MSP430L092
MSP430C09x
www.ti.com
SLAS673 – SEPTEMBER 2010
MIXED SIGNAL MICROCONTROLLER
FEATURES
1
•
•
•
•
•
•
•
•
Ultra-Low Supply Voltage (ULV) Range
– 0.9 V to 1.5 V (1 MHz)
– 1.5 V to 1.65 V (4 MHz)
Low Power Consumption
– Active Mode (AM): 45 µA/MHz (1.3 V)
– Standby Mode (LPM3, WDT_A Mode): 6 µA
– Off Mode (LPM4): 3 µA
Wake-Up From LPMx in Less Than 5 µs
16-Bit RISC Architecture
– Extended Instructions
– Up to 4-MHz System Clock
Compact Clock System
– 1-MHz Internal Trimmable High-Frequency
Clock
– 20-kHz Internal Low-Frequency Clock
Source
– External Clock Input
16-Bit Timer0_A3 With Three Capture/Compare
Registers
16-Bit Timer1_A3 With Three Capture/Compare
Registers
ULV Analog Pool Modes
– 8-Bit Analog-to-Digital Converter (ADC)
– 8-Bit Digital-to-Analog Converter (DAC)
– Programmable Comparator (COMP)
– Supply Voltage Monitor (SVM)
– Temperature Sensor
– Internal Reference Voltage Source
•
•
•
•
•
•
•
•
ULV Port Logic
– VOL Better Than 0.15 V at 2.5 mA
– VOH Better Than VCC – 0.15 V at 1 mA
– Timer0 PWM Signal Available on All Ports
– Timer1 PWM Signal Available on All Ports
ULV Brownout Circuit (BOR)
ULV RAM Retention Voltage Below BOR Level
32-Bit Watchdog Timer (WDT-A)
Bootstrap Loader in MSP430L092
Development/Prototyping Device
Full Four-Wire JTAG Debug Interface
Family Members Include
– MSP430C091
– 1KB ROM Memory
– 128 Bytes RAM + 96 Bytes CRAM
(Lockable)
– MSP430C092
– 2KB ROM Memory
– 128 Bytes RAM + 96 Bytes CRAM
(Lockable)
– MSP430L092
– 2KB Loader ROM With Service
Functions
– 2KB RAM
(1792 + 128 + 96 Bytes Lockable)
For Complete Module Descriptions, See the
MSP430x09x Family User’s Guide (SLAU321)
DESCRIPTION
The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The digitally controlled internal oscillators allow wake-up from low-power modes to active mode in less than 5 µs.
The MSP430C09x and MSP430L092 series are microcontroller configurations with two 16-bit timers, an
ultra-low-voltage 8-bit analog-to-digital (A/D) converter, an 8-bit digital-to-analog (D/A) converter, and up to 11 I/O
pins.
Typical applications for this device include single-cell systems requiring a full analog signal chain.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
MSP430L092
MSP430C09x
SLAS673 – SEPTEMBER 2010
www.ti.com
ORDERING INFORMATION (1)
PACKAGED DEVICES (2)
PLASTIC 14-PIN TSSOP (PW)
TA
MSP430C091SPW
0ºC to 50ºC
MSP430C092SPW
MSP430L092SPW
(1)
(2)
For the most current package and ordering information, see the
Package Option Addendum at the end of this document, or see the
TI web site at www.ti.com.
Package drawings, standard packing quantities, thermal data,
symbolization, and PCB design guidelines are available at
www.ti.com/package.
Pin Designation, MSP430C091PW, MSP430C092PW
PW PACKAGE
(TOP VIEW)
TCK/P2.0/TA 0.2/TA1.2/TA1.1
TMS/P2.1/TA 0.2/TA1.2/TA0.1
TDI/P2.2/TA0.2/TA1.2/CxOUT/CCI0.0
TDO/P2.3/TA0.2/TA 1.2/CCI1.0
RST/NMI/SVMOUT
P1.0/TA0.2/TA1.2/ACLK/CCI0.1/A2/CLKIN
P1.1/TA0.2/TA1.2/SMCLK/CCI1.1/A1/TA0CLK
1
2
3
4
5
6
7
14
13
12
11
10
9
8
P1.6/TA0.2/TA1.2/TA 1.1
P1.5/TA0.2/TA1.2/TA 0.1
P1.4/TA0.2/TA1.2/MCLK/A0/TA1CLK
VCC
VSS/GND
P1.3/TA0.2/TA1.2/CxOUT/CCI1.0/VREF/A3
P1.2/TA0.2/TA1.2/ACLK/CCI0.0/AOUT/A3
Functional Block Diagram, MSP430C092PW, MSP430C091PW
RST/NMI/SVMOUT
VCC
GND/VSS
P1.0...P1.6
P2.0...P2.3
128B RAM
+96B CRAM
I/O Port P1L
7 I/Os with
Interrupt
Capability
I/O Port P2L
4 I/Os with
Interrupt
Capability
Timer0_A3
Timer1_A3
AnalogPool
LF-OSC
HF-OSC
CLKIN
Clock
System
ACLK
Reset
Int-Logic
2/(1)KB ROM
SMCLK
MCLK
CPU &
Working
Registers
TMS, TCK,
TDI, TDO
4W-JTAG
Debug
support
CORE
VREF
2
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ULV
Brownout
Watchdog
WDTA
32/16-Bit
3 CC
Registers
3 CC
Register
ULV-Ref.,
8-Bit ADC,
8-Bit DAC,
Comparator,
SVS
Copyright © 2010, Texas Instruments Incorporated
MSP430L092
MSP430C09x
www.ti.com
SLAS673 – SEPTEMBER 2010
Pin Designation, MSP430L092PW
PW PACKAGE
(TOP VIEW)
SPI_CS/TCK/P2.0/TA0.2/TA1.2/TA1.1
SPI_MOSI/TMS/P2.1/TA0.2/TA1.2/TA0.1
SPI_CLK/TDI/P2.2/TA0.2/TA1.2/CxOUT/CCI0.0
SPI_MISO/TDO/P2.3/TA0.2/TA1.2/CCI1.0
RST/NMI/SVMOUT
P1.0/TA0.2/TA1.2/ACLK/CCI0.1/A2/CLKIN
P1.1/TA0.2/TA1.2/SMCLK/CCI1.1/A1/TA0CLK
14
13
12
11
10
9
8
1
2
3
4
5
6
7
P1.6/TA0.2/TA1.2/TA1.1
P1.5/TA0.2/TA1.2/TA0.1
P1.4/TA0.2/TA1.2/MCLK/A0/TA1CLK
VCC
VSS/GND
P1.3/TA0.2/TA1.2/CxOUT/CCI1.0/VREF/A3
P1.2/TA0.2/TA1.2/ACLK/CCI0.0/AOUT/A3/BOOST
Functional Block Diagram, MSP430L092PW
RST/NMI/SVMOUT
VCC
GND/VSS
P1.0...P1.6
P2.0...P2.3
2kB RAM
(128B+1792B
+96B)
I/O Port P1L
7 I/Os with
Interrupt
Capability
I/O Port P2L
4 I/Os with
Interrupt
Capability
Timer0_A3
Timer1_A3
AnalogPool
LF-OSC
HF-OSC
CLKIN
Clock
System
ACLK
Reset
Int-Logic
2KB ROM
(Loader)
SMCLK
MCLK
CPU &
Working
Registers
TMS, TCK,
TDI, TDO
4W-JTAG
Debug
support
CORE
VREF
Copyright © 2010, Texas Instruments Incorporated
ULV
Brownout
Watchdog
WDTA
32/16-Bit
3 CC
Registers
3 CC
Register
ULV-Ref.,
8-Bit ADC,
8-Bit DAC,
Comparator,
SVS
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MSP430L092
MSP430C09x
SLAS673 – SEPTEMBER 2010
www.ti.com
Table 1. Terminal Functions
TERMINAL
NAME
NO.
