SLAS256D − NOVEMBER 1999 − REVISED SEPTEMBER 2004
D Low Supply Voltage Range 1.8 V to 3.6 V
D Ultralow-Power Consumption:
D Family Members Include:
D
D
D
D
D
D
− Active Mode: 200 µA at 1 MHz, 2.2 V
− Standby Mode: 0.8 µA
− Off Mode (RAM Retention): 0.1 µA
Wake-Up From Standby Mode in less
than 6 µs
16-Bit RISC Architecture, 125 ns
Instruction Cycle Time
Basic Clock Module Configurations:
− Various Internal Resistors
− Single External Resistor
− 32 kHz Crystal
− High Frequency Crystal
− Resonator
− External Clock Source
16-Bit Timer_A With Three
Capture/Compare Registers
Serial Onboard Programming,
No External Programming Voltage
Needed
MSP430F110:
D
1KB + 128B Flash Memory
128B RAM
MSP430F112: 4KB + 256B Flash Memory
256B RAM
Available in a 20-Pin Plastic Small-Outline
Wide Body (SOWB) Package and 20-Pin
Plastic Thin Shrink Small-Outline Package
(TSSOP)
For Complete Module Descriptions, Refer
to the MSP430x1xx Family User’s Guide,
Literature Number SLAU049
DW OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
TEST
VCC
P2.5/Rosc
VSS
XOUT/TCLK
XIN
RST/NMI
P2.0/ACLK
P2.1/INCLK
P2.2/TA0
20
19
18
17
16
15
14
13
12
11
P1.7/TA2/TDO/TDI
P1.6/TA1/TDI
P1.5/TA0/TMS
P1.4/SMCLK/TCK
P1.3/TA2
P1.2/TA1
P1.1/TA0
P1.0/TACLK
P2.4/TA2
P2.3/TA1
description
The Texas Instruments MSP430 family of ultralow power microcontrollers consist of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low power
modes is optimized to achieve extended battery life in portable measurement applications. The device features
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that attribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 6µs.
The MSP430F11x series is an ultralow-power mixed signal microcontroller with a built in 16-bit timer and
fourteen I/O pins.
Typical applications include sensor systems that capture analog signals, convert them to digital values, and then
process the data and display them or transmit them to a host system. Stand alone RF sensor front-end is another
area of application.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1999 − 2004, Texas Instruments Incorporated
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#, && $##(
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1
SLAS256D − NOVEMBER 1999 − REVISED SEPTEMBER 2004
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
−40°C to 85°C
PLASTIC
20-PIN SOWB
(DW)
PLASTIC
20-PIN TSSOP
(PW)
MSP430F110IDW
MSP430F112IDW
MSP430F110IPW
MSP430F112IPW
functional block diagram
XIN
XOUT
VCC
VSS
P1
RST/NMI
JTAG
ROSC
Oscillator
System
Clock
ACLK
4KB Flash
256B RAM
SMCLK
1KB Flash
128B RAM
P2
8
I/O Port 1
8 I/Os, with
Interrupt
Capability
6
I/O Port 2
6 I/Os, with
Interrupt
Capability
MCLK
Test
MAB,
4 Bit
MAB,MAB,
16 Bit16-Bit
JTAG
CPU
MCB
Emulation
Module
Incl. 16 Reg.
Bus
Conv
MDB,
16-Bit
MDB,
16 Bit
MDB, 8 Bit
TEST
†
Watchdog
Timer
Timer_A3
POR
3 CC Reg
15/16-Bit
† A pulldown resistor of 30 kΩ is needed on F11x devices.
