MSP430G2252-DIE
www.ti.com
SLAS853 – APRIL 2012
MIXED SIGNAL MICROCONTROLLER
FEATURES
1
•
•
•
•
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•
23
Low Supply Voltage Range: 1.8 V to 3.6 V
Ultra-Low Power Consumption
Five Power-Saving Modes
Ultra-Fast Wake-Up From Standby Mode
16-Bit RISC Architecture
Basic Clock Module Configurations
– Internal Frequencies up to 16 MHz With
Four Calibrated Frequencies
– Internal Very-Low-Power Low-Frequency
(LF) Oscillator
– 32-kHz Crystal
– External Digital Clock Source
•
•
•
•
•
•
•
One 16-Bit Timer_A With Three
Capture/Compare Registers
Up to 16 Touch-Sense Enabled I/O Pins
Universal Serial Interface (USI) Supporting SPI
and I2C
On-Chip Comparator for Analog
Brownout Detector
Serial Onboard Programming,
No External Programming Voltage Needed,
Programmable Code Protection by Security
Fuse
On-Chip Emulation Logic With Spy-Bi-Wire
Interface
DESCRIPTION
The Texas Instruments MSP430™ family of ultra-low-power microcontrollers consist of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The MSP430G2252 is an ultra-low-power mixed signal microcontroller with a built-in 16-bit timer, and up to 16
I/O touch sense enabled pins and built-in communication capability using the universal serial communication
interface and has a versatile analog comparator. The MSP430G2252 has a 10-bit A/D converter. Typical
applications include low-cost sensor systems that capture analog signals, convert them to digital values, and
then process the data for display or for transmission to a host system.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MSP430 is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
MSP430G2252-DIE
SLAS853 – APRIL 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE (2)
MSP430G2252
TD
Bare die in waffle pack
ORDERABLE PART NUMBER
PACKAGE QUANTITY
MSP430G2252TDA1
100
MSP430G2252TDA2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
BARE DIE INFORMATION
2
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
11 mils.
Silicon with backgrind
Floating
AlCu (0.5%)
800 nm
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
MSP430G2252-DIE
www.ti.com
SLAS853 – APRIL 2012
Table 1. Bond Pad Coordinates in Microns (1)
(1)
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
DVCC
1
244
2253.65
319
2328.65
P1.0/TA0CLK/ACLK/A0/CA0
2
87.4
2050.15
162.4
2125.15
P1.1/TA0.0/A1/CA1
3
87.4
1810.15
162.4
1885.15
P1.2/TA0.1/A2/CA2
4
87.4
1650.15
162.4
1725.15
P1.3/ADC10CLK/CAOUT/VREF-/VEREF-/A3/CA3
5
87.4
630.15
162.4
705.15
P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/CA4/TCK
6
87.4
260.15
162.4
335.15
P1.5/TA0.0/SCLK/A5/CA5/TMS
7
240.15
87.4
315.15
162.4
P2.0
8
650.15
87.4
725.15
162.4
P2.1
9
820.15
87.4
895.15
162.4
P2.2
10
976.15
87.4
1051.15
162.4
P2.3
11
1130.15
87.4
1205.15
162.4
P2.4
12
1610.15
87.4
1685.15
162.4
P2.5
13
1800.15
87.4
1875.15
162.4
P1.6/TA0.1/SDO/SCL/A6/CA6/TDI/TCLK
14
2204.85
87.4
2279.85
162.4
P1.7/SDI/SDA/CAOUT/A7/CA7/TDO/TDI
15
2362.6
260.15
2437.6
335.15
RST BAR/NMI/SBWTDIO
16
2362.6
710.15
2437.6
785.15
TEST/SBWTCK
17
2362.6
1254.8
2437.6
1329.8
XOUT/P2.7
18
2362.6
1583.85
2437.6
1658.85
XIN/P2.6/TA0.1
19
2362.6
2096.15
2437.6
2171.15
DVSS
20
1994.8
2253.65
2069.8
2328.65
DVSS
21
1859.8
2253.65
1934.8
2328.65
DVCC
22
404
2253.65
479
2328.65
Substrate is floating.
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
Samples
(4/5)
(6)
MSP430G2252TDA1
ACTIVE
0
100
RoHS & Green
Call TI
N / A for Pkg Type
25 to 25
Samples
MSP430G2252TDA2
ACTIVE
0
10
RoHS & Green
Call TI
N / A for Pkg Type
25 to 25
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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