I/O (1)
DESCRIPTION
JTAG test clock
General-purpose digital I/O
Timer0_A3 Out2 output
TCK/P2.0/TA0.2/TA1.2/TA1.1
1
I/O
Timer1_A3 Out2 output
Timer1_A3 Out1 output
Timer0_A3 CCR2 capture: CCI2A input, compare
Timer1_A3 CCR2 capture: CCI2A input, compare
JTAG test mode select
General-purpose digital I/O
Timer0_A3 Out2 output
TMS/P2.1/TA0.2/TA1.2/TA0.1
2
I/O
Timer1_A3 Out2 output
Timer0_A3 Out1 output
Timer0_A3 CCR2 capture: CCI2B input, compare
Timer1_A3 CCR2 capture: CCI2B input, compare
JTAG test data input
General-purpose digital I/O
Timer0_A3 Out2 output
TDI/P2.2/TA0.2/TA1.2/CCI0.0/CxOUT
3
I/O
Timer1_A3 Out2 output
Comparator output
Timer0_A3 CCR0 capture: CCI0A input, compare
Test clock input
JTAG test data output
General-purpose digital I/O
TDO/P2.3/TA0.2/TA1.2/CCI1.0
4
I/O
Timer0_A3 Out2 output
Timer1_A3 Out2 output
Timer1_A3 CCR0 capture: CCI0A input, compare
Reset input active low
RST/NMI/SVMOUT
5
I/O
Non-maskable interrupt input
SVM output
General-purpose digital I/O
Timer0_A3 Out2 output
Timer1_A3 Out2 output
P1.0//TA0.2/TA1.2/ACLK/CCI0.1/A2/CLKIN
6
I/O
ACLK output
Timer0_A3 CCR1 capture: CCI1B input, compare
Analog input A2 – A-Pool
Input terminal for external clock
General-purpose digital I/O
Timer0_A3 Out2 output
Timer1_A3 Out2 output
P1.1/TA0.2/TA1.2/SMCLK/CCI1.1/A1/TA0CLK
7
I/O
SMCLK output
Timer1_A3 CCR1 capture: CCI1B input, compare
Analog input A1 – A-Pool
Timer0_A3 clock signal TACLK input
(1)
4
I = input, O = output, N/A = not available on this package offering
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MSP430L092
MSP430C09x
www.ti.com
SLAS673 – SEPTEMBER 2010
Table 1. Terminal Functions (continued)
TERMINAL
NAME
NO.
I/O (1)
DESCRIPTION
General-purpose digital I/O
Timer0_A3 Out2 output
Timer1_A3 Out2 output
P1.2/TA0.2/TA1.2/ACLK/CCI0.0/AOUT/A3
8
I/O
ACLK output
Timer0_A3 CCR0 capture: CCI0B input, compare
Analog input A3 – A-Pool
Analog output – A-Pool
General-purpose digital I/O
Timer0_A3 Out2 output
Timer1_A3 Out2 output
P1.3/TA0.2/TA1.2/CxOUT/CCI1.0/VREF/A3
9
I/O
Comparator output
Timer1_A3 CCR0 capture: CCI0B input, compare
Analog input A3 – A-Pool
Reference voltage input / output
VSS/GND
10
Analog and digital power supply ground reference
VCC
11
Analog and digital power supply
General-purpose digital I/O
Timer0_A3 Out2 output
P1.4/TA0.2/TA1.2/MCLK/A0/TA1CLK
12
I/O
Timer1_A3 Out2 output
MCLK Output
Analog input A0 – A-Pool
General-purpose digital I/O
Timer0_A3 Out2 output
P1.5/TA0.2/TA1.2/TA0.1
13
I/O
Timer1_A3 OUT2 output
Timer0_A3 OUT1 output
Timer0_A3 CCR1 capture: CCI1A input, compare
General-purpose digital I/O
Timer0_A3 Out2 output
P1.6/TA0.2/TA1.2/TA1.1
14
I/O
Timer1_A3 OUT2 output
Timer1_A3 OUT1 output
Timer1_A1 CCR1 capture: CCI1A input, compare
Copyright © 2010, Texas Instruments Incorporated
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MSP430L092
MSP430C09x
SLAS673 – SEPTEMBER 2010
www.ti.com
SHORT-FORM DESCRIPTION
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions, are
performed as register operations in conjunction with
seven addressing modes for source operand and four
addressing modes for destination operand.
Program Counter
PC/R0
Stack Pointer
SP/R1
Status Register
Constant Generator
SR/CG1/R2
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
Instruction Set
General-Purpose Register
R11
The instruction set consists of the original 51
instructions with three formats and seven address
modes. Each instruction can operate on word and
byte data. Table 2 shows examples of the three types
of instruction formats, Table 3 shows the address
modes.
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
The CPU is integrated with 16 registers that provide
reduced
instruction
execution
time.
The
register-to-register operation execution time is one
cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register, and
constant generator respectively. The remaining
registers are general-purpose registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled with
all instructions.
Table 2. Instruction Word Formats
Dual operands, source-destination
e.g., ADD
R4,R5
R4 + R5 → R5
Single operands, destination only
e.g., CALL
R8
PC→(TOS), R8 →PC
Relative jump, un/conditional
e.g., JNE
Jump-on-equal bit = 0
Table 3. Address Mode Descriptions
ADDRESS MODE
(1)
6
S
(1)
D
(1)
SYNTAX
EXAMPLE
Register
●
●
MOV Rs, Rd
MOV R10, R11
OPERATION
R10 → R11
Indexed
●
●
MOV X(Rn), Y(Rm)
MOV 2(R5), 6(R6)
M(2+R5)→ M(6+R6)
Symbolic (PC relative)
●
●
MOV EDE, TONI
Absolute
●
●
MOV & MEM, & TCDAT
Indirect
●
MOV @Rn, Y(Rm)
MOV @R10, Tab(R6)
M(R10) → M(Tab+R6)
Indirect autoincrement
●
MOV @Rn+, Rm
MOV @R10+, R11
M(R10) → R11
R10 + 2→ R10
Immediate
●
MOV #X, TONI
MOV #45, TONI
#45 → M(TONI)
M(EDE) → M(TONI)
M(MEM) → M(TCDAT)
S = source D = destination
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MSP430L092
MSP430C09x
www.ti.com
SLAS673 – SEPTEMBER 2010
Operating Modes
The MSP430 has one active mode and five software-selectable low-power modes of operation. An interrupt
event can wake up the device from any of the five low-power modes, service the request, and restore back to the
low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
• Active mode (AM)
– All clocks are active
• Low-power mode 0 (LPM0)
– CPU is disabled
– ACLK and SMCLK remain active for all sources
– MCLK is disabled
• Low-power mode 1 (LPM1)
– CPU is disabled
– ACLK and SMCLK remain active (for LF oscillator and CLKIN as source, HF oscillator is mapped to LF
oscillator as source)
– MCLK is disabled
• Low-power mode 2 (LPM2)
– CPU is disabled
– MCLK is disabled
– SMCLK is disabled
– ACLK remains active for all sources
• Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK is disabled
– SMCLK is disabled
– ACLK remains active (for LF oscillator and CLKIN as source, HF oscillator is mapped to LF oscillator as
source)
• Low-power mode 4 (LPM4)
– CPU is disabled
– MCLK is disabled
– SMCLK is disabled
– ACLK is disabled
– Oscillators are stopped
LPM2 vs LPM3
If only MCLK is feed by the HF oscillator (SELA ≠ 00, SELS ≠ 00, SELM = 00 of CCSCTL4 register) the following
behavior is implemented:
• Entering LPM2 turns off the HF oscillator and starts again with the HF oscillator selected for MCLK
• Entering LPM3 turns off the HF oscillator and starts again with the LF oscillator selected for MCLK
The only difference between LPM2 and LPM3 is the selection of the source for MCLK when re-entering active
mode and, therefore, and the level of power savings.
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MSP430L092
MSP430C09x
SLAS673 – SEPTEMBER 2010
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Interrupt Vector Addresses
The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FFE0h. The
vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 4. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM
INTERRUPT
WORD ADDRESS
PRIORITY
System Reset
Power-Up
External Reset
Watchdog
WDTIFG (1)
Reset
0x0FFFE
15, highest
System NMI
Vacant memory access
SVMIFG, VMAIFG (1)
(Non)maskable
0x0FFFC
14
User NMI
NMI
NMIIFG (1) (2)
(Non)maskable
0x0FFFA
13
Timer1_A3
TA1CCR0 CCIFG0 (3)
Maskable
0x0FFF8
12
Timer1_A3
Maskable
0x0FFF6
11
Watchdog Timer_A Interval Timer Mode
WDTIFG
Maskable
0x0FFF4
10
A-Pool
CxIFG
Maskable
0x0FFF2
9
I/O Port P1
(1)
(2)
(3)
(4)
8
TA1CCR1 CCIFG1
(1) (3)
P1IFG.0 to P1IFG.6
(1) (3)
Maskable
0x0FFF0
8
Timer0_A3
TA0CCR0 CCIFG0 (3)
Maskable
0x0FFEE
7
Timer0_A3
TA0CCR1 CCIFG1 (1) (3)
Maskable
0x0FFEC
6
I/O Port P2
P2IFG.0 to P2IFG.3 (1) (3)
Maskable
0x0FFEA
5
0x0FFE8
4
Reserved
Reserved (4)
⋮
⋮
0x0FFE0
0
Multiple source flags
A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space. (Non)maskable: the
individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it.
