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Connected Sensors Building Automation Systems Guide www.ti.com/buildingAutomation 2015 Connected Sensors Building Automation Systems Guide Table of Contents and Sensor Solutions Introduction Monitoring devices or nodes in building control systems, fire safety systems, lighting control, and other building automation and Internet of Things (IoT) applications are becoming more prevalent in today’s world. The use of connected sensors has a wide range of uses in building automation applications, from monitoring human safety and security, controlling the environment and ambience specified by the comfort preferences of the end user, or either periodic or continuous data logging of environmental and system data to detect irregular system conditions. Texas Instruments (TI) has a broad portfolio of products that cater to connected sensing in building automation applications. This portfolio ranges from innovative sensor analog front-end products to low-power wireless connectivity solutions. Table of Contents Sensor Solutions 2 Temperature Sensing 2 Humidity and Temperature Sensing 2 Ambient Light Sensing 3 Inductance Sensing 3 Capacitance Sensing 3 Hall Effect Sensor Amplifiers and Comparators 4 Low Power Amplifiers 4 General Purpose Amplifiers 4 Comparators 4 Analog-to-Digital Converters Power Management 8 8 8 9 9 9 9 DC/DC Switching Regulators Linear Regulators Voltage Reference AC/DC Converters Ultra Low Power Harvester Power Management IC System Timer Load Switches Haptic Drivers 10 Piezo Drivers 10 Haptic Drivers Interface and Protection Wireless Connectivity 11 Integrated ESD Protection 11 High Performance TVs Diodes 11 Peripheral Drivers 11 RS-485 11 eFuses 5 Wi-Fi 5 Sub-1GHz 5 Bluetooth® 5 ZigBee® 5 NFC Embedded Processing Solutions 7 MSP430 Low Power FRAM MCUs 7 MSP430 Low Power MCUs 7 ARM Based MCUs and MPUs Sensor Solutions TI has a rich, five-decade history of sensing innovation and, combined with best-in-class sensing technologies, tools, and resources, we continue to deliver better solutions today and new possibilities for tomorrow. Learn more about sensor solutions at: www.ti.com/sensing Temperature Sensing Part No. LMT70/70A LMT84 Type Analog Analog Local Sensor Accuracy (Max) At Given Temp Range (±°C) ±0.2°C from 20 to 90 ±2.7°C from –50 to 150 Supply Current (Max) (µA) 12 8.1 Supply Range (V) 2.0 to 5.5 1.5 to 5.5 TMP112 Digital ±0.5°C from 0 to 65 10 1.4 to 3.6 TMP75 Digital ±2°C from –25 to 85 85 2.7 to 5.5 TMP007 Contactless ±1°C from –40 to 125 350 2.2 to 5.5 Interface Analog Out Analog Out I2C, SMBus, 2-wire I2C, SMBus, 2-wire I2C, SMBus Infrared Sensor Accuracy (Max) (±°C) – – Operating Temp. (°C) –55 to 150 –50 to 150 Pin / Package 4DSBGA 5SC70 Approx. Price (US$ | 1ku) 0.54 / 0.65 0.18 – –40 to 125 6SOT 0.90 – –40 to 125 8SOIC, 8VSSOP 0.45 3 –40 to 125 8DSBGA 1.90 Humidity and Temperature Sensing Part No. HDC1000/1050 HDC1008 Relative Humidity Accuracy (Typ) (%RH) ±3 ±4 RH Operating Range (Typ) (%RH) 0 - 100 0 - 100 Temperature Accuracy (Typ) (°C) ±0.2 ±0.2 Supply Range (V) 3 to 5 3 to 5 *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 2 | Connected Sensors Building Automation Systems Guide 2015 Average Supply Current (Typ) (µA) 1.2 @ 1 sps 1.2 @ 1 sps Interface I2C I2C Operating Temp. (°C) –40 to 125 –40 to 125 Pin / Package 8DSBGA, 6DFN 8DSBGA Approx. Price (US$ | 1ku) 2.20 1.76 Preview products are listed in bold teal. Texas Instruments Sensor Solutions Ambient Light Sensing Supply Range (Nom) (V) Part No. OPT3001 Iq (Max) (µA) 1.6 to 3.6 Lux Range (Nom) Dark Response @ 0 Lux (Max) 0.01 to 83K 2 Gain Selection Interface Benefits I2C Matches photopic response of the human eye Rejects > 99% (Typ) of IR 11 Gains with Auto-ranging 1 Code Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) –40 to 85 USON 0.99 Inductance Sensing L (Inductance) Resolution (Bits) Supply Range Active State Current (mA) Interface Sensor Frequency (Hz) Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Part No. Key Applications Special Features Input Channels LDC1312/4 • Position • Sensing • Angle/Rotation sensing • Contactless sensing • Ultralow cost sensors (coils, PCB coils) • Immune to dust, dirt etc. 2/4 12 2.7 to 3.6 2.1 I2C 1k to 10M –40 to 125 WSON, WQFN 2.38 / 3.50 LDC1612/4 • Position Sensing • Angle/Rotation sensing • Contactless sensing • Ultralow cost sensors (coils, PCB coils) • Immune to dust, dirt etc. 2/4 28 2.7 to 3.6 2.1 I 2C 1k to 10M –40 to 125 WSON, WQFN 3.25 / 4.75 Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Capacitance Sensing Shield Drive Channels Special Features Supply Range Supply Current (mA) Interface Prog. Sampling Rate (Typ) (SPS) 4 • Liquid level sensing (with interferers) 2 Integrated Shield Drivers 3 to 3.6 0.75 I2C 100 / 200 / 400 –40 to 125 WSON 2.50 FDC2114/12 4/2 • Proximity Sensing • Liquid Level Sensing – EMI resistant core 2.7 to 3.6 2.1 I2C 40 to 4080 –40 to 125 WQFN 2.38 / 3.50 FDC2214/12 4/2 • Proximity Sensing • Liquid Level Sensing – EMI resistant core 2.7 to 3.6 2.1 I2C 40 to 13300 –40 to 125 WQFN 3.25 / 4.75 Part No. Input Channels Special Features FDC1004 Hall Effect Sensor Output Bandwidth (Typ) (kHz) Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Type Type Supply Range DRV5013/23/33 Digital Latch / Switch / Omnipolar Switch 2.5 to 38 Open Drain – –40 to 125 SOT-23, TO-92 0.29 DRV5053 Analog Analog Bipolar 2.5 to 38 0.2 to 1.8 V 10 –40 to 125 SOT-23, TO-92 0.31 Part No. Output *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red. Find the Perfect Sensor Reference Design to Get Started 16-Button Keypad using the LDC1314 Inductive-to-Digital Converter Reference Design - TIDA-00509 Key Features • Contactless buttons with superior reliability over electrical/mechanical contact solutions • Support simultaneous button presses TI Devices LDC1314 LP2985-N MSP430F5528 Backlight and Smart Lighting Control by Ambient Light and Proximity Sensor Reference Design - TIDA-00373 Key Features • Good Human Eye Spectral Matching • Dynamically Adjusts Backlight Brightness • UV Filter for Outdoor Using TI Devices OPT3001 FDC1004 HDC1000 MSP430FR5969 Spectral Response: The OPT3001 and Human Eye Ambient Light