2
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Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
P1.0/TACLK
13
I/O
General-purpose digital I/O pin/Timer_A, clock signal TACLK input
P1.1/TA0
14
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI0A input, compare: Out0 output/BSL transmit
P1.2/TA1
15
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI1A input, compare: Out1 output
P1.3/TA2
16
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI2A input, compare: Out2 output
P1.4/SMCLK/TCK
17
I/O
General-purpose digital I/O pin/SMCLK signal output/test clock, input terminal for device programming
and test
P1.5/TA0/TMS
18
I/O
General-purpose digital I/O pin/Timer_A, compare: Out0 output/test mode select, input terminal for
device programming and test
P1.6/TA1/TDI
19
I/O
General-purpose digital I/O pin/Timer_A, compare: Out1 output/test data input terminal
P1.7/TA2/TDO/TDI†
20
I/O
General-purpose digital I/O pin/Timer_A, compare: Out2 output/test data output terminal or data input
during programming
P2.0/ACLK
8
I/O
General-purpose digital I/O pin/ACLK output
P2.1/INCLK
9
I/O
General-purpose digital I/O pin/Timer_A, clock signal at INCLK
P2.2/TA0
10
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI0B input, compare: Out0 output/BSL receive
P2.3/TA1
11
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI1B input, compare: Out1 output
P2.4/TA2
12
I/O
General-purpose digital I/O pin/Timer_A, compare: Out2 output
P2.5/ROSC
RST/NMI
3
I/O
General-purpose digital I/O pin/Input for external resistor that defines the DCO nominal frequency
7
I
Reset or nonmaskable interrupt input
TEST
1
I
Selects test mode for JTAG pins on Port1. Must be tied low with less than 30 kΩ.
VCC
VSS
2
XIN
6
Supply voltage
4
Ground reference
I
Input terminal of crystal oscillator
XOUT/TCLK
5
I/O Output terminal of crystal oscillator or test clock input
† TDO or TDI is selected via JTAG instruction.
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SLAS256D − NOVEMBER 1999 − REVISED SEPTEMBER 2004
short-form description
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions,
are performed as register operations in
conjunction with seven addressing modes for
source operand and four addressing modes for
destination operand.
Program Counter
PC/R0
Stack Pointer
SP/R1
SR/CG1/R2
Status Register
Constant Generator
The CPU is integrated with 16 registers that
provide reduced instruction execution time. The
register-to-register operation execution time is
one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register,
and constant generator respectively. The
remaining registers are general-purpose
registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled
with all instructions.
instruction set
The instruction set consists of 51 instructions with
three formats and seven address modes. Each
instruction can operate on word and byte data.
Table 1 shows examples of the three types of
instruction formats; the address modes are listed
in Table 2.
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
General-Purpose Register
R11
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
Table 1. Instruction Word Formats
Dual operands, source-destination
e.g. ADD R4,R5
R4 + R5 −−−> R5
Single operands, destination only
e.g. CALL
PC −−>(TOS), R8−−> PC
Relative jump, un/conditional
e.g. JNE
R8
Jump-on-equal bit = 0
Table 2. Address Mode Descriptions
ADDRESS MODE
Indirect
D
D
D
D
D
Indirect
autoincrement
Register
Indexed
Symbolic (PC relative)
Absolute
Immediate
NOTE: S = source
4
S D
D
D
D
D
SYNTAX
EXAMPLE
MOV Rs,Rd
MOV R10,R11
MOV X(Rn),Y(Rm)
MOV 2(R5),6(R6)
OPERATION
R10
−−> R11
M(2+R5)−−> M(6+R6)
MOV EDE,TONI
M(EDE) −−> M(TONI)
MOV &MEM,&TCDAT
M(MEM) −−> M(TCDAT)
MOV @Rn,Y(Rm)
MOV @R10,Tab(R6)
M(R10) −−> M(Tab+R6)
D
MOV @Rn+,Rm
MOV @R10+,R11
M(R10) −−> R11
R10 + 2−−> R10
D
MOV #X,TONI
MOV #45,TONI
D = destination
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#45
−−> M(TONI)
SLAS256D − NOVEMBER 1999 − REVISED SEPTEMBER 2004
operating modes
The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the five low-power modes, service the request and restore back to
the low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
D Active mode AM;
−
All clocks are active
D Low-power mode 0 (LPM0);
−
CPU is disabled
ACLK and SMCLK remain active. MCLK is disabled
D Low-power mode 1 (LPM1);
−
CPU is disabled
ACLK and SMCLK remain active. MCLK is disabled
DCO’s dc-generator is disabled if DCO not used in active mode
D Low-power mode 2 (LPM2);
−
CPU is disabled
MCLK and SMCLK are disabled
DCO’s dc-generator remains enabled
ACLK remains active
D Low-power mode 3 (LPM3);
−
CPU is disabled
MCLK and SMCLK are disabled
DCO’s dc-generator is disabled
ACLK remains active
D Low-power mode 4 (LPM4);
−
CPU is disabled
ACLK is disabled
MCLK and SMCLK are disabled
DCO’s dc-generator is disabled
Crystal oscillator is stopped
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interrupt vector addresses
The interrupt vectors and the power-up starting address are located in the memory with an address range of
0FFFFh-0FFE0h. The vector contains the 16-bit address of the appropriate interrupt handler instruction
sequence.
