Module, Schematic......................................................................................78
Figure B-33. MSP-TS430RHA40A Target Socket Module, PCB............................................................................................... 79
Figure B-34. MSP-TS430DL48 Target Socket Module, Schematic........................................................................................... 81
Figure B-35. MSP-TS430DL48 Target Socket Module, PCB.....................................................................................................82
Figure B-36. MSP-TS430PT48 Target Socket Module, Schematic........................................................................................... 84
Figure B-37. MSP-TS430PT48 Target Socket Module, PCB.....................................................................................................85
Figure B-38. MSP-TS430PT48A Target Socket Module, Schematic.........................................................................................88
Figure B-39. MSP-TS430PT48A Target Socket Module, PCB.................................................................................................. 89
Figure B-40. MSP-TS430RGZ48B Target Socket Module, Schematic......................................................................................92
Figure B-41. MSP-TS430RGZ48B Target Socket Module, PCB............................................................................................... 93
Figure B-42. MSP-TS430RGZ48C Target Socket Module, Schematic......................................................................................95
Figure B-43. MSP-TS430RGZ48C Target Socket Module, PCB............................................................................................... 96
Figure B-45. MSP-TS430PM64 Target Socket Module, PCB....................................................................................................99
Figure B-46. MSP-TS430PM64A Target Socket Module, Schematic...................................................................................... 101
Figure B-47. MSP-TS430PM64A Target Socket Module, PCB............................................................................................... 102
Figure B-48. MSP-TS430PM64D Target Socket Module, Schematic......................................................................................104
Figure B-49. MSP-TS430PM64D Target Socket Module, PCB............................................................................................... 105
Figure B-50. MSP-TS430PM64F Target Socket Module, Schematic...................................................................................... 107
Figure B-51. MSP-TS430PM64F Target Socket Module, PCB................................................................................................108
Figure B-52. MSP-TS430RGC64B Target Socket Module, Schematic....................................................................................110
Figure B-53. MSP-TS430RGC64B Target Socket Module, PCB............................................................................................. 111
Figure B-54. MSP-TS430RGC64C Target Socket Module, Schematic....................................................................................114
Figure B-55. MSP-TS430RGC64C Target Socket Module, PCB............................................................................................. 115
Figure B-56. MSP-TS430RGC64USB Target Socket Module, Schematic...............................................................................118
Figure B-57. MSP-TS430RGC64USB Target Socket Module, PCB........................................................................................ 119
Figure B-58. MSP-TS430PN80 Target Socket Module, Schematic.........................................................................................122
Figure B-59. MSP-TS430PN80 Target Socket Module, PCB.................................................................................................. 123
Figure B-60. MSP-TS430PN80A Target Socket Module, Schematic...................................................................................... 125
Figure B-61. MSP-TS430PN80A Target Socket Module, PCB................................................................................................126
Figure B-62. MSP-TS430PN80B Target Socket Module, Schematic...................................................................................... 128
Figure B-63. MSP-TS430PN80B Target Socket Module, PCB................................................................................................129
Figure B-64. MSP-TS430PN80C Target Socket Module, Schematic...................................................................................... 131
Figure B-65. MSP-TS430PN80C Target Socket Module, PCB................................................................................................132
Figure B-66. MSP-TS430PN80USB Target Socket Module, Schematic................................................................................. 136
Figure B-67. MSP-TS430PN80USB Target Socket Module, PCB...........................................................................................137
Figure B-68. MSP-TS430PZ100 Target Socket Module, Schematic....................................................................................... 140
Figure B-69. MSP-TS430PZ100 Target Socket Module, PCB.................................................................................................141
Figure B-70. MSP-TS430PZ100A Target Socket Module, Schematic.....................................................................................143
Figure B-71. MSP-TS430PZ100A Target Socket Module, PCB.............................................................................................. 144
Figure B-72. MSP-TS430PZ100B Target Socket Module, Schematic.....................................................................................146
Figure B-73. MSP-TS430PZ100B Target Socket Module, PCB.............................................................................................. 147
Figure B-74. MSP-TS430PZ100C Target Socket Module, Schematic.....................................................................................149
Figure B-75. MSP-TS430PZ100C Target Socket Module, PCB.............................................................................................. 150
Figure B-76. MSP-TS430PZ100D Target Socket Module, Schematic.....................................................................................152
Figure B-77. MSP-TS430PZ100D Target Socket Module, PCB.............................................................................................. 153
Figure B-78. MSP-TS430PZ100E Target Socket Module, Schematic.....................................................................................156
Figure B-79. MSP-TS430PZ100E Target Socket Module, PCB.............................................................................................. 157
Figure B-80. MSP-TS430PZ5x100 Target Socket Module, Schematic................................................................................... 160
Figure B-81. MSP-TS430PZ5x100 Target Socket Module, PCB.............................................................................................161
Figure B-82. MSP-TS430PZ100USB Target Socket Module, Schematic................................................................................164
Figure B-83. MSP-TS430PZ100USB Target Socket Module, PCB......................................................................................... 165
Figure B-84. MSP-TS430PZ100AUSB Target Socket Module, Schematic............................................................................. 169
Figure B-85. MSP-TS430PZ100AUSB Target Socket Module, PCB.......................................................................................170
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Table of Contents
Figure B-86. MSP-TS430PEU128 Target Socket Module, Schematic.................................................................................... 173
Figure B-87. MSP-TS430PEU128 Target Socket Module, PCB..............................................................................................174
Figure B-88. EM430F5137RF900 Target Board, Schematic................................................................................................... 176
Figure B-89. EM430F5137RF900 Target board, PCB............................................................................................................. 177
Figure B-90. EM430F6137RF900 Target Board, Schematic................................................................................................... 180
Figure B-91. EM430F6137RF900 Target Board, PCB.............................................................................................................181
Figure B-92. EM430F6147RF900 Target Board, Schematic................................................................................................... 184
Figure B-93. EM430F6147RF900 Target Board, PCB.............................................................................................................185
List of Tables
Table 1-1. Individual Kit Contents, MSP-TS430xx..................................................................................................................... 12
Table B-1. MSP-TS430D8 Bill of Materials................................................................................................................................ 33
Table B-2. MSP-TS430PW14 Bill of Materials...........................................................................................................................36
Table B-3. MSP-TS430L092 Bill of Materials.............................................................................................................................39
Table B-4. MSP-TS430L092 JP1 Settings.................................................................................................................................41
Table B-5. MSP-TS430L092 Active Cable Bill of Materials....................................................................................................... 42
Table B-6. MSP-TS430PW20 Bill of Materials...........................................................................................................................46
Table B-7. MSP-TS430RHL20 Bill of Materials......................................................................................................................... 50
Table B-8. MSP-TS430PW24 Bill of Materials...........................................................................................................................53
Table B-9. MSP-TS430RGE24A Bill of Materials (BOM)...........................................................................................................56
Table B-10. MSP-TS430DW28 Bill of Materials.........................................................................................................................59
Table B-11. MSP-TS430PW28 Bill of Materials......................................................................................................................... 62
Table B-12. MSP-TS430PW28A Bill of Materials...................................................................................................................... 65
Table B-13. MSP-TS430RHB32A Bill of Materials.....................................................................................................................68
Table B-14. MSP-TS430DA38 Bill of Materials..........................................................................................................................71
Table B-15. MSP-TS430QFN23x0 Bill of Materials................................................................................................................... 74
Table B-16. MSP-TS430RSB40 Bill of Materials....................................................................................................................... 77
Table B-17. MSP-TS430RHA40A Bill of Materials.....................................................................................................................80
Table B-18. MSP-TS430DL48 Bill of Materials.......................................................................................................................... 83
Table B-19. MSP-TS430PT48 Bill of Materials.......................................................................................................................... 86
Table B-20. MSP-TS430PT48A Bill of Materials........................................................................................................................90
Table B-21. MSP-TS430RGZ48B Bill of Materials.....................................................................................................................94
Table B-22. MSP-TS430RGZ48C Bill of Materials.................................................................................................................... 97
Table B-23. MSP-TS430PM64 Bill of Materials....................................................................................................................... 100
Table B-24. MSP-TS430PM64A Bill of Materials.....................................................................................................................103
Table B-25. MSP-TS430PM64D Bill of Materials.....................................................................................................................106
Table B-26. MSP-TS430PM64F Bill of Materials (BOM)......................................................................................................... 109
Table B-27. MSP-TS430RGC64B Bill of Materials...................................................................................................................112
Table B-28. MSP-TS430RGC64C Bill of Materials.................................................................................................................. 116
Table B-29. MSP-TS430RGC64USB Bill of Materials............................................................................................................. 120
Table B-30. MSP-TS430PN80 Bill of Materials........................................................................................................................124
Table B-31. MSP-TS430PN80A Bill of Materials..................................................................................................................... 127
Table B-32. MSP-TS430PN80B Bill of Materials..................................................................................................................... 130
Table B-33. MSP-TS430PN80C Bill of Materials..................................................................................................................... 133
Table B-34. MSP-TS430PN80USB Bill of Materials................................................................................................................ 138
Table B-35. MSP-TS430PZ100 Bill of Materials...................................................................................................................... 142
Table B-36. MSP-TS430PZ100A Bill of Materials....................................................................................................................145
Table B-37. MSP-TS430PZ100B Bill of Materials....................................................................................................................148
Table B-38. MSP-TS430PZ100C Bill of Materials................................................................................................................... 151
Table B-39. MSP-TS430PZ100D Bill of Materials................................................................................................................... 154
Table B-40. MSP-TS430PZ100E Bill of Materials....................................................................................................................158
Table B-41. MSP-TS430PZ5x100 Bill of Materials.................................................................................................................. 162
Table B-42. MSP-TS430PZ100USB Bill of Materials...............................................................................................................166
Table B-43. MSP-TS430PZ100AUSB Bill of Materials............................................................................................................ 171
Table B-44. MSP-TS430PEU128 Bill of Materials................................................................................................................... 175
Table B-45. EM430F5137RF900 Bill of Materials....................................................................................................................178
Table B-46. EM430F6137RF900 Bill of Materials....................................................................................................................182
Table B-47. EM430F6147RF900 Bill of Materials....................................................................................................................186
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Read This First
Preface
Read This First
This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the
program development tool for the MSP430™ ultra-low-power microcontrollers.
How to Use This Manual
Read and follow the instructions in Chapter 1. This section lists the contents of the FET and provides instructions
on installing the hardware and the software drivers. After you see how quick and easy it is to use the
development tools, TI recommends that you read all of this manual.
This manual describes the setup and operation of the FET but does not fully describe the MSP430
microcontrollers or the development software systems. For details of these items, see the appropriate TI
documents listed in Section 1.17.
This manual applies to the following tools:
•
•
•
•
•
•
•
•
•
MSP-FET430PIF – debug interface with parallel port connection, for all MSP430 flash-based devices
MSP-FET430UIF – debug interface with USB connection, for all MSP430 flash-based devices
MSP-FET – successor to MSP-FET430UIF, debug interface with USB connection, for all MSP430 devices
eZ430-F2013 – USB stick form factor interface with attached MSP430F2013 target, for all MSP430F20xx,
MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices
eZ430-T2012 – three MSP430F2012 based target boards
eZ430-RF2500 – USB stick form factor interface with attached MSP430F2274 and CC2500 target, for
all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and
MSP430G2x31 devices
eZ430-RF2500T – one MSP430F2274 and CC2500 target board including battery pack)
eZ430-RF2500-SEH – USB stick form factor interface with attached MSP430F2274 and CC2500 target and
solar energy harvesting module
eZ430-Chronos-xxx – USB stick form factor interface with CC430F6137 based development system
contained in a watch; includes
SBW ->
XIN
XOUT
to measure supply current
J6
Q1
DNP
J4
R2
330R
1
2
3
4
5
6
7
TEST/SBWTCK
J1
J8
3
2
1
1
2
3
4
5
6
7
J9
3
2
1
P1.7/TDO
3
2
1
J10
GND
XIN
XOUT
TEST/SBWTCK
RST/SBWTDIO
P1.7/TDO
P1.6/TDI
Socket: ENPLAS
Type: OTS-14-065
14
13
12
11
10
9
8
P1.6/TDI
14
13
12
11
10
9
8
J2
3
2
1
J11
VCC
P1.5/TMS
3
2
1
J12
2-wire "SpyBiWire": Set jumpers J7 to J12 to position 2-1
4-wire JTAG: Set jumpers J7 to J12 to position 2-3
JTAG-Mode selection:
RST/SBWTDIO
R5
47K
DNP
GND
C8
2.2nF
VCC430
P1.0
P1.1
P1.2
P1.3
P1.4/TCK
P1.5/TMS
C3
100nF
DNP
GND
MSP-TS430PW14
Ext_PWR
J3
GND
P1.4/TCK
REV:
2.0
Copyright © 2021 Texas Instruments Incorporated
ext
int
2
1
12pF C2
DNP
330R
R3
12pF C1
DNP
D1
green
2
1
C5
C7
100nF
10uF/10V
GND
+
1
2
3
Sheet: 1/1
MSP-TS430PW14 Target Socket Board
TITLE:
Document Number:
Date: 7/16/2007 8:22:36 AM
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Hardware
B.2 MSP-TS430PW14
Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic
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Hardware
Connector JTAG
For JTAG Tool
Jumper J5
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J3
External power connector
Jumper J5 to "ext"
D1
LED connected to P1.0
Jumpers J7 to J12
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
Jumper J4
Open to disconnect LED
Orient Pin 1 of MSP430 device
Jumper J6
Open to measure current
Figure B-4. MSP-TS430PW14 Target Socket Module, PCB
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Table B-2. MSP-TS430PW14 Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C7
1
10uF, 10V, Tantal Size B
511-1463-2-ND
478-3351-2-ND
3
C3, C5
1
100nF, SMD0805
4
C8
0
2.2nF, SMD0805
5
D1
1
green LED, SMD0603
6
J1, J2
0
7-pin header, TH
Digi-Key Part No.
Comment
DNP
DNP: C3
DNP
475-1056-2-ND
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder
SAM1029-07-ND
: Header
SAM1213-07-ND
: Receptacle
7
J3, J5, J7,
J8, J9, J10,
J11, J12
8
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on headers J5, J7, J8, J9,
J10, J11, J12; Pos 1-2
8
J4, J6
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
Place on: J5, J7-J12; Pos 1-2
HRP14H-ND
9
36
Description
10
JTAG
1
14-pin connector, male,
TH
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
13
R2, R3
2
330 Ω, SMD0805
541-330ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: OTS-14-0.65-01
Manuf.: Enplas
17
PCB
1
56 x 53 mm
2 layers
Apply to corners at bottom side
DNP: enclosed with kit, supplied by TI
18
Adhesive
plastic feet
4
For example, 3M
Approximately 6mm width,
Bumpons Part No.
2mm height
SJ-5302
19
MSP430
2
MSP430F2013IPW
MSP430™ Hardware Tools
DNP: keep vias free of solder
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B.3 MSP-TS430L092
Figure B-5. MSP-TS430L092 Target Socket Module, Schematic
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Settings of the MSP-TS430L092 Target Socket
Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is recommended:
•
•
JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.
JP2 and JP3 connect device supply with boost converter. They can be opened to measure device current
consumption. For default operation, they should be closed.
Connector J3
External power connector
Jumper JP1
Write enable for EPROM
Jumper JP3
Open to measure current
Orient pin 1 of
MSP430 device
Figure B-6. MSP-TS430L092 Target Socket Module, PCB
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Table B-3. MSP-TS430L092 Bill of Materials
Pos.
Ref Des No.
No. Per Board
1
C1, C2
2
330nF, SMD0603
Description
2
C5
1
100n, SMD0603
3
C6
1
10u, SMD0805
4
C10
1
100n, SMD0603
5
EEPROM1
1
M95512 SO08 (SO8)
7
J1, J2
2
Digi-Key Part No.
ST Micro M95160R
Comment
Digikey: 497-8688-1-ND
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
7-pin header, TH
SAM1213-07-ND
: Header
SAM1035-07-ND
: Receptacle
8
J3
1
3-pin header, male, TH
SAM1035-03-ND
9
J4, J5
2
FE4L, FE4H
4 pol. Stiftreihe
11
J13
1
MICRO_STECKV_10
12
JP1, JP2,JP3
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
15
L1
1
33uH, SMD0806
LQH2MCN330K02L
Farnell: 151-5557
16
LED1, LED4
2
LEDCHIPLED_0603
17
Q2
1
BC817-16LT1SMD
18
R0, R6, R7
3
2K7, SMD0603
19
R1
1
1k, SMD0603
20
R2
1
47k, SMD0603
21
R4,R5, R8,
R10, RC, RD
6
10k, SMD0603
22
RA
1
3.9k, SMD0603
23
RB
1
6.8k, SMD0603
24
U1
1
14 Pin Socket IC189-0142-146
Manuf. Yamaichi
22
MSP430
2
MSP430L092PWR
DNP: Enclosed with kit. Is
supplied by TI.
DNP; Keep vias free of solder.
Reichelt: MicroMaTchConnector: MM FL 10G
Farnell: 1686065
BC817-16LT1SMD
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Hardware
B.4 MSP-TS430L092 Active Cable
Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic
40
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Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible:
•
•
JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4.
Table B-4. MSP-TS430L092 JP1 Settings
Jumper 1
Jumper 2
Description
Off
Off
The active cable has no power and does not function.
Off
On
The active cable receives power from target socket. For this option, the
target socket must have its own power supply.
On
Off
The active cable receives power from the JTAG connector.
On
On
The JTAG connector powers the active cable and the target socket. For
this option, the target socket must not have its own power source, as
this would cause a not defined state.
JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to high and
can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.
JP2
Connector JTAG
For JTAG Tool
JP1
Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB
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Table B-5. MSP-TS430L092 Active Cable Bill of Materials
42
Pos.
Ref Des
No. Per Board
1
C1, C3, C5, C6
4
100nF, SMD0603
Description
2
C2, C4
2
1uF, SMD0805
3
R1, R10
2
10K, SMD0603
4
R2
1
4K7, SMD0603
5
R5, R6, R7, R9
4
100, SMD0603
6
R8
1
680k, SMD0603
7
R11, R15
2
1K, SMD0603
Digi-Key Part No.
Comment
8
R12
0
SMD0603
DNP
9
R13
0
SMD0603
DNP
10
R14
1
0, SMD0603
11
IC1
1
SN74AUC1G04DBVR
12
IC2, IC3, IC4
3
SN74AUC2G125DCTR
Manu: TI
Manu: TI
13
J2
1
MICRO_STECKV_10
Reichelt: MicroMaTchConnector: MM FL 10G
14
JP1
1
2x2 Header
JP2Q
Put jumper on Position 1 and 2.
Do not mix direction.
place jumper on header
15
JP2
1
2-pin header, male, TH
SAM1035-02-ND
16
JTAG
1
14-pin connector, male, TH
HRP14H-ND
17
Q1
1
BC817-25LT1SMD, SOT23BEC
Digi-Key:
BC817-25LT1GOSCT-ND
18
U1, U2
2
TLVH431IDBVR
SOT23-5
MSP430™ Hardware Tools
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Hardware
B.5 MSP-TS430PW20
The MSP-TS430PW20 microcontroller development board supports the MSP430FR23x and MSP430FR21x
FRAM devices in both 20-pin and 16-pin TSSOP (TI package code PW) packages. No microcontroller devices
are included in the MSP-TS430PW20 kit, but can be ordered from the TI Store.
The MSP-TS430PW20 microcontroller development board has two jumpers on header J11 that direct the UART
BSL signals, depending on which device is being used (see Figure B-9).
Figure B-9. UART BSL Signal Select
•
•
GROUP2: Jumpers on 3-5 and 4-6 for MSP430FR231x PW16
GROUP1: Jumpers on 1-3 and 2-4 for all other compatible devices, including MSP430FR231x PW20
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43
Vcc
ext
A
14
RXD/SIMO
TXD/SOMI/SDA12
SPICLK/SCL 10
8
6
4
2
VCC
JTAG
13
11
9
7
5
3
1
B
TP3
RST/NMI
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
C
JP4
3
2
1
47k
R4
D
DNP
EVQ11
GND
JP5
3
2 PIN15
1
JP6
E
JP7
3
2 P1.5/TMS
1
JP8
F
G
2
1
I2C
UART
2
1
H
P1.3
TEST/SBWTCK
9
7
5
BSL
10
8
6
4
2
I
GND
J2
DNP
Ext_PWR
RST/SBWTDIO
If external supply voltage:
remove R3 and add R2 (0 Ohm)
3
RXD
1
TXD/SOMI/SDA1
P1.3
GND
2 PIN16
4 RXD
6 PIN15
PW16
JP11
PW20
DVCC
PIN15 1
TDX 3
PIN14 5
R15
10k
JP16
R7
10k
1
2
3
BSL Tool Select:
Open = BSL Connector
Closed = JTAG Connector
JP13
SPICLK/SCL
JP15
JP14
RXD/SIMO
P1.2
GND
100nF
C11
TXD/SOMI/SDA
J4
TDX
20
19
18
17
16
15
14
13
12
11
SAM1029-10-ND/11-20
P1.2
P1.3
P1.4/TCK
P1.5/TMS
PIN16
PIN15
PIN14
3
2 P1.4/TCK
1
IPW20
Socket: Enplas OTS-20S-0.65-007
3
2 PIN16
1
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
SW1
1.1nF
C5
RST/SBWTDIO
U1
C7
DVCC
20
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/OA0-/A2/VEREFP1.1/UCB0CLK/ACLK/C1/A1
P1.0/UCB0STE/SMCLK/C0/A0/VEREF+ P1.3/UCB0SOMI/UCB0SCL/OA0O/A319
P1.4/UCA0STE/TCK/OA0+/A4 18
TEST/SBWTCK
P1.5//UCA0CLK/TMS/TRI0O/A5 17
RST/NMI/SBWTDIO
16
P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/TRI0-/A6
DVCC
15
P1.7/UCA0TXD/UCA0SIMO/TB2.0/TD0/TRI0+/A7/VREF+
DVSS
P2.0/TB1.1/CO 14
P2.7/TB0CLK/XIN
P2.1/TB1.2 13
P2.6/MCLK/XOUT
IPW16
P2.2/UCB0STE/TB1CLK 12
P2.5/UCB0SOMI/UCB0SCL
P2.3/UCB0CLK/TB1TRG 11
P2.4/UCB0SIMO/UCB0SDA
C6
MSP430FR231XIPW20
12p
100nF
GND
3
2
1
H
I
Title: MSP-TS430PW20
Target Socket Board for MSP430FR231x devices
File: MSP-TS430PW20
Rev.: 1.1
Date: 11/27/2015 12:49:07 PM
Page 1/1
G
A3
6
5
4
3
2
1
Copyright © 2021 Texas Instruments Incorporated
3
2
1
JP3
TEST/SBWTCK
1
P1.1
2
P1.0
3
TEST/SBWTCK
4
RST/SBWTDIO
5
DVCC
6
DVSS
7
XIN
XOUT 8
9
10
DNP
C8
DNP
F
1
2
6
5
int
JTAG ->
3
2
1
1
2
3
4
5
6
7
8
9
10
SAM1029-10-ND/1-10
J3
XOUT
XIN
DNP
DNP
QUARZ5
Q2
C9
12p
DNP
E
R2
0R
R3
0R
GND
TEST/SBWTCK1
SBW ->
P1.3
P1.0
P1.1
P1.2
D
JP18
1
2
1
2
JP17
J1
DVCC
DVSS
R14DNP
R1 330R
JP9
JP2
JP10
DVCC
2
1
JP1
0R R13
D1
green
R5 330R
DNP
D2
yellow DNP
R6 330R
DNP
D3
red DNP
GND
C
1uF/10V
DNP
SW2
B
XTLGND
TP1TP2
4
3
2
1
A
R9
0R
R8
0R
2
1
2
1
2
1
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Figure B-10. MSP-TS430PW20 Target Socket Module, Schematic
Hardware
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Connector JTAG
For JTAG Tool
Connector BSL
For Bootloader Tool
10
14
1
2
1
2
Connector J2
External power connector
Jumper J1 to "ext"
Jumper JP1
Open to measure current
JP11
Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumpers JP9, JP2, JP10
Open to disconnect LEDs
D1 to D3
LEDs connected to P1.0 to P1.2
SW1
Close to reset
Figure B-11. MSP-TS430PW20 Target Socket Module, PCB
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Table B-6. MSP-TS430PW20 Bill of Materials
46
Pos.
Ref Des
No. Per Board
1
PCB
1
90.0 x 92.5 mm
Description
"MSP-TS430PW20" Rev. 1.1
Digi-Key Part No.
2 layers, green solder mask
Comment
2
JP1, JP9,
JP13, JP14,
JP15
5
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
3
JP17, JP18
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on one pin only
4
JP2, JP10
2
2-pin header, male, TH
SAM1035-02-ND
DNP, keep pads free of solder
5
J1
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
6
JP3, JP4, JP5,
JP6, JP7, JP8
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
7
JP16
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
8
J2
1
3-pin header, male, TH
SAM1035-03-ND
9
JP11
1
2x3pin header, male, TH
SAM1034-03-ND
PW20: Place jumpers on pins
1-3 and 2-4
PW16: Place jumpers on pins
3-5 and 4-6
10
R2, R8, R9
3
0R, 0805
541-0.0ATR-ND
DNP
11
R3, R13
2
0R, 0805
541-0.0ATR-ND
12
C5
1
1.1nF, CSMD0805
490-1623-2-ND
13
C7
1
1uF/10V, CSMD0805
490-1702-2-ND
14
R7, R15
1
10k, 0805
541-10KATR-ND
15
R4
1
47k, 0805
541-47KATR-ND
16
C6, C11
2
100nF, CSMD0805
490-1666-1-ND
17
C8, C9
2
12p, DNP, CSMD0805
BC1257TR-ND
18
R1
1
330R, 0805
541-330ATR-ND
19
R5, R6
2
330R, 0805
541-330ATR-ND
DNP
20
R14
1
47k, 0805
541-47KATR-ND
DNP
21
SW2
1
EVQ-11L05R
P8079STB-ND
DNP, Keep vias free of solder
22
SW1
1
EVQ-11L05R
P8079STB-ND
DNP, Keep vias free of solder
23
J3, J4
2
10-pin header, TH
SAM1029-10-ND
DNP: headers are enclosed
with kit.
