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OPA313DBVT

OPA313DBVT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOT23-5

  • 描述:

    IC OPAMP GP 1 CIRCUIT SOT23-5

  • 数据手册
  • 价格&库存
OPA313DBVT 数据手册
OPA313 OPA2313 OPA4313 www.ti.com SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 1-MHz, Micro-Power, Low-Noise, RRIO,1.8-V CMOS OPERATIONAL AMPLIFIER Precision Value Line Series Check for Samples: OPA313, OPA2313, OPA4313 FEATURES DESCRIPTION • • • • • • • • • The OPA313 family of single-, dual-, and quadchannel op amps represents a new generation of lowcost, general purpose, micro-power operational amplifiers. Featuring rail-to-rail input and output swings, and low quiescent current (50 μA, typ) combined with a wide bandwidth of 1 MHz and very low noise (25 nV/√Hz at 1 kHz) makes this family very attractive for a variety of battery-powered applications that require a good balance between cost and performance. The low input bias current supports those op amps to be used in applications with megaohm source impedances. 1 2 Low IQ: 50 µA/ch Wide Supply Range: 1.8 V to 5.5 V Low Noise: 25 nV/√Hz at 1 kHz Gain Bandwidth: 1 MHz Low Input Bias Current: 0.2 pA Low Offset Voltage: 0.5 mV Unity-Gain Stable Internal RF/EMI Filter Extended Temperature Range: –40°C to +125°C APPLICATIONS • • • Battery-Powered Instruments: – Consumer, Industrial, Medical – Notebooks, Portable Media Players Sensor Signal Conditioning: – Loop-Powered – Notebooks, Portable Media Players Wireless Sensors: – Home Security – Remote Sensing – Wireless Metering The robust design of the OPA313 devices provides ease-of-use to the circuit designer: unity-gain stability with capacitive loads of up to 150 pF, integrated RF/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM). These devices are optimized for operation at voltages as low as +1.8 V (±0.9 V) and up to +5.5 V (±2.75 V), and are specified over the extended temperature range of –40°C to +125°C. The OPA313 (single) is available in both SC70-5 and SOT23-5 packages. The OPA2313 (dual) is offered in SO-8, MSOP-8, and DFN-8 packages. The quadchannel OPA4313 is offered in a TSSOP-14 package. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE INFORMATION (1) PACKAGE-LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING SC70-5 DCK –40°C to +125°C SIE SOT23-5 DBV –40°C to +125°C SIF SO-8 D –40°C to +125°C OP2313 OPA2313 MSOP-8 DGK –40°C to +125°C OUSS DFN-8 DRG –40°C to +125°C SDY OPA4313 TSSOP-14 PW –40°C to +125°C OPA4313 PRODUCT OPA313 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. Supply voltage UNIT 7 V (V–) – 0.5 to (V+) + 0.5 V ±10 mA Output short-circuit (3) Continuous mA Operating temperature, TA –40 to +150 °C Storage temperature, Tstg –65 to +150 °C Junction temperature, TJ +150 °C Human body model (HBM) 4000 V Charged device model (CDM) 1000 V Machine model (MM) 200 V Signal input terminals ESD rating (1) (2) (3) 2 Voltage (2) OPA313, OPA2313, OPA4313 Current (2) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should be current limited to 10 mA or less. Short-circuit to ground, one amplifier per package. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 OPA313 OPA2313 OPA4313 www.ti.com SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 ELECTRICAL CHARACTERISTICS: +5.5 V (1) At TA = +25 °C, RL = 10 kΩ connected to VS / 2, and VCM = VOUT = VS / 2, unless otherwise noted. OPA313, OPA2313, OPA4313 PARAMETER TEST CONDITIONS MIN TYP MAX 0.5 2.5 UNIT OFFSET VOLTAGE VOS Input offset voltage dVOS/dT vs Temperature TA = –40°C to +125°C PSRR vs power supply TA = –40°C to +125°C Channel separation, dc At dc mV μV/°C 2 74 90 dB 10 µV/V INPUT VOLTAGE RANGE VCM Common-mode voltage range CMRR Common-mode rejection ratio No phase reversal, rail-to-rail input (V–) – 0.2 (V+) + 0.2 V TA = –40°C to +125°C, (VS–) – 0.2 V < VCM < (VS+) – 1.3 V 70 85 dB TA = –40°C to +125°C, VCM = –0.2 V to 5.7 V 64 80 dB INPUT BIAS CURRENT ±0.2 IB Input bias current ±10 pA TA = –40°C to +85°C (2) ±50 pA TA = –40°C to +125°C (2) ±600 pA ±10 pA TA = –40°C to +85°C (2) ±50 pA TA = –40°C to +125°C (2) ±600 pA ±0.2 IOS Input offset current NOISE Input voltage noise (peak-topeak) 6 μVPP f = 10 kHz 22 nV/√Hz f = 1 kHz 25 nV/√Hz f = 1 kHz 5 fA/√Hz Differential 1 pF Common-mode 5 pF en Input voltage noise density in Input current noise density f = 0.1 Hz to 10 Hz INPUT CAPACITANCE CIN OPEN-LOOP GAIN 0.05 V < VO < (V+) – 0.05 V, RL = 100 kΩ AOL Open-loop voltage gain Phase margin (1) (2) 90 104 dB TA = –40°C to +125°C, 0.1 V < VO < (V+) – 0.1 V 104 116 dB 0.3 V < VO < (V+) – 0.3 V, RL = 2 kΩ 100 110 dB 65 degrees VS = 5.0 V, G = +1 Parameters with minimum or maximum specification limits are 100% production tested at +25ºC, unless otherwise noted. Over temperature limits are based on characterization and statistical analysis. Specified by design and characterization; not production tested. Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 Submit Documentation Feedback 3 OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com ELECTRICAL CHARACTERISTICS: +5.5 V(1) (continued) At TA = +25 °C, RL = 10 kΩ connected to VS / 2, and VCM = VOUT = VS / 2, unless otherwise noted. OPA313, OPA2313, OPA4313 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT FREQUENCY RESPONSE GBW Gain-bandwidth product VS = 5.0 V, CL = 10 pF SR Slew rate VS = 5.0 V, G = +1 tS MHz V/μs To 0.1%, VS = 5.0 V, 2-V step , G = +1 5 μs To 0.01%, VS = 5.0 V, 2-V step , G = +1 6 μs Overload recovery time VS = 5.0 V, VIN × Gain > VS 3 μs Total harmonic distortion + noise (3) VS = 5.0 V, VO = 1 VRMS, G = +1, f = 1 kHz Settling time THD+N 1 0.5 0.0045% OUTPUT RL = 100 kΩ (4) VO Voltage output swing from supply rails TA = –40°C to +125°C, RL = 100 kΩ 5 20 mV 30 mV 75 100 mV 125 mV (4) RL = 2 kΩ (4) TA = –40°C to +125°C, RL = 2 kΩ ISC Short-circuit current RO Open-loop output impedance TA = –40°C to +125°C ±15 mA ±12 mA 2300 Ω POWER SUPPLY VS IQ Specified voltage range Quiescent current per amplifier Power-on time 1.8 (±0.9) IO = 0 mA, VS = 5.0 V 50 TA = –40°C to +125°C, VS = 5.0 V, IO = 0 mA VS = 0 V to 5 V, to 90% IQ level 5.5 (±2.75) V 60 µA 85 µA 10 µs TEMPERATURE (3) (4) 4 Specified range –40 +125 °C Operating range –40 +150 °C Storage range –65 +150 °C Third-order filter; bandwidth = 80 kHz at –3 dB. Specified by design and characterization; not production tested. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 OPA313 OPA2313 OPA4313 www.ti.com SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 ELECTRICAL CHARACTERISTICS: +1.8 V (1) At TA = +25 °C, RL = 10 kΩ connected to VS / 2, VCM = VS+ – 1.3 V, and VOUT = VS / 2, unless otherwise noted. OPA313, OPA2313, OPA4313 PARAMETER TEST CONDITIONS MIN TYP MAX 0.5 2.5 UNIT OFFSET VOLTAGE VOS Input offset voltage dVOS/dT vs Temperature TA = –40°C to +125°C PSRR vs power supply TA = –40°C to +125°C Channel separation, dc At dc mV μV/°C 2 74 90 dB 10 µV/V INPUT VOLTAGE RANGE VCM Common-mode voltage range CMRR Common-mode rejection ratio No phase reversal, rail-to-rail input (V–) – 0.2 (V+) + 0.2 TA = –40°C to +125°C, (VS–) – 0.2 V < VCM < (VS+) – 1.3 V 70 85 VS = 1.8 V, VCM = –0.2 V to +1.8 V 58 73 TA = –40°C to +125°C, VCM = –0.2 V to 1.6 V 58 70 V dB dB INPUT BIAS CURRENT ±0.2 IB Input bias current ±10 pA TA = –40°C to +85°C (2) ±50 pA TA = –40°C to +125°C (2) ±600 pA ±10 pA TA = –40°C to +85°C (2) ±50 pA TA = –40°C to +125°C (2) ±600 pA ±0.2 IOS Input offset current NOISE Input voltage noise (peak-topeak) 6 μVPP f = 10 kHz 22 nV/√Hz f = 1 kHz 25 nV/√Hz f = 1 kHz 5 fA/√Hz Differential 1 pF Common-mode 5 pF 90 110 dB 100 110 dB en Input voltage noise density in Input current noise density f = 0.1 Hz to 10 Hz INPUT CAPACITANCE CIN OPEN-LOOP GAIN AOL (1) (2) Open-loop voltage gain TA = –40°C to +125°C, 0.1 V < VO < (V+) – 0.1 V 0.05 V < VO < (V+) – 0.05 V, RL = 100 kΩ Parameters with minimum or maximum specification limits are 100% production tested at +25ºC, unless otherwise noted. Over temperature limits are based on characterization and statistical analysis. Specified by design and characterization; not production tested. Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 Submit Documentation Feedback 5 OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com ELECTRICAL CHARACTERISTICS: +1.8 V(1) (continued) At TA = +25 °C, RL = 10 kΩ connected to VS / 2, VCM = VS+ – 1.3 V, and VOUT = VS / 2, unless otherwise noted. OPA313, OPA2313, OPA4313 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT FREQUENCY RESPONSE GBW Gain-bandwidth product CL = 10 pF SR Slew rate G = +1 tS MHz V/μs To 0.1%, VS = 5.0 V, 2-V step , G = +1 5 μs To 0.01%, VS = 5.0 V, 2-V step , G = +1 6 μs Overload recovery time VS = 5.0 V, VIN × Gain > VS 3 μs Total harmonic distortion + noise (3) VS = 5.0 V, VO = 1 VRMS, G = +1, f = 1 kHz Settling time THD+N 0.9 0.45 0.0045% OUTPUT RL = 100 kΩ (4) VO Voltage output swing from supply rails TA = –40°C to +125°C, RL = 100 kΩ 5 (4) RL = 2 kΩ (4) 25 TA = –40°C to +125°C, RL = 2 kΩ ISC Short-circuit current RO Open-loop output impedance 15 mV 30 mV 50 mV 125 mV ±6 mA Ω 2300 POWER SUPPLY VS Specified voltage range IQ Quiescent current per amplifier IO = 0 mA 1.8 (±0.9) 50 Power-on time VS = 0 V to 5 V, to 90% IQ level 10 5.5 (±2.75) V 60 µA µs TEMPERATURE (3) (4) 6 Specified range –40 +125 °C Operating range –40 +150 °C Storage range –65 +150 °C Third-order filter; bandwidth = 80 kHz at –3 dB. Specified by design and characterization; not production tested. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 OPA313 OPA2313 OPA4313 www.ti.com SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 THERMAL INFORMATION: OPA313 OPA313 THERMAL METRIC (1) DBV (SOT23) DCK (SC70) 5 PINS 5 PINS θJA Junction-to-ambient thermal resistance 228.5 281.4 θJC(top) Junction-to-case(top) thermal resistance 99.1 91.6 θJB Junction-to-board thermal resistance 54.6 59.6 ψJT Junction-to-top characterization parameter 7.7 1.5 ψJB Junction-to-board characterization parameter 53.8 58.8 θJC(bottom) Junction-to-case(bottom) thermal resistance N/A N/A (1) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. THERMAL INFORMATION: OPA2313 OPA2313 THERMAL METRIC (1) D (SO) DGK (MSOP) DRG (DFN) 8 PINS 8 PINS 8 PINS θJA Junction-to-ambient thermal resistance 138.4 191.2 53.8 θJC(top) Junction-to-case(top) thermal resistance 89.5 61.9 69.2 θJB Junction-to-board thermal resistance 78.6 111.9 20.1 ψJT Junction-to-top characterization parameter 29.9 5.1 3.8 ψJB Junction-to-board characterization parameter 78.1 110.2 20.0 θJC(bottom) Junction-to-case(bottom) thermal resistance N/A N/A 11.6 (1) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. THERMAL INFORMATION: OPA4313 OPA4313 THERMAL METRIC (1) PW (TSSOP) UNITS 14 PINS θJA Junction-to-ambient thermal resistance 121.0 θJC(top) Junction-to-case(top) thermal resistance 49.4 θJB Junction-to-board thermal resistance 62.8 ψJT Junction-to-top characterization parameter 5.9 ψJB Junction-to-board characterization parameter 62.2 θJC(bottom) Junction-to-case(bottom) thermal resistance N/A (1) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 Submit Documentation Feedback 7 OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com PIN CONFIGURATIONS DCK PACKAGE SC70-5 (TOP VIEW) +IN 1 V- 2 -IN 3 D, DGK PACKAGES SO-8, MSOP-8 (TOP VIEW) 5 V+ 4 OUT OUT A 1 8 V+ -IN A 2 7 OUT B +IN A 3 6 -IN B V- 4 5 +IN B DBV PACKAGE SOT23-5 (TOP VIEW) OUT 1 V- 2 +IN 3 DRG PACKAGE(1) DFN-8 (TOP VIEW) 5 V+ 4 -IN OUT A 1 -IN A 2 +IN A 3 V- 4 Exposed Thermal Die Pad on Underside(2) 8 V+ 7 OUT B 6 -IN B 5 +IN B PW PACKAGE TSSOP-14 (TOP VIEW) 14 OUT D 13 -IN D 3 12 +IN D V+ 4 11 V- +IN B 5 10 +IN C -IN B 6 9 -IN C OUT B 7 8 OUT C OUT A 1 -IN A 2 +IN A A B D C (1) Pitch: 0,65 mm. (2) Connect thermal pad to V–. Pad size: 1,8 mm × 1,5 mm. 8 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 OPA313 OPA2313 OPA4313 www.ti.com SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 TYPICAL CHARACTERISTICS Table 1. Characteristic Performance Measurements TITLE FIGURE Open-Loop Gain and Phase vs Frequency Figure 1 Open-Loop Gain vs Temperature Figure 2 Quiescent Current vs Supply Voltage Figure 3 Quiescent Current vs Temperature Figure 4 Offset Voltage Production Distribution Figure 5 Offset Voltage Drift Distribution Figure 6 Offset Voltage vs Common-Mode Voltage (Maximum Supply) Figure 7 Offset Voltage vs Temperature Figure 8 CMRR and PSRR vs Frequency (RTI) Figure 9 CMRR and PSRR vs Temperature Figure 10 0.1-Hz to 10-Hz Input Voltage Noise (5.5 V) Figure 11 Input Voltage Noise Spectral Density vs Frequency (1.8 V, 5.5 V) Figure 12 Input Voltage Noise vs Common-Mode Voltage (5.5 V) Figure 13 Input Bias and Offset Current vs Temperature Figure 14 Open-Loop Output Impedance vs Frequency Figure 15 Maximum Output Voltage vs Frequency and Supply Voltage Figure 16 Output Voltage Swing vs Output Current (over Temperature) Figure 17 Closed-Loop Gain vs Frequency, G = 1, –1, 10 (1.8 V) Figure 18 Closed-Loop Gain vs Frequency, G = 1, –1, 10 (5.5 V) Figure 19 Small-Signal Overshoot vs Load Capacitance Figure 20 Phase Margin vs Capacitive Load Figure 21 Small-Signal Step Response, Noninverting (1.8 V) Figure 22 Small-Signal Step Response, Noninverting ( 5.5 V) Figure 23 Large-Signal Step Response, Noninverting (1.8 V) Figure 24 Large-Signal Step Response, Noninverting ( 5.5 V) Figure 25 Positive Overload Recovery Figure 26 Negative Overload Recovery Figure 27 No Phase Reversal Figure 28 Channel Separation vs Frequency (Dual) Figure 29 THD+N vs Amplitude (G = +1, 2 kΩ, 10 kΩ) Figure 30 THD+N vs Amplitude (G = –1, 2 kΩ, 10 kΩ) Figure 31 THD+N vs Frequency (0.5 VRMS, G = +1, 2 kΩ, 10 kΩ) Figure 32 EMIRR IN+ vs Frequency Figure 33 Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 Submit Documentation Feedback 9 OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com TYPICAL CHARACTERISTICS At TA = +25 °C, VS = 5 V, RL = 10 kΩ connected to VS / 2, and VCM = VOUT = VS / 2, unless otherwise noted. 