OPA2340TDF1

OPA2340-DIE www.ti.com SBOS691A – JUNE 2013 – REVISED SEPTEMBER 2013 SINGLE-SUPPLY, RAIL-TO-RAIL OPERATIONAL AMPLIFIER MicroAmplifier ™ Check for Samples: OPA2340-DIE FEATURES 1 • • • • • • • 23 APPLICATIONS Rail-to-Rail Input Rail-to-Rail Output Wide Bandwidth High Slew Rate Low THD+Noise Low Quiescent Current Single, Dual, and Quad Versions • • • • • • • • Driving A/D Converters PCMCIA Cards Data Acquisition Process Control Audio Processing Communications Active Filters Test Equipment DESCRIPTION The OPA2340-DIE rail-to-rail CMOS operational amplifier is optimized for low-voltage, single-supply operation. Rail-to-rail input/output and high-speed operation make them ideal for driving sampling analog-to-digital (A/D) converters. The OPA2340-DIE is also well-suited for general purpose and audio applications as well as providing I/V conversion at the output of digital-to-analog (D/A) converters. Single, dual, and quad versions have identical specifications for design flexibility. The OPA2340-DIE operates on a single supply. Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE OPA2340 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY OPA2340TDF1 100 OPA2340TDF2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MicroAmplifier is a trademark of Texas Instruments, Inc. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated OPA2340-DIE SBOS691A – JUNE 2013 – REVISED SEPTEMBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating AlSiCu 800 nm Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: OPA2340-DIE OPA2340-DIE www.ti.com SBOS691A – JUNE 2013 – REVISED SEPTEMBER 2013 Table 1. Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX Out A 1 5 1010.65 107 1112.65 N/C 2 5 778.4 107 880.4 -In A 3 5 548.5 107 650.5 +In A 4 5 250.6 107 352.6 V- 5 611 5 713 107 +In B 6 1217 250.6 1319 352.6 -In B 7 1217 548.5 1319 650.5 N/C 8 1217 778.4 1319 880.4 Out B 9 1217 1010.65 1319 1112.65 V+ 10 611 1208.9 713 1310.9 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: OPA2340-DIE 3 PACKAGE OPTION ADDENDUM www.ti.com 10-Apr-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) OPA2340TDF1 ACTIVE 0 100 RoHS & Green Call TI N / A for Pkg Type 25 to 25 OPA2340TDF2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type 25 to 25 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of