OPA170-DIE
www.ti.com
SBOS680 – FEBRUARY 2013
SINGLE-SUPPLY, LOW-POWER OPERATIONAL AMPLIFIER
VALUE LINE SERIES
Check for Samples: OPA170-DIE
FEATURES
1
•
•
•
•
•
•
•
2
RFI Filtered Inputs
Input Range Includes the Negative Supply
Input Range Operates to Positive Supply
Rail-to-Rail Output
Low Quiescent Current
High Common-Mode Rejection
Low Bias Current
APPLICATIONS
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•
•
•
•
•
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Tracking Amplifier in Power Modules
Merchant Power Supplies
Transducer Amplifiers
Bridge Amplifiers
Temperature Measurements
Strain Gauge Amplifiers
Precision Integrators
Battery-Powered Instruments
Test Equipment
DESCRIPTION
The OPA170-DIE is a single-supply, low-noise operational amplifier. It offers good offset, drift, and bandwidth
with low quiescent current.
Input signals beyond the supply rails do not cause phase reversal.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
OPA170
TD
Bare die in waffle pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
OPA170TDA1
400
OPA170TDA2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
OPA170-DIE
SBOS680 – FEBRUARY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
10.5 mils.
Silicon with backgrind
Floating
AlCuTiN
605 nm
Table 1. Bond Pad Coordinates in Microns
2
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
+IN
1
V-
2
N/C
38.65
514
113.65
589
52.25
234.15
127.25
309.15
3
52.25
46.85
127.25
121.85
OUT
4
515.9
13
590.9
88
V+
5
636
13
711
88
-IN
6
625.35
514
700.35
589
Submit Documentation Feedback
Y MAX
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: OPA170-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
14-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
OPA170TDA1
ACTIVE
0
400
RoHS & Green
Call TI
N / A for Pkg Type
25 to 25
OPA170TDA2
ACTIVE
0
10
RoHS & Green
Call TI
N / A for Pkg Type
25 to 25
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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