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM INTERRUPT
WORD ADDRESS
PRIORITY
Power-up
External reset
Watchdog
WDTIFG (Note1)
KEYV (Note 1)
Reset
0FFFEh
15, highest
NMI
Oscillator fault
Flash memory access violation
NMIIFG (Notes 1 and 5)
OFIFG (Notes 1 and 5)
ACCVIFG (Notes 1 and 5)
(non)-maskable,
(non)-maskable,
(non)-maskable
0FFFCh
14
0FFFAh
13
0FFF8h
12
0FFF6h
11
Watchdog timer
WDTIFG
maskable
0FFF4h
10
Timer_A3
TACCR0 CCIFG
(Note 2)
maskable
0FFF2h
9
Timer_A3
TACCR1 and TACCR2
CCIFGs, TAIFG
(Notes 1 and 2)
maskable
0FFF0h
8
0FFEEh
7
0FFECh
6
0FFEAh
5
0FFE8h
4
I/O Port P2
(eight flags − see Note 3)
P2IFG.0 to P2IFG.7
(Notes 1 and 2)
maskable
0FFE6h
3
I/O Port P1
(eight flags)
P1IFG.0 to P1IFG.7
(Notes 1 and 2)
maskable
0FFE4h
2
0FFE2h
1
0FFE0h
0, lowest
NOTES: 1.
2.
3.
4.
5.
6
Multiple source flags
Interrupt flags are located in the module
There are eight Port P2 interrupt flags, but only six Port P2 I/O pins (P2.0−5) are implemented on the ’11x devices.
Nonmaskable: neither the individual nor the general interrupt enable bit will disable an interrupt event.
(non)-maskable: the individual interrupt enable bit can disable an interrupt event, but the general interrupt enable cannot.
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special function registers
Most interrupt and module enable bits are collected into the lowest address space. Special function register bits
that are not allocated to a functional purpose are not physically present in the device. Simple software access
is provided with this arrangement.
interrupt enable 1 and 2
Address
7
6
0h
5
4
ACCVIE
NMIIE
rw-0
WDTIE:
OFIE:
NMIIE:
ACCVIE:
Address
3
2
1
OFIE
rw-0
0
WDTIE
rw-0
rw-0
Watchdog Timer interrupt enable. Inactive if watchdog mode is selected. Active if Watchdog Timer
is configured in interval timer mode.
Oscillator fault enable
Nonmaskable interrupt enable
Flash access violation interrupt enable
7
6
5
6
5
4
3
2
4
3
2
1
0
01h
interrupt flag register 1 and 2
Address
7
02h
NMIIFG
rw-0
WDTIFG:
OFIFG:
NMIIFG:
Address
1
OFIFG
rw-1
0
WDTIFG
rw-(0)
Set on Watchdog Timer overflow (in watchdog mode) or security key violation.
Reset on VCC power-up or a reset condition at RST/NMI pin in reset mode.
Flag set on oscillator fault
Set via RST/NMI-pin
7
6
5
4
3
2
1
0
03h
Legend
rw:
rw-0,1:
rw-(0,1):
Bit can be read and written.
Bit can be read and written. It is Reset or Set by PUC.
Bit can be read and written. It is Reset or Set by POR.
SFR bit is not present in device.