Keep vias free of solder.
24
J3, J4
2
10-pin receptacle, TH
SAM1213-10-ND
DNP: Receptacles are
enclosed with kit.
Keep vias free of solder.
25
TP1, TP2, TP3
3
Test point
DNP
DNP, keep pads free of solder
26
BSL
1
10-pin connector, male, TH
HRP10H-ND
27
JTAG
1
14-pin connector, male, TH
HRP14H-ND
28
IC1
1
Socket: OTS-20S-0.65-007
Manuf. Enplas
DNP: Free samples can be
ordered in the TI Store
29
IC1
1
MSP430FR2311IPW20
30
Q2
1
4MHz Crystal
31
Q2
1
MSV3V-T1R (32.768kHz /
20ppm / 12.5pF)
32
D1
1
green LED, HSMG-C170
DIODE0805
33
D3
1
red LED, DIODE0805
DNP
34
D2
1
yellow LED, DIODE0805
DNP
4MHz Buerklin: 78D134
DNP: Crystal is enclosed with
kit
DNP: Crystal is enclosed with
kit
516-1434-1-ND
MSP430™ Hardware Tools
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Table B-6. MSP-TS430PW20 Bill of Materials (continued)
Pos.
Ref Des
No. Per Board
35
Rubber stand
off
4
Description
Digi-Key Part No.
Buerklin: 20H1724
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Comment
apply to corners at bottom side
MSP430™ Hardware Tools
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47
BSL_SDA
0
1
0
R21
0 R20
BSL_RX R19
BSL_TX
3
2
1
TSW-103-07-G-S
J1
BSL_SCL
ext
int
VCC
VCC Current
Measurement
1
2 DVCC
R2
200
R1
330
VCC
14
12
10
8
6
4
2
JTAG
P2.2
13
11
9
7
5
3
1
RST/NMI
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
JP9
3
2
1
R8
DNP
2
C8
DNP
Q1
DNP
C9
DNP
JP10
3
2
1
DVSS
SW2
1100pF
DVSS
C5
RST/SBWTDIO
EVQ-11L05R
HFGND Connection by via
TSW-103-07-G-S
R7
DVCC
47k
TEST/SBWTCK
XIN
XOUT
TSW-103-07-G-S
XIN_ext
XOUT_ext R9
DNP
SBW ->
JTAG ->
TEST/SBWTCK1
GND
SBH11-PBPC-D07-ST-BK
R13
DNP
P2.3
P1.0
JP12
TSW-102-07-G-S
JP5
3
3
2 P1.7/TDO
1
TSW-103-07-G-S
JP6
3
2 P1.6/TDI
1
TSW-103-07-G-S
DVCC
C6
0.1µF
DVSS
C7
10µF
J3
1
2
3
4
5
6
7
8
9
10
JP7
GND
3
2 P1.5/TMS
1
TSW-103-07-G-S
VREG
4
Ext_PWR
VCC
J2
TSW-103-07-G-S
JP8
3
2 P1.4/TCK
1
TSW-103-07-G-S
C1
1µF
BSL_SCL
BSL_SDA
2
3
4
GND
9
TEST/SBWTCK 7
5
3
1
BSL_RX
BSL_TX
P1.1/UCB0CLK/ACLK/A1/VREF+/CAP1.1 1
P1.0
P1.0/UCB0STE/A0/Veref+/CAP1.0
2
TEST/SBWTCK
3
TEST/SBWTCK
RST/NMI/SBWTDIO
4
RST/SBWTDIO
DVCC
DVCC
5
DVSS
DVSS
6
P2.1/UCA0RXD/XIN
XIN
XIN_ext
7
8
XOUT_ext XOUT P2.0/UCA0TXD/XOUT
P2.6/UCB0SOMI/UCB0SCL
9
P2.5/UCB0SIMO/UCB0SDA/A7
10
DVSS
3
2
1
Texas Instruments and/or its licensors do not warrant
curacy
the acor completeness of this specification or any tion
informa
contained therein. Texas Instruments and/or its
sors
licen
do not
warrant that this design will meet the specifications,
be suitable
will
for your application or fit for any particular
rpose, pu
or will operate in an implementation. Texas Instrume
nts and/or its
licensors do not warrant that the design is production
y. You
worth
should completely validate and test your design
mentation
imple to confirm the system functionality for your
icatio
appl
BSL
5
10
8
6
4 RST/SBWTDIO
2
R3
0
If external supply voltage:
remove R3 and add R4 (0 ohm)
R4
DNP
1
3
6
SW5
4
2
4
3
SW3
4.7k
R16
4.7k
R17
2 BSL_SCL
4 BSL_SDA
1
2
2
4
BSLSCL
BSLSDA
TP1
TP2
BSL_RX
BSL_TX TP3
TP4
UART BSL Connection
BSLRX
BSLTX
1
3
1
3
I2C Pullups
SW4
I2C BSL Connection
BSLSCL
BSLSDA
DVCC
By default the UART BSL is connected
J4
© Texas Instruments 2017
http://www.ti.com
BSLSDA 10
BSLSCL 9
8
BSLTX
7
BSLRX
6
5
4
3
2
1
and the I2C BSL and the I2C pull-ups are disconnected
P1.4/TCK
P1.5/TMS
P1.6/TDI
P1.7/TDO
P2.2
P2.3
6
Designed for:Public Release
Mod. Date: 8/3/2017
Project Title: MSP-TS430RHL20
Sheet Title:
Assembly Variant:[No Variations]
Sheet:1 of 2
File: MSP-TS430RHL20_V1.0.SchDoc
Size: B
Contact: http://www.ti.com/support
P1.2/UCB0SIMO/UCB0SDA/SMCLK/A2/Veref-/CAP1.2
P1.3/UCB0SOMI/UCB0SCL/MCLK/A3/CAP1.3
VREG
P1.4/UCA0TXD/UCA0SIMO/TA0.1/TCK/CAP0.0
P1.5/UCA0RXD/UCA0SOMI/TA0.2/TMS/CAP0.1
P1.6/UCA0CLK/TA0CLK/TDI/TCLK/CAP0.2
P1.7/UCA0STE/TDO/CAP0.3
P2.2/TA1.1/SYNC/A4
P2.3/TA1.2/UCB0STE/A5
P2.4/TA1CLK/UCB0CLK/A6
AWHW-10G-0202-T
IC1
20
19
18
17
16
15
14
13
12
11
5
Orderable: EVM_orderable
TID #:
N/A
Number:
Rev: 1.0
SVN Rev: Version control disabled
Drawn By:
Engineer: M. Pridgen
A
B
C
D
Copyright © 2021 Texas Instruments Incorporated
JP1
GND
1
2
EVQ-11L05R
SW1
TSW-102-07-G-S
R10
0
TP6
Green
D1
Blue
D2
TP5
1
2
DVCC
JP11
TSW-102-07-G-S
2
1
A
B
C
D
DVSS
1
2
1
2
1
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B.6 MSP-TS430RHL20
Figure B-12. MSP-TS430RHL20 Target Socket Module, Schematic
Hardware
www.ti.com
Jumper J1
1-2 (Debugger): Power supply from JTAG interface
2-3 (External): External power supply
Connector JTAG For
JTAG Tool
Connector BLS
For Bootloader Tool
Connector J2
External power connector
Jumper J1 to External
BSL Interface Switches
Select which BSL interface to
connect to connector BSL
Jumper JP1
Open to measure current
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi Wire mode
Close 2-3 to debug in 4-wire JTAG mode
I2C pullup enable switch
Switch On to connect I2C pullup
resistors
Orient Pin 1 of MSP430 device
Jumpers JP11, JP12
Open to disconnect LEDs D1 and D2
LEDs D1, D2
LEDs connector to P1.0 and P2.3
Figure B-13. MSP-TS430RHL20 Target Socket Module, PCB
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Table B-7. MSP-TS430RHL20 Bill of Materials
Item No.
Designator
Quantity
1
!PCB
1
Printed Circuit Board
2
BSL
1
Header(Shrouded), 2.54mm,
5x2, Gold, TH
AWHW-10G-0202-T-ND
3
C1
1
CAP, CERM, 1 µF, 10 V, ±10%,
X7R, 0805
490-1695-1-ND
4
C5
1
CAP, CERM, 1100 pF, 50 V,
±5%, C0G/NP0, 0805
490-1623-1-ND
5
C6
1
CAP, CERM, 0.1 µF, 50 V,
±10%, X7R, 0805
490-1666-1-ND
6
C7
1
CAP, CERM, 10 µF, 16 V,
±10%, X5R, 0805
478-5165-1-ND
7
C8, C9
0
CAP, CERM, 22 pF, 50 V, ±5%,
C0G/NP0, 0805
490-3608-1-ND
8
D1
1
LED, Green, SMD
754-1939-1-ND
9
D2
1
LED, Blue, SMD
732-4982-1-ND
SJ5746-0-ND
50
Description
Supplier Part Number
Note
DNP
10
H5, H6, H7, H8
4
Bumpon, Cylindrical, 0.312 X
0.200, Black
11
IC1
1
Socket, QFN-20, 0.5 mm Pitch
12
J1, J2, JP5, JP6, JP7,
JP8, JP9, JP10
8
Header, 100mil, 3x1, Gold, TH
13
J3, J4
2
Header, 100mil, 10x1, Gold, TH SAM1029-10-ND
DNP: Headers are enclosed
in kit. Keep vias free of solder
14
J3, J4
2
Receptacle, 100mil, 10x1, Gold,
SAM1213-12-ND
TH
DNP: Receptacles are
enclosed in kit. Keep vias free
of solder
15
JP1, JP11, JP12
3
Header, 100mil, 2x1, Gold, TH
SAM1029-02-ND
S9170-ND
use IC564-020-130 socket
SAM1029-03-ND
16
JTAG
1
Header (shrouded), 100 mil,
7x2, Gold, TH
17
Q1
1
Crystal, 32.768 KHz, 12.5 pF,
SMD
X1A0001410014
18
R1
1
RES, 330, 5%, 0.125 W, 0805
541-330ACT-ND
19
R2
1
RES, 200, 5%, 0.125 W, 0805
541-200ACT-ND
20
R3, R10, R19, R20,
R21
5
RES, 0, 5%, 0.125 W, 0805
541-0.0ACT-ND
21
R4, R8, R9
0
RES, 0, 5%, 0.125 W, 0805
541-0.0ACT-ND
22
R7
1
RES, 47 k, 5%, 0.125 W, 0805
541-47KACT-ND
23
R13
0
RES, 47 k, 5%, 0.125 W, 0805
541-47KACT-ND
24
R16, R17
2
RES, 4.7 k, 5%, 0.125 W, 0805
541-4.7KACT-ND
25
SH‑J1, SH‑JP1,
SH‑JP5, SH‑JP6,
SH‑JP7, SH‑JP8,
SH‑JP9, SH‑JP10,
SH‑JP11, SH‑JP12
10
Shunt, 100mil, Gold plated,
Black
3M9580-ND
26
SW1, SW2
2
Switch Tactile SPST-NO 0.02A
15V
P8079STB-ND
27
SW3, SW4, SW5
3
Switch, DPST, Slide, Off-On, 1
Pos, 0.15A, 30V, TH
28
TP1, TP2, TP3, TP4,
TP5, TP6
0
Test Point, Miniature, Black, TH 36-5001-ND
GH7727-ND
MSP430™ Hardware Tools
DNP: One Epson Crystal
Included in kit
DNP
DNP
J1: 1-2, JP1: 1-2, JP5: 2-3,
JP6: 2-3, JP7: 2-3, JP8: 2-3,
JP9: 2-3, JP10: 2-3, JP11:
1-2, JP12: 1-2
Install with arrow on part
matching arrow on PCB. SW3
and SW4 should be in the
OFF position, SW5 should be
in the ON position
DNP
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B.7 MSP-TS430PW24
Figure B-14. MSP-TS430PW24 Target Socket Module, Schematic
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Connector JTAG
For JTAG Tool
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP2
Open to measure current
Orient Pin 1 of MSP430 device
D1
LED connected to P1.0
Jumper JP3
Open to disconnect LED
Figure B-15. MSP-TS430PW24 Target Socket Module, PCB
52
MSP430™ Hardware Tools
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Table B-8. MSP-TS430PW24 Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C5
1
2.2nF, SMD0805
3
C3, C7
2
10uF, 10V, SMD0805
4
C4, C6, C8
3
100nF, SMD0805
478-3351-2-ND
5
D1
1
green LED, SMD0805
P516TR-ND
6
J1, J2
0
12-pin header, TH
SAM1029-07-ND
SAM1213-07-ND
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder.
(Header and Receptacle)
7
J5, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
Place jumper on 1-2 of JP4-JP9
Place on 1-2 on JP1
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
see Pos 7 and 8
HRP14H-ND
9
Description
Digi-Key Part No.
Comment
DNP
10
JTAG
1
14-pin connector, male,
TH
11
Q1
0
Crystal
12
R1, R7
2
330 Ω, SMD0805
541-330ATR-ND
13
R5, R6, R8,
R9,
2
0 Ohm, SMD0805
541-000ATR-ND
14
R4
1
47k Ohm, SMD0805
541-47000ATR-ND
Manuf.: Enplas
2 layers
DNP: keep vias free of solder
DNP R5, R6
15
U1
1
Socket: OTS
24(28)-065-02-00
16
PCB
1
68.5 x 61 mm
17
Adhesive
plastic feet
4
Approximately 6mm width, for example, 3M Bumpons
Apply to corners at bottom side
2mm height
Part No. SJ-5302
18
MSP430
2
MSP430AFE2xx
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53
A
JTAG
13
11
9
7
5
3
1
B
TP3
RST/NMI
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
C
D
DNP
EVQ11
JP5
3
2 P1.7/TDO
1
JP6
E
3
2 P1.6/TDI
1
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
SW1
1.1nF
C5
JP7
3
2 P1.5/TMS
1
JP8
F
3
2 P1.4/TCK
1
J5
G
2
1
I2C
2
1
H
SPICLK/SCL1
TEST/SBWTCK
9
7
5
BSL
10
8
6
4
2
I
GND
J2
DNP
Ext_PWR
RST/SBWTDIO
If external supply voltage:
remove R3 and add R2 (0 Ohm)
3
P1.5/TMS
1
TXD/SOMI/SDA1
P1.3
P1.5
GND
DVCC
UART
R15
10k
JP16
R7
10k
1
2
3
BSL Tool Select:
Open = BSL Connector
Closed = JTAG Connector
JP13
SPICLK/SCL
JP15
JP14
RXD/SIMO
P1.2
TXD/SOMI/SDA
P1.4/TCK
C11
100nF
GND
3
2
1
H
I
Title: MSP-TS430RGE24A
Target Socket Board for MSP430FR2433 device
File: MSP-TS430RGE24A
Rev.: 1.0
Date: 4/28/2015 3:52:36 PM
Page 1/1
G
A3
6
5
4
3
2
1
Copyright © 2021 Texas Instruments Incorporated
14
RXD/SIMO
TXD/SOMI/SDA12
SPICLK/SCL 10
8
6
4
2
VCC
47k
R4
DVSS
18
17
16
15
14
13
SAM1029-06-ND13-18
R2
0R
R3
0R
RST/SBWTDIO
GND
DNP
DNP
XIN
XOUT
18
17
16
15
14
13
F
1
2
ext
JP4
3
2
1
IC1
E
Socket:
ENPLAS QFN-24B-0.5-0.1c
DVSS
RST/NMI/SBWTDIO
P2.6/UCA1TXD/UCA1SIMO
TEST/SBWTCK
P1.4/UCA0TXD/UCA0SIMO/TA1.2/TCK/A4 P2.5/UCA1RXD/UCA1SOMI
P2.4/UCA1CLK
P1.5/UCA0RXD/UCA0SOMI/TA1.1/TMS/A5
P3.1/UCA1STE
P1.6/UCA0CLK/TA1CLK/TDI/TCLK/A6
P2.3
P1.7/UCA0STE/SMCLK/TDO/A7
MSP430FR2433IRGE
D
JP18
1
2
1
2
JP17
TEST/SBWTCK
C6
DNP
C9
DNP
Q2
QUARZ5
C8
1
2
3
4
5
6
J6
3
2
1
DVCC
6
Vcc
int
JP3
3
2
1
DVCC
C7
100nF
GND
DNP
SAM1029-06-ND1-6
1
RST/SBWTDIO
2
TEST/SBWTCK
3
P1.4/TCK
4
P1.5/TMS
5
P1.6/TDI
6
P1.7/TDO
J3
0R
R8
0R
R9
JTAG ->
SBW ->
P1.3
P1.0
SPICLK/SCL1
P1.1
C
XTLGND
GND
TEST/SBWTCK1
DVSS
JP9
P1.2
1uF/10V
J1
DVCC
0R R13
R14DNP
R1 330R
R5 330R
JP2
JP10
B
24
23
22
21
20
19
DVCC
DVSS
XIN
XOUT
24
23
22
21
20
19
DNP
SW2
2
1
JP1
GND
DNP
D3
red DNP
R6 330R
DNP
D2
yellow DNP
D1
green
TP1TP2
5
4
3
2
1
A
SAM1029-06-ND19-24
J4
2
1
2
1
2
1
DVCC
DVSS
P2.1/XIN
P2.0/XOUT
P3.2
P2.7
P1.0/UCB0STE/TA0CLK/A0
P1.1/UCB0CLK/TA0.1/A1
P1.2/UCB0SIMO/UCB0SDA/TA0.2/A2
P1.3/UCB0SOMI/UCB0SCL/MCLK/A3
P2.2/ACLK
P3.0
7
8
9
10
11
12
SAM1029-06-ND7-12
7 P1.0
8 P1.1
9 P1.2
10 SPICLK/SCL1
11
12
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B.8 MSP-TS430RGE24A
Figure B-16. MSP-TS430RGE24A Target Socket Module, Schematic
Hardware
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Connector BSL
For bootloader tool
Connector JTAG
For JTAG tool
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector J2
External power connector
Jumper J1 to “ext”
Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Orient Pin 1 of MSP430 device
Figure B-17. MSP-TS430RGE24A Target Socket Module, PCB
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Table B-9. MSP-TS430RGE24A Bill of Materials (BOM)
56
Position
Ref Des
No. per
Board
1
PCB
1
90.0 x 92.5 mm
"MSP-TS430RGE24A" Rev.
1.0
2 layers, red solder mask
2
JP1, JP9,
JP13, JP14,
JP15
5
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
3
JP17, JP18
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on one pin only
4
JP2, JP10
2
2-pin header, male, TH
SAM1035-02-ND
DNP, keep pads free of solder
5
J1
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
6
JP3, JP4,
JP5, JP6,
JP7, JP8,
JP16
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
7
J2
1
3-pin header, male, TH
SAM1035-03-ND
8
R2, R8, R9
3
0R, 0805
541-0.0ATR-ND
9
R3, R13
2
0R, 0805
541-0.0ATR-ND
Description
Digi-Key Part No.
Comment
DNP
10
C5
1
1.1nF, CSMD0805
490-1623-2-ND
11
C7
1
1uF/10V, CSMD0805
490-1702-2-ND
12
R7, R15
1
10k, 0805
541-10KATR-ND
13
R4
1
47k, 0805
541-47KATR-ND
14
C6, C11
2
100nF, CSMD0805
490-1666-1-ND
15
R1
1
330R, 0805
541-330ATR-ND
16
R5, R6
2
330R, 0805
541-330ATR-ND
DNP
17
R14
1
47k, 0805
541-47KATR-ND
DNP
18
C8, C9
2
DNP, CSMD0805
19
SW2
1
EVQ-11L05R
P8079STB-ND
DNP, Keep vias free of solder.
Lacon: 1251459
20
SW1
1
EVQ-11L05R
P8079STB-ND
DNP, Keep vias free of solder,
Lacon: 1251459
21
J3, J4, J5, J6
4
6-pin header, TH
SAM1029-06-ND
DNP: headers enclosed in kit.
Keep vias free of solder.
22
J3, J4, J5, J6
4
6-pin receptacle, TH
SAM1213-06-ND
DNP: receptacles enclosed in
kit.
Keep vias free of solder.
23
TP1, TP2,
TP3
3
Test point
24
BSL
1
10-pin connector, male, TH
HRP10H-ND
25
JTAG
1
14-pin connector, male, TH
HRP14H-ND
26
IC1
1
Socket:QFN-24B-0.5-0.1c
Manuf. Enplas
27
IC1
1
MSP430FR2433IRGER
DNP: Free samples can be
ordered in the TI Store
28
Q2
1
DNP: MS3V-TR1 (32,768kHz/
depends on application
20ppm/12,5pF)
DNP: Micro Crystal, enclosed
in kit. Keep vias free of solder
29
D1
1
green LED, HSMG-C170
DIODE0805
Avago, Farnell 5790852
30
D3
1
red (DNP), DIODE0805
DNP
31
D2
1
yellow (DNP), DIODE0805
DNP
32
Rubber stand
off
4
DNP
DNP, keep pads free of solder
516-1434-1-ND
Buerklin: 20H1724
MSP430™ Hardware Tools
Apply to corners at bottom
side
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B.9 MSP-TS430DW28
If external supply voltage:
-
R9
GND
C2
R8
0R
R2
0R
2
Q1
560R
R3
R1
-
12pF
C1
12pF
LED3
D1
14
12
10
8
6
4
2
JTAG
ML14
13
11
9
7
5
3
1
J5
JP1Q
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
C8
TDO
TDI
TMS
TCK
P1.3
P1.2
P1.1
P1.0
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
10nF
RST/NMI
C5
C7
100nF
10uF/10V
J4
JP1Q
SMD-Footprint
F123
TST/VPP 1
VCC430 2
3
P2.5
4
GND
5
XOUT
6
XIN
RST/NMI 7
8
P2.0
9
P2.1
10
P2.2
11
P3.0
12
P3.1
13
P3.2
14
P3.3
P1.7
P1.6
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
U2
TST
VCC
P2.5
VSS
XOUT
XIN
RST
P2.0
P2.1
P2.2
P3.0
P3.1
P3.2
P3.3
R5
50K
TST/VPP
VCC
TCK
TMS
TDI
TDO
U1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
SOCK28DW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TDO
TDI
TMS
TCK
P1.3
P1.2
P1.1
P1.0
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
Socket: Yamaichi
Type: IC189-0282-042
TST/VPP
VCC430
P2.5
GND
XOUT
XIN
RST/NMI
P2.0
P2.1
P2.2
P3.0
P3.1
P3.2
P3.3
RST/NMI
1
2
3
4
5
6
7
8
9
10
11
12
13
14
FE14L
J1
J2
FE14H
28
27
26
25
24
23
22
21
20
19
18
17
16
15
R7
0R
R6
0R
TITLE:
J3
Ext_PWR
MSP-TS430DW28
Document Number:
R10 -
R11 0R
Sheet: 1/1
REV:
2.0
If external supply voltage:
remove R11 and add R10 (0 Ohm)
10
8
6
4 RST/NMI
2
ML10
not assembled
9
7
5
3
1
BOOTST
GND
1
2
3
MSP-TS430DW28 Target Socket DW28
GND
Date: 11/14/2006 1:26:04 PM
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57
MSP430™ Hardware Tools
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remove R8 and add R9 (0 Ohm)
R1, C1, C2
not assembled
GND
2
1
+
QUARZ3
Figure B-18. MSP-TS430DW28 Target Socket Module, Schematic
www.ti.com
Hardware
D1
LED connected to P1.0
Jumper J4
Open to disconnect LED
Connector J3
External power connector
Remove R8 and jumper R9
Jumper J5
Open to measure current
Connector JTAG
For JTAG Tool
Orient Pin 1 of
MSP430 device
Connector BOOTST
For Bootloader Tool
Figure B-19. MSP-TS430DW28 Target Socket Module, PCB
58
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Table B-10. MSP-TS430DW28 Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
2
C5
1
100nF, SMD0805
3
C7
1
10uF, 10V Tantal Elko B
4
C8
1
10nF
SMD0805
5
D1
1
LED3 T1 3mm yellow
RS: 228-4991
6
Q1
0
QUARZ, Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
7
J1, J2
2
Description
Digi-Key Part No.
Comment
DNP: C1, C2, Cover holes while
soldering
12pF, SMD0805
DNP: Cover holes while soldering
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder.
14-pin header, TH male
: Header
: Receptacle
7.1
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder.
