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OPA376AIDCKR

OPA376AIDCKR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SC70-5

  • 描述:

    精密 (0.025mV)、低噪声 (7.5nV/rtHz)、低静态电流 (760uA) 运算放大器

  • 数据手册
  • 价格&库存
OPA376AIDCKR 数据手册
Burr Brown Products from Texas Instruments OP A3 76 OPA 2376 OPA 4376 OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 Precision, Low Noise, Low Quiescent Current, Operational Amplifier 1 FEATURES LOW NOISE: 7.5nV/√Hz at 1kHz 0.1Hz to 10Hz NOISE: 0.8μVPP QUIESCENT CURRENT: 950μA (max) LOW OFFSET VOLTAGE: 25μV (max) SINGLE-SUPPLY OPERATION SUPPLY VOLTAGE: 2.2V to 5.5V SPACE-SAVING PACKAGES: – SC-70, SOT23, MSOP, TSSOP DESCRIPTION The OPA376 family represent a new generation of low-noise operational amplifiers. Rail-to-rail input, low offset (5μV typ), low noise (7.5nV/√Hz), quiescent current less than 1mA max, and a 5.5MHz bandwidth make this part very attractive for a variety of precision and portable applications. In addition, this device has a reasonably wide supply range with excellent PSRR, making it attractive for applications that run directly from batteries without regulation. The OPA376 (single version) is available in MicroSIZE SC70-5, SOT23-5, and SO-8 packages. The OPA2376 (dual) is offered in the MSOP-8 and SO-8 packages. The OPA4376 (quad) is offered in a TSSOP-14 package. All versions are specified for operation from –40°C to +125°C. OFFSET VOLTAGE PRODUCTION DISTRIBUTION • • • • • • • 2 APPLICATIONS • • • • ADC BUFFER AUDIO EQUIPMENT MEDICAL INSTRUMENTATION HANDHELD TEST EQUIPMENT Population -25.0 -22.5 -20.0 -17.5 -15.0 -12.5 -10.0 -7.5 -5.0 -2.5 0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 Offset Voltage (mV) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 2007, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) OPA376, OPA2376, OPA4376 Supply Voltage Signal Input Terminals Output Short-Circuit (3) Operating Temperature Storage Temperature Junction Temperature Human Body Model ESD Rating Charged Device Model Machine Model (1) (2) (3) Voltage (2) UNIT V V mA °C °C °C V V V +7 –0.5 to (V+) + 0.5 ±10 Continuous –40 to +150 –65 to +150 +150 4000 1000 200 Current (2) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. Short-circuit to ground one amplifier per package. PACKAGE INFORMATION (1) PRODUCT OPA376 OPA2376 OPA2376 OPA4376 (1) PACKAGE-LEAD SC70-5 SOT23-5 SO-8 SO-8 MSOP-8 TSSOP-14 PACKAGE DESIGNATOR DCK DBV D D DGK PW PACKAGE MARKING BUR BUQ OPA376 OPA2376 OBBI OPA4376 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. 2 Submit Documentation Feedback Product Folder Link(s): OPA376 OPA2376 OPA4376 Copyright © 2007, Texas Instruments Incorporated www.ti.com OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 ELECTRICAL CHARACTERISTICS: VS = +2.2V to +5.5V Boldface limits apply over the specified temperature range: TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted. OPA376, OPA2376, OPA4376 PARAMETERS OFFSET VOLTAGE Input Offset Voltage vs Temperature VOS dVOS/dT PSRR –40°C to +85°C –40°C to +125°C vs Power Supply Over Temperature Channel Separation, dc (dual, quad) INPUT BIAS CURRENT Input Bias Current Over Temperature Input Offset Current NOISE Input Voltage Noise, f = 0.1Hz to 10Hz Input Voltage Noise Density, f = 1kHz Input Current Noise, f = 1kHz INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio INPUT CAPACITANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain AOL 50mV < VO < (V+) – 50mV, RL = 10kΩ 100mV < VO < (V+) – 100mV, RL = 2kΩ FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Settling Time 0.1% Settling Time 0.01% Overload Recovery Time THD + Noise THD+N GBW SR tS tS G = +1 2V Step , G = +1 2V Step , G = +1 VIN × Gain > VS VO = 1VRMS, G = +1, f = 1kHz, RL = 10kΩ CL = 100pF, VS = 5.5V 5.5 2 1.6 2 0.33 0.00027 MHz V/μs μs μs μs % 120 120 134 126 dB dB 6.5 