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SLAS256D − NOVEMBER 1999 − REVISED SEPTEMBER 2004
memory organization
MSP430F110
FFFFh
FFE0h
FFDFh
Int. Vector
1 KB Flash
FC00h Segment0,1
MSP430F112
FFFFh
FFE0h
Int. Vector
FFDFh
4 KB
Main
Flash
Segment0−7 Memory
F000h
10FFh
1080h
0FFFh
0C00h
128B Flash
SegmentA
1 KB
Boot ROM
10FFh
2 × 128B
Information
Flash
Memory
1000h SegmentA,B
0FFFh
1 KB
Boot ROM
0C00h
02FFh
027Fh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
256B RAM
128B RAM
16b Per.
8b Per.
SFR
0200h
01FFh
16b Per.
0100h
00FFh
0010h
000Fh
0000h
8b Per.
SFR
bootstrap loader (BSL)
The MSP430 bootstrap loader (BSL) enables users to program the flash memory or RAM using a UART serial
interface. Access to the MSP430 memory via the BSL is protected by user-defined password. For complete
description of the features of the BSL and its implementation, see the Application report Features of the MSP430
Bootstrap Loader, Literature Number SLAA089.
BSL Function
DW & PW Package Pins
Data Transmit
14 - P1.1
Data Receive
10 - P2.2
flash memory
The flash memory can be programmed via the JTAG port, the bootstrap loader, or in-system by the CPU. The
CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
D Flash memory has n segments of main memory and two segments of information memory (A and B) of 128
bytes each. Each segment in main memory is 512 bytes in size.
D Segments 0 to n may be erased in one step, or each segment may be individually erased.
D Segments A and B can be erased individually, or as a group with segments 0−n.
Segments A and B are also called information memory.
D New devices may have some bytes programmed in the information memory (needed for test during
manufacturing). The user should perform an erase of the information memory prior to the first use.
8
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Segment0 w/
Interrupt Vectors
0FDFFh
0FC00h
Segment1
0FBFFh
0FA00h
Segment2
0F9FFh
0F800h
Segment3
0F7FFh
0F600h
Segment4
0F5FFh
0F400h
Segment5
0F3FFh
0F200h
Segment6
0F1FFh
0F000h
Segment7
010FFh
01080h
SegmentA
0107Fh
01000h
SegmentB
Information
Memory
0FFFFh
0FE00h
Flash Main Memory
flash memory (continued)
NOTE: All segments not implemented on all devices.
peripherals
Peripherals are connected to the CPU through data, address, and control busses and can be handled using
all instructions. For complete module descriptions, refer to the MSP430x1xx Family User’s Guide, literature
number SLAU049.
oscillator and system clock
The clock system is supported by the basic clock module that includes support for a 32768-Hz watch crystal
oscillator, an internal digitally-controlled oscillator (DCO) and a high frequency crystal oscillator. The basic clock
module is designed to meet the requirements of both low system cost and low-power consumption. The internal
DCO provides a fast turn-on clock source and stabilizes in less than 6 µs. The basic clock module provides the
following clock signals:
D Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal or a high frequency crystal.
D Main clock (MCLK), the system clock used by the CPU.
D Sub-Main clock (SMCLK), the sub-system clock used by the peripheral modules.
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SLAS256D − NOVEMBER 1999 − REVISED SEPTEMBER 2004
digital I/O
There are two 8-bit I/O ports implemented—ports P1 and P2 (only six P2 I/O signals are available on external
pins):
D
D
D
D
All individual I/O bits are independently programmable.
Any combination of input, output, and interrupt conditions is possible.
Edge-selectable interrupt input capability for all the eight bits of port P1 and six bits of port P2.
Read/write access to port-control registers is supported by all instructions.