Interrupt flags are located in the module.
Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain
compatibility with other devices, it is recommended to reserve these locations.
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MSP430C09x
www.ti.com
SLAS673 – SEPTEMBER 2010
Special Function Registers (SFRs)
The MSP430 SFRs are located in the lowest address space and can be accessed via word or byte formats.
Legend
rw:
rw-0,1:
rw-(0,1):
Bit can be read and written.
Bit can be read and written. It is reset or set by PUC.
Bit can be read and written. It is reset or set by POR.
SFR bit is not present in device.
Interrupt Enable 1
15
14
13
12
11
10
9
8
SVMIE
r0
r0
r0
r0
r0
r0
r0
rw-0
7
6
5
4
3
2
1
0
JMBOUTIE
JMBINIE
NMIIE
VMAIE
OFIE
WDTIE
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
SVMIE
JMBOUTIE
JMBINIE
NMIIE
VMAIE
OFIE
WDTIE
r0
r0
SVM interrupt enable
Nonmaskable-interrupt enable
Vacant memory access interrupt enable
Watchdog-timer interrupt enable. Inactive if watchdog mode is selected. Active if watchdog timer is configured as a
general-purpose timer.
Interrupt Enable 2
15
14
13
12
11
10
9
8
SVMIFG
r0
r0
r0
5
7
6
JMBOUTIFG
JMBINIFG
rw-0
rw-0
SVMIFG
JMBOUTIFG
JMBINIFG
NMIIFG
VMAIFG
OFIFG
WDTIFG
r0
r0
r0
r0
2
4
3
NMIIFG
VMAIFG
rw-0
rw-0
r0
r0
rw-0
1
0
OFIFG
WDTIFG
rw-0
rw-0
Set by SVM when voltage falls below set voltage
Set via RST/NMI pin
Set on vacant memory access
Set on watchdog timer overflow (in watchdog mode) or security key violation
Reset on VCC power-on or a reset condition at the RST/NMI pin in reset mode
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MSP430L092
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Reset Pin Control Register
15
14
13
12
11
10
9
8
r0
r0
r0
r0
r0
r0
r0
r0
7
6
5
4
r0
SYSRSTRE
SYSRSTUP
SYSNMIES
SYSNMI
r0
r0
3
2
1
0
SYSRSTRE
SYSRSTUP
SYSNMIES
SYSNMI
r1
r1
r1
rw-0
r0
Indicates resistor present on RST pin
Indicates pullup on RST pin
Indicates NMI edge select
NMI enable on RST/NMI pin
Memory Organization
Table 5. Memory Organization
TYPE
Primary interrupt
vectors
ROM
Secondary
interrupt vectors
RAM
Lockable
Application ROM
memory
ROM
Boot Code (BC) /
Loader Code
ROM (by TI)
RAM memory
RAM
LRAM memory
(lockable)
RAM
CRAM memory
(lockable)
RAM
Peripherals
(1)
(2)
(3)
Size
MSP430C091
MSP430C092
MSP430L092
MSP430L092 (EMU) (1)
32 B
32 B
32 B
32 B
0x0FFE0 (2) – 0x0FFFF
0x0FFE0 (2) – 0x0FFFF
0x0FFE0 (2) – 0x0FFFF
0x0FFE0 (2) – 0x0FFFF
0x01C60 – 0x01C7F
864 B
1888 B
0x0FC80 – 0x0FFDF
0x0F880 – 0x0FFDF
ROM not available
128 B (BC)
128 B (BC)
2016 B (Loader)
Config/loading by tool
0x0F800 – 0x0F87F
0x0F800 – 0x0F87F
0x0F800 – 0x0FFDF
0x0F800 – 0x0F87F
128B
128B
128 B
128 B
0x02380 – 0x023FF
0x02380 – 0x023FF
0x02380 – 0x023FF
0x02380 – 0x023FF
1792 B
1760 B
0x01C80 – 0x0237F
0xF900 – 0xFFDF
96 B
96 B
96 B
128 B (3)
0x01C00 – 0x01C5F
0x01C00 – 0x01C5F
0x01C00 – 0x01C5F
0x0F880 – 0x0F8FF
4 kB
4 kB
4 kB
4 kB
0x00000 – 0x00FFF
0x00000 – 0x00FFF
0x00000 – 0x00FFF
0x00000 – 0x00FFF
The MSP430L092 emulates the MSP430C092 device (MSP430C091 emulation via tool and software).
Not the whole interrupt vector range of CSYS is used on MSP430x09x devices (see Table 4).
Resets and interrupt redirections in RAM with alternate interrupt vectors cannot be emulated .
Start-Up Code (SUC)
The MSP430C09x start-up code checks the password and releases control to the application or enables JTAG
on password match, enters LPM4, and waits for a debug session. The behavior of the SUC is described in the
MSP430L092 Loader Code User's Guide (SLAU324).
Loader Code (Loader)
The MSP430L092 loader checks the presence of an external SPI/I2C memory device containing a valid code
signature, loads validated code into the application LRAM, and starts the application. The loader program uses
P1.2 with an external circuit to pump up the voltage required for SPI memory device readout. For complete
description of the features of the loader and its implementation, see the MSP430L092 Loader Code User's Guide
(SLAU324).
10
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RAM Memory
The RAM memory is split into three ranges for different purposes: application memory, lockable application
memory, and calibration memory.
Lockable application memory and calibration memory can be protected against accidental erasure by setting a
dedicated lock bit in the special functions register (System Maintenance Register).
Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x09x Family User's Guide (SLAU321).
Digital I/O
There are two I/O ports implemented: P1 (7 I/O lines) and P2 (4 I/O lines).
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt conditions is possible.
• Programmable pullup or pulldown on all ports.
• Edge-selectable interrupt input capability for all ports on P1 and P2.
• Read/write access to port-control registers is supported by all instructions.
• Ports can be accessed byte-wise (P1 and P2) or word-wise in pairs (P1/P2 combo).
Oscillator and System Clock
The clock system in the MSP430x09x family of devices is supported by the Compact Clock System (CCS)
module that includes support for an internal 20-kHz current-controlled low-frequency oscillator (LF-OSC), an
internal adjustable 1-MHz current-controlled high-frequency oscillator (HF-OSC), and an external clock input from
CLKIN; however, a missing CLKIN signal does not trigger an oscillator failsafe mechanism in this family.
The CCS module is designed to meet the requirements of both low system cost and low power consumption.
The CCS provides a fast turn-on of the oscillators, less than 1 ms. The CCS module provides the following clock
signals:
• Auxiliary clock (ACLK), sourced from the 20-kHz internal LF-OSC, the 1-MHz internal HF-OSC, or CLKIN.
• Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made
available to ACLK.
• Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by
same sources made available to ACLK.
• VLOCLK is an ultra-low-power low-frequency clock that is available as long the device is powered.
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OSCOFF
SELAx
ACLK enable logic
DIVAx
3
00
01
10
11
HF – OSC
Divider
/1/2/4/8/16/32
0
1 1
ACLK
SCG0
SELMx
CPUOFF
MCLK enable logic
LF-OSC
DIVMx
3
00
01
10
11
0
CLKIN
/2
Divider
/1/2/4/8/16/32
0
1 1
SELSx
1
MCLK
SCG1
SMCLK enable logic
DIVSx
DIVCLK
00
01
10
11
3
Divider
/1/2/4/8/16/32
0
1 1
SMCLK
VLOCLK
Figure 1. Compact Clock System (CCS) Block Diagram
Watchdog Timer (WDT_A)
The primary function of the watchdog timer (WDT_A) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
Table 6. WDT_A Signal Connections
DEVICE CLOCK SIGNAL
MODULE CLOCK SIGNAL
ACLK
ACLK
SMCLK
SMCLK
LF-OSC-CLK
VLOCLK
LF-OSC-CLK
X-CLK
Compact System Module (C-SYS)
The Compact SYS module handles many of the system functions within the device. These include power-on
reset and power-up clear handling, NMI source selection and management, reset interrupt vector generators, and
configuration management. It also includes a data exchange mechanism via JTAG called a JTAG mailbox that
can be used in the application.
12
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RST/NMI/SVMOUT System
The reset system of the MSP430x09x family features the functions reset input, reset output, NMI input, SVM
output, and SVS input.
...
Interrupt
signals
maskable/
unmaskable
Interrupt
Logic
CPU
irq
nmi
Resetsignals
and
violations
PUC
...
