OPA1637EVM

User's Guide SBOU235A – December 2019 – Revised June 2020 OPA1637 Evaluation Module This user's guide contains information and support documentation for the OPA1637 evaluation module (EVM). Included are the circuit description, schematic, and bill of materials of the OPA1637EVM. Throughout this document, the terms evaluation board, evaluation module, and EVM are synonymous with the OPA1637EVM. SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated OPA1637 Evaluation Module 1 www.ti.com 1 2 Contents Introduction ................................................................................................................... 3 1.1 Related Documentation ............................................................................................ 3 1.2 Electrostatic Discharge Caution................................................................................... 3 Schematic, PCB Layout, and Bill of Materials ........................................................................... 4 2.1 Schematic ............................................................................................................ 4 2.2 PCB Layout .......................................................................................................... 4 2.3 Bill of Materials .................................................................................................... 10 List of Figures 1 OPA1637EVM Schematic .................................................................................................. 4 2 Top Overlay PCB Layout ................................................................................................... 5 3 Top Layer PCB Layout ...................................................................................................... 6 4 Ground Layer PCB Layout 5 Power Layer PCB Layout ................................................................................................... 8 6 Bottom Layer PCB Layout .................................................................................................. 9 ................................................................................................. 7 List of Tables 1 Related Documentation ..................................................................................................... 3 2 OPA1637EVM Bill of Materials ........................................................................................... 10 Trademarks Burr-Brown is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 2 OPA1637 Evaluation Module SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated Introduction www.ti.com 1 Introduction The OPA1637 is a high-performance, low-noise, low total harmonic distortion (THD), fully differential amplifier that can easily filter and drive fully differential audio signal chains from Texas Instruments. For a full list of electrical characteristics, see the OPA1637 High-Performance, High-Voltage, Low -Noise, BurrBrown™ Fully Differential Amplifier data sheet. The OPA1637EVM is configured by default in a second-order, low-pass, Butterworth filter configuration with a gain of 5-V/V and a corner frequency of 30-kHz. Input and output connections are accessible using SMA connectors and XLR audio connectors. 1.1 Related Documentation The following document provides information regarding Texas Instruments integrated circuits used in the assembly of the OPA1637EVM. This user's guide is available from the TI website under literature number SBOU235. Any letter appended to the literature number corresponds to the document revision that is current at the time of the writing of this document. Newer revisions may be available from the TI website at http://www.ti.com/, or call the Texas Instruments Literature Response Center at (800) 477-8924 or the Product Information Center at (972) 644-5580. When ordering, identify the document by both title and literature number. Table 1. Related Documentation 1.2 Device Literature Number OPA1637 SBOSA00 Electrostatic Discharge Caution Many of the components on the OPA1637EVM are susceptible to damage by electrostatic discharge (ESD). Customers are advised to observe proper ESD handling precautions when unpacking and handling the EVM, including the use of a grounded wrist strap at an approved ESD workstation. SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated OPA1637 Evaluation Module 3 Schematic, PCB Layout, and Bill of Materials 2 www.ti.com Schematic, PCB Layout, and Bill of Materials This section contains the schematic, bill of materials, and pcb layout for the OPA1637EVM. 2.1 Schematic Figure 1 illustrates the EVM schematic. TP1 IN+ J2 R1 1 R2 732 TP9 GND 3.65k TP2 GND C5 50V 1000pF VCC GND DNPC6 50V 1000pF GND OUT_NEG J3 C7 J5 MH1 R4 0 OUT_NEG 102 C8 DNP 50V SHDN 7 GND + SHIELD 100nF R5 2 1 3 4 VOCM C16 50V 6200pF GND C10 100nF 50V 1 R8 49.9 GND C9 50V DNP 1000pF 5 GND V+ VOCM V- 2 4 OPA1637DGKR C12 6 EGND 8 604 100pF 3 MH2 R6 U1 VEE 1000pF TP5 J6 GND TP10 GND GND 604 50V 1000pF GND J7 R10 R11 732 TP6 GND OUT_POS OUT_POS C14 IN1 TP4 102 GND R9 GND DNP C11 50V GND 100pF R7 0 100nF C13 DNP 50V TP3 GND R3 J4 3.65k MH1 Note: DNP components are not populated. GND GND 1 OUT_POS2 OUT_NEG3 4 + MH2 SHIELD PREAMP OUT GND VCC SHDN R13 10.0k J8 VCC GND EGND VCC VOCM TP7 1 2 3 SHDN J9 VOCM 1 2 C15 100nF 50V GND VEE J1 TP8 R14 1.00k R15 49.9 R12 DNP 10.0k 3 2 1 R16 C1 10uF C2 100nF C3 10uF