180 140 Gain Phase 100 k , 5.5 V 135 100 135 CL=10pF C L = 10 pF 80 60 Phase (o) Gain (dB) 140 90 40 20 45 C L = 100 pF CL=100pF Open-Loop Gain (dB) 120 130 10 k , 5.5 V 125 120 2 k , 5.5 V 115 110 0 105 -20 1 10 100 1k 10k 100k Frequency (Hz) 1M 10M 0 100M 10 k , 1.8 V 100 -50 C001 Figure 1. OPEN-LOOP GAIN AND PHASE vs FREQUENCY -25 0 25 50 Temperature (oC) 75 100 125 C002 Figure 2. OPEN-LOOP GAIN vs TEMPERATURE 65 60 Quiescent Current (µA/ch) Quiescent Current (µA/ch) 58 56 54 52 50 48 46 44 60 VS = 5.5 V 55 50 45 VS = 1.8 V 40 42 40 35 1.5 2 2.5 3 3.5 4 4.5 Supply Voltage (V) 5 5.5 -50 6 -25 0 C003 Figure 3. QUIESCENT CURRENT vs SUPPLY 25 50 Temperature (oC) 75 100 125 C004 Figure 4. QUIESCENT CURRENT vs TEMPERATURE 25 9 Percent of Amplifiers (%) Percent of Amplifiers (%) 8 7 6 5 4 3 2 20 15 10 5 Submit Documentation Feedback 3 2.5 2.75 2.25 2 1.75 1.5 1.25 1 0.75 2.5 2 1.5 0.5 Offset Voltage Drift (µV/oC) C005 Figure 5. OFFSET VOLTAGE PRODUCTION DISTRIBUTION 10 0 0.25 Offset Voltage (mV) 1 0.5 0 -0.5 -1 -1.5 -2 0 -2.5 1 C006 Figure 6. OFFSET VOLTAGE DRIFT DISTRIBUTION Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 OPA313 OPA2313 OPA4313 www.ti.com SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 TYPICAL CHARACTERISTICS (continued) At TA = +25 °C, VS = 5 V, RL = 10 kΩ connected to VS / 2, and VCM = VOUT = VS / 2, unless otherwise noted. 1500 1500 Typical Units VS = 5.5 V 1200 900 Offset Voltage (µV) Offset Voltage (µV) 900 600 300 0 -300 -600 600 300 0 -300 -600 -900 -900 -1200 -1200 -1500 -1500 0 0.5 1 1.5 2 2.5 3 3.5 4 Common-Mode Voltage (V) 4.5 5 5.5 -50 -25 0 C007 Figure 7. OFFSET VOLTAGE vs COMMON-MODE VOLTAGE 25 50 Temperature (oC) 75 100 125 C008 Figure 8. OFFSET VOLTAGE vs TEMPERATURE 110 Common-Mode Rejection Ratio (dB), Power-Supply Rejection Ratio (dB) 120 Common-Mode Rejection Ratio (dB), Power-Supply Rejection Ratio (dB) Typical Units VS = 5.5 V 1200 100 80 +PSRR 60 CMRR 40 20 -PSRR 105 PSRR 100 95 90 CMRR 85 80 75 70 65 VCM = ±0.2 V to 5.2 V 60 0 10 100 1k 10k Frequency (Hz) 100k -50 1M -25 0 C009 Figure 9. CMRR AND PSRR vs FREQUENCY (Referred-to-Input) 25 50 75 Temperature (oC) 100 125 C001 Figure 10. CMRR AND PSRR vs TEMPERATURE 1000 9ROWDJH 1RLVH Q9 ¥+] Voltage Noise (1 µV/div) VS = 1.8 V 100 10 VS = 5.5 V 1 Time (1 s/div) 1 10 C011 Figure 11. 0.1-Hz TO 10-Hz INPUT VOLTAGE NOISE 100 1k Frequency (Hz) 10k 100k C012 Figure 12. INPUT VOLTAGE NOISE SPECTRAL DENSITY vs FREQUENCY Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 Submit Documentation Feedback 11 OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25 °C, VS = 5 V, RL = 10 kΩ connected to VS / 2, and VCM = VOUT = VS / 2, unless otherwise noted. 200 VS = 5.5 V f = 1 kHz 35 150 Input Bias Current (pA) 9ROWDJH 1RLVH 'HQVLW\ Q9 ¥+] 40 30 25 20 IBN 100 IBP 50 0 15 IOS -50 10 -100 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Common-Mode Input Voltage (V) 5 5.5 -50 -25 0 25 50 Temperature (oC) C013 75 125 C014 Figure 13. VOLTAGE NOISE vs COMMON-MODE VOLTAGE Figure 14. INPUT BIAS AND OFFSET CURRENT vs TEMPERATURE 100k 6 RL = 10 k CL = 10 pF 5 VS = 5.5 V Output Voltage (V) Output Impedance ( ) 100 VS = 1.8 V 10k 4 VS = 1.8 V 3 2 1 VS = 5.5 V 1000 1 10 100 1k Frequency (Hz) 10k 0 1000 100k Figure 15. OPEN-LOOP OUTPUT IMPEDANCE vs FREQUENCY 100k 1M Frequency (Hz) C016 Figure 16. MAXIMUM OUTPUT VOLTAGE vs FREQUENCY AND SUPPLY VOLTAGE 3 40 G = +10 V/V 2 1 20 oC +125 +125oC 0 +25oC +25 oC Gain (dB) Output Voltage Swing (V) 10k C015 -40 oC -40oC -1 G = +1 V/V 0 -2 G = -1 V/V VS = 1.8 V -3 -20 0 5 10 Output Current (mA) 15 20 Figure 17. OUTPUT VOLTAGE SWING vs OUTPUT CURRENT (Over Temperature) 12 Submit Documentation Feedback 10 100 C017 1k 10k 100k Frequency (Hz) 1M 10M 100M C018 Figure 18. CLOSED-LOOP GAIN vs FREQUENCY (Minimum Supply) Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 OPA313 OPA2313 OPA4313 www.ti.com SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 TYPICAL CHARACTERISTICS (continued) At TA = +25 °C, VS = 5 V, RL = 10 kΩ connected to VS / 2, and VCM = VOUT = VS / 2, unless otherwise noted. 