2
14-pin header, TH female
J3
1
3-Pin Connector, male
9
J4, J5
2
2-Pin Connector, male
10
BOOTST
0
ML10, 10-Pin Conn., m
RS: 482-115
11
JTAG
1
ML14, 14-Pin Conn., m
RS: 482-121
12
R1, R2, R6,
R7, R8,R9,
R10, R11
4
0R, SMD0805
13
R3
1
560R, SMD0805
14
R5
1
47K, SMD0805
15
U1
1
SOP28DW socket
16
U2
0
TSSOP
: Header
: Receptacle
8
With jumper
DNP, Cover holes while soldering
DNP: R1, R2, R9, R10
Yamaichi: IC189-0282-042
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Vcc
int
ext
3
2
1
JP1
C4
14
12
10
8
6
4
2
JTAG
R5
0R
13
11
9
7
5
3
1
VCC
P1.0
GND
JTAG ->
SBW ->
XOUT/P2.7
R6
0R
DNP
TEST/SBWTCK
100nF
XIN/P2.6
JP3
R4
47k
TST
VCC
P2.5
VSS
XOUT
XIN
RST
P2.0
P2.1
P2.2
P3.0
P3.1
P3.2
P3.3
U1
P1.7
P1.6
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
14
13
12
11
10
9
8
7
6
5
4
3
2
1
J2
JP6
GND
J5
-
DNP
R3 0R
R2
DNP
Ext_PWR
3
2 P1.4/TCK
1
JP9
10
8
6
4
2
DNP
GND
If external supply voltage:
remove R11 and add R10 (0 Ohm)
9
7
5
3
1
BOOTST
3
2 P1.5/TMS
1
JP8
RST/SBWTDIO
P1.1
TEST/SBWTCK
3
2 P1.6/TDI
1
JP7
3
2 P1.7/TDO
1
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3
2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2
RST/SBWTDIO
C5
GND
P1.7/TDO
P1.6/TDI
P1.5/TMS
P1.4/TCK
P1.3
P1.2
P1.1
P1.0
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
DNP
2.2nF
28
27
26
25
24
23
22
21
20
19
18
17
16
15
P2.2
3
2
1
RST/NMI
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
3
2
1
R7
330R
JP5
TEST/SBWTCK1
VCC430 2
3
P2.5
4
GND
XOUT/P2.75
XIN/P2.6 6
RST/SBWTDIO7
8
P2.0
9
P2.1
10
P2.2
11
P3.0
12
P3.1
13
P3.2
14
P3.3
TEST/SBWTCK
3
2
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
MSP430F12xx
JP4
J1
Socket: Enplas
OTS-28-0.65-01
MSP-TS430PW28:
Target Socket Board for MSP430's in PW28 package
3.1
Copyright © 2021 Texas Instruments Incorporated
2
1
VCC430
C2
12pF
DNP
DNP
Q1
R1 330R
DNP
XTLGND
C1
12pF
D1
green
2
1
JP2
C3
10uF/10V
GND
+
GND
2
1
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B.10 MSP-TS430PW28
Figure B-20. MSP-TS430PW28 Target Socket Module, Schematic
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Hardware
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP1 to “ext”
Jumper JP2
Open to measure current
Jumper JP4 to JP9:
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1
LED connected to P5.1
Figure B-21. MSP-TS430PW28 Target Socket Module, PCB
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Table B-11. MSP-TS430PW28 Bill of Materials
Pos.(1)
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C3
1
10uF, 10V Tantal Elko B
3
C4
1
100nF, SMD0805
4
C5
0
2.2nF, SMD0805
5
D1
1
LED green SMD0603
6
Q1
0
QUARZ, Crystal
7
J1, J2
2
Description
Digi-Key Part No.
Comment
DNP: C1, C2 , Cover holes
while soldering
DNP
DNP: Cover holes and
Micro Crystal MS1V-T1K
neighboring holes while
32.768kHz, C(Load) = 12.5pF
soldering
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
14-pin header, TH male
: Header
: Receptacle
7.1
2
DNP: headers and
receptacles enclosed with
kit.Keep vias free of solder.
14-pin header, TH female
: Header
: Receptacle
(1)
62
8
J5, IP1
1
3-Pin Connector , male
8a
JP1, JP4,
JP5, JP6,
JP7, JP8, JP9
7
3-Pin Connector , male
Jumper on Pos 1-2
9
JP2, JP3
2
2-Pin Connector , male
with Jumper
10
BOOTST
0
ML10, 10-Pin Conn. , m
RS: 482-115
11
JTAG
1
ML14, 14-Pin Conn. , m
RS: 482-121
12
R1, R7
2
330R, SMD0805
12
R2, R3, R5,
R6
0
0R, SMD0805
14
R4
1
47K, SMD0805
15
U1
1
SOP28PW socket
DNP: Cover holes while
soldering
DNP
Enplas: OTS-28-0.65-01
PCB 66 x 79 mm, two layers; Rubber stand off, four pieces
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B.11 MSP-TS430PW28A
JTAG Mode selection:
4-wire JTAG: Set jumpers J4 to J9 to position 2-3
2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1
Figure B-22. MSP-TS430PW28A Target Socket Module, Schematic
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1
LED connected to P1.0
Figure B-23. MSP-TS430PW28A Target Socket Module, PCB (Red)
Note
For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be populated. If
the board is supplied internally, R3 (0 Ω) must be assembled. If the board is supplied externally, R2 (0
Ω) must be assembled, and R3 must be removed.
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Table B-12. MSP-TS430PW28A Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C5
1
2.2nF, SMD0805
3
C3
1
10uF, 10V, SMD0805
4
C4, C6,
2
100nF, SMD0805
478-3351-2-ND
5
D1
1
green LED, SMD0805
P516TR-ND
6
J1, J2
0
14-pin header, TH
7
J5, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
Place jumper on 1-2 of JP4-JP9 Place
on 1-2 on JP1
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
see Pos 7 an 8
14-pin connector, male,
TH
HRP14H-ND
9
Description
Digi-Key Part No.
Comment
DNP
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder:
(Header and Receptacle)
10
JTAG
1
11
BOOTST
0
12
Q1
0
Crystal
Micro Crystal MS3V
32.768kHz, C(Load) =
12.5pF
13
R1, R7
2
330 Ω, SMD0805
541-330ATR-ND
14
R2, R3,R5,
R6,
0
0 Ohm, SMD0805
541-000ATR-ND
15
R4
1
47k Ω, SMD0805
541-47000ATR-ND
DNP Keep vias free of solder
DNP: keep vias free of solder
DNP R2, R3,R5, R6
16
U1
1
Socket: OTS-28-0.65-01
Manuf.: Enplas
17
PCB
1
63.5 x 64.8 mm
2 layers
18
Adhesive
plastic feet
4
Approximately 6mm width, for example, 3M Bumpons
Apply to corners at bottom side
2mm height
Part No. SJ-5302
19
MSP430
2
MSP430G2553IPW28
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65
ext
Vcc
DVCC
14
12
10
8
6
4
2
JP2
JTAG
P1.4
13
11
9
7
5
3
1
GND
DVCC
RST/NMI
TCK
TMS
TDI
TDO
C8
DNP
2.2nF
R5
47K
RST
VCC
C14
1 JP4
2
3
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
TDO 1
RST 2
RST/NMI 3
JP9
RST
TEST/SBWTCK
VREF
AVSS
ROSC
GND
DVCC
VCORE
A2.0+
A2.0A3.0+
A3.0-
A0.0+
A0.0A1.0+
A1.0-
J1
SAM1029-08-ND1-8
TCK
TEST/SBWTCK
R6
R8
R9
R10
R11
R12
R13
R14
R2
100nF
DNP 10k
DNP 10k
DNP 10k
DNP 10k
DNP 10k
DNP 10k
DNP 10k
DNP 10k
20k/0.1%
R4
SAM1029-08-ND9-16
J2
U1
1 JP8
2
3
M
TMS
1 JP7
2
3
I
TDI
1 JP6
2
3
A0.0+
P2.7/TA0.2
A0.0P2.6/TA0.1
A1.0+
P2.5/TA0.0
A1.0P2.4/TA1.0
P2.3/VMONIN
A2.0+
P2.2/TA1.2
A2.0P2.1/TA1.1
A3.0+
P2.0/TA1.0/CLKIN
A3.0P1.7/UCB0SDA/UCB0SIMO/TA1CLK
VREF
P1.6/UCB0SCL/UCB0SOMI/TA0.2
AVSS
P1.5/UCB0CLK/TA0.1
ROSC
P1.4/UCB0STE/TA0.0
DVSS
P1.3/UCA0TXD/UCA0SIMO/TA0CLK/TDO/TDI
VCC
VCORE P1.2/UCA0RXD/UCA0SOMI/ACLK/TDI/TCLK
P1.1/UCA0CLK/SMCLK/TMS
RST/NMI/SBWTDIO
TEST/SBWTCK
P1.0/UCA0STE/MCLK/TCK
C
TCK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MSP430I2040TRHBQFN11T032-003
Socket:
Yamaichi
QFN11T032-003
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
O
TDO
JP5
1
2
3
P1.0
P2.7/XOUT
Q1 DNP
P2.6/XIN
R3 560R
JP3
R1
330R
3
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
P1.7/TDO 38
P1.6/TDI 37
P1.5/TMS 36
P1.4/TCK 35
34
P1.3
33
P1.2
32
P1.1
31
P1.0
30
P2.4
29
P2.3
28
P3.7
27
P3.6
26
P3.5
25
P3.4
24
P4.7
23
P4.6
22
P4.5
21
P4.4
20
P4.3
JP6
3
2 P1.7/TDO
1
J2
JP7
3
2
1
3
2
1
JP8
P2.2
3
2
1
JP9
DNP
GND
J3
DNP
R11 0R
R10 -
DNP
Ext_PWR
P1.4/TCK
10
8
6
4
2
BOOTST
9
7
5
3
1
Sheet: 1/1
REV:
1.3
GND
If external supply voltage:
remove R11 and add R10 (0 Ohm)
P1.5/TMS
RST/SBWTDIO
P1.1
TEST/SBWTCK
P1.6/TDI
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3
2-wire "SpyBiWire":Set jumpers JP4 to JP9 to position 2-1
DNP GND
R5
47k C8
10nF
U1
TEST/SBWTCK P1.7/TDO
DVCC
P1.6/TDI
P2.5
P1.5/TMS
DVSS
P1.4/TCK
P2.7
P1.3
P2.6
P1.2
RST/SBWDAT
P1.1
P2.0
P1.0
P2.1
P2.4
P2.2
P2.3
P3.0
P3.7
P3.1
P3.6
P3.2
P3.5
P3.3
P3.4
AVSS
P4.7
AVCC
P4.6
P4.0 Socket:
P4.5
P4.1 Yamaichi
P4.4
P4.2 IC189-0382-037P4.3
MSP430F2274IDA
RST/SBWTDIO
TEST/SBWTCK1
2
VCC430
3
P2.5
4
GND
5
P2.7/XOUT
6
P2.6/XIN
RST/SBWTDIO7
8
P2.0
9
P2.1
10
P2.2
11
P3.0
12
P3.1
13
P3.2
14
P3.3
15
GND
16
VCC430
17
P4.0
18
P4.1
19
P4.2
JP5
1
TEST/SBWTCK 2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
MSP-TS430DA38:
MSP-TS430DA38
Target Socket Board for MSP430F2247IDA
TITLE:
Document Number:
Date: 6/18/2008 11:04:56 AM
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2
1
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2
1
JP2
C7
10uF/10V
GND
GND
2
1
+
Figure B-26. MSP-TS430DA38 Target Socket Module, Schematic
Hardware
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
D1
LED connected to P1.0
Jumper JP3
Open to disconnect LED
Orient pin 1 of MSP430 device
Jumper JP2
Open to measure current
Connector J3
External power connector
Jumper JP1 to "ext"
Figure B-27. MSP-TS430DA38 Target Socket Module, PCB
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Table B-14. MSP-TS430DA38 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C7
1
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
0
2.2nF, SMD0805
5
D1
1
green LED, SMD0603
6
J1, J2
0
Description
Digi-Key Part No.
Comment
DNP
DNP
475-1056-2-ND
DNP: headers and
receptacles enclosed with
kit.Keep vias free of solder.
19-pin header, TH
SAM1029-19-ND
: Header
SAM1213-19-ND
: Receptacle
7
"J3, JP1, JP4,
JP5, JP6,
JP7, JP8,
JP9"
8
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on headers
JP1, JP4,JP5, JP6, JP7, JP8,
JP9; Pos 1-2
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
Place on: JP1 - JP9; Pos 1-2
HRP14H-ND
9
10
JTAG
1
14-pin connector, male, TH
11
BOOTST
0
10-pin connector, male, TH
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
13
R1, R3
2
330 Ω, SMD0805
541-330ATR-ND
14
R10, R11
0
0 Ω, SMD0805
541-000ATR-ND
541-47000ATR-ND
15
R5
1
47k Ω, SMD0805
16
U1
1
Socket: IC189-0382--037
17
PCB
1
67 x 66 mm
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430F2274IDA
DNP: Keep vias free of solder
DNP
Manuf.: Yamaichi
2 layers
for example, 3M Bumpons
Part No. SJ-5302
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side
DNP: enclosed with kit
supplied by TI
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B.14 MSP-TS430QFN23x0
Figure B-28. MSP-TS430QFN23x0 Target Socket Module, Schematic
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1
LED connected to P1.0
Figure B-29. MSP-TS430QFN23x0 Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be populated. If
the board is supplied internally, R3 (0 Ω) must be assembled. If the board is supplied externally, R2 (0
Ω) must be assembled, and R3 must be removed.
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Table B-15. MSP-TS430QFN23x0 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C3
1
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C4
1
100nF, SMD0805
478-3351-2-ND
4
C5
1
10nF, SMD0805
478-1383-2-ND
5
D1
1
green LED, SMD0603
475-1056-2-ND
6
J1, J2, J3, J4
0
Description
Digi-Key Part No.
DNP
DNP: headers and
receptacles enclosed with
kit.Keep vias free of solder.
10-pin header, TH
SAM1034-10-ND
: Header
SAM1212-10-ND
: Receptacle
7
J5, JP1
2
3-pin header, male, TH
SAM1035-03-ND
Place jumper on header JP1;
Pos 1-2.
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
3
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3
10
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
9
DNP: Keep vias free of solder
Q1
0
Crystal
Micro Crystal MS1V-T1K
DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
13
R1
1
330 Ω, SMD0805
541-330ATR-ND
14
R2, R3
0
0 Ω, SMD0805
541-000ATR-ND
541-47000ATR-ND
12
74
Comment
15
R4
1
47k Ω, SMD0805
16
U1
1
Socket: QFN-40B-0.5-01
17
PCB
1
79 x 66 mm
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430F2370IRHA
DNP
Manuf.: Enplas
2 layers
for example, 3M Bumpons
Part No. SJ-5302
MSP430™ Hardware Tools
Apply to corners at bottom
side
DNP: enclosed with kit
supplied by TI
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B.15 MSP-TS430RSB40
Figure B-30. MSP-TS430RSB40 Target Socket Module, Schematic
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1
LED connected to P1.0
Figure B-31. MSP-TS430RSB40 Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be populated. If
the board is supplied internally, R3 (0 Ω) must be assembled. If the board is supplied externally, R2 (0
Ω) must be assembled, and R3 must be removed.
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Table B-16. MSP-TS430RSB40 Bill of Materials
Pos.
Ref Des
No. Per Board
Description
1
C1, C2
0
12pF, SMD0805
2
C3, C7, C10,
C12
3
10uF, 10V, SMD 0805
445-1371-1-ND
DNP C12
3
C4, C6, C8,
C11
3
100nF, SMD0805
311-1245-2-ND
DNP C11
4
C5
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
6
D1
1
green LED, SMD0805
7
J1, J2, J3, J4
4
Digi-Key Part No.
Comment
DNP: C1, C2
P516TR-ND
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
10-pin header, TH
: Header
: Receptacle
7.1
4
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
10-pin header, TH
: Header
: Receptacle
8
JP1, JP4,JP5,
JP6, JP7, JP8,
JP9, J5, JP10
9
3-pin header, male, TH
SAM1035-03-ND
Jumper: 1-2 on JP1, JP10; 2-3
on JP4-JP9
place jumper on header
9
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
10
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
Enplas
DNP. Keep vias free of solder
12
U1
1
QFN-40B-0.4_
ENPLAS_SOCKET
13
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) = 12.5pF
DNP: Q1. Keep vias free of
solder
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8, JP9, JP10
15
16
R1,R7
2
330R SMD0805
17
R2, R3, R5,
R6, R8, R9,
R10
3
0R SMD0805
18
R4
1
47k SMD0805
19
MSP430
2
MSP430F5132
20
Rubber stand
off
4
DNP R2, R3, R5, R6
DNP: enclosed with kit. Is
supplied by TI
select appropriate; for example,
apply to corners at bottom side
Buerklin: 20H1724
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B.16 MSP-TS430RHA40A
Figure B-32. MSP-TS430RHA40A Target Socket Module, Schematic
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
D1
LED connected to P1.0
Jumper JP3
Open to disconnect LED
Orient Pin 1 of MSP430 device
Figure B-33. MSP-TS430RHA40A Target Socket Module, PCB
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Table B-17. MSP-TS430RHA40A Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP: C1, C2
2
C5
0
2.2nF, SMD0805
DNP C12
3
C3, C7
2
10uF, 10V, SMD0805 5
4
C4, C6
2
100nF, SMD0805
5
C9
1
470nF, SMD0805
6
D1
1
green LED, SMD0805
7
J1, J2, J3,
J4
4
Description
Digi-Key Part No.
Comment
DNP C11
478-3351-2-ND
P516TR-ND
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
10-pin header, TH
: Header
: Receptacle
7.1
4
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
10-pin header, TH
: Header
: Receptacle
8
J5, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
9
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
9
Jumper
15-38-1024-ND
HRP14H-ND
10
80
Place jumper on 1-2 of JP4-JP9; Place
on 1-2 on JP1
place jumper on header
see Pos 8 an 9
11
JTAG
1
14-pin connector, male,
TH
12
BOOTST
0
10-pin connector, male,
TH
13
U1
1
Socket: QFN-40B-0.5-01
14
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
15
R1,R7
2
330R SMD0805
541-330ATR-ND
16
R2, R3, R5,
R6, R8, R9,
2
0 Ohm, SMD0805
541-000ATR-ND
17
R4
1
47k SMD0805
18
PCB
1
79 x 66 mm
19
Rubber
stand off
4
20
MSP430
2
DNP. Keep vias free of solder
Manuf.: Enplas
DNP: Q1. Keep vias free of solder
DNP:R2, R3, R5, R6
2 layers
select appropriate;
for example, Buerklin:
20H1724
MSP430N5736IRHA
MSP430™ Hardware Tools
apply to corners at bottom side
DNP: enclosed with kit. Is supplied by TI
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B.17 MSP-TS430DL48
int
3
2
1
2
14
12
10
8
6
4
2
JTAG
ML14
J5
JP1Q
13
11
9
7
5
3
1
P1.0
XOUT
C5
100nF
Q1
XIN
1
JP1Q
J4
C8
10nF
TCK
TMS
TDI
TDO
GND
1
3
5
7
9
11
13
15
17
19
21
23
2
4
6
8
10
12
14
16
18
20
22
24
R5
47K
R4
0R
J1
RST/NMI
R12
0R
VCC
C3
100nF
P5.4
P5.3
P5.2
COM0
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
S5
P5.7
P5.6
P5.5
P5.0
P5.1
LCDCAP
LCDREF
P1.0
P1.1
P1.2
P1.3
C4
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28 P1.0
27
26
25
IC51-1387.KS-15186
TDO/TDI
TDI/TCLK
TMS
TCK
RST/NMI
DVCC
DVSS
XIN
XOUT
AVSS
AVCC
VREF+
P6.0
P6.1
P6.2
P6.3
P6.4
P6.5
P6.6
P6.7
P1.7
P1.6
P1.5
P1.4
TITLE:
1
3
5
7
9
11
13
15
17
19
21
23
10uF/10V
J3
J2
GND
2
4
6
8
10
12
14
16
18
20
22
24
Ext_PWR
BSL_TX
0R
R7 0R
R6
MSP-TS430DL48
Document Number:
ML10
10
8
6
4
2
BOOTST
9
7
5
3
1
BSL_RX
Vcc
ext
int
JP2
RST/NMI
TCK
REV:
1.3
Sheet: 1/1
Copyright © 2021 Texas Instruments Incorporated
1
2
3
MSP-TS430DL48 Target Socket DL48
GND
GND
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ext
JP1
2
1
+
C7
10uF/10V
560R
R3
12pF
C1
12pF
C2
GND
D1
LED3
TDO 1
2
TDI
TMS 3
TCK 4
RST/NMI 5
6
GND 7
8
XIN
XOUT 9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
U1
+
Date: 11/14/2006 1:24:44 PM
1
2
3
Vcc
Q1, C1, C2
not assembled
GND
QUARZ3
Figure B-34. MSP-TS430DL48 Target Socket Module, Schematic
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP2
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper J5
Open to measure current
Connector J3
External power connector
Jumper JP2 to "ext"
D1
LED connected to P1.0
Jumper J4
Open to disconnect LED
Orient pin 1 of MSP430 device
Figure B-35. MSP-TS430DL48 Target Socket Module, PCB
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Table B-18. MSP-TS430DL48 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C4, C7
2
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C3, C5
2
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
D1
1
yellow LED, TH, 3mm, T1
511-1251-ND
6
J1, J2
0
Description
Digi-Key Part No.
Comment
DNP
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
24-pin header, TH
SAM1034-12-ND
: Header
SAM1212-12-ND
: Receptacle
7
J3, JP1, JP2
2
3-pin header, male, TH
SAM1035-03-ND
Place jumper on header JP1;
Pos 1-2. DNP: JP2
8
J4, J5
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
Place on: JP1, J4, J5
3
Jumper
15-38-1024-ND
10
9
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
DNP: Keep vias free of solder
Q1
0
Crystal
Micro Crystal MS1V-T1K
DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
13
R3
1
560 Ω, SMD0805
541-560ATR-ND
14
R4, R6, R7,
R12
2
0 Ω, SMD0805
541-000ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: IC51-1387 KS-15186
Manuf.: Yamaichi
17
PCB
1
58 x 66 mm
2 layers
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430F4270IDL
12
for example, 3M Bumpons
Part No. SJ-5302
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DNP: R6, R7
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
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B.18 MSP-TS430PT48
Figure B-36. MSP-TS430PT48 Target Socket Module, Schematic
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Jumper J1
1-2 (Debugger): Power supply from JTAG interface
2-3 (External): External power supply
Connector JTAGConnector BSL
For JTAG tool For bootloader tool
Connector J2
External power connector
Jumper J1 to External
BSL Interface Switches
Select which BSL interface to
connect to connector BSL
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP1
Open to measure current
I2C pullup enable switch
Switch on to connect
I2C pullup resistors
Jumpers JP11 and JP12
Open to disconnect LEDs D1 and D2
Orient pin 1 of MSP430 device
D1, D2
LEDs connected to P1.0, P1.1
Figure B-37. MSP-TS430PT48 Target Socket Module, PCB
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Table B-19. MSP-TS430PT48 Bill of Materials
Ref Des
No. per
Board
!PCB
1
Printed circuit board
BSL
1
Header(Shrouded),
2.54mm, 5x2, Gold, TH
C5
1
1100pF
C6
1
C7
Value
Description
Package
Reference
Part Number
Manufacturer
MCU061
Any
AWHW-10G-0202-T
Assman WSW
CAP, CERM, 1100 pF, 50
0805
V, +/- 5%, C0G/NP0, 0805
GRM2165C1H112JA01D
MuRata
0.1uF
CAP, CERM, 0.1 µF, 50 V,
0805
+/- 10%, X7R, 0805
GRM21BR71H104KA01L
MuRata
1
10uF
CAP, CERM, 10 µF, 16 V,
+/- 10%, X5R, 0805
0805
0805YD106KAT2A
AVX
D1
1
Green
LED, Green, SMD
LED_0805
APT2012LZGCK
Kingbright
D2
1
Blue
LED, Blue, SMD
LED_0805
150080BS75000
Wurth Elektronik
H5, H6, H7,
H8
4
Bumpon, Cylindrical,
0.312 X 0.200, Black
Black Bumpon
SJ61A1
3M
IC1
1
Socket, QFP-48, 0.5 mm
Pitch
Socket, QFP-48,
0.5 mm Pitch
IC357-0484-142P-2
Yamaichi
Electronics
J1, J2, JP5,
JP6, JP7,
JP8, JP9,
JP10
8
Header, 100mil, 3x1, Gold,
3x1 Header
TH
TSW-103-07-G-S
Samtec
J3, J4, J5,
J6
4
Header, 100mil, 12x1,
Gold, TH
12x1 Header
TSW-112-07-G-S
Samtec
J3A, J4A,
J5A, J6A
4
Receptacle, 2.54mm,
12x1, Gold, TH
Receptacle,
2.54mm, 12x1, TH
PPPC121LFBN-RC
Sullins Connector
Solutions
JP1, JP11,
JP12
3
Header, 100mil, 2x1, Gold,
2x1 Header
TH
TSW-102-07-G-S
Samtec
JTAG
1
Header (shrouded), 100
mil, 7x2, Gold, TH
7x2 Shrouded
Header
SBH11-PBPC-D07-ST-BK
Sullins Connector
Solutions
R1
1
330
RES, 330, 5%, 0.125 W,
0805
0805
CRCW0805330RJNEA
Vishay-Dale
R2
1
200
RES, 200, 5%, 0.125 W,
0805
0805
CRCW0805200RJNEA
Vishay-Dale
R3, R10,
R19, R20,
R21
5
0
RES, 0, 5%, 0.125 W,
0805
0805
CRCW08050000Z0EA
Vishay-Dale
R7
1
47k
RES, 47 k, 5%, 0.125 W,
0805
0805
CRCW080547K0JNEA
Vishay-Dale
R16, R17
2
4.7k
RES, 4.7 k, 5%, 0.125 W,
0805
0805
CRCW08054K70JNEA
Vishay-Dale
SH-J1, SHJP1, SHJP5, SHJP6, SHJP7, SHJP8, SHJP9, SHJP10, SHJP11, SHJP12
10
1x2
Shunt, 100mil, Gold
plated, Black
Shunt
SNT-100-BK-G
Alternate part number:
969102-0000-DA
Samtec
SW1, SW2
2
Switch, SPST-NO, Off6x6mm
Mom, 0.02 A, 15 VDC, TH
EVQ-11A04M
Panasonic
SW3, SW4,
SW5
3
Switch, DPST, Slide, Off9.65x7.12mm
On, 1 Pos, 0.15A, 30V, TH
78F01T
Grayhill
C8, C9
0
CAP, CERM, 12 pF, 50 V,
+/- 5%, C0G/NP0, 0805
C0805C120J5GACTU
Kemet
86
12pF
Header, 2.54mm,
5x2, TH
0805
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Table B-19. MSP-TS430PT48 Bill of Materials (continued)
Ref Des
No. per
Board
FID1, FID2,
FID3
0
Q1A
Value
Package
Reference
Description
Fiducial mark. There is
nothing to buy or mount.