Reset
Logic
POR
BOR
SWBOR
RST/NMI/
SVMOUT
SWPOR
RSTNMI
Brownout
Circuit
& Delay
clr
from SVM logic
SVMOE
PortsOn
SVSEN
SVMPD
set
SVMPO
Figure 2. RST/NMI/SVMOUT and PortsOn Logic Block Diagram
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Table 7. System Module Interrupt Vector Registers
INTERRUPT VECTOR
REGISTER
SYSRSTIV, System Reset
SYSSNIV, System NMI
SYSUNIV, User NMI
SYSBERRIV, Bus Error
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INTERRUPT VECTOR
WORD
ADDRESS
OFFSET
No interrupt pending
00h
Brownout (BOR)
02h
SVMBOR (BOR)
04h
RST/NMI (BOR)
06h
DoBOR (BOR)
08h
Security violation (BOR)
0Ah
DoPOR(POR)
019Eh
WDT timeout (PUC)
0Eh
10h
CCS key violation
12h
PMM key violation
14h
Peripheral area fetch (PUC)
16h
Reserved
18h-3Eh
No interrupt pending
00h
SVMIFG
02h
VMAIFG
04h
019Ch
08h
Reserved
0Ah-3Eh
No interrupt pending
00h
NMIFG
02h
019Ah
06h
Reserved
08h-3Eh
Reserved
0198h
Highest
Lowest
Highest
04h
BERR
No interrupt pending
Lowest
06h
JMBOUTIFG
OFIFG
Highest
0Ch
WDT key violation (PUC)
JMBINIFG
PRIORITY
Lowest
00h
02h-3Eh
Lowest
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Timer0_A3
Timer0_A3 is a 16-bit timer/counter with three capture/compare registers. Timer0_A3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer0_A3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Table 8. Timer0_A3 Signal Connections
INPUT PIN
NUMBER
PW
7 – P1.1
DEVICE INPUT
SIGNAL
MODULE INPUT
SIGNAL
TA0CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
7 – P1.1
TA0CLK
TACLK
3 – P2.2
CCI0.0
CCI0A
8 – P1.2
CCI0.0
CCI0B
VSS
GND
MODULE BLOCK
MODULE
DEVICE OUTPUT
OUTPUT SIGNAL
SIGNAL
Timer
NA
NA
CCR0
TA0
TA0.0
OUTPUT PIN
NUMBER
PW
VCC
VCC
13 – P1.5
TA0.1
CCI1A
2 – P2.1
6 – P1.0
CCI0.1
CCI1B
13 – P1.5
VSS
GND
VCC
VCC
1 – P2.0
TA0.2
CCI2A
2 – P2.1
TA0.2
CCI2B
VSS
GND
VCC
VCC
Copyright © 2010, Texas Instruments Incorporated
CCR1
TA1
TA0.1
1-4 – P2.0-P2.3
CCR2
TA2
TA0.2
6-9 – P1.0-P1.3
12-14 – P1.4-P1.6
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Timer1_A3
Timer1_A3 is a 16-bit timer/counter with three capture/compare registers. Timer1_A3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer1_A3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Table 9. Timer1_A3 Signal Connections
INPUT PIN
NUMBER
PW
12 – P1.4
16
DEVICE INPUT
SIGNAL
MODULE INPUT
SIGNAL
TA1CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
12 – P1.4
TA1CLK
TACLK
4 – P2.3
CCI1.0
CCI0A
9 – P1.3
CCI1.0
CCI0B
VSS
GND
VCC
VCC
14 – P1.6
TA1.1
CCI1A
7 – P1.1
CCI1.1
CCI1B
VSS
GND
VCC
VCC
1 – P2.0
TA1.2
CCI2A
2 – P2.1
TA1.2
CCI2B
VSS
GND
VCC
VCC
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MODULE BLOCK
MODULE
DEVICE OUTPUT
OUTPUT SIGNAL
SIGNAL
Timer
NA
CCR0
TA0
OUTPUT PIN
NUMBER
PW
NA
TA1.0
1 – P2.0
CCR1
TA1
TA1.1
14 – P1.6
1-4 – P2.0-P2.3
CCR2
TA2
TA1.2
6-9 – P1.0-P1.3
12-14 – P1.4-P1.6
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A-Pool
The analog functions pool (A-Pool) provides a series of functions that can be configured to a digital-to-analog
converter (DAC), multichannel analog-to-digital converter (ADC), supply voltage supervisor (SVS), and
comparator. Input voltage dividers and an internal reference source allow a wide range of combined analog
functions.
PSELx
VREF
REFON
Reference
256mV
CMPON
+
OSEL
NSELx
Vcc
Vcc
6R
OSWP
DFSETx
CxIFG logic
0
DeGlitching
1
xCLK
from AZ-logic
DBON
ODEN
Aout
1
CLKSEL
EOCIFG logic
2
VLOCLK
MCLK
SMCLK
00
01
10
11
CBSTP
SBSTP
TBSTP
TA0.1
Pre-Scaler
?
by 1/2/4/8/16/32
R
D/A-8
R
CxOUT
SVMIFG logic
SLOPE
0
4
0000
0001
0010
0011
0100
0101
0110
0111
A0
A1
A2
A3
AZ
EN
CT
VREFEN
4
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
Clock
CLKDIVx Logic
xCLK
8
ADC-DAC-SAR-REG
Up-Dn Counter sEOC
TA0.0
TA0EN
TA1EN
TA1.0
clr
Run/
Stop set
Start Stop Logic
APVDIV Register
CONVON
SLOPE SAREN
MDB and buffer register
Figure 3. A-Pool Block Diagram
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Versatile I/O Port P1, P2
The versatile I/O ports P1 and P2 feature device-dependent reset values. The reset values for the MSP430x09x
devices are shown in Table 10.
Table 10. Versatile Port Reset Values
PORT
NUMBER
PxOUT
PxDIR
PxREN
PxSEL0
PxSEL1
RESET
PORTS ON
COMMENT
P1.0
0
0
0
0
0
PUC
yes
P1.0, input
P1.1
0
0
0
0
0
PUC
yes
P1.1, input
P1.2
0
0
0
0
0
PUC
yes
P1.2, input
P1.3
0
0
0
0
0
PUC
yes
P1.3, input
P1.4
0
0
0
0
0
PUC
yes
P1.4, input
P1.5
0
0
0
0
0
PUC
yes
P1.5, input
P1.6
0
0
0
0
0
PUC
yes
P1.6, input
P1.7
-
-
-
-
-
-
-
-
P2.0
1
0
1
1
1
BOR
no
JTAG TCK, input, pullup
P2.1
1
0
1
1
1
BOR
no
JTAG TMS, input, pullup
P2.2
1
0
1
1
1
BOR
no
JTAG TDI, input, pullup
P2.3
0
1
0
1
1
BOR
no
JTAG TDO, output, pullup
Peripheral File Map
Table 11. Peripherals
MODULE NAME
REGISTER DESCRIPTION
Timer1_A interrupt vector
Timer1_A3
OFFSET
TA1IV
2Eh
TA1CCR2
16h
Capture/compare register 1
TA1CCR1
14h
Capture/compare register 0
TA1CCR0
Timer1_A register
TA1R
12h
0380h
10h
Capture/compare control 2
TA1CCTL2
06h
Capture/compare control 1
TA1CCTL1
04h
Capture/compare control 0
TA1CCTL0
02h
TA1CTL
00h
Timer0_A interrupt vector
TA0IV
2Eh
Capture/compare register 2
TA0CCR2
16h
Capture/compare register 1
TA0CCR1
14h
Capture/compare register 0
TA0CCR0
12h
Timer1_A register
TA0R
0340h
10h
Capture/compare control 2
TA0CCTL2
06h
Capture/compare control 1
TA0CCTL1
04h
Capture/compare control 0
TA0CCTL0
02h
TA0CTL
00h
Timer1_A control
18
BASE
ADDRESS
Capture/compare register 2
Timer1_A control
Timer0_A3
REGISTER
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Table 11. Peripherals (continued)
MODULE NAME
REGISTER DESCRIPTION
Port P2 interrupt Flag
Port P2 interrupt enable
Port P2 interrupt edge select
Port P2 interrupt vector word
Port P2
P2IFG
1Dh
P2IE
1Bh
P2IES
19h
P2IV
1Eh
0Dh
Port P2 selection 0
P2SEL0
Port P2 pullup/pulldown enable
P2REN
07h
Port P2 direction