C4 100nF GND DNP10.0k GND VEE VEE Figure 1. OPA1637EVM Schematic 2.2 PCB Layout The OPA1637EVM is a four-layer PCB design. Figure 2 to Figure 6 show the PCB layer illustrations. The top layer consists of all analog signal path traces, and is poured with a solid ground plane. To minimize second and other even-harmonic content, route traces as symmetrically as possible for both positive and negative feedback pathways. Place feedback components in close proximity to the output and input pins of the device. Position decoupling capacitors C7 and C12 on the top layer as close as possible to the power-supply pins. The second internal layer is a dedicated solid GND plane. Place independent vias at the ground connection of every component to provide a low-impedance path to ground. The third internal layer routes the power-supply connections. The fourth layer routes the shutdown pin and VOCM pin connections. 4 OPA1637 Evaluation Module SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated Schematic, PCB Layout, and Bill of Materials www.ti.com Figure 2. Top Overlay PCB Layout SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated OPA1637 Evaluation Module 5 Schematic, PCB Layout, and Bill of Materials www.ti.com Figure 3. Top Layer PCB Layout 6 OPA1637 Evaluation Module SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated Schematic, PCB Layout, and Bill of Materials www.ti.com Figure 4. Ground Layer PCB Layout SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated OPA1637 Evaluation Module 7 Schematic, PCB Layout, and Bill of Materials www.ti.com Figure 5. Power Layer PCB Layout 8 OPA1637 Evaluation Module SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated Schematic, PCB Layout, and Bill of Materials www.ti.com Figure 6. Bottom Layer PCB Layout SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated OPA1637 Evaluation Module 9 Schematic, PCB Layout, and Bill of Materials 2.3 www.ti.com Bill of Materials Table 2 lists the OPA1637EVM bill of materials (BOM). Table 2. OPA1637EVM Bill of Materials Designator Qty Value Description !PCB1 1 C1, C3 2 10uF CAP, CERM, 10 uF, 35 V, +/- 10%, X7R, 1206 C2, C4, C7, C12 2 0.1uF CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R, 0805 C5, C14 2 1000pF C10, C15 2 0.1uF C16 1 6200pF H1, H2, H3, H4 Package Reference Part Number Manufacturer AMPS093 Any 1206 C3216X7R1V106K160AC TDK 0805 08055C104KAT2A AVX CAP, CERM, 1000 pF, 50 V, +/- 10%, C0G/NP0, 0805 0805 08055A102KAT2A AVX CAP, CERM, 0.1 uF, 50 V, +/- 5%, X7R, 0603 0603 C0603C104J5RACTU Kemet CAP, CERM, 6200 pF, 50 V, +/- 5%, C0G/NP0, 080 0805 GRM2195C1H622JA01D MuRata 4 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead Screw NY PMS 440 0025 PH B&F Fastener Supply H5, H6, H7, H8 4 Standoff, Hex, 0.5"L #4-40 Nylon Standoff 1902C Keystone J1 1 Terminal Block, 3.5mm Pitch, 3x1, TH 10.5x8.2x6.5mm ED555/3DS On-Shore Technology J2, J3, J6, J7 4 Connector, End launch SMA, 50 ohm, SMT End Launch SMA 142-0701-801 Cinch Connectivity J4 1 Receptacle, Male, 3 Position, R/A, TH Receptacle, Male, 3 Position, R/A, TH PQG3MRA112 Switchcraft J5 1 Receptacle, 160mil, 3 Position, R/A, TH Receptacle, 160mil, 3 Position, R/A, TH PQG3FRA112 Switchcraft J8 1 Header, 100mil, 3x1, Gold, TH PBC03SAAN PBC03SAAN Sullins Connector Solutions J9 1 Terminal Block, 3.5mm Pitch, 2x1, TH 7.0x8.2x6.5mm ED555/2DS On-Shore Technology R1, R10 2 732 RES, 732, 0.1%, 0.125 W, 0805 0805 RT0805BRD07732RL Yageo America R2, R11 2 3.65k RES, 3.65 k, 1%, 0.125 W, AEC-Q200 Grade 0, 0805 0805 CRCW08053K65FKEA Vishay-Dale R3, R6 2 0 RES, 0, 0%, W, AEC-Q200 Grade 0, 0805 0805 PMR10EZPJ000 Rohm R5, R9 2 604 RES, 604, 1%, 0.125 W, AEC-Q200 Grade 0, 0805 0805 CRCW0805604RFKEA Vishay-Dale R4, R7 2 102 RES, 102, 1%, 0.125 W, AEC-Q200 Grade 0, 0805 0805 CRCW0805102RFKEA Vishay-Dale R8, R15 2 49.9 RES, 49.9, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060349R9FKEA Vishay-Dale R13 1 10.0k RES, 10.0 k, 1%, 0.1 W, 0603 0603 ERJ-3EKF1002V Panasonic R14 1 1.00k RES, 1.00 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06031K00FKEA Vishay-Dale SH-J1 1 1x2 Shunt, 100mil, Flash Gold, Black Closed Top 100mil Shunt SPC02SYAN Sullins Connector Solutions TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9, TP10 10 Test Point, Miniature, SMT Test Point, Miniature, SMT 5019 Keystone U1 1 OPA1637, high voltage, low noise, low THD, fully differential amplifier DGK0008A OPA1637IDGKT Texas Instruments 10 Printed Circuit Board OPA1637 Evaluation Module SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated Revision History www.ti.com Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (December 2019) to A Revision ................................................................................................ Page • • • Changed EVM image ..................................................................................................................... 1 Changed R4/R7 to 102-Ohms ........................................................................................................... 4 Changed R4/R7 to 102-Ohms ......................................................................................................... 10 SBOU235A – December 2019 – Revised June 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated Revision History 11 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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