N/A
0
Crystal, 4MHz, 18 pF, TH
Q1B
0
Crystal, 32.768 kHz,
12.5pF, SMD
R4, R8, R9
0
0
R13
0
TP1, TP2,
TP3, TP4
0
TP5, TP6
0
Part Number
Manufacturer
N/A
N/A
11.5x5mm
9B-4.000MAAJ-B
TXC Corporation
1.4x1.4x5.0mm
SMD
MS3V-T1R 32.768KHZ
+/-20PPM 12.5PF
Micro Crystal AG
RES, 0, 5%, 0.125 W,
0805
0805
CRCW08050000Z0EA
Vishay-Dale
47k
RES, 47 k, 5%, 0.125 W,
0805
0805
CRCW080547K0JNEA
Vishay-Dale
Black
Test Point, Miniature,
Black, TH
Black miniature
testpoint
5001
Keystone
Test Point, Miniature,
Black, TH
Black miniature
testpoint
5001
Keystone
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87
A
B
C
D
BSL_SDA
J1
BSL_SCL
ext
VCC
int
JP1
0
DVCC
14
12
10
8
6
4
2
R13
DNP
47k
JTAG
P4.0
P4.7
P1.0
13
11
9
7
5
3
1
GND
RST/NMI
3
2
1
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
JP9
TEST/SBWTCK1
JTAG ->
SBW ->
R9
DNP
0
2
JP10
3
2
1
R7
47k
C8
DNP
12pF
12pF
DNP
C9
GND
DNP
32.768kHz
Q1B
DVCC
TEST/SBWTCK
XIN
XOUT
DNP
Q1A
2
1
Customer Note
Populate either Q1A (High Speed) or
Q1B (Low Speed, 32.768KHz) crystal
XIN_ext
XOUT_ext
R8
DNP
0
2
SW2
JP5
DVSS
Connection by via
1100pF
C5
RST/SBWTDIO
3
HFGND
DVSS
3
3
2 P1.7/TDO
1
3
JP6
3
2 P1.6/TDI
1
JP7
GND
3
2 P1.5/TMS
1
P1.4/TCK
P1.5/TMS
P1.6/TDI
P1.7/TDO
4
BSL_SCL
BSL_SDA
9
TEST/SBWTCK 7
5
3
1
BSL_RX
BSL_TX
GND
BSL
J6
J4
5
10
8
6
4 RST/SBWTDIO
2
DNP
DNP
5
R3
0
IC1
1
3
6
SW5
2
4
4.7k
R16
4.7k
R17
BSLSCL
BSLSDA
TP2
2 BSL_SCL
DNP
TP1
4 BSL_SDA
DNP
BSL_RX
DNP
TP3
BSL_TX
DNP
TP4
UART BSL Connection
BSLRX
BSLTX
SW4
SW3
2
4
I2C Pullups
1
3
I2C BSL Connection
BSLSCL
BSLSDA
DVCC
1
3
By default the UART BSL is connected
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and the I2C BSL and the I2C pull-ups are disconnected
J5
12
11
10
P4.0 9
8
7
6DNP
5
4
3
2
1
6
Sheet: 1 of 2
Size: B
Mod. Date: 9/12/2018
36 P2.7/UCB1STE
35 P4.2/TA3CLK
34 P4.1/TA3.0
33 P4.0/TA3.1
32 P3.7/TA3.2
31 DNC
30 P2.6/UCA1TXD/UCA1SIMO
29 P2.5/UCA1RXD/UCA1SOMI
28 P2.4/UCA1CLK
27 P3.1/UCA1STE
26 P3.4/TA2CLK/COMP0OUT
25 P2.3/TA2.0
Designed for: Public Release
Project Title: MSP-TS430PT48A
Sheet Title:
Assembly Variant: 001
File: MCU046A_Schematic.SchDoc
Contact: http://www.ti.com/support
R4
DNP
0
If external supply voltage:
remove R3 and add R4 (0 ohm)
Orderable: MSP-TS430PT48A
TID #:
N/A
Number: MCU046
Rev: A
SVN Rev: Version control disabled
Drawn By:
Engineer: M Pridgen
49
Ext_PWR
VCC
J2
JP8
3
2 P1.4/TCK
1
DNPC10
1uF
DVSS
DNC
DVCC
1
RST/NMI/SBWTDIO
2
TEST/SBWTCK
3
P1.4/UCA0TXD/UCA0SIMO/TA1.2/TCK/A4/VREF+ 4
P1.5/UCA0RXD/UCA0SOMI/TA1.1/TMS/A5
5
P1.6/UCA0CLK/TA1CLK/TDI/TCLK/A6
6
P1.7/UCA0STE/SMCLK/TDO/A7
7
P4.3/UCB1SOMI/UCB1SCL/TB0.5/A8
8
P4.4/UCB1SIMO/UCB1SDA/TB0.6/A9
9
P5.3/UCB1CLK/TA3.0/A10
10
P5.4/UCB1STE/TA3CLK/A11
11
P1.0/UCB0STE/TA0CLK/A0/Veref+
12
Customer Note
CONN1-4 and CONN5-8 are male and female headers included loose
in the kit and are intended to be populated on J3-6 as needed
J3
1 DVCC
2 RST/SBWTDIO
3 TEST/SBWTCK
4 BSLTX
5 BSLRX
6
DNP7
8
9
10
11
12 P1.0
DVCC
C6
0.1uF
DVSS
C7
10uF
4
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
Customer Note
X1 on hardware page is included loose in the kit
and is intended to be populated on Q1B as needed
3
2
1
1
JP11
JP12
VCC
R20
R21 0
0
BSL_RX R19
BSL_TX
3
2
1
330
R1
200
R2
SW1
DVCC
Green
D1
Blue
D2
TP5
GND
VCC Current
Measurement
DNP
TP6
R10
0
DNP
DVSS
1
A
B
C
D
Copyright © 2021 Texas Instruments Incorporated
P4.7
12
11
10
9
8
7
6
5
4
3
2
1
DVSS
XIN_ext
XOUT_ext
48 DVSS
XIN
47 P2.1/XIN
XOUT
46 P2.0/XOUT
45 P5.2/UCA0TXD/UCA0SIMO/TB0.4
44 P5.1/UCA0RXD/UCA0SOMI/TB0.3
43 P5.0/UCA0CLK/TB0.2
42 P4.7/UCA0STE/TB0.1
41 P6.2/TB0.0
40 P6.1/TB0CLK
39 P3.6/UCB1SOMI/UCB1SCL
38 P3.2/UCB1SIMO/UCB1SDA
37 P3.5/UCB1CLK/TB0TRG
13
14
15
16
17
18
19
20
21
22
23
24
P1.1/UCB0CLK/TA0.1/COMP0.0/A1
P1.2/UCB0SIMO/UCB0SDA/TA0.2/A2/VerefP1.3/UCB0SOMI/UCB0SCL/MCLK/A3
P2.2/ACLK/COMP0.1
P4.5/UCB0SOMI/UCB0SCL/TA3.2
P4.6/UCB0SIMO/UCB0SDA/TA3.1
P5.5/UCB0CLK/TA2CLK
P5.6/UCB0STE/TA2.0
P5.7/TA2.1/COMP0.2
P6.0/TA2.2/COMP0.3
P3.0/TA2.2
P3.3/TA2.1
1
2 BSLSDA
3 BSLSCL
4
5
6
7
8
9
10
11
12
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B.19 MSP-TS430PT48A
Figure B-38. MSP-TS430PT48A Target Socket Module, Schematic
Hardware
www.ti.com
Jumper J1
1-2 (Debugger): Power supply from JTAG Interface
2-3 (External): External power supply
Connector JTAG
For JTAG Tool
Connector BSL
For Bootloader Tool
Connector J2
External power connector
Jumper J1 to External
BSL Interface Switches
Select which BSL interface to
connect to connector BSL
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
I2C pullup enable switch
Switch On to connect
I2C pullup resistors
Jumper JP1
Open to measure current
Orient Pin 1 of
MSP430 device
Jumpers JP11 and JP12
Open to disconnect LEDs D1 and D2
D1, D2
LEDs connected to P1.0, P4.7
Figure B-39. MSP-TS430PT48A Target Socket Module, PCB
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Table B-20. MSP-TS430PT48A Bill of Materials
Ref Des
Quantity
Value
Description
!PCB
1
Printed Circuit Board
BSL
1
Header(Shrouded),
2.54mm, 5x2, Gold, TH
C5
1
1100pF
C6
1
C7
1
CONN1,
CONN2,
CONN3,
CONN4
Package
Reference
Part Number
Manufacturer
MCU046
Any
AWHW-10G-0202-T
Assman WSW
CAP, CERM, 1100 pF, 50
0805
V, +/- 5%, C0G/NP0, 0805
GRM2165C1H112JA01D
MuRata
0.1uF
CAP, CERM, 0.1 uF, 16 V,
0603
+/- 10%, X7R, 0603
C0603X104K4RACTU
Kemet
10uF
CAP, CERM, 10 uF, 16 V,
+/- 10%, X5R, 0805
0805
0805YD106KAT2A
AVX
4
Header, 100mil, 12x1,
Gold, TH
12x1 Header
TSW-112-07-G-S
Samtec
CONN5,
CONN6,
CONN7,
CONN8
4
Receptacle, 2.54mm,
12x1, Gold, TH
Receptacle,
2.54mm, 12x1, TH
PPPC121LFBN-RC
Sullins Connector
Solutions
D1
1
Green
LED, Green, SMD
LED_0805
APT2012LZGCK
Kingbright
D2
1
Blue
LED, Blue, SMD
LED_0805
150080BS75000
Wurth Elektronik
Black Bumpon
SJ61A1
3M
Socket, QFP-48,
0.5 mm Pitch
IC357-0484-142P-2
Yamaichi
Electronics
Header, 2.54mm,
5x2, TH
H1, H2, H3,
H4
4
Bumpon, Cylindrical,
0.312 X 0.200, Black
IC1
1
Socket, QFP-48, 0.5 mm
Pitch, www.yamaichi.com
J1, J2, JP5,
JP6, JP7,
JP8, JP9,
JP10
8
Header, 100mil, 3x1, Gold,
3x1 Header
TH
TSW-103-07-G-S
Samtec
JP1, JP11,
JP12
3
Header, 100mil, 2x1, Gold,
2x1 Header
TH
TSW-102-07-G-S
Samtec
JTAG
1
Header (shrouded), 100
mil, 7x2, Gold, TH
SBH11-PBPC-D07-ST-BK
Sullins Connector
Solutions
R1
1
330
RES, 330, 5%, 0.125 W,
0805
AEC-Q200 Grade 0, 0805
CRCW0805330RJNEA
Vishay-Dale
R2
1
200
RES, 200, 5%, 0.125 W,
0805
AEC-Q200 Grade 0, 0805
CRCW0805200RJNEA
Vishay-Dale
R3, R10,
R19, R20,
R21
5
0
RES, 0, 5%, 0.333 W,
0805
AEC-Q200 Grade 0, 0805
CRCW08050000Z0EAHP
Vishay-Dale
R7
1
47k
RES, 47 k, 5%, 0.125 W,
0805
AEC-Q200 Grade 0, 0805
CRCW080547K0JNEA
Vishay-Dale
R16, R17
2
4.7k
RES, 4.7 k, 5%, 0.125 W,
0805
AEC-Q200 Grade 0, 0805
CRCW08054K70JNEA
Vishay-Dale
SH-J1, SHJP1, SHJP5, SHJP6, SHJP7, SHJP8, SHJP9, SHJP10, SHJP11, SHJP12
10
1x2
Shunt, 100mil, Gold
plated, Black
SNT-100-BK-G
Alternate part number:
969102-0000-DA
Samtec
SW1, SW2
2
EVQ-11A04M
Panasonic
90
7x2 Shrouded
Header
Shunt
Switch, SPST-NO, Off6x6mm
Mom, 0.02 A, 15 VDC, TH
MSP430™ Hardware Tools
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Table B-20. MSP-TS430PT48A Bill of Materials (continued)
Value
Package
Reference
Ref Des
Quantity
Description
SW3, SW4,
SW5
3
Switch, DPST, Slide, Off9.65x7.12mm
On, 1 Pos, 0.15A, 30V, TH
78F01T
Grayhill
X1
1
Crystal, 32.768 kHz,
12.5pF, SMD
1.4x1.4x5.0mm
SMD
MS3V-T1R 32.768KHZ
+/-20PPM 12.5PF
Micro Crystal AG
C8, C9
0
12pF
CAP, CERM, 12 pF, 50 V,
+/- 5%, C0G/NP0, 0805
0805
C0805C120J5GACTU
Kemet
C10
0
1uF
CAP, CERM, 1 uF, 50 V,
+/- 10%, X5R, 0603
0603
GRM188R61H105KAALD MuRata
FID1, FID2,
FID3
0
Fiducial mark. There is
nothing to buy or mount.
N/A
N/A
N/A
J3, J4, J5,
J6
0
Header, 100mil, 12x1,
Gold, TH
12x1 Header
TSW-112-07-G-S
Samtec
Q1A
0
Crystal, 4 MHz, 18 pF, TH
11.5x5mm
9B-4.000MAAJ-B
TXC Corporation
Q1B
0
Crystal, 32.768 kHz,
12.5pF, SMD
1.4x1.4x5.0mm
SMD
MS3V-T1R 32.768KHZ
+/-20PPM 12.5PF
Micro Crystal AG
R4, R8, R9
0
0
RES, 0, 5%, 0.333 W,
0805
AEC-Q200 Grade 0, 0805
CRCW08050000Z0EAHP
Vishay-Dale
R13
0
47k
RES, 47 k, 5%, 0.125 W,
0805
AEC-Q200 Grade 0, 0805
CRCW080547K0JNEA
Vishay-Dale
TP1, TP2,
TP3, TP4,
TP5, TP6
0
Test Point, Miniature,
Black, TH
5001
Keystone
Black Miniature
Testpoint
Part Number
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B.20 MSP-TS430RGZ48B
Figure B-40. MSP-TS430RGZ48B Target Socket Module, Schematic
92
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP1
Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Figure B-41. MSP-TS430RGZ48B Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. If
the board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10
(0 Ω) must be assembled, and R11 must be removed.
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Table B-21. MSP-TS430RGZ48B Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7, C12
3
10uF, 6.3V, SMD0805
4
C5, C11,
C13, C14
4
100nF, SMD0805
5
C8
1
2.2nF, SMD0805
Digi-Key Part No.
Comment
311-1245-2-ND
6
C9
1
470nF, SMD0805
478-1403-2-ND
7
D1
1
green LED, SMD0805
P516TR-ND
8
J1, J2, J3,
J4
0
12-pin header, TH
SAM1029-12-ND
DNP: Headers and receptacles enclosed
(Header) SAM1213-12-ND
with kit. Keep vias free of solder:
(Receptacle)
9
J5
1
3-pin header, male, TH
10
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
11
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
See Pos. 10and Pos. 11
HRP14H-ND
12
94
Description
13
JTAG
1
14-pin connector, male,
TH
14
BOOTST
0
10-pin connector, male,
TH
15
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
DNP: Q1 Keep vias free of solder
16
Q2
0
Crystal
Q2: 4MHz Buerklin:
78D134
DNP: Q2 Keep vias free of solder
17
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/
Art_Detail.cfm?
ART_ARTNUM=70.08.121
18
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
19
R1, R2, R4,
R6, R8,
R9,R10,
R11, R12
3
0 Ohm, SMD0805
541-000ATR-ND
20
R5
1
47k Ω, SMD0805
541-47000ATR-ND
21
U1
1
Socket:
QFN11T048-008_A101121
_RGZ48
Manuf.: Yamaichi
22
PCB
1
81 x 76 mm
2 layers
23
Adhesive
plastic feet
4
Approximately 6mm width, for example, 3M Bumpons
Apply to corners at bottom side
2mm height
Part No. SJ-5302
24
MSP430
2
MSP430F5342IRGZ
"DNP Keep vias free of solder"
MSP430™ Hardware Tools
DNP: R6, R8, R9, R10, R11,R12
DNP: enclosed with kit, supplied by TI
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B.21 MSP-TS430RGZ48C
Vcc
ext
int
J1
3
2
1
VCC
14
12
10
8
6
4
2
JTAG
13
11
9
7
5
3
1
GND
TEST/SBWTCK1
RST/NMI
JP3
3
2
1
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
JTAG ->
R7
0R
TEST/SBWTCK
JP4
3
2
1
R4
47k
JP5
3
2 PJ.0/TDO
1
DVSS 12
P4.6 11
P4.5 10
P4.4 9
P1.7 8
P1.6 7
P3.7 6
P3.6 5
P3.5 4
P3.4 3
P2.2 2
P2.1 1
DNP
36
35
34
33
32
31
30
29
28
27
26
25
DNP
C9
JP7
GND
9
7
5
3
1
JP8
GND
J2
Ext_PWR
3
2 PJ.3/TCK
1
100nF
C6
DVCC
C7
DNP
1uF/10V
GND
10
8
6
4
2
DNP
If external supply voltage:
remove R3 and add R2 (0 Ohm)
DNP
BOOTST
3
2 PJ.2/TMS
1
HFGND
RST/SBWTDIO
P2.0
TEST/SBWTCK1
P2.1
DNP
C8
DNP
JP6
SV2
3
2 PJ.1/TDI
1
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3
2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2
SW1
DNP
EVQ11
GND
HFXOUT
HFXIN
C5
1.1nF
RST/SBWTDIO
U1
36_DVSS
35_P4.6
34_P4.5
33_P4.4
32_P1.7
31_P1.6
30_P3.7
29_P3.6
28_P3.5
27_P3.4
26_P2.2
25_P2.1
Target Socket Board for MSP430FR58xx, FR59xx IRGZ
MSP-TS430RGZ48C
1.2
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2
1
95
MSP430™ Hardware Tools
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SBW ->
C2
DNP
LFXIN
LFXOUT
SV1
1_P1.0
2_P1.1
3_P1.2
4_P3.0
5_P3.1
6_P3.2
7_P3.3
8_P4.7
9_P1.3
10_P1.4
11_P1.5
12_PJ.0_TDO
QUARZ5
Q2
2
1
C4
DNP
1
P1.0
2
P1.1
3
P1.2
4
P3.0
5
P3.1
6
P3.2
7
P3.3
8
P4.7
9
P1.3
10
P1.4
11
P1.5
PJ.0/TDO 12
12
11
10
9
8
7
6
5
4
3
2
1
JP1
C3
100nF
1
2
3
4
5
6
7
8
9
10
11
12
R8
0R
R9
0R
DVCC
AVCC
1uF/10V
SV4
Q1
LFGND QUARZ5
DNP
C1
DNP
P1.3
P1.2
P1.1
P1.0
0R
R6
0R
R5
2
1
JP2
GND
DVCC
connection by via
AVSS
DVSS
JP11
JP10
JP9
R2
-
R3
0R
0R R12
0R R13
R14DNP
R11 DNP
D3
red (DNP)
R10DNP
R1 330R
D2
yellow (DNP)
D1
green
GND
SV3
DNP
SW2
48 AVCC
47 AVSS
46
45
44 AVSS
43
42
41 AVSS
40 P2.4
39 P2.3
38 P2.7
37 DVCC
48_AVCC
47_AVSS
46_LFXOUT
45_LFXIN
44_AVSS
43_HFXOUT
42_HFXIN
41_AVSS
40_P2.4
39_P2.3
38_P2.7
37_DVCC
13_PJ.1_TDI
14_PJ.2_TMS
15_PJ.3/TCK
16_P4.0
17_P4.1
18_P4.2
19_P4.3
20_P2.5
21_P2.6
22_TEST/SBWTCK
23_RST/SBWTDIO
24_P2.0
13
1 PJ.1/TDI
2 PJ.2/TMS
14
3 PJ.3/TCK
15
4 P4.0
16
5 P4.1
17
6 P4.2
18
7 P4.3
19
8 P2.5
20
9 P2.6
21
10 TEST/SBWTCK22
11 RST/SBWTDIO 23
12 P2.0
24
2
1
2
1
2
1
TP1TP2
Figure B-42. MSP-TS430RGZ48C Target Socket Module, Schematic
www.ti.com
Hardware
Connector JTAG
For JTAG Tool
Jumper JP2
Analog/digital power
C5
JP8
JP4
RST/SBWTDIO
BOOTST
123
123
123
123
JP5
JP7 JP6
JP2 JP1
R4
DVCC
AVCC
123
2
1
SBW
int
Ext.
Pwr.
Vcc
123
3
Vcc
R2
TDO
R3
1
2
JTAG
ext
PWR
Jumper JP1
Open to measure current
10
1
2
TCK TMS TDI
J1
Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
14
JTAG
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector BOOTST
For Bootloader Tool
JP3 R7
TEST/SBWTCK
20
25
GND
GND
J2
MSP-TS430RGZ48C
Rev. 1.2
RoHS
15
TP1
Clamshell
GND
QFN11T048-008 A101121
P1.3
45
R6
Q1
R9
R5
R8
C7
C2
C1
C8
Q2
C9
RESET
C6
SW1
R13
GND
R12
C4
C3
R14
40
TP2
P1.0
R1 D1
R10 D2
Orient Pin 1 of MSP430 device
SW2
1
U1
LEDs connected to
P1.0, P1.1, P1.2 via
JP9, JP10, JP11
(only D1 assembled)
JP9
P1.2
35
JP10
JP11
5
R11 D3
30
P1.1
10
Switch SW1
Device reset
Connector J2
External power connector
Jumper J1 to "ext"
Switch SW2
Connected to P1.3
HF ands LF oscillators with capacitors
and resistors to connect pinheads
Figure B-43. MSP-TS430RGZ48C Target Socket Module, PCB
Note
LFOSC and HFOSC pins are swapped at SV1.
42_HFXIN (pin 42) → SV1 (pin 7)
43_HFXOUT (pin 43) → SV1 (pin 6)
45_LFXIN (pin 45) → SV1 (pin 10)
46_LFXOUT (pin 46) → SV1 (pin 9)
96
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Table B-22. MSP-TS430RGZ48C Bill of Materials
Pos
1
Ref Des
SV1, SV2, SV3,
SV4
Number
Per
Board
4
Description
Digi-Key Part Number
12-pin header, TH
Comment
DNP: headers and receptacles enclosed with kit.
Keep vias free of solder.
SAM1029-12-ND
: Header
: Receptacle
1.1
SV1, SV2, SV3,
SV4
4
12-pin receptable, TH
DNP: headers and receptacles enclosed with kit.
Keep vias free of solder.
: Header
SAM1213-12-ND
: Receptacle
2
JP1, JP2, JP9
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
3
JP10, JP11
2
2-pin header, male, TH
SAM1035-02-ND
DNP
4
J1, JP3, JP4, JP5,
JP6, JP7, JP8
7
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on pins 2-3
5
J2
1
3-pin header, male, TH
SAM1035-03-ND
6
JP1, JP2, JP9, J1,
JP3, JP4, JP5, JP6,
JP7, JP8
10
Jumper
15-38-1024-ND
7
R2, R3, R5, R6, R8,
R9, R10, R11, R14
9
DNP, 0805
Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,
JP7, JP8
DNP
8
R12, R13, R7
3
0R, 0805
541-000ATR-ND
9
C5
1
1.1nF, CSMD0805
490-1623-2-ND
10
C3, C7
2
1uF, 10V, CSMD0805
490-1702-2-ND
11
R4
1
47k, 0805
541-47000ATR-ND
12
C4, C6
2
100nF, CSMD0805
311-1245-2-ND
13
R1
1
330R, 0805
541-330ATR-ND
14
C1, C2, C8, C9
4
DNP, CSMD0805
15
SW1, SW2
2
EVQ-11L05R
P8079STB-ND
DNP
16
BOOTST
1
10-pin connector, male, TH
HRP10H-ND
DNP, keep vias free of solder
17
JTAG
1
14-pin connector, male, TH
HRP14H-ND
18
Q1
1
DNP: MS3V-TR1 (32768kHz,
20ppm, 12.5pF)
depends on application
Micro Crystal, DNP, enclosed in kit, keep vias free of
solder
19
Q2
1
DNP, Christal
depends on application
DNP, keep vias free of solder
20
U1
1
Socket: QFN11T048-008
A101121-001
20.1
U1
1
MSP430FR5969IRGZ
21
D1
1
green LED, DIODE0805
22
D3
1
red (DNP), DIODE0805
DNP
23
D2
1
yellow (DNP), DIODE0805
DNP
24
TP1, TP2
2
Testpoint
25
Rubber stand off
4
26
PCB
1
DNP
Manuf.: Yamaichi
DNP: enclosed with kit. Is supplied by TI.