P2DIR
05h
Port P2 output
P2OUT
03h
P2IN
01h
P1IFG
1Ch
P1IE
1Ah
P1IES
18h
Port P1 interrupt enable
Port P1 interrupt edge select
Port P1 interrupt vector word
0200h
0Bh
P1IV
0Eh
Port P1 selection 1
P1SEL1
0Ch
Port P1 selection 0
P1SEL0
Port P1 pullup/pulldown enable
P1REN
06h
Port P1 direction
P1DIR
04h
Port P1 output
P1OUT
02h
Port P1 input
P1IN
00h
Analog pool interrupt vector register
APIV
1Eh
Analog pool interrupt enable register
APIE
1Ch
Analog pool interrupt flag register
APIFG
1Ah
Analog pool fractional value buffer
APFRACTB
16h
Analog pool fractional value register
Analog pool integer value buffer
Analog pool integer value register
0200h
APFRACT
APINTB
0Ah
14h
01A0h
12h
APINT
10h
Analog pool voltage divider register
APVDIV
06h
Analog pool operation mode register
APOMR
04h
Analog pool control register
APCTL
02h
Analog pool configuration register
APCNF
00h
SYSRSTIV
1Eh
SYSSNIV
1Ch
User NMI vector generator
SYSUNIV
1Ah
Bus error vector generator
SYSBERRIV
18h
SYSCNF
10h
Reset vector generator
System NMI vector generator
System Configuration register
CSYS
OFFSET
P2SEL1
Port P1 interrupt Flag
A-POOL
BASE
ADDRESS
Port P2 selection 1
Port P2 input
Port P1
REGISTER
JTAG mailbox output register #1
SYSJMBO1
JTAG mailbox output register #0
SYSJMBO0
0Ch
JTAG mailbox input register #1
SYSJMBI1
0Ah
JTAG mailbox input register #0
SYSJMBI0
08h
JTAG mailbox control register
SYSJMBC
06h
SYSCTL
00h
System control register
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0180h
0Eh
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Table 11. Peripherals (continued)
MODULE NAME
REGISTER DESCRIPTION
REGISTER
BASE
ADDRESS
OFFSET
CCS control 15 register
CCSCTL15
CCS control 8 register
CCSCTL8
10h
CCS control 7 register
CCSCTL7
0Eh
CCS control 5 register
CCSCTL5
CCS control 4 register
CCSCTL4
CCS control 2 register
CCSCTL2
04h
CCS control 1 register
CCSCTL1
02h
CCS control 0 register
CCSCTL0
WDT_A
Watchdog timer control
WDTCTL
0150h
0Ch
PMM
PMM control 0
PMMCTL0
0120h
00h
ET-Wrapper
ET Key and select
ETKEYSEL
0110h
00h
SFR Reset pin control register
SFRRPCR
CCS
Special Functions
SFR interrupt flag register
SFR interrupt enable register
20
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SFRIFG1
SFRIE1
1Eh
0160h
0Ah
08h
00h
04h
0100h
02h
00h
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Absolute Maximum Ratings (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
Voltage applied at VCC referenced to VSS (VAMR)
–0.3 V to 1.90 V
–0.3 V to VCC + 0.3 V
Voltage applied to any pin (references to VSS)
–0.3 V to 1.90 V
Diode current at any device pin (2)
±2.5 mA
Current derating factor when I/O ports are switched in parallel electrically and logically (3)
0.9
Storage temperature range (4)
–55°C to 150°C
ESD tolerance, Human-Body Model (HBM)
(1)
(2)
(3)
(4)
2000 V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS.
The diode current increases to ±4.5 mA when two pins are connected, ± 6.75 mA for three pins.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Recommended Operating Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
MIN
VCC
Supply voltage during program execution
VSS
Supply voltage (GND reference)
TA
Operating free-air temperature
CVCC
Capacitor on VCC
fSYSTEM (1) (
System operating frequency
2)
(1)
(2)
NOM
0.9
MAX
UNIT
1.65
V
0
0
V
50
470
°C
nF
VCC > 0.9 V, tLOW ≥ 450 ns, tHIGH ≥ 450 ns
1
MHz
VCC > 1.5 V, tLOW ≥ 113 ns, tHIGH ≥ 113 ns
4
MHz
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
Modules may have a different maximum input clock specification. Refer to the specification of the respective module in this data sheet.
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Active Mode Supply Current (Into VCC) Excluding External Current (1) (2)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fMCLK = fSMCLK = 1 MHz, fACLK = 20 kHz,
Program executes in RAM,
CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0
IAM,1MHz
1.3 V
MAX
59
68
84
86
101
59
68
72
84
1.65 V
86
101
0.9 V
60
70
74
87
1.65 V
88
105
0.9 V
31
35
33
38
1.65 V
37
42
0.9 V
31
35
33
38
37
42
32
37
35
41
40
48
1.3 V
1.3 V
fMCLK = fSMCLK = 125 kHz, fACLK = 20 kHz
Program executes in RAM
CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0
TYP
72
1.3 V
1.3 V
30°C
50°C
0°C
30°C
1.65 V
0.9 V
fMCLK = fSMCLK = 125 kHz, fACLK = 20 kHz,
Program executes in RAM,
CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0
(1)
(2)
0°C
0.9 V
fMCLK = fSMCLK = 1 MHz, fACLK = 20 kHz,
Program executes in RAM,
CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0
fMCLK = fSMCLK = 125 kHz, fACLK = 20 kHz,
Program executes in RAM,
CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0
IAM/MHz
MIN
1.65 V
fMCLK = fSMCLK = 1 MHz, fACLK = 20 kHz,
Program executes in RAM,
CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0
IAM,125kHz
TA
0.9 V
1.3 V
50°C
1.65 V
fMCLK = fSMCLK : 1 to 5 MHz, fACLK = 20 kHz
Program executes in RAM, CPUOFF = 0, SCG0 = 0,
SCG1 = 0, OSCOFF = 0
1.3 V
30°C
UNIT
µA
µA
µA/
MHz
45
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
Characterized with program executing typical data processing "Type2".
Low-Power Mode Supply Current (Into VCC) Excluding External Current (1) (2)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA
0.9 V
1.3 V
0°C
1.65 V
0.9 V
ILPM0
fMCLK = fSMCLK = 1 MHz, fACLK = 20 kHz
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0
7.6
9
8.6
11
9
1.65 V
9.5
12
0.9 V
8.9
12
11
14
1.65 V
12
17
0.9 V
6.6
8
7.6
9
1.65 V
8.6
11
0.9 V
7
9
8.3
11
9,5
12
8.9
12
11
14
12
17
1.3 V
50°C
0°C
30°C
0.9 V
1.3 V
1.65 V
22
8
11
30°C
1.65 V
(1)
(2)
MAX
6.6
7
1.3 V
fMCLK = fSMCLK = 1 MHz, fACLK = 20 kHz
CPUOFF = 1, SCG0 = 1, SCG1 = 0, OSCOFF = 0
TYP
8.3
1.3 V
1.3 V
ILPM1
MIN
50°C
UNIT
µA
µA
Current for WDT clocked by ACLK included.
Current for Brownout included.