40 50 45 VS = 1.8V, VCM = 0.5V 40 G = +10 V/V Overshoot (%) Gain (dB) 20 G = +1 V/V 0 35 30 25 VS = 5.5V 20 15 10 G = -1 V/V Gain = +1 V/V RL = 10 kŸ 5 VS = 5.5V 0 ±20 10 100 1k 10k 100k 1M Frequency (Hz) 10M 100M 0 100 C000 Figure 19. CLOSED-LOOP GAIN vs FREQUENCY (Maximum Supply) 200 Capacitive Load (pF) 300 400 C002 Figure 20. SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE 90 80 Voltage (25 mV/div) Phase Margin (o) 70 60 50 VS = 5.5V 40 30 G = +1 V/V VS = 1.8V VCM = 0.5V RL = 10 kŸ CL = 100 pF VIN CL = 10 pF 20 VS = 1.8V, VCM = 0.5V 10 0 0 100 200 Capacitive Load (pF) 300 400 Time (1 µs/div) C003 Figure 21. PHASE MARGIN vs CAPACITIVE LOAD G = +1 V/V VS = 1.8 V RL = 10 k CL = 100 pF VIN Voltage (250 mV/div) Voltage (25 mV/div) G = +1 V/V VS = 5.5 V RL = 10 k C004 Figure 22. SMALL-SIGNAL PULSE RESPONSE (Minimum Supply) CL = 10 pF VOUT VIN Time (1 µs/div) Time (2.5 µs/div) C023 Figure 23. SMALL-SIGNAL PULSE RESPONSE (Maximum Supply) C024 Figure 24. LARGE-SIGNAL PULSE RESPONSE (Minimum Supply) Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 Submit Documentation Feedback 13 OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25 °C, VS = 5 V, RL = 10 kΩ connected to VS / 2, and VCM = VOUT = VS / 2, unless otherwise noted. Voltage (500 mV/div) G = -10 V/V VS = 5.5 V Voltage (250 mV/div) G = +1 V/V VS = 5.5 V RL = 10 k VOUT VIN VOUT VIN Time (2.5 µs/div) Time (2 µs/div) C025 C026 Figure 26. POSITIVE OVERLOAD RECOVERY Voltage (1 V/div) Voltage (500 mV/div) Figure 25. LARGE-SIGNAL PULSE RESPONSE (Maximum Supply) VIN VOUT VOUT G = -10 V/V VS = 5.5 V VIN Time (2 µs/div) Time (125 µs/div) C027 C028 Figure 27. NEGATIVE OVERLOAD RECOVERY Figure 28. NO PHASE REVERSAL -60 0.1 VS = 5.5 V -100 THD + N (%) Crosstalk (dB) -80 chB to chA -120 chA to chB 0.01 RL = 2 k 0.001 -140 RL = 10 k -160 100 1k 10k 100k Frequency (Hz) 1M 10M Submit Documentation Feedback 0.1 1 Output Amplitude (VRMS) C029 Figure 29. CHANNEL SEPARATION vs FREQUENCY 14 0.0001 0.01 VS = 1.8 V f = 1 kHz BW = 80 kHz G = +1 V/V 10 C030 Figure 30. THD+N vs OUTPUT AMPLITUDE (Minimum Supply) Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 OPA313 OPA2313 OPA4313 www.ti.com SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 TYPICAL CHARACTERISTICS (continued) At TA = +25 °C, VS = 5 V, RL = 10 kΩ connected to VS / 2, and VCM = VOUT = VS / 2, unless otherwise noted. 0.1 0.1 0.01 THD + N (%) THD + N (%) VS = 5.5 V VOUT= 0.5 VRMS BW = 80 kHz G = +1 V/V RL = 2 k 0.001 VS = 5.5 V f = 1 kHz BW = 80 kHz G = -1 V/V 0.0001 0.01 RL = 2 k 0.01 0.001 RL = 10 k R L = 10 k 0.0001 0.1 1 Output Amplitude (VRMS) 10 10 100 1k Frequency (Hz) C031 Figure 31. THD+N vs OUTPUT AMPLITUDE (Maximum Supply) 10k 100k C032 Figure 32. THD+N vs FREQUENCY 120 PRF = -10 dBm VSUPPLY = 5 V VCM = 2.5 V EMIRR IN+ (dB) 100 80 60 40 20 0 10 100 1000 Frequency (MHz) 10000 C033 Figure 33. EMIRR IN+ vs FREQUENCY Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 Submit Documentation Feedback 15 OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com APPLICATION INFORMATION The OPA313 is a family of low-power, rail-to-rail input and output operational amplifiers specifically designed for portable applications. These devices operate from 1.8 V to 5.5 V, are unity-gain stable, and suitable for a wide range of general-purpose applications. The class AB output stage is capable of driving ≤ 10-kΩ loads connected to any point between V+ and ground. The input common-mode voltage range includes both rails, and allows the OPA313 family to be used in virtually any single-supply application. Rail-to-rail input and output swing significantly increases dynamic range, especially in low-supply applications, and makes them ideal for driving sampling analog-to-digital converters (ADCs). The OPA313 features 1-MHz bandwidth and 0.5-V/μs slew rate with only 50-μA supply current per channel, providing good ac performance at very low power consumption. DC applications are also well served with a low input noise voltage of 25 nV/√Hz at 1 kHz, low input bias current (0.2 pA), and an input offset voltage of 0.5 mV (typical). The typical offset voltage drift is 2 μV/°C; over the full temperature range the input offset voltage changes only 200 μV (0.5 mV to 0.7 mV). OPERATING VOLTAGE The OPA313 series op amps are fully specified and ensured for operation from +1.8 V to +5.5 V. In addition, many specifications apply from –40°C to +125°C. Parameters that vary significantly with operating voltages or temperature are shown in the Typical Characteristics graphs. Power-supply pins should be bypassed with 0.01μF ceramic capacitors. RAIL-TO-RAIL INPUT The input common-mode voltage range of the OPA313 series extends 200 mV beyond the supply rails. This performance is achieved with a complementary input stage: an N-channel input differential pair in parallel with a P-channel differential pair, as shown in Figure 34. The N-channel pair is active for input voltages close to the positive rail, typically (V+) – 1.3 V to 200 mV above the positive supply, while the P-channel pair is on for inputs