P516TR-ND
DNP, keep pads free of solder
79.6 x 91.0 mm
Buerklin: 20H1724
apply to corners at bottom side
MSP-TS430RGZ48C
Rev. 1.2
2 layers, black solder mask
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97
12pF
C2
not assembled
R9
12pF
C1
R3
R4
2
13
11
9
7
5
3
1
J1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
100nF
1
0R
R2
DVCC
2
3
4
5
6
7
XIN
XOUT
10
11
12
13
14
15
16
10nF
47K
VCC
TCK
TMS
TDI
TDO
C8
R5
U2
MSP64PM
Socket:
Yamaichi
IC51-0644-807
RST/NMI
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
C3
12pF
not assembled
C4
12pF
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
J3
ML10
10
8
6
4
2
BOOTST
9
7
5
3
1
not assembled
J5
TITLE:
MSP-TS430PM64
Document Number:
PWR3
GND
1
2
3
For BSL usage add:
R11 0R
R6 R7 R13 R14
MSP430F14x : 0 0 open open
MSP430F41x : open open 0 0
If external supply voltage:
remove R11 and add R10 (0 Ohm)
R10 -
REV:
1.2
Sheet: 1/1
MSP-TS430PM64 Target Socket PM64
for F14x and F41x
FE16-1-3
GND
Date: 3/14/2006 10:46:30 AM
Copyright © 2021 Texas Instruments Incorporated
JTAG
ML14
1
C7
+
14
12
10
8
6
4
2
J6
JP1Q
Open J6 if LCD
is connected
560R
2
remove R8 and add R9 (0 Ohm)
If external supply voltage:
GND
C5
FE16-1-1
0R
0R
0R
R14
0R
R7
R13
R6
FE16-1-4
XTCLK
J2
10uF/10V
10uF/6,3V
+
C6
JP1Q
not assembled
J7
1
R1 0R
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AVCC
DVSS
AVSS
61
60
59
RST
TCK
TMS
TDI
TDO
53
52
51
50
49
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
-
LFXTCLK
0R
R12
Q1
-
R8
reserved for
future
enhancement
LED3
D1
J4
FE16-1-2
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Hardware
B.22 MSP-TS430PM64
Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made.
Figure B-44. MSP-TS430PM64 Target Socket Module, Schematic
www.ti.com
Hardware
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
D1
LED connected to pin 12
Connector J5
External power connection
Remove R8 and jumper R9
Jumper J7
Open to measure current
Jumper J6
Open to disconnect LED
Orient Pin 1 of
MSP430 device
Figure B-45. MSP-TS430PM64 Target Socket Module, PCB
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Hardware
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Table B-23. MSP-TS430PM64 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
1.1
C3, C4
0
47pF, SMD0805
DNP: Only recommendation.
Check your crystal spec.
2
C6, C7
1
10uF, 10V, Tantal Size B
511-1463-2-ND
Digi-Key Part No.
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
0
Comment
DNP: C6
DNP: Headers and receptacles
enclosed with kit.Keep vias free
of solder.
16-pin header, TH
SAM1029-16-ND
: Header
SAM1213-16-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
J6, J7
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
Place on: J6, J7
11
2
Jumper
15-38-1024-ND
12
JTAG
1
14-pin connector, male, TH
HRP14H-ND
13
BOOTST
0
10-pin connector, male, TH
DNP: Keep vias free of solder
Q1, Q2
0
Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
15
R3
1
330 Ω, SMD0805
541-330ATR-ND
16
R1, R2, R4,
R6, R7, R8,
R9, R10, R11,
R12, R13, R14
3
0 Ω, SMD0805
541-000ATR-ND
17
R5
1
47k Ω, SMD0805
541-47000ATR-ND
18
U1
1
Socket: IC51-0644-807
Manuf.: Yamaichi
19
PCB
1
78 x 75 mm
2 layers
20
Rubber
standoff
4
21
MSP430
22
14
100
Description
select appropriate
MSP430F2619IPM
MSP430F417IPM
MSP430™ Hardware Tools
DNP: Keep vias free of solder
DNP: R4, R6, R7, R9, R10, R11,
R12, R13, R14
Apply to corners at bottom side
DNP: Enclosed with kit supplied
by TI
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B.23 MSP-TS430PM64A
Vcc
3
2
ext
1
int
JP3
14
12
10
8
6
4
2
JTAG
0R
R2
13
11
9
7
5
3
1
GND
JTAG ->
SBW ->
AVCC
J1
VCC430
AVSS
C4
100nF
0R
3
2
1
JP4
AVCC
AVSS
J4
R6
330R
3
TEST/SBWTCK 2
A
1
JP5
RST/NMI
VCC
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Socket:
Yamaichi
IC51-0644-807
DNP GND
R4
47k C3
2.2nF
VCC430
RST/SBWTDIO
B
P1.0
P1.1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
3
2 P7.0/TDO
1
C
JP6
J3
3
2
1
JP7
P7.1/TDI
D
DNP
R13
0R
TEST/SBWTCK
A
ADD LCD-CAP!
P5.1
3
2 P7.2/TMS
1 E
JP8
DNP
9
7
5
3
1
DNP
R11
0R
DNP
RST/SBWTDIO
B
DNP
R10
0R
PWR3
GND
1
2
3
3
2 P7.3/TCK
1 F
JP9
10
8
6
4
2
R14
0R BOOTST
GND
J5
Sheet: 1/1
REV:
1.1
If supplied by interface: populate R11 (0R), remove R10
If supplied locally: populate R10 (0R), remove R11
MSP-TS430PM64A
MSP-TS430PM64A Target Socket
for F4152
TITLE:
Document Number:
Date: 3/29/2011 3:07:02 PM
Copyright © 2021 Texas Instruments Incorporated
101
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2
1
JP2
C5
100nF
DNP
R7
XIN
Q1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
GND
J2
A
B
F
E
D
C
VCC430
C6
10uF/6.3V
R1 0R
DNP
12pF
C2
DNP
R5
0R
XOUT
DNP
R3
P5.1
330R
JP1
Open JP1 if LCD
is connected
DNP
12pF
C1
XTLGND
D1
2
1
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
GND
GND
1
2
+
Figure B-46. MSP-TS430PM64A Target Socket Module, Schematic
Hardware
www.ti.com
Connector JTAG
For JTAG Tool
Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector BOOTST
For Bootloader Tool
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP2
Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP1
Open to disconnect LED
D1
LED connected to P5.1
Figure B-47. MSP-TS430PM64A Target Socket Module, PCB
102
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Hardware
Table B-24. MSP-TS430PM64A Bill of Materials
Pos.
Ref Des
No. per Board
1
C1, C2,
0
12pF, SMD0805
2
C3
0
2.2nF, SMD0805
3
C6,
1
10uF, 10V, Tantal Size B
4
C4, C5
2
100nF, SMD0805
478-3351-2-ND
5
D1
1
green LED, SMD0805
P516TR-ND
6
J1, J2, J3, J4
0
Description
Digi-Key Part No.
Comment
DNP
DNP
511-1463-2-ND
DNP: Headers and receptacles
enclosed with kit. Keep vias
free of solder.
16-pin header, TH
SAM1029-16-ND
: Header
SAM1213-16-ND
: Receptacle
7
J5, JP3, JP4,
JP5, JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
8
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
2
Jumper
15-38-1024-ND
Place on: J6, J7
10
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
9
DNP: Keep vias free of solder
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
13
R3, R6
2
330 Ω, SMD0805
541-330ATR-ND
14
R1, R2, R5,
R7, R9, R10,
R11, R13, R14
2
0 Ω, SMD0805
541-000ATR-ND
541-47000ATR-ND
12
DNP: Keep vias free of solder
DNP: R5, R7, R9, R10, R11,
R13, R14
15
R4
1
47k Ω, SMD0805
16
U1
1
Socket: IC51-0644-807
Manuf.: Yamaichi
17
PCB
1
78 x 75 mm
4 layers
18
Rubber stand
off
4
19
MSP430
2
select appropriate
MSP430F4152IPM
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Apply to corners at bottom side
DNP: Enclosed with kit supplied
by TI
MSP430™ Hardware Tools
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103
6
A
Vcc
int
GND
B
3
2
1
JP1
14
12
10
8
6
4
2
JTAG
13
11
9
7
5
3
1
to measure supply current
JP2
R5
R6
C
D2 DNP 330R DNP
LED_Green
D3 DNP 330R DNP
LED_Green
XOUT
P4.6
P4.7
P4.5
C6
P4.4
C7
C9
C8
XIN
D
3
2
1
47K
JP9 R4
TEST/SBWTCK
VCC430
U1
P4.7/R13
P4.6/R23
P4.5/R33
P4.4/LCDC2
P4.3/LCDC1
P4.2/XOUT
P4.1/XIN
DVSS
DVCC
RST/NMI/SBWTDIO
TEST/SBWTCK1
P4.0/TA1.1
P8.3/TA1.2
P8.2/TA1CLK
P8.1/A1CLK/A9
P8.0/SMCLK/A8
DNP
EVQ11
E
RST/SBWTDIO
SW1
E
3
2
1
JP8
P1.7/TDO
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
F
3
2
1
JP7
3
2
1
JP6
P1.6/TDI
P1.1
P1.0
9
J3
BSLRX 3
BSLTX 1
5
TEST/SBWTCK7
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
G
3
2
1
JP5
VCC
P1.5/TMS
Ext_PWR
J5
P1.4/TCK
BSL
DNP R10 0R
10
8
DNP R11 0R
6
4 RST/SBWTDIO
2
BSL Interface
4-wire JTAG: Set jumpers J4 to J9 to position 2-3
2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 2-1
JTAG-Mode selection:
P6.0/L16
P6.1/L17
P6.2/L18
P6.3/L19
P6.4/L20
P6.5/L21
P6.6/L22
P6.7/L23
P2.0/L24
P2.1/L25
P2.2/L26
P2.3/L27
P2.4/L28
P2.5/L29
P2.6/L30
P2.7/L31
File: MSP-TS430PM64D
Datum:9/3/2014 3:08:18 PM
G
H
H
Rev.: 1.0
Target Socket Board for MSP430FR413xIPM and MSP430FR203xIPM
Titel: MSP-TS430PM64D
MSP430FR413xIPM / MSP430FR203xIPM
Socket: Yamaichi IC51-0644-807
F
1
2
3
RST/NMI
3
2
1
TCK
TMS
TDI
TDO/SBWTDIO
P1.2
P1.1
P1.0
P1.3
SBW ->JP10
JTAG ->
JP3
JP4
1
1
P4.7
2
2
P4.6
3
3
P4.5
4
4
P4.4
5
5
P4.3
DNP
6
XOUT 6
R3 0R
DNP
7
XIN 7
R2
0R
8 GND
8
9 VCC430
9
10
10
RST/SBWTDIO
11
11
TEST/SBWTCK
12
12
13
13
14
14
15
15
16
16
D
J4
GND
330R
D1
LED_Green
R1
SW2
C4
EVQ11
100nF
DNP
DNP
100nF
P4.3
J1
Disconnect JP3 and
JP4 before BSL use.
ext
2
1
C3
12pF C2
TP1 TP2
12pF C1
100nF
DNP
100nF
DNP
100nF
DNP
C
I
Seite 1/1
I
A3
6
5
4
3
2
1
Copyright © 2021 Texas Instruments Incorporated
2
1
2
1
10uF/10V
B
J2
5
4
3
2
1
A
25
26
27
28
29
30
31
32
Q1
QUARZ5
C5
1.1nF
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
P7.0/L0
P7.1/L1
P7.2/L2
P7.3/L3
P7.4/L4
P7.5/L5
P7.6/L6
P7.7/L7
P3.0/L8
P3.1/L9
P3.2/L10
P3.3/L11
P3.4/L12
P3.5/L13
P3.6/L14
P3.7/L15
P1.7/TA0.1/TDO/A7
P1.6/TA0.2/TDI/TCLK/A6
P1.5/TA0CLK/TMS/A5
P1.4/MCLK/TCK/A4
P1.3/UCA0STE/A3
P1.2/UCA0CLK/A2
P1.1/UCA0RXD/UCA0SOMI/A1
P1.0/UCA0TXD/UCA0SIMO/A0
P5.7/L39
P5.6/L38
P5.5/L37
P5.4/L36
P5.3/UCB0SOMI/UCB0SCL/L35
P5.2/UCB0SIMO/UCB0SDA/L34
P5.1/UCB0CLK/L33
P5.0/UCB0STE/L32
P1.7/TDO 17
P1.6/TDI 18
P1.5/TMS 19
P1.4/TCK 20
21
P1.3
22
P1.2
23
P1.1
24
P1.0
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
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B.24 MSP-TS430PM64D
Figure B-48. MSP-TS430PM64D Target Socket Module, Schematic
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Connector JTAG
For JTAG Tool
32
1
1
2
25
R11
JP3
R1 D1
JP4
R5 D2
R6 D3
20
P1.0
P1.1
P1.2
17
Switch SW2
Connected to P1.3
J1
SW2
C4
C3
Clamshell
35
33
U1
P1.3
10
GND
GND
C2
R3
Switch SW1
Device reset
RESET
45
C8
C9
SW1
R2
C1
5
Connector J5
External power connector
Jumper JP1 to "ext"
R4 C5
Q1
VCC
40
J5
MSP-TS430PM64D
Rev. 1.0
RoHS
1
2
3
1
2
3
JP6
JP7
JP8
3
1
2
3
1
30
Disconnect JP3 and
JP4 before BSL use!
16
Curr. Meas.
JP2
GND
JP5
J2
TP1
Jumper JP2
Open to measure current
2
3
SBW->
JTAG->
3
ext
VCC
int
2
R10
1
2
BSL
10
1
2
JP10
JP9
3
2
1
JP1
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
14
JTAG
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector BOOTST
For Bootloader Tool
C7
C6
48
1
J3
IC51-0644-807
TP2
49
55
60
64
GND
Orient Pin 1 of
MSP430 device
J4
Figure B-49. MSP-TS430PM64D Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. If
the board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10
(0 Ω) must be assembled, and R11 must be removed.
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Table B-25. MSP-TS430PM64D Bill of Materials
Pos.
1
No. per
Board
Ref Des
Description
PCB
1
90x96 mm
Digi-Key Part No.
MSP-TS430PM64D Rev. 1.0
Comment
2 layers, 90x96mm, white solder
mask
2
BSL
1
10-pin connector, male, TH
HRP10H-ND
DNP, keep vias free of solder
3
D1
1
Green LED, HSMG-C170,
DIODE0805
516-1434-1-ND
Avago, Farnell 5790852
4
D2, D3
2
LED, DIODE0805
5
JP2, JP3,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
6
JP1, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 (JTAG)
7
R1
1
330R, 0805
541-330ATR-ND
8
R5, R6
2
330R, 0805
541-330ATR-ND
DNP
9
R2, R3,
R10, R11
4
0R, 0805
541-0.0ATR-ND
DNP
10
R4
1
47K, 0805
311-47KARTR-ND
11
C1, C2
2
12pF, CSMD0805
709-1169-2-ND
DNP
12
C3
1
10uF/10V, CSMD0805
445-1371-2-ND
13
C4
1
100nF, CSMD0805
311-1245-2-ND
14
C6, C7, C8, 4
C9
100nF, CSMD0805
311-1245-2-ND
15
C5
1
1.1nF, CSMD0805
490-1623-2-ND
16
J1, J2, J3,
J4
1
16-pin header, TH
SAM1029-16-ND
DNP: headers and receptacles,
enclosed with kit. Keep vias free
of solder.
17
J1, J2, J3,
J4
1
16-pin receptable, TH
SAM1213-16-ND
DNP: headers and receptacles,
enclosed with kit. Keep vias free
of solder.
HRP14H-ND
DNP
18
JTAG
1
14-pin connector, male, TH
19
U1
1
Socket IC51-0644-807
Manuf.: Yamaichi
20
U1
2
MSP430FR4133IPM
DNP: enclosed with kit. Is
supplied by TI.
21
J5
1
3-pin header, male, TH
22
Q1
1
Microcrystal 32768Hz, MS3VT1R (32.768kHz, 20ppm, 12.5pF)
23
SW1, SW2 2
24
Rubber
stand off
106
4
Panasonic EVQ11
SAM1035-03-ND
P8079STB-ND
DNP, Lacon: 1251459
Buerklin: 20H1724
apply to corners at bottom side
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B.25 MSP-TS430PM64F
6
Vcc
ext
int
J1
A
3
2
1
2
1
JTAG
13
11
9
7
5
3
1
B
STE
RST/NMI
JP3
3
2
1
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
SBW ->
JTAG ->
GND
TEST/SBWTCK1
14
RXD/SIMO
TXD/SOMI/SDA12
SPICLK/SCL 10
8
6
4
2
VCC
DVCC
AVCC
C
TEST/SBWTCK
JP4
3
2
1
47k
R4
D
EVQ11
DNP
JP5
3
2 PJ.0/TDO
1
JP6
E
3
2 PJ.1/TDI
1
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
SW1
1.1nF
C5
RST/SBWTDIO
JP7
3
2 PJ.2/TMS
1
JP8
F
G
C11
100nF
GND
2
1
I2C
2
1
H
SPICLK/SCL1
TEST/SBWTCK
9
7
5
3
RXD/SIMO1
1
TXD/SOMI/SDA1
P1.7
P2.1
GND
DVCC
UART
R15
10k
JP16
R7
10k
1
2
3
BSL Tool Select:
Open = BSL Connector
Closed = JTAG Connector
JP13
SPICLK/SCL
JP15
JP14
RXD/SIMO
P2.0
P1.6
TXD/SOMI/SDA
J5
LFGND
connection by via
3
2 PJ.3/TCK
1
C2
DNP
DNP
DNP
C1
48
47
46
45
P1.0 44
P1.1 43
P1.2 42
P1.3 41
DVCC 40
DVSS 39
38
37
36
35
34
33
P2.0
BSL
Rev.: 1.0
I
GND
J2
DNP
Ext_PWR
STE
Page 1/1
I
A3
If external supply voltage:
remove R3 and add R2 (0 Ohm)
RST/SBWTDIO
10
8
6
4
2
3
2
1
Title: MSP-TS430PM64F
Target Socket Board for MSP430FR697x/687x devices
H
File: MSP-TS430PM64F
Date: 10/20/2014 4:38:53 PM
G
R2
0R
R3
0R
2
1
DNP
DNP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
Socket:
Yamaichi C51-0644-807
F
6
5
4
3
2
1
Copyright © 2021 Texas Instruments Incorporated
1
2
SAM1129-16-ND
JP1
GND
LFXIN
LFXOUT
MSP430FR697XPM/RGC
P9.7/A15/C15
P9.6/A14/C14
P9.5/A13/C13
P9.4/A12/C12
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREFP1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+
P1.2/TA1.1/TA0CLK/COUT/A2/C2
P1.3/TA1.2/A3/C3
DVCC2
DVSS2
P7.4/SMCLK/S11
P7.3/TA0.2/S12
P7.2/TA0.1/S13
P7.1/TA0.0/S14
P7.0/TA0CLK/S15
P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK/S16
QUARZ5
Q1
107
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C4
SAM1129-16-ND
SAM1129-16-ND
E
JP18
1
2
1
2
JP17
C3
D
R6
0R
R5
0R
100nF
HFXIN
HFXOUT
AVSS
AVCC
DVCC
DNP
DNP
AVSS
C9
DNP
Q2
HFGND QUARZ5
DNP
C8
DNP
U1
J6
P4.3/UCA0SOMI/UCA0RXD/UCB1STE/S4
P1.4/UCB0CLK/UCA0STE/TA1.0/S3
P1.5/UCB0STE/UCA0CLK/TA0.0/S2
P1.6/UCB0SIMO/UCB0SDA/TA0.1/S1
P1.7/UCB0SOMI/UCB0SCL/TA0.2/S0
R33/LCDCAP
P6.0/R23
P6.1/R13/LCDREF
P6.2/COUT/R03
P6.3/COM0
P6.4/TB0.0/COM1/S30
P6.5/TB0.1/COM2/S29
P6.6/TB0.2/COM3/S28
P3.0/UCB1CLK/TA3.2/S27
P3.1/UCB1SIMO/UCB1SDA/TA3.3/S26
P3.2/UCB1SOMI/UCB1SCL/TA3.4/S25
C10
DVCC
1
1
2
2
3
3
4 P1.6
4
5 SPICLK/SCL15
6 LCDCAP
6
7
7
8
8
9
9
10
10
11
11
12
12
13
13
14
14
15
15
16
16
LCDCAP
GND
100nF
C15
4u7
C
AVSS
C6
J3
100nF
GND
C7
P1.3
P1.2
P1.1
P1.0
DNP
GND
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
DVCC
DVSS
0R
R8
0R
R9
1uF/10V
AVSS
DVSS
JP11
JP10
JP9
1uF/10V
DVCC
JP2
GND
0R R12
0R R13
R14DNP
R11 DNP
D3
red (DNP)
R10DNP
R1 330R
D2
yellow (DNP)
D1
green
GND
B
SAM1129-16-ND
5
4
3
2
1
A
J4
DNP
SW2
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
P4.2/UCA0SIMO/UCA0TXD/UCB1CLK/S5
DVSS1
DVCC3
DVCC1
DVSS3
TEST/SBWTCK
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S6
RST/NMI/SBWTDIO
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1P4.6/UCB1SIMO/UCB1SDA/TA1.1/S7
P4.5/UCB1CLK/TA1.0/S8
PJ.1/TDI/TCLK/MCLK/SRSCG0
P4.4/UCB1STE/TA1CLK/S9
PJ.2/TMS/ACLK/SROSCOFF
P5.7/UCA1STE/TB0CLK/S10
PJ.3/TCK/COUT/SRCPUOFF
AVSS3
P3.3/TA1.1/TB0CLK/S24
PJ.6/HFXIN
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S23
PJ.7/HFXOUT
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S22
AVSS2
P3.6/UCA1CLK/TB0.2/S21
PJ.5/LFXOUT
P3.7/UCA1STE/TB0.3/S20
PJ.4/LFXIN
P2.3/UCA0STE/TB0OUTH/S19
AVSS1
P2.2/UCA0CLK/TB0.4/RTCCLK/S18
AVCC1
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0/S17
17 DVSS
17
18 DVCC
18
19TEST/SBWTCK 19
20RST/SBWTDIO 20
21
21PJ.0/TDO
22PJ.1/TDI
22
23PJ.2/TMS
23
24PJ.3/TCK
24
25
25
26
26
27
27
28
28
29
29
30
30
31
31
32RXD/SIMO1
32
2
1
2
1
2
1
TP1TP2
Figure B-50. MSP-TS430PM64F Target Socket Module, Schematic
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Hardware
BSL Tool Select
Jumper JP13 to JP15
Open = BSL Connector
Close = JTAG Connector
Connector BSL
For Bootloader
BSL Interface Select
Jumper J16
2
Close 1-2 for I C
Close 2-3 for UART
10
Connector JTAG
For JTAG Tool
Close JP17 and JP18
to enable BSL pullups
14
1
2
Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
1
2
R15
Connector J2
External power connector
Jumper J1 to “ext”
Jumper JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
R7
30
J5
U1
Clamshell
35
Switch SW1
Device reset
J4
5
Orient Pin 1 of MSP430 device
1 J3
HF and LF oscillators with capacitors
and resistors to connect pinheads
IC51-0644-807
D1 R1
D3 R11
LEDs connected to
P1.0, P1.1, P1.2 from
JP9, JP10, JP11
(only D1 assembled)
D2R10
45
40
C11
Switch SW2
Connected to P1.3
20
10 15
Jumper JP1, JP2
Open to measure
digital or analog current
25
50
55
60
J6
This target board supports UART or I2C BSL configuration. To select the configuration to use, set the
jumpers as shown in the following table.
Jumper Configuration
UART BSL Configuration
2
I C BSL Configuration
JP17 and JP18
Open
Close
JP16
Close 2-3 (UART)
Close 1-2 (I2C)
Figure B-51. MSP-TS430PM64F Target Socket Module, PCB
108
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Table B-26. MSP-TS430PM64F Bill of Materials (BOM)
Pos.
Ref Des
Number
per
Board
1
PCB
1
90.0 x 92.5 mm
MSP-TS430PM64F Rev. 1.0 2 layers, purple solder mask
2
JP1, JP2, JP9, JP13,
JP14, JP15,
6
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
3
JP17, JP18
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header's pin1 only
4
JP10, JP11
2
2-pin header, male, TH
SAM1035-02-ND
DNP, keep pads free of solder
5
J1
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
6
JP3, JP4, JP5, JP6,
JP7, JP8, JP16
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
Description
DigiKey Part Number
7
J2
1
3-pin header, male, TH
SAM1035-03-ND
8
R2, R5, R6, R8, R9
5
0R, 0805
541-0.0ATR-ND
9
R3, R12, R13
3
0R, 0805
541-0.0ATR-ND
10
C5
1
1.1nF, CSMD0805
490-1623-2-ND
11
C3, C7
2
1uF/10V, CSMD0805
490-1702-2-ND
12
C15
1
4u7, CSMD0805
445-1370-1-ND
13
R7, R15
1
10k, 0805
541-10KATR-ND
14
R4
1
47k, 0805
541-47KATR-ND
Comment
DNP
DNP
15
C4, C6, C10, C11
4
100nF, CSMD0805
490-1666-1-ND
16
R1
1
330R, 0805
541-330ATR-ND
17
R10, R11
2
330R, 0805
541-330ATR-ND
DNP
18
R14
1
47k, 0805
541-47KATR-ND
DNP
19
C1, C2, C8, C9
4
DNP, CSMD0805
20
SW2
1
EVQ-11L05R
P8079STB-ND
DNP, Lacon: 1251459
21
SW1
1
EVQ-11L05R
P8079STB-ND
DNP, Lacon: 1251459
22
J3, J4, J5, J6
4
16-pin header, TH
SAM1029-16-ND
DNP: headers enclosed with kit.
Keep vias free of solder.
23
J3, J4, J5, J6
4
16-pin receptacle, TH
SAM1213-16-ND
DNP: receptacles enclosed with kit.
Keep vias free of solder.
24
TP1, TP2
2
Testpoint
25
BSL
1
10-pin connector, male, TH
HRP10H-ND
26
JTAG
1
14-pin connector, male, TH
HRP14H-ND
27
U1
1
Socket:IC51-0644-807
Manuf. Yamaichi
28
U1
2
MSP430FR6972IPMR
DNP: enclosed with kit.
Is supplied by TI.