13 pF pF VCM CMRR (V–) < VCM < (V+) – 1.3 V (V–) – 0.1 76 90 (V+) + 0.1 V dB en in 0.8 7.5 2 μVPP nV/√Hz fA/√Hz IOS IB 0.2 10 pA pA pA VS = +2.2V to +5.5V, VCM < (V+) – 1.3V VS = +2.2V to +5.5V, VCM < (V+) – 1.3V 5 0.26 0.32 5 5 0.5 25 1 2 20 μV μV/°C μV/°C μV/V μV/V mV/V CONDITIONS MIN TYP MAX UNIT See Typical Characteristics 0.2 10 Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 www.ti.com ELECTRICAL CHARACTERISTICS: VS = +2.2V to +5.5V (continued) Boldface limits apply over the specified temperature range: TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted. OPA376, OPA2376, OPA4376 PARAMETERS OUTPUT Voltage Output Swing from Rail Over Temperature Voltage Output Swing from Rail Over Temperature Short-Circuit Current Capacitive Load Drive Open-Loop Output Impedance POWER SUPPLY Specified Voltage Range Operating Voltage Range Quiescent Current per amplifier Over Temperature TEMPERATURE RANGE Specified Range Operating Range Thermal Resistance SC70 SOT23 SO-8, TSSOP-14, MSOP-8 θJA 250 200 150 –40 –40 +125 +150 °C °C °C/W °C/W °C/W °C/W IQ IO = 0, VS = +5.5V, VCM < (V+) – 1.3V VS 2.2 2 to 5.5 760 950 1 5.5 V V μA mA ISC CLOAD RO RL = 10kΩ RL = 10kΩ RL = 2kΩ RL = 2kΩ ±40 See Typical Characteristics 150 Ω 40 10 20 40 50 80 mV mV mV mV mA CONDITIONS MIN TYP MAX UNIT 4 Submit Documentation Feedback Product Folder Link(s): OPA376 OPA2376 OPA4376 Copyright © 2007, Texas Instruments Incorporated www.ti.com OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 PIN CONFIGURATIONS OPA376 SOT23-5 Top View OUT V+IN 1 2 3 4 -IN 5 V+ OPA376 SO-8 Top View NC -IN +IN V1 2 3 4 8 7 6 5 NC V+ OUT NC OPA376 SC70-5 Top View +IN V-IN 1 2 3 4 OUT 5 V+ OPA2376 SO-8, MSOP-8 Top View OUT A -IN A +IN A V1 2 3 4 8 7 6 5 V+ OUT B -IN B +IN B OPA4376 TSSOP-14 Top View Out A -IN A +IN A V+ +IN B -IN B OUT B 1 2 3 4 5 6 7 14 13 12 11 10 9 8 OUT D -IN D +IN D V+IN C -IN C OUT C NOTE: NC denotes no internal connection. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted. POWER-SUPPLY AND COMMON-MODE REJECTION RATIO vs FREQUENCY 0 -20 Gain Phase -40 120 OPEN-LOOP GAIN/PHASE vs FREQUENCY 160 140 Power-Supply Rejection Ratio (dB) V(+) Power-Supply Rejection Ratio 100 80 60 40 V(-) Power-Supply Rejection Ratio 20 0 10 100 1k 10k 100k 1M 10M Frequency (Hz) Open-Loop Gain (dB) 120 100 80 60 40 20 0 -20 0.1 1 10 -60 -80 -100 -120 -140 -160 Phase Margin (°) Common-Mode Rejection Ratio 100 1k 10k 100k 1M -180 10M Frequency (Hz) Figure 1. OPEN-LOOP GAIN AND POWER-SUPPLY REJECTION RATIO vs TEMPERATURE 160 Figure 2. 0.1Hz to 10Hz INPUT VOLTAGE NOISE Open-Loop Gain and PSRR (dB) Open-Loop Gain (RL = 2kW) 140 120 Power-Supply Rejection Ratio (VS = 2.1V to 5.5V) 100 80 -50 -25 0 25 50 75 100 125 150 Temperature (°C) 500nV/div 1s/div Figure 3. INPUT VOLTAGE NOISE SPECTRAL DENSITY 100 1 Figure 4. TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY Total Harmonic Distortion + Noise (%) VS = 5V, VCM = 2V, VOUT = 1VRMS 0.1 Voltage Noise (nV/ÖHz) 10 0.01 Gain = 10V/V 0.001 Gain = 1V/V 0.0001 1 1 10 100 1k 10k 100k Frequency (Hz) 10 100 1k Frequency (Hz) 10k 100k Figure 5. Figure 6. 6 Submit Documentation Feedback Product Folder Link(s): OPA376 OPA2376 OPA4376 Copyright © 2007, Texas Instruments Incorporated www.ti.com OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted. COMMON-MODE REJECTION RATIO vs TEMPERATURE 110 1000 QUIESCENT CURRENT vs TEMPERATURE Common-Mode Rejection Ratio (dB) 100 90 80 70 60 50 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Quiescent Current (mA) 900 800 700 600 500 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Figure 7. QUIESCENT AND SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE 1000 50 75 VS = ±2.75V 50 Short-Circuit Current (mA) Figure 8. SHORT-CIRCUIT CURRENT vs TEMPERATURE 900 Quiescent Current (mA) 40 ISC Short-Circuit Current (mA) 25 0 -25 -50 -75 ISC+ 800 30 700 IQ 600 20 ISC- 10 500 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Supply Voltage (V) 0 -100 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Figure 9. INPUT BIAS CURRENT vs TEMPERATURE 150 125 3 2 Figure 10. OUTPUT VOLTAGE vs OUTPUT CURRENT Input Bias Current (pA) 100 75 50 25 0 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Output Voltage (V) 1 +150°C 0 -1 -2 -3 0 10 20 30 40 50 60 70 80 Output Current (mA) +125°C +25°C -40°C Figure 11. Figure 12. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted. OFFSET VOLTAGE PRODUCTION DISTRIBUTION OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION (–40°C to +125°C) Population Population -25.0 -22.5 -20.0 -17.5 -15.0 -12.5 -10.0 -7.5 -5.0 -2.5 0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 Offset Voltage (mV) Figure 13. MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 6 5 VS = 5.5V VS = 5V SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE 50 G = +1V/V Small-Signal Overshoot (%) 40 Output Voltage (VPP) 4 3 2 1 0 1k 10k 100k Frequency (Hz) 1M 10M 30 VS = 2.5V 20 10 0 10 100 Load Capacitance (pF) 1k Figure 15. SMALL-SIGNAL PULSE RESPONSE G = +1 RL = 10kW CL = 50pF 50mV/div 1V/div Time (400ns/div) Figure 17. 8 Submit Documentation Feedback Product Folder Link(s): OPA376 OPA2376 OPA4376 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 ½Offset Voltage Drift½ (mV/°C) Figure 14. Figure 16. LARGE-SIGNAL PULSE RESPONSE G = +1 RL = 2kW CL = 50pF Time (2ms/div) Figure 18. Copyright © 2007, Texas Instruments Incorporated www.ti.com OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted. SETTLING TIME vs CLOSED-LOOP GAIN 100 140 120 CHANNEL SEPARATION vs FREQUENCY Channel Separation (dB) Settling Time (ms) 100 80 60 40 20 10 0.01% 1 0.1% 0.1 1 10 Closed-Loop Gain (V/V) 100 0 10 100 1k 10k 100k 1M 10M 100M Frequency (Hz) Figure 19. OPEN-LOOP OUTPUT RESISTANCE vs FREQUENCY 1k Figure 20. Open-Loop Output Resistance (W) 100 10 400mA Load 1 2mA Load 0.1 10 100 1k 10k 100k 1M 10M Frequency (Hz) Figure 21. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Link(s): OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 www.ti.com APPLICATION INFORMATION OPERATING CHARACTERISTICS The OPA376 family of amplifiers has parameters that are fully specified from +2.2V to +5.5V. Many of the specifications apply from –40°C to +125°C. Parameters that can exhibit significant variance with regard to operating voltage or temperature are presented in the Typical Characteristics. COMMON-MODE VOLTAGE RANGE The input common-mode voltage range of the OPA376 series extends 100mV beyond the supply rails. The offset voltage of the amplifier is very low, from approximately (V–) to (V+) – 1V, as shown in Figure 23. The offset voltage increases as common-mode voltage exceeds (V+) –1V. Common-mode rejection is specified from (V–) to (V+) – 1.3V. 3 2 GENERAL LAYOUT GUIDELINES For best operational performance of the device, good printed circuit board (PCB) layout practices are required. Low-loss, 0.1μF bypass capacitors must be connected between each supply pin and ground as close to the device as possible. A single bypass capacitor from V+ to ground is applicable to single-supply applications. Output Voltage (mV) 1 0 -1 -2 BASIC AMPLIFIER CONFIGURATIONS The OPA376 family is unity-gain stable. It does not exhibit output phase inversion when the input is overdriven. A typical single-supply connection is shown in Figure 22. The OPA376 is configured as a basic inverting amplifier with a gain of –10V/V. This single-supply connection has an output centered on the common-mode voltage, VCM. For the circuit shown, this voltage is 2.5V, but may be any value within the common-mode input voltage range. R2 10kW -V +V 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Common-Mode (V) -3 -0.5 0 Figure 23. Offset and