Sensor with Human Eye Visibility 1 Normalized Response The OPT3001 is a single-chip lux meter, measuring the intensity of light as visible by the human eye. The precision spectral response and strong IR rejection of the device enables the OPT3001 to accurately meter the intensity of light as seen by the human eye regardless of light source. The strong IR rejection also aids in maintaining high accuracy when industrial design calls for mounting the sensor under dark glass for aesthetics. 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 300 400 500 600 700 800 900 1000 Wavelength (nm) Texas Instruments Connected Sensors Building Automation Systems Guide 2015 | 3 Amplifier and Comparator Solutions Texas Instruments delivers a broad portfolio of amplifier and linear solutions including precision and high speed op amps, instrumentation and differential amplifers along with comparators. TI has an amplifier suited for any application. Learn more about Amplifier solutions at: www.ti.com/amplifier Low Power Amplifiers Slew Rate (Typ) (V/µs) CMRR (Typ) (dB) Offset Voltage @ 25°C (Max) (mV) Offset Drift (Typ) (µV/°C) Part No. Supply Range (V) Channels Iq per ch. (Max) (mA) LMV611/2/4 1.8 to 5.5 1/2/4 0.21 1.5 0.42 60 4 LPV521 1.6 to 5.5 1 0.0004 0.0062 0.0024 102 GBW (Typ) (MHz) Rail-Rail Operating Temp. (°C) Approx. Price (US$ | 1ku) 5.5 RRIO –40 to 125 0.22 / 0.25 / 0.30 1 0.4 RRIO –40 to 125 0.49 OPA369 1.8 to 5.5 1 0.0012 0.012 0.005 100 0.75 0.4 RRIO –40 to 85 0.65 OPA349 1.8 to 5.5 1 0.002 0.065 0.02 52 10 15 RRIO 0 to 70 0.50 Offset Voltage @ 25°C (Max) (mV) Offset Drift (Typ) (µV/°C) General Purpose Amplifiers Supply Range (V) Channels Iq per ch. (Max) (mA) TLC271/2/4 3 to 16 1/2/4 1.6 1.7 3.6 65 10 1.8 LM2904 3 to 26 2 0.6 0.7 0.3 50 7 7 –40 to 125 0.07 LM358 3 to 32 2 0.6 0.7 0.3 65 7 7 0 to 70 0.07 OPAx313 1.8 to 5.5 1, 2, 4 0.06 1 0.5 70 2.5 2 -40 to 125 0.26 / 0.38 / 0.55 OPAx314 1.8 to 5.5 1, 2, 4 0.21 3 1.5 75 2.5 1 -40 to 125 0.30 / 0.45 / 0.65 OPAx316 1.8 to 5.5 1, 2, 4 0.5 10 6 76 2.5 2 -40 to 125 0.48 / 0.72 / 1.08 OPAx170 2.7 to 36 1, 2, 4 0.145 1.2 0.5 104 1.8 0.3 -40 to 125 0.40 / 0.60 / 0.90 OPAx171 2.7 to 36 1, 2, 4 0.595 3 1.5 104 1.8 0.3 -40 to 125 0.40 / 0.60 / 0.90 OPAx172 2.7 to 36 1, 2, 4 1.8 10 10 90 1 0.3 -40 to 125 0.65 / 0.99 / 1.49 Input Bias Current (±) (Max) (nA) VICR (V) Offset Voltage @ 25°C (Max) (mV) Operating Temp. (°C) Approx. Price (US$ | 1ku) Part No. GBW (Typ) (MHz) Slew Rate (Typ) (V/µs) CMRR (Typ) (dB) Operating Temp. (°C) –40 to 85 Approx. Price (US$ | 1ku) 0.31 / 0.41 / 0.60 Comparators Part No. Type Supply Range (V) Channels tRESP Low-toHigh (µs) Iq per ch. (Max) (mA) TLV3691 Push-Pull 0.9 to 6.5 1 24 0.00015 0.1 -0.1 to 6.6 15 –40 to 85 0.40 TLV3012 Push-Pull 1.8 to 5.5 1 6 0.005 0.01 -0.2 to 5.7 12 –40 to 85 0.75 TLC3702 Push-Pull 3 to 16 2 1.1 0.02 0.03 0 to 15 5 –40 to 85 0.36 TLV1701/2/4 Open Collector 2.2 to 36 1, 2, 4 0.56 0.075 15 2.2 to 36 2.5 -40 to 125 0.38 / 0.61 / 0.97 Analog-to-Digital Converters Sample Rate (SPS) Input Channels Interface Supply Range (V) Features Operating Temp. (°C) Approx. Price (US$ | 1ku) Part No. Type Resolution (bits) ADS7040/1/2/3/4 SAR 8 to 12 1000 1 SPI 0 to 3.6 Nanowatt Power Consumption -40 to 125 1.00 / 1.60 / 2.10 ADS1018 ΣΔ 12 3300 4 SPI 2 to 5.5 Temp. Sensor (0.5°C accurate) -40 to 125 1.15 SPI 2.3 to 5.5 Single cycle setting, sensor, IDACs -40 to 125 3.15 / 3.95 ADS1120/1220 ΣΔ 16, 24 2000 4 *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 4 | Connected Sensors Building Automation Systems Guide 2015 Texas Instruments Li-Ion Wireless Connectivity Smallest Power Source Required AAA With the industry’s broadest wireless connectivity portfolio TI offers cost-effective, low-power solutions for short-range, long-range, mesh, and IP networks No Battery Coin Cell Learn more about Wireless Connectivity solutions at: www.ti.com/wireless Wi-Fi BLE/ANT ZigBee BLE/ANT Sub-1 GHz RF4CE 2.4 GHz 6LoWPAN 2.4 GHz NFC/RFID Proprietary Wi-Fi Part No. Technology Benefits TI Designs and Development Tools CC3200 SimpleLink Wi-Fi Wireless MCU with ARM Cortex®-M4, Integrated Wi-Fi Connectivity, security, low power, ease of use: Certified Wi-Fi modules available CC3200MODLAUNCHXL, TIDA-00372, TIDC-CC3200SMARTPLUG, TIDC-CC3200CAMBOOST CC3100 SimpleLink Wi-Fi Wireless Network Processor: provides easy Wi-Fi connectivity for building automation applications. Fully integrated 802.11 b/b/n radio, baseband, and MAC. Connect serialy Interface to any 8, 16, or 32-bit micro-controllers. Certified Wi-Fi modules available CC3100MODBOOST WL1837MOD High performance, low power, certified combo modules integrating Wi-Fi + Bluetooth + Bluetooth Low Energy. Connects to any Linux Processor with SDIO interface, available up to 85°C, 2.4GHz and 5GHz WL1837MODCOM8I Part No. Benefits TI Designs and Development Tools CC1200 High performance, long distance, low power radio transceiver: optimized for wide band applications CC1200DK, CC1200EMK-868-930, TIDC-CHN CC1120 High performance, long distance, low power radio transceiver: optimized for Narrowband CC1120DK, CC1120EMK-169, CC1120EMK-420-470, CC1120EMK-868-915, TIDC-MULTIBAND-WMBUS CC1101 Ultra-low power radio transceiver CC1101DK433, CC1101DK868-915, TIDM-SUB1GHZ-MESH-NETWORK CC1310 SimpleLink Ultra-low power ARM® Cortex®-M Based Wireless MCU TIDA-00484 Sub-1GHz Bluetooth® Part No. Benefits TI Designs and Development Tools CC2650 SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU: multi-standard supported Bluetooth Low-Energy, 6LowPAN and ZigBee. Ideal for end point sensors CC2650DK, CC2650STK, TIDA-00374 CC2640 SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU supporting Bluetooth LowEnergy: ultra-low power, small size and ease of use. Ideal for end point sensors CC2650DK, CC2650STK, TIDA-00374 CC2540T Extreme temperature Bluetooth Low Energy (up to 125 degree C) wireless MCU combined with low power and ease of use CC2541DK-MINI, TIDC-BLUETOOTH-LOW-ENERGY-LONG-RANGE, TIDC-BLUETOOTH-SMART-TO-RS-485-GATEWAY CC2564MODA Dual Mode Bluetooth (Bluetooth Low energy + Bluetooth Classic) transceivers module with antenna integrated: low-power, stable and robust SW stack CC256XQFNEM CC2564MODAEM (RTM September) Part