29
Q1
1
DNP: MS3V-TR1
(32,768kHz/ 20ppm/12,5pF)
depends on application
Micro Crystal, DNP, enclosed in kit,
keep vias free of solder
30
Q2
1
DNP, Crystal
depends on application
DNP, keep vias free of solder
516-1434-1-ND
Avago, Farnell 5790852
31
D1
1
green LED, HSMG-C170
DIODE0805
32
D3
1
red (DNP), DIODE0805
33
D2
1
yellow (DNP), DIODE0805
34
Rubber stand off
4
DNP
DNP, keep pads free of solder
DNP
DNP
Buerklin: 20H1724
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B.26 MSP-TS430RGC64B
Figure B-52. MSP-TS430RGC64B Target Socket Module, Schematic
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
If the system should
be supplied from LDOI (J6),
close JP4 and set JP3 to "ext"
Orient Pin 1 of MSP430 device
D1
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Figure B-53. MSP-TS430RGC64B Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R11 or R12 must be populated. If
the board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R12
(0 Ω) must be assembled, and R11 must be removed.
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Table B-27. MSP-TS430RGC64B Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7, C10
3
10uF, 6.3V, SMD0805
4
C5, C11,
C13, C14,
C15
5
100nF, SMD0805
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
7
C16
1
4.7uF, SMD0805
8
C17
1
220nF, SMD0805
9
D1
1
green LED, SMD0805
P516TR-ND
10
J1, J2, J3, J4
0
16-pin header, TH
SAM1029-16-ND
(Header) SAM1213-16-ND
(Receptacle)
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder:
11
J5 , J6
2
3-pin header, male, TH
12
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on pins
1-2 on JP3,
13
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
10
Jumper
15-38-1024-ND
See Pos. 12 and Pos. 13
HRP14H-ND
14
112
Description
Digi-Key Part No.
Comment
311-1245-2-ND
478-1403-2-ND
15
JTAG
1
14-pin connector, male, TH
16
BOOTST
0
10-pin connector, male, TH
17
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
18
Q2
0
Crystal
Q2: 4MHz Buerklin: 78D134 DNP: Q2 Keep vias free of solder
19
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/
Art_Detail.cfm?
ART_ARTNUM=70.08.121
20
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
21
R1, R2, R4,
R6, R8,
R9,R10, R11,
R12
3
0 Ohm, SMD0805
541-000ATR-ND
22
R5
1
47k Ω, SMD0805
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
23
U1
1
Socket: QFN11T064-006-NHSP
24
PCB
1
85 x 76 mm
25
Adhesive
plastic feet
4
Approximately 6mm width,
2mm height
2
MSP430F5310 RGC
26
D3,D4
27
MSP430
"DNP Keep vias free of solder"
for example, 3M Bumpons
Part No. SJ-5302
MSP430™ Hardware Tools
DNP: Q1 Keep vias free of solder
DNP: R6, R8, R9, R10, R11,R12
Apply to corners at bottom side
DNP: enclosed with kit, supplied by TI
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B.27 MSP-TS430RGC64C
The MSP-TS430RGC64C target board has been designed with the option to operate with the target device DVIO
input voltage supplied via header J6 (see Figure B-54). This development platform does not supply the 1.8-V
DVIO rail on board and it MUST be provided by external power supply for proper device operation. For correct
JTAG connection, programming, and debug operation, it is important to follow this procedure:
1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully discharged to
0 V.
2. Enable the 1.8-V external DVIO power supply.
3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSPFET430UIF JTAG debugger interface).
4. Connect the MSP-FET430UIF JTAG connector to the target board.
5. Start the debug session using IAR or CCS IDE.
For more information on debugging the MSP430F522x and MSP430F525x, see the device-specific data sheets
(MSP430F522x and MSP430F525x) and Designing with MSP430F522x and MSP430F521x Devices.
For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain, short JP4
with the jumper.
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113
A
13
11
9
7
5
3
1
RST/NMI
GND
TCK
TMS
TDI
TDO
TCK
2
3
1
2
3
JP8
4
THERMAL_4
tbd
C4
5
S.G.
9
7
5
3
1
J6
1
2
3
6
J5
0R
DVCC
1
2
Size:
0R
1.1
MSP430
Tools
TI Friesing
Revision:
Mentor Pads Logic V9
6
R11
PINHEAD_1X2
JP4
PINHEAD_1X3
GND
GND
BSL
CN-ML10
0 1
8
6
4
2
BOOTST
C16
GND
C15
4.7uF
1
MSP-TS430RGC64C
100nF
GND
Comment:
PINHEAD_1X3
3
2
1
DVIO Power Circle
P1.2/TA0.1
P1.1/TA0.0
TEST/SBWTCK
GND
Name:
SHORTCUT2
J3
12/14/10
Date:
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
tbd C3 XTLGND2
JP9
JP10
1
1
J5
JP1
JP5
JP10
JP9
JP8
JP7
JP6
2
R5
R2
1
SBW ->
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
VCC
GND
GND
USB1
Connector JTAG
For JTAG Tool
D1
R3
C12
C13
JP2
16
3 2 1
17 J2
32
S2
S1
LED1
R15
LED2
R16
LED3
R13
LED
C11
C10
Clamshell
J3 33
Jumper JP2
Open to disconnect LED
MSP-TS430RGC64USB
Rev.: 1.4
RoHS
Figure B-57. MSP-TS430RGC64USB Target Socket Module, PCB
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Table B-29. MSP-TS430RGC64USB Bill of Materials
Pos.
Ref Des
No. Per Board
1
C1, C2
0
12pF, SMD0805
1.1
C3, C4
2
47pF, SMD0805
2
C6, C7
2
10uF, 6.3V, Tantal Size B
511-1463-2-ND
3
C5, C11, C13,
C14
4
100nF, SMD0805
311-1245-2-ND
3.1
C10, C12
0
10uF, SMD0805
4
C8
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
Digi-Key Part No.
Comment
DNP: C1, C2
DNP: C10, C12
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
16-pin header, TH
SAM1029-16-ND
: Header
SAM1213-16-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6, JP7,
JP8, JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
10
JP1, JP2, JP4
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
place jumper on pins 1-2
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8, JP9, JP10
12
120
4
Description
13
JTAG
1
14-pin connector, male, TH
HRP14H-ND
14
Q1
0
Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
15
Q2
1
Crystal
Q2: 4MHz Buerklin: 78D134
16
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R12
2
0 Ω, SMD0805
541-000ATR-ND
18
R10
1
100 Ω, SMD0805
Buerklin: 07E500
18
R11
1
1M Ω, SMD0805
18
R5
1
47k Ω, SMD0805
19
U1
1
Socket: QFN11T064-006
Manuf.: Yamaichi
20
PCB
1
79 x 77 mm
2 layers
21
Rubber stand
off
4
22
MSP430
2
MSP430F5509 RGC
23
Insulating disk
to Q2
1
Insulating disk to Q2
http://www.ettinger.de/
Art_Detail.cfm?
ART_ARTNUM=70.08.121
27
C33
1
220n SMD0603
Buerklin: 53D2074
28
C35
1
10p SMD0603
Buerklin: 56D102
29
C36
1
10p SMD0603
Buerklin: 56D102
30
C38
1
220n SMD0603
Buerklin: 53D2074
31
C39
1
4u7 SMD0603
Buerklin: 53D2086
32
C40
1
0.1u SMD0603
Buerklin: 53D2068
33
D2, D3, D4
3
LL103A
Buerklin: 24S3406
DNP: Q1
Keep vias free of solder
DNP: R4, R6, R8, R9, R12
541-47000ATR-ND
Buerklin: 20H1724
Apply to corners at bottom side
DNP: enclosed with kit. Is
supplied by TI
MSP430™ Hardware Tools
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Table B-29. MSP-TS430RGC64USB Bill of Materials (continued)
Pos.
Ref Des
No. Per Board
34
IC7
1
Description
Digi-Key Part No.
TPD4E004
Comment
Manu: TI
36
LED
0
JP3QE
SAM1032-03-ND
DNP
37
LED1
0
LEDCHIPLED_0603
FARNELL: 852-9833
DNP
38
LED2
0
LEDCHIPLED_0603
FARNELL: 852-9868
DNP
39
LED3
0
LEDCHIPLED_0603
FARNELL: 852-9841
DNP
40
R13, R15, R16
0
470R
Buerklin: 07E564
DNP
41
R33
1
1k4 / 1k5
Buerklin: 07E612
42
R34
1
27R
Buerklin: 07E444
43
R35
1
27R
Buerklin: 07E444
44
R36
1
33k
Buerklin: 07E740
45
S1
0
PB
P12225STB-ND
DNP
46
S2
0
PB
P12225STB-ND
DNP
46
S3
1
PB
P12225STB-ND
47
USB1
1
USB_RECEPTACLE
FARNELL: 117-7885
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B.29 MSP-TS430PN80
A.
122
For MSP430F47x and MSP430FG47x devices:
Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).
MSP430™ Hardware Tools
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Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).
For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1.
Figure B-58. MSP-TS430PN80 Target Socket Module, Schematic
Jumper JP2
Open to measure current
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
D1
LED connected to pin 12
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper J6
Open to disconnect LED
Orient Pin 1 of
MSP430 device
Figure B-59. MSP-TS430PN80 Target Socket Module, PCB
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Table B-30. MSP-TS430PN80 Bill of Materials
Pos.
Ref Des
No. per Board
1
C1, C2
0
12pF, SMD0805
DNP: C1, C2
1.1
C3, C4
0
47pF, SMD0805
DNP: Only recommendation.
Check your crystal spec.
2
C6, C7
1
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
D1
1
green LED, SMD0603
475-1056-2-ND
6
J1, J2, J3, J4
Digi-Key Part No.
Comment
DNP: Headers and receptacles
enclosed with kit.Keep vias free
of solder.
25-pin header, TH
SAM1029-20-ND
: Header
SAM1213-20-ND
: Receptacle
7
J5, JP1
2
3-pin header, male, TH
SAM1035-03-ND
8
J6, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
Place on: J6, JP2, JP1/Pos1-2
9
124
0
Description
3
Jumper
15-38-1024-ND
10
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
DNP: Keep vias free of solder
12
Q1, Q2
0
Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
13
R3
1
560 Ω, SMD0805
541-560ATR-ND
14
R1, R2, R4,
R6, R7, R10,
R11, R12
2
0 Ω, SMD0805
541-000ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: IC201-0804-014
17
PCB
1
77 x 77 mm
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430FG439IPN
DNP: Keep vias free of solder
DNP: R4, R6, R7, R10, R11,
R12
Manuf.: Yamaichi
2 layers
for example, 3M Bumpons Part
Apply to corners at bottom side
No. SJ-5302
MSP430™ Hardware Tools
DNP: Enclosed with kit supplied
by TI
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B.30 MSP-TS430PN80A
Figure B-60. MSP-TS430PN80A Target Socket Module, Schematic
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
Connector BOOTST
For Bootloader Tool
Connector JTAG
For JTAG Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector J6
If the system is supplied from LDOI,
close JP4 and set JP3 to external
Orient Pin 1 of
MSP430 device
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Figure B-61. MSP-TS430PN80A Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. If
the board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10
(0 Ω) must be assembled, and R11 must be removed.
126
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Table B-31. MSP-TS430PN80A Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7,
C10, C12
3
10uF, 6.3V, SMD0805
DNP C10
4
C5, C11,
C13, C14,
C15
5
100nF, SMD0805
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
7
C16
1
4.7uF, SMD0805
8
C17
1
220nF, SMD0805
9
D1
1
green LED, SMD0805
P516TR-ND
SAM1029-20-ND
DNP: Headers and receptacles enclosed
(Header) SAM1213-20-ND
with kit. Keep vias free of solder:
(Receptacle)
Description
Digi-Key Part No.
Comment
311-1245-2-ND
478-1403-2-ND
J1, J2, J3,
J4
0
20-pin header, TH
11
J5 , J6
2
3-pin header, male, TH
12
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
13
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
10
Jumper
15-38-1024-ND
See Pos. 12 and Pos. 13
HRP14H-ND
10
14
15
JTAG
1
14-pin connector, male,
TH
16
BOOTST
0
10-pin connector, male,
TH
17
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
DNP: Q1 Keep vias free of solder
18
Q2
0
Crystal
Q2: 4MHz Buerklin:
78D134
DNP: Q2 Keep vias free of solder
19
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/
Art_Detail.cfm?
ART_ARTNUM=70.08.121
20
D3,D4
2
LL103A
Buerklin: 24S3406
21
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
22
R1, R2, R4,
R6, R8,
R9,R10,
R11, R12
3
0 Ohm, SMD0805
541-000ATR-ND
23
R5
1
47k Ω, SMD0805
541-47000ATR-ND
24
U1
1
Socket:IC201-0804-014
Manuf.: Yamaichi
25
PCB
1
77 x 91 mm
2 layers
26
Adhesive
plastic feet
4
Approximately 6mm width, for example, 3M Bumpons
Apply to corners at bottom side
2mm height
Part No. SJ-5302
27
MSP430
2
MSP430F5329IPN
"DNP Keep vias free of solder"
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DNP: R6, R8, R9, R10, R11,R12
DNP: enclosed with kit, supplied by TI
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127
Vcc
A
3
2
1
14
RXD/SIMO
TXD/SOMI/SDA12
SPICLK/SCL 10
8
6
4
2
VCC
JTAG
13
11
9
7
5
3
1
B
GND
TEST/SBWTCK1
DVCC
ext
int
J1
C
TEST/SBWTCK
JP4
3
2
1
D
EVQ11
GND
DNP
JP5
3
2 PJ.0/TDO
1
JP6
E
3
2 PJ.1/TDI
1
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
SW1
1.1nF
C5
RST/SBWTDIO
R4
47k
SAM1029-20-ND
JP7
3
2 PJ.2/TMS
1
DNP
DNP
HFXIN
HFXOUT
JP8
F
3
2 PJ.3/TCK
1
C9
DNP
G
P1.6
P2.0
2
1
I2C
2
1
H
SPICLK/SCL1
TEST/SBWTCK
9
7
5
3
RXD/SIMO1
1
TXD/SOMI/SDA1
P1.7
P2.1
GND
DVCC
UART
R15
10k
JP16
R7
10k
1
2
3
BSL Tool Select:
Open = BSL Connector
Closed = JTAG Connector
JP13
SPICLK/SCL
JP15
JP14
RXD/SIMO
C7
DVCC
TXD/SOMI/SDA
C6
GND
Q2
100nF
QUARZ5 HFGND
DNP
DNP
C8
G
H
BSL
10
8
6
4
2
I
GND
J2
DNP
Ext_PWR
STE
RST/SBWTDIO
A3
If external supply voltage:
remove R3 and add R2 (0 Ohm)
I
Title: MSP-TS430PN80B
Target socket board for MSP430FR5994IPN device
File: MSP-TS430PN80B
Page 1/1
Date: 10/5/2015 2:54:53 PM
Rev.: 1.0
J5
3
2
1
STE
RST/NMI
JP3
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
JTAG ->
3
2
1
LFXIN
LFXOUT
60
DVSS
59
58
57
56
55
54
53
SPICLK/SCL1 52
51
P1.6
50
49
48
47
46
45
44
43
42
41
P2.0
RXD/SIMO1
R2
0R
R3
0R
2
1
SBW ->
DNP
DNP
60
DVSS
59
P4.6
58
P4.5
P4.4/TB0.5 57
P5.3/UCB1STE 56
P5.2/UCB1CLK/TA4CLK 55
P5.1/UCB1SOMI/UCB1SCL 54
P5.0/UCB1SIMO/UCB1SDA 53
P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.052
P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.051
P3.7/TB0.6 50
P3.6/TB0.5 49
P3.5/TB0.4/COUT 48
P3.4/TB0.3/SMCLK 47
46
P8.3
45
P8.2
44
P8.1
P2.2/TB0.2/UCB0CLK 43
P2.1/TB0.0/UCA0RXD/UCA0SOMI 42
41
P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK
C10
Socket:
Yamaichi IC201-0804-014
MSP430FR59XXPN
DVCC
100nF
GND
F
1
2
JP17
DVCC
AVCC
DNP
DNP
C1
U1
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREFP1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+
P1.2/TA1.1/TA0CLK/COUT/A2/C2
P3.0/A12/C12
P3.1/A13/C13
P3.2/A14/C14
P3.3/A15/C15
P6.0/UCA3TXD/UCA3SIMO
P6.1/UCA3RXD/UCA3SOMI
P6.2/UCA3CLK
P6.3/UCA3STE
P4.7
P7.0/UCB2SIMO/UCB2SDA
P7.1/UCB2SOMI/UCB2SCL
P8.0
P1.3/TA1.2/UCB0STE/A3/C3
P1.4/TB0.1/UCA0STE/A4/C4
P1.5/TB0.2/UCA0CLK/A5/C5
DVSS
DVCC
SAM1029-20-ND
E
6
5
4
3
2
1
Copyright © 2021 Texas Instruments Incorporated
1
2
1uF/10V
2
1
P1.0
P1.1
P1.2
P1.3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
DVSS 19
DVCC 20
D
JP18
1
2
SAM1029-20-ND
R8
0R
R9
0R
JP1
DVCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
C2
C11
Q1
100nF
LFGND QUARZ5
connection by via
DNP
GND
J3
J6
JP2
P1.3
P1.2
P1.1
P1.0
C
DVCC
C4
100nF
JP11
DNP
JP10
DNP
JP9
AVCC
AVSS
LFXOUT
LFXIN
AVSS
HFXOUT
HFXIN
AVSS
0R
R6
0R
R5
C3
GND
AVSS
DVSS
R14DNP
R11 DNP
D3
red (DNP)
R10DNP
R1 330R
D2
yellow (DNP)
D1
green
B
SAM1029-20-ND
6
5
4
0R R13
0R R12
1uF/10V
GND
DNP
SW2
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
J4
3
2
1
A
TP1TP2
80
AVCC
79
AVSS
PJ.5/LFXOUT 78
PJ.4/LFXIN 77
76
AVSS
PJ.7/HFXOUT 75
PJ.6/HFXIN 74
73
AVSS
P6.7/UCB3STE 72
P6.6/UCB3CLK 71
P6.5/UCB3SOMI/UCB3SCL 70
P6.4/UCB3SIMO/UCB3SDA 69
P5.7/UCA2STE/TA4.1/MCLK 68
P5.6/UCA2CLK/TA4.0/SMCLK 67
P5.5/UCA2RXD/UCA2SOMI/ACLK 66
P5.4/UCA2TXD/UCA2SIMO/TB0OUTH65
P2.4/TA1.0/UCA1CLK/A7/C11 64
P2.3/TA0.0/UCA1STE/A6/C10 63
62
P2.7
61
DVCC
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6
PJ.1/TDI/TCLK/MCLK/SRSCG0/C7
PJ.2/TMS/ACLK/SROSCOFF/C8
PJ.3/TCK/SRCPUOFF/C9
P7.2/UCB2CLK
P7.3/UCB2STE/TA4.1
P7.4/TA4.0/A16
P7.5/A17
P7.6/A18
P7.7/A19
P4.0/A8
P4.1/A9
P4.2/A10
P4.3/A11
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P2.6/TB0.1/UCA1RXD/UCA1SOMI
TEST/SBWTCK
RST/NMI/SBWTDIO
DVSS
DVCC
21
21PJ.0/TDO
22PJ.1/TDI
22
23PJ.2/TMS
23
24
24PJ.3/TCK
25
25
26
26
27
27
28
28
29
29
30
30
31
31
32
32
33
33
34
34
35
35
36
36
37TEST/SBWTCK37
38RST/SBWTDIO38
39
39DVSS
40
40DVCC
2
1
2
1
2
1
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B.31 MSP-TS430PN80B
Figure B-62. MSP-TS430PN80B Target Socket Module, Schematic
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Hardware
Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Connector BSL
For Bootloader Tool
10
14
1
2
1
2
Connector J2
External power connector
Jumper JP3 to "ext"
Jumpers JP3 through JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumpers JP1 and JP2
Open to measure current
Orient Pin 1 of
MSP device
Jumpers JP9 through JP11
Open to disconnect LEDs
D1 through D3
LEDs connected to
P1.0 through P1.2
Figure B-63. MSP-TS430PN80B Target Socket Module, PCB
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129
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Table B-32. MSP-TS430PN80B Bill of Materials
130
Position
Ref Des
No. per
Board
1
PCB
1
90.0 x 92.5 mm
"MSP-TS430PN80B" Rev.
2 layers, blue solder mask
1.0
2
JP1, JP2,
JP9, JP13,
JP14, JP15
6
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
3
JP17, JP18
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on one side of header
4
JP10, JP11
2
2-pin header, male, TH
SAM1035-02-ND
DNP, keep pads free of solder
5
J1
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
6
JP3, JP4,
JP5, JP6,
JP7, JP8,
JP16
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
7
J2
1
3-pin header, male, TH
SAM1035-03-ND
8
R2, R5, R6,
R8, R9
5
0R, 0805
541-0.0ATR-ND
9
R3, R12,
R13
3
0R, 0805
541-0.0ATR-ND
10
C5
1
1.1nF, CSMD0805
490-1623-2-ND
11
C3, C7
2
1uF/10V, CSMD0805
490-1702-2-ND
12
R7, R15
2
10k, 0805
541-10KATR-ND
13
R4
1
47k, 0805
541-47KATR-ND
14
C4, C6,
C10, C11
4
100nF, CSMD0805
490-1666-1-ND
15
R1
1
330R, 0805
541-330ATR-ND
16
R10, R11
2
330R, 0805
541-330ATR-ND
DNP
17
R14
1
47k, 0805
541-47KATR-ND
DNP
18
C1, C2, C8,
C9
4
DNP, CSMD0805
19
SW2
1
EVQ-11L05R
P8079STB-ND
DNP, keep pads free of solder
20
SW1
1
EVQ-11L05R
P8079STB-ND
DNP, keep pads free of solder
21
TP1, TP2
2
Test point
HRP10H-ND
HRP14H-ND
Description
22
BSL
1
10-pin connector, male,
TH
23
JTAG
1
14-pin connector, male,
TH
Digi-Key Part No.