Common-Mode Voltage INPUT AND ESD PROTECTION The OPA376 family incorporate internal electrostatic discharge (ESD) protection circuits on all pins. In the case of input and output pins, this protection primarily consists of current steering diodes connected between the input and power-supply pins. These ESD protection diodes also provide in-circuit, input overdrive protection, provided that the current is limited to 10mA as stated in the Absolute Maximum Ratings. Figure 24 shows how a series input resistor may be added to the driven input to limit the input current. The added resistor contributes thermal noise at the amplifier input and its value should be kept to a minimum in noise-sensitive applications. +5V R1 1kW OPA376 VIN C1 100nF VOUT VCM = 2.5V IOVERLOAD 10mA max V+ OPA376 VOUT Figure 22. Basic Single-Supply Connection VIN 5kW Figure 24. Input Current Protection 10 Submit Documentation Feedback Product Folder Link(s): OPA376 OPA2376 OPA4376 Copyright © 2007, Texas Instruments Incorporated www.ti.com OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 CAPACITIVE LOAD AND STABILITY The OPA376 series of amplifiers may be used in applications where driving a capacitive load is required. As with all op amps, there may be specific instances where the OPAx376 can become unstable, leading to oscillation. The particular op amp circuit configuration, layout, gain and output loading are some of the factors to consider when establishing whether an amplifier will be stable in operation. An op amp in the unity-gain (+1V/V) buffer configuration and driving a capacitive load exhibits a greater tendency to be unstable than an amplifier operated at a higher noise gain. The capacitive load, in conjunction with the op amp output resistance, creates a pole within the feedback loop that degrades the phase margin. The degradation of the phase margin increases as the capacitive loading increases. The OPAx376 in a unity-gain configuration can directly drive up to 250pF pure capacitive load. Increasing the gain enhances the ability of the amplifier to drive greater capacitive loads (see the typical characteristic plot, Small-Signal Overshoot vs Capacitive Load. In unity-gain configurations, capacitive load drive can be improved by inserting a small (10Ω to 20Ω) resistor, RS, in series with the output, as shown in Figure 25. This resistor significantly reduces ringing while maintaining dc performance for purely capacitive loads. However, if there is a resistive load in parallel with the capacitive load, a voltage divider is created, introducing a gain error at the output and slightly reducing the output swing. The error introduced is proportional to the ratio RS/RL, and is generally negligible at low output current levels. V+ RS OPA376 VIN 10W to 20W RL CL VOUT ACTIVE FILTERING The OPA376 series is well-suited for filter applications requiring a wide bandwidth, fast slew rate, low-noise, single-supply operational amplifier. Figure 26 shows a 50kHz, 2nd-order, low-pass filter. The components have been selected to provide a maximally-flat Butterworth response. Beyond the cutoff frequency, roll-off is –40dB/dec. The Butterworth response is ideal for applications requiring predictable gain characteristics such as the anti-aliasing filter used ahead of an analog-to-digital converter (ADC). R3 5.49kW C2 150pF V+ R1 5.49kW R2 12.4kW OPA376 VIN C1 1nF VOUT (V+)/2 Figure 26. Second-Order Butterworth 50kHz Low-Pass Filter DRIVING AN ANALOG-TO-DIGITAL CONVERTER The low noise and wide gain bandwidth of the OPA376 family make it an ideal driver for ADCs. Figure 27 illustrates the OPA376 driving an ADS8327, 16-bit, 250kSPS converter. The amplifier is connected as a unity-gain, noninverting buffer. Figure 25. Improving Capacitive Load Drive Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 +5V C1 0.1mF