from 200 mV below the negative supply to approximately (V+) – 1.3 V. There is a small transition region, typically (V+) – 1.4 V to (V+) – 1.2 V, in which both pairs are on. This 200-mV transition region can vary up to 300 mV with process variation. Thus, the transition region (both stages on) can range from (V+) – 1.7 V to (V+) – 1.5 V on the low end, up to (V+) – 1.1 V to (V+) – 0.9 V on the high end. Within this transition region, PSRR, CMRR, offset voltage, offset drift, and THD may be degraded compared to device operation outside this region. V+ Reference Current VIN+ VINVBIAS1 Class AB Control Circuitry VO VBIAS2 V(Ground) Figure 34. Simplified Schematic 16 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 OPA313 OPA2313 OPA4313 www.ti.com SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 INPUT AND ESD PROTECTION The OPA313 family incorporates internal electrostatic discharge (ESD) protection circuits on all pins. In the case of input and output pins, this protection primarily consists of current-steering diodes connected between the input and power-supply pins. These ESD protection diodes also provide in-circuit, input overdrive protection, as long as the current is limited to 10 mA as stated in the Absolute Maximum Ratings. Figure 35 shows how a series input resistor may be added to the driven input to limit the input current. The added resistor contributes thermal noise at the amplifier input and its value should be kept to a minimum in noise-sensitive applications. V+ IOVERLOAD 10-mA max Device VOUT VIN 5 kW Figure 35. Input Current Protection COMMON-MODE REJECTION RATIO (CMRR) CMRR for the OPA313 is specified in several ways so the best match for a given application may be used; see the Electrical Characteristics. First, the CMRR of the device in the common-mode range below the transition region [VCM < (V+) – 1.3 V] is given. This specification is the best indicator of the capability of the device when the application requires use of one of the differential input pairs. Second, the CMRR over the entire commonmode range is specified at (VCM = –0.2 V to 5.7 V). This last value includes the variations seen through the transition region (see Figure 7). EMI SUSCEPTIBILITY AND INPUT FILTERING Operational amplifiers vary with regard to the susceptibility of the device to electromagnetic interference (EMI). If conducted EMI enters the op amp, the dc offset observed at the amplifier output may shift from its nominal value while EMI is present. This shift is a result of signal rectification associated with the internal semiconductor junctions. While all op amp pin functions can be affected by EMI, the signal input pins are likely to be the most susceptible. The OPA313 operational amplifier family incorporate an internal input low-pass filter that reduces the amplifiers response to EMI. Both common-mode and differential mode filtering are provided by this filter. The filter is designed for a cutoff frequency of approximately 35 MHz (–3 dB), with a roll-off of 20 dB per decade. Texas Instruments has developed the ability to accurately measure and quantify the immunity of an operational amplifier over a broad frequency spectrum extending from 10 MHz to 6 GHz. The EMI rejection ratio (EMIRR) metric allows op amps to be directly compared by the EMI immunity. Figure 33 illustrates the results of this testing on the OPA313 family. Detailed information can also be found in the application report, EMI Rejection Ratio of Operational Amplifiers (SBOA128), available for download from www.ti.com. RAIL-TO-RAIL OUTPUT Designed as a micro-power, low-noise operational amplifier, the OPA313 delivers a robust output drive capability. A class AB output stage with common-source transistors is used to achieve full rail-to-rail output swing capability. For resistive loads up to 10 kΩ, the output swings typically to within 5 mV of either supply rail regardless of the power-supply voltage applied. Different load conditions change the ability of the amplifier to swing close to the rails; refer to the typical characteristic graph, Output Voltage Swing vs Output Current. Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 Submit Documentation Feedback 17 OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com CAPACITIVE LOAD AND STABILITY The OPA313 is designed to be used in applications where driving a capacitive load is required. As with all op amps, there may be specific instances where the OPA313 can become unstable. The particular op amp circuit configuration, layout, gain, and output loading are some of the factors to consider when establishing whether or not an amplifier is stable in operation. An op amp in the unity-gain (+1-V/V) buffer configuration that drives a capacitive load exhibits a greater tendency to be unstable than an amplifier operated at a higher noise gain. The capacitive load, in conjunction with the op amp output resistance, creates a pole within the feedback loop that degrades the phase margin. The degradation of the phase margin increases as the capacitive loading increases. When operating in the unity-gain configuration, the OPA313 remains stable with a pure capacitive load up to approximately 1 nF. The equivalent series resistance (ESR) of some very large capacitors (CL greater than 1 μF) is sufficient to alter the phase characteristics in the feedback loop such that the amplifier remains stable. Increasing the amplifier closed-loop gain allows the amplifier to drive increasingly larger capacitance. This increased capability is evident when observing the overshoot response of the amplifier at higher voltage gains. See the typical characteristic graph, Small-Signal Overshoot vs. Capacitive Load. One technique for increasing the capacitive load drive capability of the amplifier operating in a unity-gain configuration is to insert a small resistor, typically 10 Ω to 20 Ω, in series with the output, as shown in Figure 36. This resistor significantly reduces the overshoot and ringing associated with large capacitive loads. One possible problem with this technique, however, is that a voltage divider is created with the added series resistor and any resistor connected in parallel with the capacitive load. The voltage divider introduces a gain error at the output that reduces the output swing. V+ RS VOUT Device VIN 10 W to 20 W RL CL Figure 36. Improving Capacitive Load Drive DFN PACKAGE The OPA2313 (dual version) uses the DFN style package (also known as SON); this package is a QFN with contacts on only two sides of the package bottom. This leadless package maximizes printed circuit board (PCB) space and offers enhanced thermal and electrical characteristics through an exposed pad. One of the primary advantages of the DFN package is its low, 0.9-mm height. DFN packages are physically small, have a smaller routing area, improved thermal performance, reduced electrical parasitics, and use a pinout scheme that is consistent with other commonly-used packages, such as SO and MSOP. Additionally, the absence of external leads eliminates bent-lead issues. The DFN package can easily be mounted using standard PCB assembly techniques. See Application Note, QFN/SON PCB Attachment (SLUA271) and Application Report, Quad Flatpack No-Lead Logic Packages (SCBA017), both available for download from www.ti.com. NOTE The exposed leadframe die pad on the bottom of the DFN package should be connected to the most negative potential (V–). 18 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 OPA313 OPA2313 OPA4313 www.ti.com SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 APPLICATION EXAMPLES GENERAL CONFIGURATIONS When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. The simplest way to establish this limited bandwidth is to place an RC filter at the noninverting terminal of the amplifier, as Figure 37 shows. RG RF R1 VOUT VIN C1 f-3 dB = ( RF VOUT = 1+ RG VIN (( 1 1 + sR1C1 1 2pR1C1 ( Figure 37. Single-Pole Low-Pass Filter If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this task, as Figure 38 shows. For best results, the amplifier should have a bandwidth that is eight to 10 times the filter frequency bandwidth. Failure to follow this guideline can result in phase shift of the amplifier. C1 R1 R1 = R2 = R C1 = C2 = C Q = Peaking factor (Butterworth Q = 0.707) R2 VIN VOUT C2 1 2pRC f-3 dB = RF RF RG = RG ( 2- 1 Q ( Figure 38. Two-Pole Low-Pass Sallen-Key Filter Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 Submit Documentation Feedback 19 OPA313 OPA2313 OPA4313 SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (December 2012) to Revision C Page • Changed first Open-Loop Gain, AOL typical specification in Electrical Characteristics: +5.5 V table ................................... 3 • Updated Figure 10 .............................................................................................................................................................. 11 • Updated Figure 19 through Figure 22 ................................................................................................................................ 12 Changes from Revision A (Sepetmber 2012) to Revision B Page • Changed title of document .................................................................................................................................................... 