Comment
DNP
DNP
DNP, keep pads free of solder
24
U1
1
Socket IC201-0804-014
Manuf. Yamaichi
25
MSP device
1
MSP430FR5994
DNP: Not enclosed in kit
26
Q1
1
DNP: MS3V-TR1
(32768kHz, 20ppm,
12.5pF)
depends on application
MSP430™ Hardware Tools
Micro Crystal, DNP, enclosed in kit, keep
vias free of solder
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B.32 MSP-TS430PN80C
A
BSL_SDA
J1
BSL_SCL
ext
VCC
1
0 R20
BSL_RX R19
0
R21 0
BSL_TX
3
2
1
VCC
14
12
10
8
6
4
2
JTAG
AVCC
13
11
9
7
5
3
1
GND
RST/NMI
3
2
1
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
JP9
TEST/SBWTCK1
JTAG ->
SBW ->
12pF
DNP
C2
12pF
DNP
C1
2
JP10
DVCC
TEST/SBWTCK
LFXIN
R6
DNP
0
Q1 DNPQ1A
LFXOUT R5
DNP
0
LFXIN_ext
3
2
1
LFXOUT_ext
VCC_Meas
AVSS
USSXTIN_ext
R7
R18
4.7uF
C12
R18
0
DVSS
JP5
DNPC12
4.7uF
LCDCAP
1100pF
DVSS
C5
SW2
RST/SBWTDIO
DNP
DNP
R15
DNP
0
Use LCD_C Module
0 ohm
USSXTOUT
No LCD_C Module
C4
0.1μF
DVCC
DVSS
USSXTOUT_ext
47k
Populate either Q1 or Q1A if a crystal is needed
C11
0.1μF
Connection by via
AVSS
C8
DNP
22
R22
R14
DNP
0
22pF
DNP
22pF
DNP
Q2A
C9
HFXOUT
DNP
Q2
HFXIN
USSXTIN
Q3
USSXT_OUT
HFGND Connection by via
Populate either Q2 or Q2A if a crystal is needed
27pF
C15
27pF
C14
R8
DNP
0
HFXOUT_ext R9
DNP
0
HFXIN_ext
P1.3
P1.1
2
3
3
2 PJ.0/TDO
1
J3
3
JP6
3
2 PJ.1/TDI
1
1 AVCC
2
3
4 P1.0
5 P1.1
6 AVSS
7 LFXIN_ext
8 LFXOUT_ext
9 AVSS
10 HFXIN_ext
11 HFXOUT_ext
12
13
14
15 TEST/SBWTCK
16 RST/SBWTDIO
17 PJ.0/TDO
18 PJ.1/TDI
19 PJ.2/TMS
20 PJ.3/TCK
JP7
GND
3
2 PJ.2/TMS
1
4
Ext_PWR
VCC
J2
JP8
VCC
3
2 PJ.3/TCK
1
BSL_SCL
BSL_SDA
AVCC1
P2.2/COUT/UCA0CLK/A14/C14
P2.3/TA0.0/UCA0STE/A15/C15
P1.0/UCA1CLK/TA1.0/A0/C0/VREF-/VeREFP1.1/UCA1STE/TA4.0/A1/C1/VREF+/VeREF+
AVSS2
LFXIN
PJ.4/LFXIN
LFXOUT
PJ.5/LFXOUT
AVSS3
HFXIN
PJ.6/HFXIN/USSXT_BOUT
HFXOUT
PJ.7/HFXOUT
P2.4/TA0CLK/TB0CLK/TA1CLK/LCDS24
P2.6/UCA0SIMO/UCA0TXD/TA1.2/TA1.2C/LCDS23
P2.7/UCA0SOMI/UCA0RXD/TA4.1/TA4.1C/LCDS22
TEST/SBWTCK
RST/NMI/SBWTDIO
PJ.0/UCA2CLK/SRSCG1/DMAE0/C10/TDO
PJ.1/UCA2STE/SRSCG0/TA4CLK/C11/TDI/TCLK
PJ.2/UCA2SIMO/UCA2TXD/SROSCOFF/TB0OUTH/C12/TMS
PJ.3/UCA2SOMI/UCA2RXD/SRCPUOFF/TB0.6/C13/TCK
4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
GND
9
TEST/SBWTCK 7
5
3
1
J6
BSL_RX
BSL_TX
J4
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
BSL
5
10
8
6
4 RST/SBWTDIO
2
5
R3
0
Ch0OUT
If external supply voltage:
remove R3 and add R4 (0 ohm)
R4
DNP
0
IC1
1
3
6
SW4
2
SW5
TP8
DNP
TP1
2 BSL_SCL
DNP
TP2
4 BSL_SDA
1
I2C BSL Connection
BSLSCL
BSLSDA
1
3
J5
2
4
3
4
2
4
BSLSCL
BSLSDA
TP3
BSL_RX
DNP
TP4
BSL_TX
DNP
R17
4.7k
R16
4.7k
© Texas Instruments 2017
http://www.ti.com
C6
0.1μF
1
DNPR24
Ch1OUT
DNP
200
C18 DNP
1000pF
JP13
Ch1IN 2
SW3
I2C Pullups
1
3
UART BSL Connection
BSLRX
BSLTX
DVCC
TP7
1
R23 DNP
DNP
200
DNPC17
1000pF
Ch0IN
2
JP14
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
PVSS
60 P6.3/COM7/R23
DVCC
59 DVCC3
DVSS
58 DVSS3
57 P6.2/TB0CLK/R13/LCDREF/LCDS32
56 P6.1/RTCCLK/R03/LCDS33
55 P7.0/TA1.0/TA1.2/XPB0/LCDS30
54 P6.6/ACLK/COM2/LCDS31
53 P6.5/SMCLK/COM1/LCDS34
52 P6.4/MCLK/COM0
51 P6.0/TA0CLK/COUT/LCDS0
50 P5.7/TA0.2/UCB1STE/LCDS1
49 P5.6/TB0OUTH/UCB1SOMI/UCB1SCL/LCDS2
48 P5.5/TA4.1/UCB1SIMO/UCB1SDA/LCDS3
47 P5.4/TA0.0/UCB1CLK/TA4.0/LCDS4
46 P5.3/TB0.3/UCA2STE/LCDS5
45 P5.2/TB0.2/UCA2CLK/LCDS6
44 P5.1/TB0.1/UCA2SOMI/UCA2RXD/LCDS7
43 P5.0/TB0.0/UCA2SIMO/UCA2TXD/LCDS8
42 P4.7/DMAE0/LCDS9
DVSS
41 DVSS2
C7
1uF
DVCC
DVSS
6
Designed for: Public Release
Mod. Date: 2/16/2018
Project Title: MSP-TS430PN80C
Sheet Title:
Assembly Variant: 001
Sheet: 1 of 2
File: MCU022A_MSP-TS430PN80C_Schematic.SchDoc
Size: B
Contact: http://www.ti.com/support
IC357-0804-096P-1
Orderable: MSP-TS430PN80C
TID #:
N/A
Number: MCU022
Rev: A
SVN Rev: Version control disabled
Drawn By:
Engineer: Mike Pridgen
A
B
C
D
Copyright © 2021 Texas Instruments Incorporated
int
2
1
DVCC
AVCC
R13
DNP
47k
AVSS
Connection by via
C13
1000pF
JP12
P1.0
Ground pad not used
3
2
1
131
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VCC Current
Measurement
JP1
2
1
Power Rail
Connections
JP2
2
1
C3
1uF
AVSS
PVSS
PVSS
C16
47μF
AVSS
R11
0
R12
0
330
R1
200
R2
SW1
2
1 PVCC
GND
2
1
DVCC
JP3
JP4
TP6
DNP
R10
0
D2
DNP
TP5
1
Blue
D1
Green
JP11
81
AVSS 20
80 AVSS1
USSXTOUT_ext 19
79 USSXTOUT
USSXTIN_ext
78 USSXTIN
18
AVSS 17
77 AVSS4
76 P3.7/UCB1SOMI/UCB1SCL/TB0.2/TB0OUTH/LCDS36
16
75 P3.6/UCB1SIMO/UCB1SDA/TB0.6/USSXT_BOUT/LCDS35
15
Ch0IN 14
74 CH0_IN
CH0_OUT13
73 Ch0OUT
PVSS 12
72 PVSS
PVCC 11
71 PVCC
PVCC 10
70 PVCC
PVSS 9
69 PVSS
CH1_OUT 8
68 Ch1OUT
Ch1IN 7
67 CH1_IN
66 P3.5/ACLK/COM3/COUT/LCDS26
6
65 P3.4/SMCLK/COM6/DMAE0/LCDS27
5
64 P3.3/MCLK/TB0.3/XPB1/LCDS25
4
63 P3.2/TA1.1/COM5/LCDS28
3
62 P6.7/TA0.1/COM4/LCDS29
2
LCDCAP1
61 R33/LCDCAP
DVSS1
21
DVCC1
22
P2.5/TA0.2/TA4.0/LCDS21
23
P3.0/TB0.0/LCDS20
24
P1.2/UCA1SIMO/UCA1TXD/TA1.0/A8/C8
25
P1.3/UCA1SOMI/UCA1RXD/TA1.1/A9/C9
26
P2.0/UCA1CLK/UCA3SIMO/UCA3TXD/LCDS19
27
P2.1/UCA1STE/UCA3SOMI/UCA3RXD/LCDS18
28
P1.6/UCA3STE/UCB0SIMO/UCB0SDA/LCDS17
29
P1.7/USSTRG/UCA3CLK/UCB0SOMI/UCB0SCL/LCDS1630
P1.4/TB0.4/UCB0STE/A2/C2
31
P1.5/TB0.5/UCB0CLK/A3/C3
32
P3.1/TA1CLK/TB0.1/MTIF_OUT_IN
33
P4.0/RTCCLK/TA4.1/MTIF_PIN_EN
34
P4.1/UCA0CLK/TB0.4/UCA3SOMI/UCA3RXD/LCDS15 35
P4.2/UCA0STE/TB0.5/UCA3SIMO/UCA3TXD/LCDS14 36
P4.3/UCA0SIMO/UCA0TXD/LCDS13
37
P4.4/UCA0SOMI/UCA0RXD/LCDS12
38
P4.5/TA0CLK/TA1CLK/LCDS11
39
P4.6/TB0CLK/TA4CLK/LCDS10
40
1 DVSS
2 DVCC
3
4
5
6 P1.3
7 BSLTX
8 BSLRX
9 BSLSDA
10 BSLSCL
11
12
13
14
15
16
17
18
19
20
B
C
D
2
DVSS
1
2
1
2
1
Figure B-64. MSP-TS430PN80C Target Socket Module, Schematic
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Hardware
Jumper J1
1-2 (Debugger): Power supply from JTAG Interface
2-3 (External): External power supply
Connector JTAG
For JTAG Tool
Connector BSL
For Bootloader Tool
Connector J2
External power connector
Jumper J1 to External
BSL Interface Switches
Select which BSL interface to connect to
connector BSL
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumpers JP1 to JP4
Open to measure current
I2C pullup enable switch
Switch On to connect I2C pullup resistors
Orient Pin 1 of MSP430 device
Jumpers JP11 and JP12
Open to disconnect LEDs D1 and D2
D1, D2
LEDs connected to P1.0, P1.1
Figure B-65. MSP-TS430PN80C Target Socket Module, PCB
132
MSP430™ Hardware Tools
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Hardware
Table B-33. MSP-TS430PN80C Bill of Materials
Designator
Quantity
Value
Description
!PCB
1
Printed Circuit Board
Package Reference
MCU022
Part Number
Any
Manufacturer
BSL
1
Header(Shrouded),
Header, 2.54mm, 5x2,
2.54mm, 5x2, Gold, TH TH
AWHW-10G-0202-T
Assman WSW
C3, C7
2
1uF
CAP, CERM, 1 uF, 10
V, ±10%, X5R, 0805
0805
GRM216R61A105KA01D
MuRata
C4, C6, C11
3
0.1uF
CAP, CERM, 0.1 µF,
50 V, ±10%, X7R,
0805
0805
GRM21BR71H104KA01L
MuRata
C5
1
1100pF
CAP, CERM, 1100 pF,
50 V, ±5%, C0G/NP0,
0805
0805
GRM2165C1H112JA01D
MuRata
0805
GCM2165C1H102JA16D
MuRata
C13
1
1000pF
CAP, CERM, 1000 pF,
50 V, ±5%, C0G/NP0,
AEC-Q200 Grade 1,
0805
C14, C15
2
27pF
CAP, CERM, 27 pF,
50 V, ±5%, C0G/NP0,
0603
0603
GRM1885C1H270JA01D
MuRata
C16
1
47uF
CAP, CERM, 47 µF,
6.3 V, ±20%, X5R,
0805
0805
GRM21BR60J476ME15L
MuRata
D1
1
Green
LED, Green, SMD
LED_0805
APT2012LZGCK
Kingbright
D2
1
Blue
LED, Blue, SMD
LED_0805
150080BS75000
Wurth Elektronik
Black Bumpon
SJ61A1
3M
Comments
H1, H2, H3,
H4
4
Bumpon, Cylindrical,
0.312 X 0.200, Black
IC1
1
Socket, QFP-80,
0.5 mm Pitch
Socket, QFN-80,
0.5 mm Pitch
IC357-0804-096P-1
Yamaichi Electronics
J1, J2, JP5,
JP6, JP7,
JP8, JP9,
JP10
8
Header, 100mil, 3x1,
Gold, TH
3x1 Header
TSW-103-07-G-S
Samtec
J3, J4, J5, J6
4
Header, 100mil, 20x1,
Gold, TH
20x1 Header
TSW-120-07-G-S
Samtec
Not installed,
included in kit
J3A, J4A,
J5A, J6A
4
Receptacle, 2.54 mm,
20x1, Gold, TH
Receptacle, 2.54mm,
20x1, TH
PPPC201LFBN-RC
Sullins Connector
Solutions
Not installed,
included in kit
JP1, JP2,
JP3, JP4,
JP11, JP12,
JP13, JP14
8
Header, 100mil, 2x1,
Gold, TH
2x1 Header
TSW-102-07-G-S
Samtec
JTAG
1
Header (shrouded),
100 mil, 7x2, Gold, TH
7x2 Shrouded Header
SBH11-PBPC-D07-ST-BK
Sullins Connector
Solutions
Q1
1
Crystal, 32.768 kHz,
12.5pF, SMD
1.4x1.4x5.0mm SMD
MS3V-T1R 32.768KHZ
±20PPM 12.5PF
Micro Crystal AG
Q3
1
Crystal, 8MHz, SMD
4.7x4.1mm
R- 8,00M-ZTACS/
MT-0,5-0,4-H-30/30-TR
Auris-GmbH
R1
1
330
RES, 330, 5%,
0.125 W, 0805
0805
CRCW0805330RJNEA
Vishay-Dale
R2
1
200
RES, 200, 5%,
0.125 W, 0805
0805
CRCW0805200RJNEA
Vishay-Dale
R3, R10,
R11, R12,
R18, R19,
R20, R21
8
0
RES, 0, 5%, 0.125 W,
0805
0805
CRCW08050000Z0EA
Vishay-Dale
R7
1
47k
RES, 47 k, 5%,
0.125 W, 0805
0805
CRCW080547K0JNEA
Vishay-Dale
R16, R17
2
4.7k
RES, 4.7 k, 5%,
0.125 W, 0805
0805
CRCW08054K70JNEA
Vishay-Dale
R22
1
22
RES, 22, 5%, 0.1 W,
0603
0603
CRCW060322R0JNEA
Vishay-Dale
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Table B-33. MSP-TS430PN80C Bill of Materials (continued)
Designator
Quantity
SH‑J1,
SH‑JP1,
SH‑JP2,
SH‑JP3,
SH‑JP4,
SH‑JP5,
SH‑JP6,
SH‑JP7,
SH‑JP8,
SH‑JP9,
SH‑JP10,
SH‑JP11,
SH‑JP12,
SH‑JP13,
SH‑JP14
15
SW1, SW2
2
SW3, SW4,
SW5
3
C1, C2
0
C8, C9
Value
Shunt, 100mil, Gold
plated, Black
Package Reference
Shunt
Part Number
Manufacturer
SNT-100-BK-G
Samtec
Switch, SPST-NO, OffMom, 0.02 A, 15 VDC, 6x6mm
TH
EVQ-11A04M
Panasonic
Switch, DPST, Slide,
Off-On, 1 Pos, 0.15A,
30V, TH
9.65x7.12mm
78F01T
Grayhill
12pF
CAP, CERM, 12 pF,
50 V, ±5%, C0G/NP0,
0805
0805
CC0805JRNP09BN120
Yageo America
0
22pF
CAP, CERM, 22 pF,
50 V, ±5%, C0G/NP0,
0805
0805
GQM2195C1H220JB01D
MuRata
C12
0
4.7uF
CAP, CERM, 4.7 µF,
10 V, +80/-20%, Y5V,
0805
0805
CC0805ZRY5V6BB475
Yageo America
C17, C18
0
1000pF
CAP, CERM, 1000 pF,
50 V, ±1%, C0G/NP0,
0805
0805
08055A102FAT2A
AVX
FID1, FID2,
FID3, FID4,
FID5, FID6
0
Fiducial mark. There
is nothing to buy or
mount.
N/A
N/A
N/A
Q1A, Q2A
0
Crystal, 12 MHz,
18 pF, TH
11.5x5mm
9B-12.000MEEJ-B
TXC Corporation
Q2
0
Crystal, 32.768 kHz,
12.5pF, SMD
1.4x1.4x5.0mm SMD
MS3V-T1R 32.768KHZ
±20PPM 12.5PF
Micro Crystal AG
R4, R5, R6,
R8, R9
0
0
RES, 0, 5%, 0.125 W,
0805
0805
CRCW08050000Z0EA
Vishay-Dale
R13
0
47k
RES, 47 k, 5%,
0.125 W, 0805
0805
CRCW080547K0JNEA
Vishay-Dale
R14, R15
0
0
RES, 0, 5%, 0.1 W,
0603
0603
CRCW06030000Z0EA
Vishay-Dale
R23, R24
0
200
RES, 200, 1%,
0.125 W, 0805
0805
CRCW0805200RFKEA
Vishay-Dale
TP1, TP2,
TP3, TP4
0
Black
Test Point, Miniature,
Black, TH
Black Miniature
Testpoint
5001
Keystone
TP5, TP6,
TP7, TP8
0
Test Point, Miniature,
Black, TH
Black Miniature
Testpoint
5001
Keystone
134
1x2
Description
MSP430™ Hardware Tools
Comments
Alternate part
number:
969102-0000DA
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B.33 MSP-TS430PN80USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V
lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to
run the MCU at 3.0 V, set it to 3.3 V.
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A.
R11 should be populated.
Figure B-66. MSP-TS430PN80USB Target Socket Module, Schematic
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Connector JTAG
For JTAG Tool
Jumper JP3
1-2 (int): Power supply from JTAG debug interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
USB Connector
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP4
Close for USB bus powered device
Button S3
BSL invoke
Orient Pin 1 of MSP430 device
D1
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Figure B-67. MSP-TS430PN80USB Target Socket Module, PCB
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Table B-34. MSP-TS430PN80USB Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
1.1
C3, C4
2
47pF, SMD0805
2
C6, C7
2
10uF, 6.3V, Tantal Size B
511-1463-2-ND
3
C5, C11, C13,
C14
4
100nF, SMD0805
311-1245-2-ND
3.1
C10, C12
0
10uF, SMD0805
311-1245-2-ND
4
C8
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
4
20-pin header, TH
SAM1029-20-ND
7.1
4
Description
Digi-Key Part No.
Comment
DNP: C1, C2
DNP: C10, C12
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder.
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder.
20-pin header, TH
SAM1213-20-ND
: Header
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6,
JP7, JP8,JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on pins 2-3
10
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
JP4
1
SAM1035-02-ND
Place jumper only on one pin
JP3
1
3-pin header, male, TH
SAM1035-03-ND
Place jumper on pins 1-2
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8, JP9,
JP10
11
12
138
13
JTAG
1
14-pin connector, male, TH
HRP14H-ND
14
Q1
0
Crystal
Micro Crystal MS1V-T1K
DNP: Q1 Keep vias free of
32.768kHz, C(Load) = 12.5pF solder
15
Q2
1
Crystal
"Q2: 4MHzBuerklin: 78D134"
16
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R12
2
0 Ω, SMD0805
541-000ATR-ND
18
R10
1
100 Ω, SMD0805
Buerklin: 07E500
18
R11
0
1M Ω, SMD0805
DNP: R4, R6, R8, R9, R12
DNP
18
R5
1
47k Ω, SMD0805
19
U1
1
Socket:IC201-0804-014
541-47000ATR-ND
20
PCB
1
79 x 77 mm
21
Rubber
standoff
4
22
MSP430
2
MSP430F5529
23
Insulating disk
to Q2
1
Insulating disk to Q2
http://www.ettinger.de/
Art_Detail.cfm?
ART_ARTNUM=70.08.121
27
C33
1
220n
Buerklin: 53D2074
28
C35
1
10p
Buerklin: 56D102
29
C36
1
10p
Buerklin: 56D102
Manuf.: Yamaichi
2 layers
Buerklin: 20H1724
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
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Table B-34. MSP-TS430PN80USB Bill of Materials (continued)
Pos.
Ref Des
No. per
Board
30
C38
1
220n
Buerklin: 53D2074
31
C39
1
4u7
Buerklin: 53D2086
32
C40
1
0.1u
Buerklin: 53D2068
33
D2, D3, D4
3
LL103A
Buerklin: 24S3406
34
IC7
1
TPD4E004
36
LED
0
JP3QE
Description
Digi-Key Part No.
Comment
Manu: TI
SAM1032-03-ND
DNP
37
LED1
0
LEDCHIPLED_0603
FARNELL: 852-9833
DNP
38
LED2
0
LEDCHIPLED_0603
FARNELL: 852-9868
DNP
39
LED3
0
LEDCHIPLED_0603
FARNELL: 852-9841
DNP
40
R13, R15,
R16
0
470R
Buerklin: 07E564
DNP
41
R33
1
1k4
Buerklin: 07E612
42
R34
1
27R
Buerklin: 07E444
43
R35
1
27R
Buerklin: 07E444
44
R36
1
33k
Buerklin: 07E740
45
S1
0
PB
P12225STB-ND
DNP
46
S2
0
PB
P12225STB-ND
DNP
46
S3
1
PB
P12225STB-ND
47
USB1
1
USB_RECEPTACLE
FARNELL: 117-7885
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B.34 MSP-TS430PZ100
A.
Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made.
Figure B-68. MSP-TS430PZ100 Target Socket Module, Schematic
140
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Jumper J6
Open to disconnect LED
Connector JTAG
For JTAG Tool
Jumper J7
Open to measure current
Connector BOOTST
For Bootloader Tool
D1
LED connected to pin 12
Connector J5
External power connection
Remove R8 and jumper R9
Orient Pin 1 of MSP430 device
Figure B-69. MSP-TS430PZ100 Target Socket Module, PCB
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Table B-35. MSP-TS430PZ100 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
Digi-Key Part No.
DNP
DNP: Only recommendation.
Check your crystal spec.
C3, C4
0
47pF, SMD0805
2
C6, C7
1
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
yellow LED, TH, 3mm, T1
511-1251-ND
J1, J2, J3, J4
0
Comment
12pF, SMD0805
1b
7
DNP: C6
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
25-pin header, TH
SAM1029-25-ND
: Header
SAM1213-25-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
J6, J7
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
Place on: J6, J7
10
2
Jumper
15-38-1024-ND
11
JTAG
1
14-pin connector, male, TH
HRP14H-ND
12
BOOTST
0
10-pin connector, male, TH
DNP: Keep vias free of solder
Q1, Q2
0
Crystal
Q1: Micro Crystal MS1V-T1K
DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
14
R3
1
330 Ω, SMD0805
541-330ATR-ND
15
R1, R2, R4,
R8, R9, R10,
R11, R12
3
0 Ω, SMD0805
541-000ATR-ND
16
R5
1
47k Ω, SMD0805
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
13
142
Description
17
U1
1
Socket: IC201-1004-008 or
IC357-1004-53N
18
PCB
1
82 × 90 mm
19
Adhesive
Plastic feet
4
~6mm width, 2mm height
20
MSP430
2
MSP430FG4619IPZ
for example, 3M Bumpons
Part No. SJ-5302
MSP430™ Hardware Tools
DNP: R4, R9, R10, R12
Apply to corners at bottom
side
DNP: enclosed with kit
supplied by TI
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B.35 MSP-TS430PZ100A
Figure B-70. MSP-TS430PZ100A Target Socket Module, Schematic
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Jumper JP1
Open to measure current
Connector BOOTST
For Bootloader Tool
Jumper JP2
Open to disconnect LED
Connector J5
External power connector
Jumper JP3 to "ext"
D1
LED connected to P5.1
Orient Pin 1 of
MSP430 Device
Figure B-71. MSP-TS430PZ100A Target Socket Module, PCB
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Table B-36. MSP-TS430PZ100A Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
1b
C3, C4
0
47pF, SMD0805
DNP: Only recommendation.
Check your crystal spec.
2
C7, C9
2
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5, C11, C14
3
100nF, SMD0805
311-1245-2-ND
4
C8
1
10nF, SMD0805
478-1358-1-ND
5
C6
0
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
67-1553-1-ND
7
J1, J2, J3, J4
0
Description
Digi-Key Part No.
Comment
DNP
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
25-pin header, TH
SAM1029-25-ND
: Header
SAM1213-25-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
10
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
pPlace jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
Place jumper on pins 1-2
3
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3
HRP14H-ND
12
13
JTAG
1
14-pin connector, male, TH
14
BOOTST
0
10-pin connector, male, TH
15
Q1, Q2
0
Crystal
Q1: Micro Crystal MS1V-T1K
DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
16
R3
1
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R7, R8,
R9, R10, R11,
R12
2
0 Ω, SMD0805
541-000ATR-ND
18
R5
1
47k Ω, SMD0805
541-47000ATR-ND
19
U1
1
Socket: IC357-1004-53N
Manuf.: Yamaichi
20
PCB
1
90 x 82 mm
4 layers
21
Rubber
standoff
4
22
MSP430
2
DNP: Keep vias free of solder
Select appropriate
MSP430F47197IPZ
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DNP: R4, R6, R7, R8, R9,
R10, R11, R12
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
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B.36 MSP-TS430PZ100B
Figure B-72. MSP-TS430PZ100B Target Socket Module, Schematic
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP1
Open to measure current
Orient Pin 1 of MSP430 device
JP11, JP12, JP13
Connect 1-2 to connect
AUXVCCx with DVCC
or drive AUXVCCx externally
D1
LED connected to P1.0
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP2
Open to disconnect LED
Figure B-73. MSP-TS430PZ100B Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. If
the board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10
(0 Ω) must be assembled, and R11 must be removed.
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Table B-37. MSP-TS430PZ100B Bill of Materials
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C4, C5, C6 ,
C7, C8, C9
6
100nF, SMD0805
311-1245-2-ND
3
C10, C26
2
470 nF, SMD0805
478-1403-2-ND
4
C11, C12
1
10 uF / 6.3 V SMD0805
5
C13, C14,
C16, C18,
C19, C29
6
4.7 uF SMD0805
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3,
J4
0
25-pin header, TH
SAM1029-25-ND
DNP: Headers and receptacles enclosed
(Header) SAM1213-25-ND
with kit. Keep vias free of solder:
(Receptacle)
8
J5
1
3-pin header, male, TH
9
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
10
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
11
JP11, JP12,
JP13
3
4-pin header, male, TH
13
Jumper
15-38-1024-ND
HRP14H-ND
Position
12
148
Description
Digi-Key Part No.