NOTE:
Six bits of port P2, P2.0 to P2.5, are available on external pins − but all control and data bits for port
P2 are implemented.
watchdog timer
The primary function of the watchdog timer (WDT) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
timer_A3
Timer_A3 is a 16-bit timer/counter with three capture/compare registers. Timer_A3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Timer_A3 Signal Connections
Input Pin Number
Device Input Signal
Module Input Name
13 - P1.0
TACLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
9 - P2.1
INCLK
INCLK
14 - P1.1
TA0
CCI0A
TA0
CCI0B
DVSS
DVCC
GND
10 - P2.2
15 - P1.2
TA1
VCC
CCI1A
11 - P2.3
TA1
CCI1B
16 - P1.3
10
DVSS
DVCC
TA2
GND
VCC
CCI2A
ACLK (internal)
CCI2B
DVSS
DVCC
GND
Module Block
Module Output Signal
Timer
NA
14 - P1.1
18 - P1.5
CCR0
TA0
10 - P2.2
15 - P1.2
19 - P1.6
CCR1
TA1
11 - P2.3
16 - P1.3
20 - P1.7
CCR2
VCC
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TA2
12 - P2.4
SLAS256D − NOVEMBER 1999 − REVISED SEPTEMBER 2004
peripheral file map
PERIPHERALS WITH WORD ACCESS
Timer_A
Reserved
Reserved
Reserved
Reserved
Capture/compare register
Capture/compare register
Capture/compare register
Timer_A register
Reserved
Reserved
Reserved
Reserved
Capture/compare control
Capture/compare control
Capture/compare control
Timer_A control
Timer_A interrupt vector
TACCTL2
TACCTL1
TACCTL0
TACTL
TAIV
017Eh
017Ch
017Ah
0178h
0176h
0174h
0172h
0170h
016Eh
016Ch
016Ah
0168h
0166h
0164h
0162h
0160h
012Eh
TACCR2
TACCR1
TACCR0
TAR
Flash Memory
Flash control 3
Flash control 2
Flash control 1
FCTL3
FCTL2
FCTL1
012Ch
012Ah
0128h
Watchdog
Watchdog/timer control
WDTCTL
0120h
PERIPHERALS WITH BYTE ACCESS
Basic Clock
Basic clock sys. control2
Basic clock sys. control1
DCO clock freq. control
BCSCTL2
BCSCTL1
DCOCTL
058h
057h
056h
Port P2
Port P2 selection
Port P2 interrupt enable
Port P2 interrupt edge select
Port P2 interrupt flag
Port P2 direction
Port P2 output
Port P2 input
P2SEL
P2IE
P2IES
P2IFG
P2DIR
P2OUT
P2IN
02Eh
02Dh
02Ch
02Bh
02Ah
029h
028h
Port P1
Port P1 selection
Port P1 interrupt enable
Port P1 interrupt edge select
Port P1 interrupt flag
Port P1 direction
Port P1 output
Port P1 input
P1SEL
P1IE
P1IES
P1IFG
P1DIR
P1OUT
P1IN
026h
025h
024h
023h
022h
021h
020h
Special Function
SFR interrupt flag2
SFR interrupt flag1
SFR interrupt enable2
SFR interrupt enable1
IFG2
IFG1
IE2
IE1
003h
002h
001h
000h
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SLAS256D − NOVEMBER 1999 − REVISED SEPTEMBER 2004
absolute maximum ratings†
Voltage applied at VCC to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4.1 V
Voltage applied to any pin (referenced to VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC+0.3 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA
Storage temperature, Tstg (unprogrammed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C
Storage temperature, Tstg (programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE: All voltages referenced to VSS.
recommended operating conditions
MIN
Supply voltage during program execution, VCC (see Note 1)
1.8
Supply voltage during program/erase flash memory, VCC
2.7
Supply voltage, VSS
MAX
−40
LF mode selected, XTS=0
Watch crystal
V
3.6
V
85
°C
XT1 mode selected, XTS=1
Hz
450
8000
1000
8000
VCC = 1.8 V
dc
2
MHz
VCC = 2.2 V
dc
5
MHz
Crystal
Processor frequency f(system) (MCLK signal)
V
32 768
Ceramic resonator
UNITS
3.6
0
Operating free-air temperature range, TA
LFXT1 crystal frequency,
f(LFXT1) (see Note 2)
NOM
kHz
VCC = 3.6 V
dc
8
MHz
NOTES: 1. The LFXT1 oscillator in LF-mode requires a resistor of 5.1 MΩ from XOUT to VSS when VCC