1 • Changed third paragraph of Description section .................................................................................................................. 1 • Changed title of Electrical Characteristics: +5.5 V table ....................................................................................................... 3 • Deleted middle two rows from Input Voltage Range, CMRR parameter in Electrical Characteristics: +5.5 V table ............ 3 • Changed test conditions of Input Voltage Range, CMRR parameter in Electrical Characteristics: +5.5 V table ................. 3 • Added footnote to Input Bias Current, IB and IOS parameters in Electrical Characteristics: +5.5 V table ............................. 3 • Changed Open-Loop Gain, AOL parameter in Electrical Characteristics: +5.5 V table ......................................................... 3 • Deleted first row from Frequency Response, GBW parameter in Electrical Characteristics: +5.5 V table .......................... 4 • Deleted first row from Frequency Response, SR parameter in Electrical Characteristics: +5.5 V table .............................. 4 • Changed Output, VO parameter in Electrical Characteristics: +5.5 V table .......................................................................... 4 • Changed Output, ISC parameter in Electrical Characteristics: +5.5 V table .......................................................................... 4 • Changed test conditions for the first row in the Power Supply, IQ parameter in Electrical Characteristics: +5.5 V table ..... 4 • Changed Electrical Characteristics: +1.8 V table ................................................................................................................. 5 • Changed conditions of Electrical Characteristics: +1.8 V table ............................................................................................ 5 • Changed last row of Input Voltage Range, CMRR parameter in Electrical Characteristics: +1.8 V table ........................... 5 • Changed footnote to Input Bias Current, IB and IOS parameters in Electrical Characteristics: +1.8 V table ......................... 5 • Changed Open-Loop Gain, AOL parameter in Electrical Characteristics: +1.8 V table ......................................................... 5 • Changed Frequency Response, GBW parameter test conditions in Electrical Characteristics: +1.8 V table ...................... 6 • Changed Frequency Response, SR parameter test conditions in Electrical Characteristics: +1.8 V table ......................... 6 • Changed Output, VO parameter test conditions in Electrical Characteristics: +1.8 V table .................................................. 6 • Changed Output, ISC parameter in Electrical Characteristics: +1.8 V table .......................................................................... 6 • Deleted last row from Power Supply, IQ parameter in Electrical Characteristics: +1.8 V table ............................................ 6 • Updated Figure 2 ................................................................................................................................................................ 10 Changes from Original (September 2012) to Revision A • 20 Page Changed from product preview to production data ............................................................................................................... 1 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: OPA313 OPA2313 OPA4313 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) OPA2313ID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 OP2313 OPA2313IDGK ACTIVE VSSOP DGK 8 80 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 OUSS OPA2313IDGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 OUSS OPA2313IDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 OP2313 OPA2313IDRGR ACTIVE SON DRG 8 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SDY OPA2313IDRGT ACTIVE SON DRG 8 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SDY OPA313IDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SIE OPA313IDBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SIE OPA313IDCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SIF OPA313IDCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SIF OPA4313IPW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4313 OPA4313IPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4313 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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