Comment
DNP
C12 DNP
place jumper on header 1-2
See Pos. 9 and Pos. 10 and Pos. 11
15
JTAG
1
14-pin connector, male,
TH
16
BOOTST
0
10-pin connector, male,
TH
"DNP Keep vias free of solder"
17
Q1
0
Crystal
DNP: Q1 Keep vias free of solder
21
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
22
R1, R2, R4,
R6, R8,
R10, R11
2
0 Ohm, SMD0805
541-000ATR-ND
23
R5
1
47k Ω, SMD0805
541-47000ATR-ND
24
U1
1
Socket: IC357-1004-53N
Manuf.: Yamaichi
25
PCB
1
90 x 82 mm
2 layers
26
Adhesive
plastic feet
4
Approximately 6mm width, for example, 3M Bumpons
Apply to corners at bottom side
2mm height
Part No. SJ-5302
27
MSP430
2
MSP430F6733IPZ
MSP430™ Hardware Tools
DNP: R4, R6, R8, R10, R11
DNP: enclosed with kit, supplied by TI
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B.37 MSP-TS430PZ100C
BOOTST
10
8
6
4
2
R10
R11
DNP
DNP
0R
0R
LDOO
C18
100nF
C19
100nF
GND
1 JP5
2
3
DNP
GND
JP6
R9
XT2IN
R12
XT2OUT
TDO 1
RST 2
RST/NMI 3
1 JP4
2
LDOI/LDOO Interface
GND
R7 330R
VCC
GND
TEST/SBWTCK
TCK
1 J6
2
3
Note: If the system should be
supplied via LDOI (J6) close JP4
and set JP3 to external
LDOI
GND
RST/NMI
TCK
TMS
TDI
TDO
TEST/SBWTCK
C
TCK
0R
0R
D1
1 JP7
2
3
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
M
TMS
HCTC_XTL_4
DNP
Q2G$1
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
P8.2 60
P8.1 59
P8.0 58
57
56
55
54
53
52
51
1 JP8
2
3
C3
DNP
I
TDI
47pF
47pF
DNP
C4
J3
DVCC1
1 JP9
2
3
GND
O
TDO
C11 100nF
C10 100nF
DNP
GND
4
3
2
1
VBAT
DVCC1
GND
1 JP10
C
TEST/SBWTCK
JP4
3
2
1
D
EVQ11
GND
DNP
JP5
3
2 PJ.0/TDO
1
JP6
E
3
2 PJ.1/TDI
1
JP7
3
2 PJ.2/TMS
1
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP3 to JP8 to position 2-3
2-wire "SpyBiWire": Set jumpers JP3 to JP8 to position 1-2
SW1
1.1nF
C5
RST/SBWTDIO
47k
R4
HFXIN
HFXOUT
JP8
F
3
2 PJ.3/TCK
1
DNP
DNP
DNP
C9
DNP
DNP
C8
HFGND
C7
100nF
C6
DVCC
1uF/10V
GND
G
J5
H
TEST/SBWTCK
BSLRX
BSLTX
RST/SBWTDIO
DVCC
ESIVCC
C12
GND
9
7
5
3
1
10
8
6
4
2
BSL
DNP
Rev.: 1.2
I
GND
J2
Ext_PWR
DNP
DNP
Seite 1/1
I
A3
6
5
1
2
3
4
If external supply voltage:
remove R3 and add R2 (0 Ohm)
1 JP12
2
DNP
100nF
C13
DNP
DNP
470nF
C14
3
2
1
Bearb.:Petersen
1099/1/001/01.1
GND
ESICOM
1uF/10V
DNP
GND
File: MSP-TS430PZ100D
Datum:7/9/2013 5:23:25 PM
G
H
Target Socket Board for MSP430FR698xPZ, FR688xPZ
Dok:
Titel: MSP-TS430PZ100D
FE25-1A3
75 ESIVCC 75
ESIVCC
74
P9.7/ESICI3/A15/C15 74
73
P9.6/ESICI2/A14/C14 73
72
P9.5/ESICI1/A13/C13 72
71
P9.4/ESICI0/A12/C12 71
70
P9.3/ESICH3/ESITEST3/A11/C11 70
69
P9.2/ESICH2/ESITEST2/A10/C10 69
68
P9.1/ESICH1/ESITEST1/A9/C9 68
67
P9.0/ESICH0/ESITEST0/A8/C8 67
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREF66 P1.0 66
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+65 P1.1 65
P1.2/TA1.1/TA0CLK/COUT/A2/C2 64 P1.2 64
P1.3/ESITEST4/TA1.2/A3/C3 63 P1.3 63
62
P8.7/A4/C4 62
61
P8.6/A5/C5 61
60
P8.5/A6/C6 60
59
P8.4/A7/C7 59
58 DVCC 58
DVCC2
57 DVSS 57
DVSS2
56
P7.4/SMCLK/S13 56
55
P7.3/TA0.2/S14 55
54
P7.2/TA0.1/S15 54
53
P7.1/TA0.0/S16 53
52
P7.0/TA0CLK/S17 52
P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK51 BSLTX51
Socket:
Yamaichi IC201-1004-008
F
R2
-
R3
0R
J1
DVCC
ext
int
DVCC
AVCC
DNP
DNP
E
QUARZ5
Q2
2
1
2
1
JP1
100nF
C4
C2
DNP
C1
LFXIN
LFXOUT
P4.3/UCA0SOMI/UCA0RXD/UCB1STE
P1.4/UCB0CLK/UCA0STE/TA1.0/S1
P1.5/UCB0STE/UCA0CLK/TA0.0/S0
P1.6/UCB0SIMO/USB0SDA/TA0.1
P1.7/UCB0SOMI/UCB0SCL/TA0.2
R33/LCDCAP
P6.0/R23
P6.1/R13/LCDREF
P6.2/COUT/R03
P6.3/COM0
P6.4/TB0.0/COM1
P6.5/TB0.1/COM2
P6.6/TB0.2/COM3
P2.4/TB0.3/COM4/S43
P2.5/TB0.4/COM5/S42
P2.6/TB0.5/COM6/S41
P2.7/TB0.6/COM7/S40
P10.2/TA1.0/SMCLK/S39
P5.0/TA1.1/MCLK/S38
P5.1/TA1.2/S37
P5.2/TA1.0/TA1CLK/ACLK/S36
P5.3/UCB1STE/S35
P3.0/UCB1CLK/S34
P3.1/UCB1SIMO/UCB1SDA/S33
P3.2/UCB1SOMI/UCB1SCL/S32
IC1
Q1
LFGND QUARZ5
DNP
connection by via
100nF
C11
GND
DNP
1
1
2
2
3
3
4
4
5
5
6 LCDCAP 6
7
7
8
8
9
9
10
10
11
11
12
12
13
13
14
14
15
15
16
16
17
17
18
18
19
19
20
20
21
21
22
22
23
23
24
24
25
25
FE25-1A1
J3
C10
DVCC
MSP430FR698XPZ
LCDCAP
100nF
C15
4u7
GND
D
Copyright © 2021 Texas Instruments Incorporated
C3
DVCC
P1.3
P1.2
P1.1
P1.0
DNP
GND
ESIVSS
1uF/10V
AVSS
DVSS
JP11
JP10
JP9
C
AVSS
AVCC
ESICOM
JP2
GND
0R R12
0R R13
R14DNP
R11 DNP
D3
red (DNP)
R10DNP
R1 330R
D2
yellow (DNP)
D1
green
GND
B
AVSS
6
5
4
3
2
1
A
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
AVSS
0R
R6
0R
R5
R8
0R
R9
0R
GND
FE25-1A4
R7
0R
J4
DNP
SW2
DVCC
DVSS
P4.2/UCA0SIMO/UCA0TXD/UCB1CLK 100
DVSS1
99
DVCC3
DVCC1
98
DVSS3
TEST/SBWTCK
P4.1/UCB1SOMI/UCB1SCL/ACLK/S2 97
XRST/NMI/SBWTDIO
P4.0/UCB1SIMO/UCB1SDA/MCLK/S3 96
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1
P10.0/SMCLK/S4 95
PJ.1/TDI/TCLK/MCLK/SRSCG0
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S5 94
PJ.2/TMS/ACLK/SROSCOFF
P4.6/UCB1SIMO/UCB1SDA/TA1.1/S6 93
PJ.3/TCK/COUT/SRCPUOFF
P4.5/UCB1CLK/TA1.0/S7 92
P6.7/TA0CLK/S31
P4.4/UCB1STE/TA1CLK/S8 91
P7.5/TA0.2/S30
P5.7/UCA1STE/TB0CLK/S9 90
P7.6/TA0.1/S29
P5.6/UCA1CLK/S10 89
P10.1/TA0.0/S28
P5.5/UCA1SOMI/UCA1RXD/S11 88
P7.7/TA1.2/TB0OUTH/S27
P5.4/UCA1SIMO/UCA1TXD/S12 87
P3.3/TA1.1/TB0CLK/S26
86
AVSS2
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S25
PJ.5/LFXOUT 85
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S24
PJ.4/LFXIN 84
P3.6/UCA1CLK/TB0.2/S23
83
AVSS1
P3.7/UCA1STE/TB0.3/S22
PJ.6/HFXIN 82
P8.0/RTCCLK/S21
PJ.7/HFXOUT 81
P8.1/DMAE0/S20
80
AVSS3
P8.2/S19
79
AVCC1
P8.3/MCLK/S18
78
ESICOM
P2.3/UCA0STE/TB0OUTH
77
ESICI
P2.2/UCA0CLK/TB0.4/RTCCLK
76
ESIVSS
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0
26 DVSS
26
27 DVCC
27
28 TEST/SBWTCK28
29 RST/SBWTDIO29
30 PJ.0/TDO
30
31 PJ.1/TDI
31
32 PJ.2/TMS
32
33 PJ.3/TCK
33
34
34
35
35
36
36
37
37
38
38
39
39
40
40
41
41
42
42
43
43
44
44
45
45
46
46
47
47
48
48
49
49
50 BSLRX
50
TP1TP2
J6
FE25-1A2
2
1
2
1
2
1
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B.38 MSP-TS430PZ100D
Figure B-76. MSP-TS430PZ100D Target Socket Module, Schematic
Hardware
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Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
45
40
Vcc
int
R13
TEST/SBWTCK
SBW
1
35
30
Jumper JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
C10
J4 26
R4
50
JTAG
GND
SW1
C5
25
J5 51
J2
TP2
Switch SW1
Device reset
RESET
JP1
C11
Q1
Q2
5
C3
C4
70
10
C15
C12
C13
65
JP9
D1 R1
C14
80
85
90
J3
1
C2
R6
R5
C1
C8
R9
R8
C9
75
ESIVCC
JP12
R7
JP2
AVCC 76 J6
Orient Pin 1 of MSP430 device
1
R12
P1.0
JP11
D3 R11
D2 R10
P1.1
P1.2
JP10
R14
IC1
15
SW2
60
P1.3
RoHS
C6
C7
Rev. 1.2
DVCC
Switch SW2
Connected to P1.3
MSP-TS430PZ100D
20
55
Jumper JP1
Open to measure current
LEDs connected to
P1.0, P1.1, P1.2 through
JP9, JP10, JP11
(only D1 assembled)
PWR J1
ext
R3
R2
Vcc
GND
GND
Connector J2
External power connector
Jumper J1 to “ext”
JTAG
BSL
Ext.
Pwr.
1
2
TDO
RST/SBWTDIO
14
1
2
TCK
TMS
TDI
10
JP8 1
JP7 1
JP6 1
JP5 1
JP4 1
JP3 1
Connector BSL
For Bootloader Tool
95
TP1
HF and LF oscillators with
capacitors and resistors
to connect pinheads
GND
100
Figure B-77. MSP-TS430PZ100D Target Socket Module, PCB
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Table B-39. MSP-TS430PZ100D Bill of Materials
Pos.
Ref Des
Number
Per
Board
Description
Digi-Key Part No.
Comment
1
PCB
1
90.0 x 100.0 mm
MSP-TS430PZ100D
Rev 1.2
2 layers, white solder mask
2
JP1, JP2,
JP9
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
3
JP10, JP11,
JP12
3
2-pin header, male, TH
SAM1035-02-ND
DNP, keep pads free of solder
4
J1
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
5
JP3, JP4,
JP5, JP6,
JP7, JP8
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
6
J2
1
3-pin header, male, TH
SAM1035-03-ND
7
R2, R3, R5,
R6, R8, R9
6
0R, 0805
541-0.0ATR-ND
8
R7, R12,
R13
3
0R, 0805
541-0.0ATR-ND
9
C5
1
1.1nF, CSMD0805
490-1623-2-ND
10
C3, C7
2
1uF/10V, CSMD0805
490-1702-2-ND
11
C12
1
1uF/10V, CSMD0805
490-1702-2-ND
12
R4
1
47k, 0805
541-47KATR-ND
13
C4, C6, C10, 4
C11
100nF, CSMD0805
490-1666-1-ND
14
C13
1
100nF, CSMD0805
490-1666-1-ND
DNP
15
C15
1
4u7, CSMD0805
445-1370-1-ND
DNP
16
R1
1
330R, 0805
541-330ATR-ND
17
C14
1
470nF, CSMD0805
587-1290-2-ND
DNP
18
R10, R11
2
330R, 0805
541-330ATR-ND
DNP
19
R14
1
47k, 0805
541-47KATR-ND
DNP
20
C1, C2, C8,
C9
4
DNP, CSMD0805
21
SW2
1
EVQ-11L05R
P8079STB-ND
22
SW1
1
EVQ-11L05R
P8079STB-ND
DNP
23
J3, J4, J5, J6 4
SAM1029-25-ND
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
: Header
SAM1213-25-ND
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
: Receptacle
J3, J4, J5, J6 4
25-pin receptacle, TH
25
TP1, TP2
Testpoint
2
DNP
DNP
25-pin header, TH
24
DNP
DNP
DNP, keep pads free of solder
26
BSL
1
10-pin connector, male, TH
HRP10H-ND
27
JTAG
1
14-pin connector, male, TH
HRP14H-ND
28
IC1
1
Socket: IC201-1004-008
29
IC1
1
MSP430FR6989
30
Q1
1
DNP: MS3V-TR1 (32768kHz/
20ppm/12,5pF)
depends on application
Micro Crystal, DNP, enclosed in kit, keep
vias free of solder
31
Q2
1
DNP, Crystal
depends on application
DNP, keep vias free of solder
32
D1
1
green LED, DIODE0805
P516TR-ND
33
D3
1
red (DNP), DIODE0805
DNP
34
D2
1
yellow (DNP), DIODE0805
DNP
154
DNP, keep vias free of solder
Manuf. Yamaichi
DNP: enclosed with kit. Is supplied by TI
MSP430™ Hardware Tools
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Table B-39. MSP-TS430PZ100D Bill of Materials (continued)
Pos.
35
Ref Des
Rubber
stand off
Number
Per
Board
Description
4
Digi-Key Part No.
Buerklin: 20H1724
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Comment
apply to corners at bottom side
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B.39 MSP-TS430PZ100E
Figure B-78. MSP-TS430PZ100E Target Socket Module, Schematic
156
MSP430™ Hardware Tools
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Jumper J1
1-2 (Debugger): Power supply from JTAG interface
2-3 (External): External power supply
Connector JTAG
For JTAG Tool
Connector BSL
For Bootloader Tool
Connector J2
External power connector
Jumper J1 to External
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
BSL Interface Switches
Select which BSL interface to connect
to connector BSL
Jumpers JP1 to JP4
Open to measure current
I2C pullup enable switch
Switch On to connect I2C pullup resistors
Orient Pin 1 of MSP430 device
Jumpers JP11, JP12
Open to disconnect LEDs D1 and D2
D1, D2
LEDs connected to P1.0, P1.1
Figure B-79. MSP-TS430PZ100E Target Socket Module, PCB
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Table B-40. MSP-TS430PZ100E Bill of Materials
Item No.
158
Designator
Quantity
Description
Supplier Part Number
Note
2 layers, yellow solder
mask
1
PCB1
1
PCB, 3.20" x 4.50"
2
BSL
1
Header(Shrouded), 2.54mm, 5x2,
Gold, TH
3
C1, C2
2
CAP, CERM, 12 pF, 50 V, ±5%, C0G/
311-1100-1-ND
NP0, 0805
4
C3, C7
2
CAP, CERM, 1 µF, 10 V, ±10%, X5R,
490-1702-1-ND
0805
5
C4, C6, C10, C11
4
CAP, CERM, 0.1 µF, 50 V, ±10%,
X7R, 0805
490-1666-1-ND
6
C5
1
CAP, CERM, 1100 pF, 50 V, ±5%,
C0G/NP0, 0805
490-1623-1-ND
7
C8, C9
2
CAP, CERM, 22 pF, 50 V, ±5%, C0G/
490-3608-1-ND
NP0, 0805
DNP
8
C12
1
CAP, CERM, 4.7 µF, 10 V, +80/-20%,
311-1371-2-ND
Y5V, 0805
DNP
9
C13
1
CAP, CERM, 1000 pF, 50 V, ±5%,
490-8032-1-ND
C0G/NP0, AEC-Q200 Grade 1, 0805
10
C14, C15
2
CAP, CERM, 27 pF, 50 V, ±5%, C0G/
490-1413-1-ND
NP0, 0603
11
C16
1
CAP, CERM, 47 µF, 6.3 V, ±20%,
X5R, 0805
490-9960-1-ND
12
D1
1
LED, Green, SMD
754-1939-1-ND
13
D2
1
LED, Blue, SMD
732-4982-1-ND
14
H1, H2, H3, H4
4
125mil Mounting Hole
15
H5, H6, H7, H8
4
Bumpon, Cylindrical, 0.312 X 0.200,
Black
16
IC1
1
Socket, QFP-100, 0.5 mm Pitch
17
J1, J2, JP5, JP6, JP7,
JP8, JP9, JP10
8
Header, 100mil, 3x1, Gold, TH
SAM1029-03-ND
18
J3, J4, J5, J6
4
Header, 100mil, 25x1, Gold, TH
SAM1029-25-ND
DNP: Headers are
enclosed in kit. Keep
vias free of solder
19
J3, J4, J5, J6
4
Receptacle, 100mil, 25x1, Gold, TH
SAM1213-25-ND
DNP: Receptacles are
enclosed in kit. Keep
vias free of solder
20
JP1, JP2, JP3, JP4,
JP11, JP12, JP13, JP14
8
Header, 100mil, 2x1, Gold, TH
SAM1029-02-ND
21
JTAG
1
Header (shrouded), 100 mil, 7x2,
Gold, TH
S9170-ND
22
Q1, Q2
2
32.768kHz ±20ppm 12.5pF
94M8466
DNP: Keep holes free of
solder
23
Q3
1
ZTACS Crystal Resonator
77D9806
DNP
24
R1
1
RES, 330, 5%, 0.125 W, 0805
541-330ACT-ND
25
R2
1
RES, 200, 5%, 0.125 W, 0805
541-200ACT-ND
26
R3, R10, R11, R12,
R18, R19, R20, R21
8
RES, 0, 5%, 0.125 W, 0805
541-0.0ACT-ND
27
R4, R5, R6, R8, R9,
R14, R15
7
RES, 0, 5%, 0.1 W, 0603
541-0.0GCT-ND
28
R7
1
RES, 47 k, 5%, 0.125 W, 0805
541-47KACT-ND
29
R13
1
RES, 47 k, 5%, 0.125 W, 0805
541-47KACT-ND
30
R16, R17
2
RES, 4.7 k, 5%, 0.125 W, 0805
541-4.7KACT-ND
AWHW-10G-0202-T-ND
DNP
SJ5746-0-ND
MSP430™ Hardware Tools
DNP
DNP
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Table B-40. MSP-TS430PZ100E Bill of Materials (continued)
Item No.
Designator
Quantity
31
R22
1
Description
32
SH‑J1, SH‑JP1,
SH‑JP2, SH‑JP3,
SH‑JP4, SH‑JP5,
SH‑JP6, SH‑JP7,
SH‑JP8, SH‑JP9,
SH‑JP10, SH‑JP11,
SH‑JP12, SH‑JP13,
SH‑JP14
15
Shunt, 100mil, Gold plated, Black
3M9580-ND
33
SW1, SW2
2
Switch Tactile SPST-NO 0.02A 15V
P8079STB-ND
GH7727-ND
Install with arrow
matching arrow on
PCB. S5 should be
"ON", S3 and S4 should
be "OFF"
36-5001-ND
DNP
RES, 22, 5%, 0.1 W, 0603
34
SW3, SW4, SW5
3
Switch, DPST, Slide, Off-On, 1 Pos,
0.15A, 30V, TH
35
TP1, TP2, TP3, TP4,
TP5, TP6
6
Test Point, Miniature, Black, TH
Supplier Part Number
Note
541-22GCT-ND
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J1: 1-2, JP1: 1-2, JP2:
1-2, JP3: 1-2, JP4: 1-2,
JP5: 2-3, JP6: 2-3, JP7:
2-3, JP8: 2-3, JP9: 2-3,
JP10: 2-3, JP11: 1-2,
JP12: 1-2, JP13: 1-2,
JP14: 1-2
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B.40 MSP-TS430PZ5x100
Figure B-80. MSP-TS430PZ5x100 Target Socket Module, Schematic
160
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Connector JTAG
For JTAG Tool
Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector BOOTST
For Bootloader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP1
Open to measure current
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 ofMSP430 device
D1
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Figure B-81. MSP-TS430PZ5x100 Target Socket Module, PCB
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Table B-41. MSP-TS430PZ5x100 Bill of Materials
Pos.
Ref Des
No. Per
Board
1
C1, C2
0
1b
C3, C4
2
C6, C7
2
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5, C10, C11,
C12, C13, C14
4
100nF, SMD0805
311-1245-2-ND
4
C8
0
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
67-1553-1-ND
7
J1, J2, J3, J4
Digi-Key Part No.
Comment
12pF, SMD0805
DNP
47pF, SMD0805
DNP: Only recommendation.
Check your crystal spec.
DNP: C12, C14
DNP
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
25-pin header, TH
SAM1029-25-ND
: Header
SAM1213-25-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6, JP7,
JP8, JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on pins 2-3
10
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
Place jumper on pins 1-2
9
Jumper
15-38-1024-ND
Place on JP1, JP2, JP3, JP5,
JP6, JP7, JP8, JP9, JP10
HRP14H-ND
12
162
0
Description
13
JTAG
1
14-pin connector, male, TH
14
BOOTST
0
10-pin connector, male, TH
15
Q1, Q2
0
Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
16
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R10, R11, R12
3
0 Ω, SMD0805
541-000ATR-ND
18
R5
1
47k Ω, SMD0805
541-47000ATR-ND
19
U1
1
Socket: IC357-1004-53N
Manuf.: Yamaichi
20
PCB
1
90 x 82 mm
2 layers
21
Rubber
standoff
4
22
MSP430
2
DNP: Keep vias free of solder
Select appropriate
MSP430F5438IPZ
MSP430™ Hardware Tools
DNP: Keep vias free of solder
DNP: R6, R8, R9, R10, R11,
R12
Apply to corners at bottom side
DNP: Enclosed with kit supplied
by TI
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B.41 MSP-TS430PZ100USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V
lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to
run the MCU at 3.0 V, set it to 3.3 V.
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Figure B-82. MSP-TS430PZ100USB Target Socket Module, Schematic
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
USB1
USB connector
Connector JTAG
For JTAG Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
LED1, LED2, LED3
LEDs connected to P8.0, P8.1, P8.2
Jumpers LED 1, 2, 3
Open to disconnect LED1, LED2, LED3
Figure B-83. MSP-TS430PZ100USB Target Socket Module, PCB
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Table B-42. MSP-TS430PZ100USB Bill of Materials
Pos.
Ref Des
No. Per Board
1
C1, C2
0
12pF, SMD0805
1.1
C3, C4
2
47pF, SMD0805
2
C6, C7
2
10uF, 6.3V, Tantal Size B
511-1463-2-ND
3
C5, C11, C13,
C14, C19
5
100nF, SMD0805
311-1245-2-ND
3.1
C10, C12,
C18, C17
0
100nF, SMD0805
311-1245-2-ND
4
C8
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
7.1
25-pin header, TH
Digi-Key Part No.
Comment
DNP: C1, C2
DNP: C10, C12,C18, C17
SAM1029-25-ND
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
: Header
: Receptacle
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
: Header
: Receptacle
4
25-pin header, TH
SAM1213-25-ND
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6, JP7,
JP8, JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
10
JP1, JP2, JP4
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
place jumper on pins 1-2
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8, JP9, JP10
1
14-pin connector, male, TH
HRP14H-ND
12
13
166
4
Description
JTAG
14
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
15
Q2
1
Crystal
Q2: 4MHz, Buerklin: 78D134
16
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R12
3
0 Ω, SMD0805
541-000ATR-ND
Buerklin: 07E500
DNP: Q1. Keep vias free of
solder
DNP: R6, R8, R9, R12
18
R10
1
100 Ω, SMD0805
18
R11
1
1M Ω, SMD0603
18
R5
1
47k Ω, SMD0805
19
U1
1
Socket:IC201-1004-008
Manuf.: Yamaichi
20
PCB
1
79 x 77 mm
2 layers
21
Rubber stand
off
4
22
MSP430
2
MSP430F6638IPZ
23
Insulating disk
to Q2
1
Insulating disk to Q2
not existing in Rev 1.0
541-47000ATR-ND
Buerklin: 20H1724
apply to corners at bottom side
DNP: enclosed with kit. Is
supplied by TI
http://www.ettinger.de/
Art_Detail.cfm?
ART_ARTNUM=70.08.121
24
C16
1
4.7 nF SMD0603
27
C33
1
220n SMD0603
Buerklin: 53D2074
28
C35, C36
2
10p SMD0603
Buerklin: 56D102
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Table B-42. MSP-TS430PZ100USB Bill of Materials (continued)
Pos.
Ref Des
No. Per Board
30
C38
1
220n SMD0603
Description
Buerklin: 53D2074
Digi-Key Part No.
Comment
31
C39
1
4u7 SMD0603
Buerklin: 53D2086
32
C40
1
0.1u SMD0603
Buerklin: 53D2068
33
D2, D3, D4
3
LL103A
Buerklin: 24S3406
34
IC7
1
TPD4E004
35
LED
0
JP3QE
SAM1032-03-ND
DNP
36
LED1, LED2,
LED3
0
LEDCHIPLED_0603
FARNELL: 852-9833
DNP
37
R13, R15, R16
0
470R SMD0603
Buerklin: 07E564
DNP
38
R33
1
1k4 / 1k5 SMD0603
Buerklin: 07E612
39
R34
1
27R SMD0603
Buerklin: 07E444
40
R35
1
27R SMD0603
Buerklin: 07E444
41
R36
1
33k SMD0603
Buerklin: 07E740
42
S1, S2, S3
1
PB
P12225STB-ND
43
USB1
1
USB_RECEPTACLE
FARNELL: 117-7885
44
JP11
1
4-pin header, male, TH
SAM1035-04-ND
Manu: TI
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DNP S1 and S2. (Only S3)
place jumper only on Pin 1
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B.42 MSP-TS430PZ100AUSB
The development board MSP-TS430PZ100AUSB supports the MSP430FG662x and MSP430FG642x
flash devices in the 100-pin QFP package. MSP430FG6626IPZ devices are not included in the MSPTS430PZ100AUSB kit. Free samples can be ordered from www.ti.com/product/MSP430FG6626/samplebuy.
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GND
14
12
10
8
6
4
2
100nF
C5
R11
1M
AVCC
C40
0.1u
1
VBUS
USB1
D-
I
TDI
C38
220n
GND
1 JP9
2
3
C33
220n
1
2
3
JP10
GND
O
TDO
1 JP4
2
D4
LL103A
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