No. Benefits TI Designs and Development Tools CC2630 SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU : ideal for end point sensors CC2650DK, CC2650STK, TIDA-00374 CC2530 ZigBee Wireless MCU: enables robust network nodes to be built with very low total bill-of-material costs CC2530DK, CC2530EMK, CC2531EM-IOT-HOME-GATEWAY-RD, CC2530-CC2592EM-RD CC2538 512kB ARM® Cortex®-M Based Wireless MCU: handle complex network stacks with security, demanding applications, and over-the-air download CC2538DK, CC2538EMK, TIDC-ZNP-HOST-SW3 Benefits TI Designs and Development Tools ZigBee® NFC Part No. transponder chip with a programmable 16-bit MSP430 low-power microcontroller. Optimized RF430FRL152H 13.56-MHz for operation in fully passive (battery-less) or single-cell battery-powered (semi-active) mode. RF430CL330H NFC Tag Type 4 device which combines a wireless NFC interface and a wired SPI/I2C interface to connect the device to a host *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. Texas Instruments TIDM-RF430-TEMPSENSE, TIDM-RF430FRLSENSE TIDA-00217 New products are listed in bold red. Connected Sensors Building Automation Systems Guide 2015 | 5 Wireless Connectivity Find the Perfect Connectivity Reference Design to Get Started SimpleLink™ Bluetooth Smart®/ Multi-Standard SensorTag Reference Design - CC2650STK-RD Key Features • More Sensors! 10 Sensors including light, humidity, pressure, magnetic, accelerometer, gyroscope, and others • Flexibility for IoT applications; Enable ZigBee or 6LoWPAN through a firmware upgrade TI Devices CC2650 TMP007 OPT3001 HDC1000 Wired (UART or RS-485) to Wi-Fi® Bridge with 24-VAC Power Reference Design - TIDA-00375, TIDA-00485, TIDA-00486 Key Features • Add Wi-Fi® Connectivity to an existing wired network • Wide Input Voltage Range of 18- to 30-VAC, 12- to 48-VDC • Galvanically Isolated or Non-Isolated variations TI Devices CC3200MOD CC3100MOD LM5160 LMR16006 Battery-less NFC/RFID Temperature Sensing Patch Reference Design TIDM-RF430-TEMPSENSE Key Features • No batteries required • “Over the air” configuration of the ADC • Different antenna configurations allow many form factors TI Devices RF430FRL152H Dynamic Field Powered NFC Reference Design for Data Logging and Security Applications Reference Design - TIDA-00217 Key Features • User can receive updated information from a field unit • Battery-less sensor interface; NFC reader provides TI Devices TMP103 RF430CL330H MSP430FR5969 SimpleLink™ Wi-Fi® CC3200 Smart Plug Reference Design TIDC-CC3200SMARTPLUG Key Features • Single-Phase energy measurement that calculates Current, Voltage, Power, and Energy • SimpleLink™ Wi-Fi® connectivity over 802.11 b/g/n networks from any mobile device • Isolated flyback power supply to provide Constant-Voltage and Constant-Current output regulation without optical coupler” TI Devices CC3200 UCC28910 TPS61097A-33 Embedded Processing Solutions Microcontrollers and processors from Texas Instruments offer a broad range of performance and power consumption options. From MSP430 MCU with ultra-low power consumption to the Sitara™ AM335x family