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Low-Power Mode Supply Current (Into VCC) Excluding External Current(1)(2) (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA
MIN
0.9 V
1.3 V
ILPM2,1MHz
fMCLK = fSMCLK = 1MHz, fACLK = 1MHz
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0
fMCLK = fSMCLK = fACLK = 20 kHz
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0
32
29
33
0.9 V
28
32
30
35
1.65 V
32
38
0.9 V
6.6
8
7.6
10
1.65 V
8.6
11
0.9 V
7
10
8.3
12
1.65 V
9.5
13
0.9 V
8.9
13
11
15
12
17
6.6
8
1.3 V
1.3 V
50°C
0°C
30°C
50°C
1.65 V
0.9 V
1.3 V
0°C
1.65 V
0.9 V
ILPM3
fMCLK = fSMCLK = fACLK = 20 kHz
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0
1.3 V
30°C
1.65 V
0.9 V
1.3 V
fMCLK = fSMCLK = fACLK = 20 kHz
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1
9
8.6
11
7.1
9
8.3
11
9.5
12
8.9
12
11
14
12
17
0.9 V
3.2
4.7
5.1
6.3
0°C
1.65 V
6.5
8
0.9 V
4
5.7
6
7.9
1.65 V
1.3 V
7.8
10
0.9 V
6
8.9
8.6
12
11
16
1.3 V
1.65 V
Copyright © 2010, Texas Instruments Incorporated
50°C
7.6
1.65 V
1.3 V
ILPM4
30
28
1.3 V
ILPM2,20kHz
MAX
26
1.65 V
1.3 V
0°C to 30°C
TYP
30°C
50°C
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UNIT
µA
µA
µA
µA
23
MSP430L092
MSP430C09x
SLAS673 – SEPTEMBER 2010
www.ti.com
Ports P1 and P2, RST/NMI/SVMOUT
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VOH
VOL
TEST CONDITIONS
VCC – 0.25
VCC = 1.65 V, IOH = –1 mA (1) for ports P1, P2
VCC – 0.15
VCC = 0.9 V, IOH = –300 µA (1) for ports P1, P2
VCC – 0.15
VIH
VHYS
Δt/Δv
0.2
(2)
UNIT
V
0.15
for ports P1, P2
V
0.07
VCC = 1.65 V
0.3 × VCC
VCC = 0.9 V
0.25 × VCC
VCC = 1.65 V
0.7 × VCC
VCC = 0.9 V
0.75 × VCC
Intrinsic hysteresis
mV
VCC = 0.9 V, CL = 15 pF || RL = 750 Ω to VSS on VOH for ports P1, P2
75
VCC = 0.9 V, CL = 15 pF || RL = 320 Ω to VCC on VOL for ports P1, P2
75
VCC = 1.65 V, CL = 25 pF || RL = 1600 Ω to VSS on VOH for ports P1, P2
75
VCC = 1.65 V, CL = 25 pF || RL = 600 Ω to VSS on VOL for ports P1, P2
75
VCC = 0.9 V to 1.65 V for ports P1, P2
–1
VCC = 0.9 V to 1.65 V for ports P1, P2
2.5
ILKG
VCC = 0.9 V to 1.65 V (at 50°C)
tINT
P0.x, VCC = 0.9 V to 1.65 V
RPULL
For pullup: VIN = VSS, For pulldown: VIN = VCC for ports P1, P2
30
RRST
Pullup on RST/NMI/SVMOUT
30
REXT
External pullup resistor on RST terminal (optional)
CI
VIN = VSS or VCC
V
V
150
IOL
24
MAX
VCC = 1.65 V, IOL = 2.5 mA (2) for ports P1, P2
IOH
(1)
(2)
TYP
VCC = 0.9 V, IOL = 2.5 mA (2) for ports P1, P2
VCC = 0.9 V, IOL = 300 µA
VIL
MIN
VCC = 0.9 V, IOH = –1 mA (1) for ports P1, P2
ns/V
mA
mA
±100
nA
35
40
kΩ
35
40
kΩ
200
ns
680
kΩ
7
pF
The maximum total current IOH, for all outputs combined should not exceed 5 mA to hold the maximum voltage drop specified.
The maximum total current IOL, for all outputs combined should not exceed 15 mA to hold the maximum voltage drop specified.
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Copyright © 2010, Texas Instruments Incorporated
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MSP430C09x
www.ti.com
SLAS673 – SEPTEMBER 2010
Typical Characteristics – Outputs
TYPICAL LOW-LEVEL OUTPUT VOLTAGE
vs
OUTPUT CURRENT
TYPICAL HIGH-LEVEL OUTPUT VOLTAGE
vs
OUTPUT CURRENT
0
VCC = 0.9 V
IOH – Typical High-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
3
0°C, 30°C, 50°C
2.5
2
1.5
1
0.5
0.05
VOL – Low-Level Output Voltage – V
0.1
-0.4
-0.6
-0.8
-1
0°C, 30°C, 50°C
0.85
0.875
VOH – High-Level Output Voltage – V
Figure 4.
Figure 5.
TYPICAL LOW-LEVEL OUTPUT VOLTAGE
vs
OUTPUT CURRENT
TYPICAL HIGH-LEVEL OUTPUT VOLTAGE
vs
OUTPUT CURRENT
0.9
0
VCC = 1.65 V
IOH – Typical High-Level Output Current – mA
3
IOL – Typical Low-Level Output Current – mA
-0.2
-1.2
0.825
0
0
VCC = 0.9 V
0°C, 30°C, 50°C
2.5
2
1.5
1
0.5
VCC = 1.65 V
-0.2
-0.4
-0.6
-0.8
-1
0°C, 30°C, 50°C
-1.2
0
0
0.01
0.02
0.03
0.04
VOL – Low-Level Output Voltage – V
Figure 6.
Copyright © 2010, Texas Instruments Incorporated
0.05
1.6
1.61
1.62
1.63
1.64
VOH – High-Level Output Voltage – V
1.65
Figure 7.
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MSP430L092
MSP430C09x
SLAS673 – SEPTEMBER 2010
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Typical Characteristics – Outputs (continued)
TYPICAL LOW-LEVEL OUTPUT VOLTAGE
vs
LARGE SIGNAL OUTPUT CURRENT
TYPICAL HIGH-LEVEL OUTPUT VOLTAGE
vs
LARGE SIGNAL OUTPUT CURRENT
0
IOH – Typical High-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
16
VCC = 1.65 V
14
12
10
30°C
8
6
4
2
0
VCC = 1.65 V
-2
-4
-6
30°C
-8
-10
-12
-14
-16
0
0.05
0.1
0.15
0.2
0.25
0.8
VOL – Low-Level Output Voltage – V
Figure 8.
Figure 9.
TYPICAL LOW-LEVEL INPUT VOLTAGE
vs
SUPPLY VOLTAGE
TYPICAL LOW-LEVEL INPUT VOLTAGE
vs
SUPPLY VOLTAGE
0.6
0.55
0.5
0.45
0.4
50°C
30°C
0°C
0°C
30°C
50°C
0.75
0.7
0.65
0.6
0.55
0.5
0.3
0.8
1
1.2
1.4
VCC – Supply Voltage – V
Figure 10.
26
1.8
0.8
VIH – Typical High-Level Input Voltage – V
VIL – Typical Low-Level Input Voltage – V
0.65
0.35
1
1.2
1.4
1.6
VOH – High-Level Output Voltage – V
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1.6
1.8
0.8
1
1.2
1.4
1.6
1.8
VCC – Supply Voltage – V
Figure 11.
Copyright © 2010, Texas Instruments Incorporated
MSP430L092
MSP430C09x
www.ti.com
SLAS673 – SEPTEMBER 2010
High-Frequency Oscillator
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
MIN
TYP
MAX
UNIT
fHFOSC
PARAMETER
VCC = 0.9 V to 1.65 V (minimum trim range via register)
0.75
1
1.25
MHz
fHFOSC
VCC = 0.9 V to 1.65 V (trimmed at 30°C)
0.92
1
1.08
MHz
Duty cycle
VCC = 0.9 V to 1.65 V
45
50
55
%
tSTART
VCC = 0.9 V to 1.65 V
20
µs
ΔfHFOSC/DT
VCC = 0.9 V to 1.65 V, fHFOSC = 1 MHz
ΔfHFOSC/ΔVCC
VCC = 1.0 V to 1.65 V, fHFOSC = 1 MHz
ΔfHFOSC/ΔVCC
VCC = 0.90 V to 1.0 V, fHFOSC = 1 MHz
ΔfHFOSC/CALSTEP (1)
VCC = 0.9 V to 1.65 V, fHFOSC = 1 MHz, ±64 calibration steps
IOSC
VCC = 0.9 V to 1.65 V, fHFOSC = 1 MHz
(1)
TEST CONDITIONS
±0.07
±0.15
%/°C
±1
%/V
±1
±2.5
%/V
1
4
%/
Step
0.1
22
µA
Normalized to typical frequency
Typical Characteristics – High-Frequency Oscillator
FREQUENCY vs TRIM SETTING
2500
Frequency – kHz
VCC = 1.3 V
2000
1500
1000
500
0
16
32
48
64
80
Value in CCSCTL2 Register
96
112
128
Figure 12.
FREQUENCY vs TEMPERATURE
Frequency / Frequency30°C
1.02
1.01
VCC
0.9 V
1
1.3 V
1.65 V
0.99
0.98
0
10
20
30
TA – Temperature – °C
40
50
Figure 13.
Copyright © 2010, Texas Instruments Incorporated
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MSP430L092
MSP430C09x
SLAS673 – SEPTEMBER 2010
www.ti.com
Low-Frequency Oscillator
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
MIN
TYP
MAX
fLFOSC
PARAMETER
VCC = 0.9 V to 1.65 V
TEST CONDITIONS
6
20
45
Duty cycle
VCC = 0.9 V to 1.65 V
45
50
tSTART
VCC = 0.9 V to 1.65 V
IOSC
VCC = 0.9 V to 1.65 V, fLFOSC = 20 kHz
UNIT
kHz
55
%
500
µs
0.6
µA
Typical Characteristics – Low-Frequency Oscillator
FREQUENCY vs TEMPERATURE
40.0
VCC
Frequency – kHz
0.9 V
30.0
1.0 V
1.3 V
1.65 V
20.0
10.0
0
10
20
30
40
TA – Temperature – °C
50
60
Figure 14.
