OPA140A-DIE
www.ti.com
SBOS610B – MARCH 2012 – REVISED MARCH 2012
HIGH-PRECISION, LOW-NOISE, RAIL-TO-RAIL OUTPUT,
11-MHZ JFET OPERATIONAL AMPLIFIER
Check for Samples: OPA140A-DIE
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
Very Low Offset Drift
Very Low Offset
Low Input Bias Current
Very Low 1/f Noise
Low Noise
Slew Rate
Low Supply Current
Input Voltage Range Includes V– Supply
Single-Supply Operation: 4.5 V to 36 V
Dual-Supply Operation: ±2.25 V to ±18 V
No Phase Reversal
APPLICATIONS
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Battery-Powered Instruments
Industrial Controls
Medical Instrumentation
Photodiode Amplifiers
Active Filters
Data Acquisition Systems
Automatic Test Systems
DESCRIPTION
The OPA140A operational amplifier is a low-power JFET input amplifier that features good drift and low input
bias current. The rail-to-rail output swing and input range that includes V– allow designers to take advantage of
the low-noise characteristics of JFET amplifiers while also interfacing to modern, single-supply, precision analogto-digital converters (ADCs) and digital-to-analog converters (DACs). The OPA140A runs on a single 4.5-V to
36-V supply or dual ±2.25-V to ±18-V supplies.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE (2)
OPA140A
TD
Bare Die In Waffle Pack
ORDERABLE PART NUMBER
PACKAGE QUANTITY
OPA140ATDD1
252
OPA140ATDD2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
OPA140A-DIE
www.ti.com
SBOS610B – MARCH 2012 – REVISED MARCH 2012
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
15 mils.
Silicon with backgrind
Floating
TiW/AlCu (0.5%)
1100 nm
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
VIN
1
N/C
2
X MIN
Y MIN
469.600
-720.500
544.600
X MAX
-645.500
Y MAX
49.500
-430.500
124.500
-355.500
-49.550
VIP
3
N/C
4
V-
5
1034.050
-124.550
1109.050
OUT
6
1264.500
-107.500
1339.500
-32.500
V+
7
1264.500
-737.500
1339.500
-662.500
2
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): OPA140A-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
Samples
(4/5)
(6)
OPA140ATDD1
ACTIVE
0
252
RoHS & Green
Call TI
N / A for Pkg Type
Samples
OPA140ATDD2
ACTIVE
0
10
RoHS & Green
Call TI
N / A for Pkg Type
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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