with integrated multi-protocol industrial communications support to connect various kinds of sensors in real-time for better automation; TI is tailored to meet your design challenges. Learn more about Microcontroller solutions at: www.ti.com/msp430 and www.ti.com/msp432. Learn more about processor solutions at: www.ti.com/processors. Non-volatile Memory (KB) SRAM (KB) GPIO I2C SPI UART DMA ADC Comparator (Channels) Timers 16-Bit Multipliers AES Additional Features Operating Temp. (°C) Package MSP430FR4133 16 15.5 2 60 1 2 1 0 ADC10-10ch 0 2 N/A N/A LCD, RTC, BOR, Temp Sensor –40 to 85 LQFP, TSSOP 1.55 MSP430FR5969 16 64 2 40 1 3 2 3 ADC12-16ch 16 5 32x32 AES256 RTC, BOR, IrDA, Temp Sensor –40 to 85 VQFN 2.35 MSP430FR6972 16 64 2 51 2 4 2 3 ADC12-8ch 8 5 32x32 AES256 LCD, RTD, BOR, IrDA, Temp Sensor –40 to 85 LQFP 2.55 MSP430FR6989 16 128 2 83 2 4 2 3 ADC12-16ch 16 5 32x32 AES256 LCD, RTC, Scan I/F, BOR, IrDA, Temp Sensor –40 to 85 LQFP 4.50 Part No. *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 6 | Connected Sensors Building Automation Systems Guide 2015 Approx.Price (US$ | 1ku) Frequency (MHz) MSP430 Low Power FRAM MCUs New products are listed in bold red. Texas Instruments Embedded Processing Solutions Non-volatile Memory (KB) SRAM (KB) GPIO I2C SPI UART ADC Comparator (Channels) Timers 16-Bit Multipliers Additional Features Operating Temp. (°C) Package MSP430G2553 16 16 0.5 24 1 1 1 ADC10-8ch 8 2 N/A Temp Sensor, BOR, IrDA –40 to 85 TSSOP, VQFN 0.90 MSP430G2955 16 56 4 32 1 2 1 ADC10-12ch 8 3 N/A Temp Sensor, BOR, IrDA –40 to 85 TSSOP, VQFN 1.30 MSP430F2274 16 32 1 32 1 1 1 ADC10-12ch 0 2 N/A Temp Sensor, BOR, OpAmp –40 to 105 –40 to 85 DSBGA, TSSOP, VQFN 1.80 MSP430I2041 16 32 2 16 1 2 1 SigmaDelta 24-4ch 0 2 16 x16 Temp Sensor, BOR, IrDA -40 to 105 TSSOP, VQFN 1.75 Part No. Approx.Price (US$ | 1ku) Frequency (MHz) MSP430 Low Power MCUs ARM Based MCUs and MPUs Part No. MSP432P401R AM3352 ARM CPU Benefits TI Designs and Dev. Tools ARM Cortex-M4F MSP432P4x microcontrollers are the ideal combination of TI's MSP430 low-power DNA, advanced mixed-signal features, and the high-performance processing capabilities of ARM®'s 32-bit Cortex®-M4F RISC engine. MSP-EXP432P401R ARM Cortex-A8 Sitara™ AM335x ARM Cortex-A8 Processors deliver the right balance of performance (300 MHz to 1 GHz of processing power), Interfaces (DDR3, LCD, Touch Screen Controller), and Connectivity (UART and Industrial Protocols) Beaglebk, TMDXEVM3358 New products are listed in bold red. *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. Find the Perfect MCU Reference Design to Get Started Thermostat Implementation with FRAM Microcontroller Reference Design - TIDM-FRAM-THERMOSTAT Key Features • 0°C to 35°C Temperature Measurement with 0.1°C Resolution • 3.4 inch LCD Display • Ultra-Low Power: 1.8 µA Standby Current TI Devices MSP430FR4133 SN65HVD75 TPS782 Smoke Detector with Ultra Low Power MCU Reference Design - TIDM-G2xxSMOKEDETECTOR Key Features • Passive infrared (PIR) smoke chamber with discrete Amplification circuitry to ADC input • Low power (2.07 µA) and small code size (