Brown-Out Reset (BOR)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VBOR(Start)
MIN
V(BOR_IT+)
VCC rising, ΔVCC/Δt < 3 V/s
1095
V(BOR_IT–)
VCC falling, ΔVCC/Δt < 3 V/s
860
Vhys(BOR)
VMARGIN
(2)
28
MAX
VMARGIN = V(BOR-IT–) – VCRIT, (VCRIT < 820 mV) (1)
UNIT
mV
1150
mV
900
mV
200
mV
40
mV
3000 (2
td(BOR)
(1)
TYP
490
)
µs
VCRIT is a temperature depending voltage where the single components of the device become unreliable (the 'L092 provides a safety
margin to ensure overall device function).
Strongly depends on voltage ramp in system (actually a maximum typical value).
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MSP430C09x
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SLAS673 – SEPTEMBER 2010
A-POOL, External Reference Source
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VCC = 0.9 V to 1.65 V, ADC / DAC operational
VREF
VCC = 0.9 V to 1.65 V, ADC / DAC not operational
IREF(Input)
VCC = 0.9 V to 1.65 V, load to external sinks
CREF
REFON = 0
TYP
100
0
MAX
UNIT
275
mV
VCC
3
20
V
µA
50
pF
A-POOL, Built-In Reference Source
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VREF
VCC = 0.9 V to 1.65 V (±1.5%, overall 3%)
IREF
VCC = 0.9 V to 1.65 V
CREF
REFON = 1
TREF
VCC = 0.9 V to 1.65 V (ΔV/ΔT × VREF referenced to 25°C)
±250
tSETTLE
VCC = 0.9 V to 1.65 V, REFON = 1, CREF = CREF(max) (1)
900 (1)
µs
IREF(Output)
VCC = 0.9 V to 1.65 V, REFON = 1, CREF = CREF(max)
2
µA
(1)
256
UNIT
mV
10
20
µA
50
pF
ppm/
°C
As the actual on reference enable signal is synchronized with the LF oscillator.
Typical Characteristics – A-POOL Built-In Reference Source
VOLTAGE vs TEMPERATURE
VREF – Reference Voltage (TYP = 256 mV)
258
257
256
VCC
1.65 V
1.3 V
255
1.0 V
0.9 V
254
0
10
20
30
40
TA – Temperature – °C
50
60
Figure 15.
Copyright © 2010, Texas Instruments Incorporated
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MSP430L092
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A-POOL, Temperature Sensor
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
ISENSOR
VCC = 0.9 V to 1.65 V
TCSENSOR
VCC = 0.9 V to 1.65 V, TA = 0°C to 50°C (ΔV/ΔT referenced to 30°C)
464
VOFFSET25
VCC = 0.9 V to 1.65 V at TA = 30°C
179
tSETTLE
VCC = 0.9 V to 1.65 V (before start of conversion)
VSENSOR (1)
VCC = 0.9 V to 1.65 V, TA = 0°C to 50°C
(1)
MAX
2
UNIT
µA
µV/°C
mV
15
179
µs
mV
This formula can be used to calculate the temperature sensor output voltage: VSENSOR = VOFFSET25 + TCSENSOR × (TA – 30°C).
A-POOL, Input Voltage Dividers
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
ΔRx/Rx
TEST CONDITIONS
MIN
Any Rx in dividers
ΔIVCC
MAX
±1.5
Any Rx across switches and internal supply voltage divider (by 4, by 8)
On A0/A1 , VA0/VA1 = 0.5V, ADIV0/ADIV1 = 1 (500-mV range)
RIN
TYP
%
±2
120
200
300
On A2/A3 , VA2/VA3 = 0.5V, ADIV2/ADIV4 = 1 (1-V range)
80
133
190
On A2/A3 , VA2/VA3 = 0.5V, ADIV2+ADIV3/ADIV4+ADIV5 = 1 (2-V range)
70
114
150
ADIV7 = 1 (supply voltage divider on)
UNIT
2
kΩ
µA
A-POOL, DAC-8
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VREF
TEST CONDITIONS
MIN
VCC = 0.9 V to 1.65 V
MAX
256
On ±1 LSB steps (6t), VCC = 0.9 V to 1.65 V, external VREF
tSETTLE
TYP
mV
2
Between all codes > 20 on AOUT (6t), VCC = 0.9 V to 1.65 V, external VREF
UNIT
µs
14
EI
VCC = 0.9 V to 1.65 V, external VREF,
add ±7 mV for VOUT offset (1) for codes > 7
±3
LSB
ED
VCC = 0.9 V to 1.65 V, external VREF,
add ±7 mV for VOUT offset (1) for codes > 7
±1
LSB
MAX
UNIT
275
mV
(1)
This offset can be compensated using software.
A-POOL, Comparator
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VIN
TEST CONDITIONS
MIN
VCC = 0.9 V to 1.65 V
tpd
TYP
0
Overdrive = 20 mV
0.5
Overdrive = 5 mV
0.5
Overdrive = 1 mV
1
µs
A-POOL, AOUT Terminal
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
| ILOAD |
tSETTLE
30
TEST CONDITIONS
VCC = 0.9 V to 1.65 V, CLOAD = 25 pF
MIN
VOUT > 50 mV
(accuracy ±1% of VOUT)
5
VOUT > 20 mV
(accuracy ±1% of VOUT)
2
MAX
UNIT
µA
VCC = 0.9 V to 1.65 V, CLOAD = 25 pF, ± 1% (6t) (for AOUT 20 to 256 mV)
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TYP
4
µs
Copyright © 2010, Texas Instruments Incorporated
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MSP430C09x
www.ti.com
SLAS673 – SEPTEMBER 2010
A-POOL, ADC-8 Counter
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fCNT
VCC = 0.9 V to 1.65 V
tCONV
Full conversion (all codes), fCNT = 1 MHz
MIN
TYP
MAX
UNIT
1
MHz
256
µs
RAM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST CONDITIONS
MIN
VOP
PARAMETER
Operating temperature 0°C to 70°C, fCPU = 1MHz
900
mV
VRET
Operating temperature 0°C to 70°C (tracks BOL level)
700
mV
Copyright © 2010, Texas Instruments Incorporated
TYP
MAX
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UNIT
31
MSP430L092
MSP430C09x
SLAS673 – SEPTEMBER 2010
www.ti.com
PORT SCHEMATICS
Port P1, P1.0 Input/Output
Pad Logic
to Clock System
to A-Pool
PSELx=y # NSELx=y
P1REN.x
P1DIR.x
Vss
Vcc
00
01
10
11
0
1
PortsOn
P1OUT.x
TA 0.2
TA 1.2
SMCLK
00
01
10
11
P1.0/TA0.2/TA1.2/ACLK/CCI0.1/A2/CLKIN
P1SEL 0.x
P1SEL 1.x
P1IN.x
# EN1
EN2
Module X IN
D
P1IES.x
Set
Q
P1IFG.x
P1IE.x
P1IRQ.x
Table 12. Port P1 (P1.0) Pin Functions
CONTROL BITS/SIGNALS (1)
PIN NAME (P1.x)
x
FUNCTION
P1.0 (I/O)
P1.0/TA0.2/TA1.2/ACLK/
CCI0.1/A2/CLKIN
(1)
32
0
P1DIR.x
P1SEL1.x
P1SEL0.x
RSELx/ASE
Lx
I:0, O:1
0
0
0
Timer_A0.2
1
0
1
0
Timer_A1.2
1
1
0
0
ACLK
1
1
1
0
Timer A0, CCI1B
0
≠0
≠0
X
A2
X
X
X
2
CLKIN (via Bypass)
X
X
X
X
X = Don't care
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Port P1, P1.1 and P1.4 Input/Output
Pad Logic
to A-Pool
PSELx=y # NSELx=y
P1REN.x
P1DIR.x
Vss
Vcc
00
01
10
11
0
1
PortsOn
P1OUT.x
TA 0.2
TA 1.2
from Module
00
01
10
11
P1.1/TA0.2/TA1.2/SMCLK/CCI1.1/A1/TA0CLK
P1.4/TA0.2/TA1.2/MCLK/A0/TA1CLK
P1SEL 0.x
P1SEL 1.x
P1IN.x
# EN1
EN2
Module X IN
D
P1IES.x
Set
Q
P1IRQ.x
Copyright © 2010, Texas Instruments Incorporated
P1IFG.x
P1IE.x
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Table 13. Port P1 (P1.1, P1.4) Pin Functions
CONTROL BITS/SIGNALS (1)
PIN NAME (P1.x)
x
FUNCTION
P1.1 (I/O)
P1.1/TA0.2/TA1.2/SMCLK/
CCI1.1/A1/TA0CLK
1
(1)
34
P1SEL0.x
RSELx/ASE
Lx
I:0, O:1
0
0
0
1
0
1
0
Timer_A1.2
1
1
0
0
0
SMCLK
1
1
1
A1
X
X
X
1
TimerA0 CLK
X
≠0
≠0
X
0
≠0
≠0
X
I:0, O:1
0
0
0
Timer_A0.2
1
0
1
0
Timer_A1.2
1
1
0
0
0
P1.4 (I/O)
4
P1SEL1.x
Timer_A0.2
Timer A1, CCI1B
P1.4/TA0.2/TA1.2/MCLK/
A0/TA1CLK
P1DIR.x
MCLK
1
1
1
A0
X
X
X
0
TimerA1 CLK
0
≠0
≠0
X
X = Don't care
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Port P1, P1.2 and P1.3 Input/Output
Pad Logic
to A-Pool
PSELx=y # NSELx=y
from A -Pool
from A -Pool
P1REN .x
P1DIR.x
Vss
Vcc
00
01
10
11
0
1
PortsOn
P1OUT .x
TA 0.2
TA 1.2
from Module
00
01
10
11
P1.2/TA0.2/TA1.2/ACLK/CCI0.0/AOUT/A3
P1.3/TA0.2/TA1.2/CxOUT/CCI1.0/VREF/A3
P1SEL0.x
P1SEL1.x
P1IN.x
# EN1
EN2
Module X IN
D
P1IES.x
Set
Q
P1IRQ.x
P1IFG .x
P1IE.x
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Table 14. Port P1 (P1.2, P1.3) Pin Functions
CONTROL BITS/SIGNALS (1)
PIN NAME (P1.x)
x
FUNCTION
P1.2 (I/O)
P1.2/TA0.2/TA1.2/ACLK/
CCI0.0/AOUT/A3
2
36
RSELx/ASE
Lx
Analog Out
0
0
0
0
1
0
1
0
0
Timer_A1.2
1
1
0
0
0
ACLK
1
1
1
0
0
Timer A0, CCI0B
0
≠0
≠0
X
X
A3
X
X
X
3
X
(2)
X
X
X
X
1
I:0, O:1
0
0
0
0
Timer_A0.2
1
0
1
0
0
Timer_A1.2
1
1
0
0
0
CxOUT
1
1
1
0
0
Timer A1, CCI0B
0
≠0
≠0
X
X
A3
X
X
X
3
X
X
X
X
X
1
VREF
(1)
(2)
P1SEL0.x
I:0, O:1
P1.3 (I/O)
3
P1SEL1.x
Timer_A0.2
AOUT
P1.3/TA0.2/TA1.2/CxOUT/
CCI1.0//VREF/A3
P1DIR.x
(2)
X = Don't care
An analog output enable overrides the digital output control.
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SLAS673 – SEPTEMBER 2010
Port P1, P1.5 and P1.6 Input/Output
Pad Logic
P1REN.x
P1DIR.x
Vss
Vcc
00
01
10
11
0
1
PortsOn
P1OUT.x
TA 0.2
TA 1.2
Module X OUT
00
01
10
11
P1.5/TA 0.2/TA1.2/TA0.1
P1.6/TA 0.2/TA1.2/TA1.1
P1SEL0.x
P1SEL1.x
P1IN.x
# EN1
EN2
Module X IN
D
P1IES.x
Set
Q
P1IFG.x
P1IE.x
P1IRQ.x
Table 15. Port P1 (P1.5, P1.6) Pin Functions
PIN NAME (P1.x)
x
FUNCTION
P1DIR.x
P1SEL1.x
P1SEL0.x
I:0, O:1
0
0
Timer_A0.2
1
0
1
Timer_A1.2
1
1
0
Timer A0.1
1
1
1
Timer_A0.CCI1A
0
≠0
≠0
P1.5 (I/O)
P1.5/TA0.2/TA1.2/TA0.1
5
P1.6 (I/O)
P1.6/TA0.2/TA1.2/TA1.1
(1)
6
CONTROL BITS/SIGNALS (1)
I:0, O:1
0
0
Timer_A0.2
1
0
1
Timer_A1.2
1
1
0
Timer A1.1
1
1
1
Timer_A1.CCI1A
0
≠0
≠0
X = Don't care
Copyright © 2010, Texas Instruments Incorporated
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37
MSP430L092
MSP430C09x
SLAS673 – SEPTEMBER 2010
www.ti.com
Port P2, P2.0 to P2.2, Input/Output
Pad Logic
P2REN.x
P2DIR.x
Vss
Vcc
00
01
10
11
0
1
PortsOn
P2OUT.x
TA 0.2
TA 1.2
Module X OUT
00
01
10
11
TCK/P2.0/TA0.2/TA1.2/TA 1.1
TMS/P2.1/TA0.2/TA 1.2/TA0.1
TDI/P2.2/TA0.2/TA 1.2/CxOUT/CCI0.0
P2SEL0.x
P2SEL1.x
P2IN.x
to JTAG
from JTAG
# EN1
EN2
Module X IN
D
P2IES.x
Set
Q
P2IRQ.x
38
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P2IFG.x
P2IE.x
Copyright © 2010, Texas Instruments Incorporated
MSP430L092
MSP430C09x
www.ti.com
SLAS673 – SEPTEMBER 2010
Table 16. Port P2 (P2.0 to P2.2) Pin Functions
PIN NAME (P2.x)
x
FUNCTION
P2.0 (I/O)
TCK/P2.0/TA0.2/
TA1.2/TA1.1
0
1
2
P2SEL0.x
JTAG Mode
0
0
0
1
0
1
0
Timer_A1.2
1
1
0
0
Timer_A1.1
1
1
1
0
Timer_A0.CCI2A and Timer_A1.CCI2A
0
≠0
≠0
0
JTAG-TCK (2) (3) (4)
X
X
X
1
I:0, O:1
0
0
0
Timer_A0.2
1
0
1
0
Timer_A1.2
1
1
0
0
Timer_A0.1
1
1
1
0
Timer_A0.CCI2B and Timer_A1.CCI2B
0
≠0
≠0
0
JTAG-TMS (2) (3) (4)
X
X
X
1
I:0, O:1
0
0
0
Timer_A0.2
1
0
1
0
Timer_A1.2
1
1
0
0
CxOUT
1
1
1
0
Timer_A0.CCI0A
0
≠0
≠0
0
(2) (3) (4)
X
X
X
1
JTAG-TDI
(1)
(2)
(3)
(4)
P2SEL1.x
I:0, O:1
P2.2 (I/O)
TDI/P2.2/TA0.2/TA1.2/
CxOUT/CCI0.0
P2DIR.x
Timer_A0.2
P2.1 (I/O)
TMS/P2.1/TA0.2/
TA1.2/TA0.1
CONTROL BITS/SIGNALS (1)
X = Don't care
JTAG signals TMS,TCK and TDI read as "1" when nor configured as explicit JTAG terminals
JTAG overrides digital output control when configured as explicit JTAG terminals
JTAG function with enabled pullup resistors is default after power up
Copyright © 2010, Texas Instruments Incorporated
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MSP430L092
MSP430C09x
SLAS673 – SEPTEMBER 2010
www.ti.com
Port P2, P2.3, Input/Output
Pad Logic
P2REN.x
P2DIR.x
Vss
Vcc
00
01
10
11
from JTAG
0
1
PortsOn
P2OUT.x
TA 0.2
TA 1.2
TDO from JTAG
00
01
10
11
TDO/P2.3/TA0.2/TA 1.2/CCI1.0
P2SEL0.x
P2SEL1.x
P2IN.x
to JTAG
# EN1
EN2
Module X IN
D
P2IES.x
Set
Q
P2IFG.x
P2IE.x
P2IRQ.x
Table 17. Port P2 (P2.3) Pin Functions
PIN NAME (P2.x)
x
FUNCTION
P2DIR.x
P2SEL1.x
P2SEL0.x
I:0, O:1
0
0
Timer_A0.2
1
0
1
Timer_A1.2
1
1
0
JTAG-TDO(2)(3)
1
1
1
Timer_A1.CCI0A
0
≠0
≠0
P2.0 (I/O)
TDO/P2.0/TA0.2/TA1.2/
CCI1.0
(1)
40
3
CONTROL BITS/SIGNALS (1)
X = Don't care
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Copyright © 2010, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
MSP430L092SPW
ACTIVE
TSSOP
PW
14
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 50
L092S
MSP430L092SPWR
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 50
L092S
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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