R1 100W OPA376 C3 1.2nF (1) (1) www.ti.com +5V +IN -IN VIN ADS8327 Low Power 16-Bit 500kSPS REF IN +5V REF5040 4.096V C4 100nF NOTE: (1) Suggested value; may require adjustment based on specific application. Figure 27. Driving an ADS8327 PHANTOM-POWERED MICROPHONE The circuit provided in Figure 28 depicts how a remote microphone amplifier can be powered by a phantom source on the output side of the signal cable. The cable serves double duty, carrying both the differential output signal from, and dc power to the microphone amplifier stage. An OPA2376 serves as a single-ended input, to differential output amplifier with a 6dB gain. Common-mode bias for the two op amps is provided by the dc voltage developed across the electret microphone element. A 48V phantom supply is Microphone 100W + R1 2.7kW C2 33mF R6 100W R8 4.7kW R9 4.7kW R10 6.8kW R11 6.8kW 10mF +15V D1 5.1V reduced to 5.1V by the series 6.8kΩ resistors on the output side of the cable, and the 4.7kΩ and zener diode on the input side of the cable. AC coupling is used to block the different dc voltage levels from each other on each end of the cable. An INA163 instrumentation amplifier provides differential inputs and receives the balanced audio signals from the cable. The INA163 gain may be set from 0dB to 80dB by selecting the RG value. The INA163 circuit is typical of the input circuitry used in mixing consoles. Phantom Power (Provides power source for microphone) 48V 1mF 33mF + 1/2 OPA2376 + 2 2 + 1kW 3 Panasonic WM-034CY 10kW 1/2 OPA2376 RG 3 1 C3 33mF R7 100W Low-level differential audio signal is transmitted differentially on the same cable as power to the microphone. 1 3.3kW 10mF INA163 + 1kW 3.3kW -15V + + 10mF Typical microphone input circuit used in mixing consoles. Figure 28. Phantom-Powered Electret Microphone 12 Submit Documentation Feedback Product Folder Link(s): OPA376 OPA2376 OPA4376 Copyright © 2007, Texas Instruments Incorporated www.ti.com OPA376 OPA2376 OPA4376 SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007 V+ = +2.7V to 5V Passband 300Hz to 3kHz R9 510kW R1 1.5kW C1 1000pF R2 1MW R4 20kW C3 33pF R7 51kW R8 150kW 1/2 OPA2376 C2 1000pF +IN 2 -IN 3 4 VREF 1 8 V+ 7 ADS7822 6 12-Bit A/D 5 DCLOCK DOUT CS/SHDN Serial Interface 1/2 OPA2376 Electret (1) Microphone R3 1MW R6 100kW R5 20kW G = 100 GND NOTE: (1) Electret microphone powered by R1. Figure 29. OPA2376 as a Speech Bandpass Filtered Data Acquisition System Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Link(s): OPA376 OPA2376 OPA4376 PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2007 PACKAGING INFORMATION Orderable Device OPA2376AID OPA2376AIDG4 OPA2376AIDGKR OPA2376AIDGKRG4 OPA2376AIDGKT OPA2376AIDGKTG4 OPA2376AIDR OPA2376AIDRG4 OPA376AID OPA376AIDBVR OPA376AIDBVRG4 OPA376AIDBVT OPA376AIDBVTG4 OPA376AIDCKR OPA376AIDCKRG4 OPA376AIDCKT OPA376AIDCKTG4 OPA376AIDG4 OPA376AIDR OPA376AIDRG4 OPA4376AIPW OPA4376AIPWG4 OPA4376AIPWR OPA4376AIPWRG4 (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOIC SOIC MSOP MSOP MSOP MSOP SOIC SOIC SOIC SOT-23 SOT-23 SOT-23 SOT-23 SC70 SC70 SC70 SC70 SOIC SOIC SOIC TSSOP TSSOP TSSOP TSSOP Package Drawing D D DGK DGK DGK DGK D D D DBV DBV DBV DBV DCK DCK DCK DCK D D D PW PW PW PW Pins Package Eco Plan (2) Qty 8 8 8 8 8 8 8 8 8 5 5 5 5 5 5 5 5 8 8 8 14 14 14 14 75 75 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 75 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 75 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 90 90 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) The marketing status values are defined as follows: Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2007 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) 330 180 330 179 179 179 179 330 330 Reel Width (mm) 12 12 12 8 8 8 8 12 12 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 8 8 8 4 4 4 4 8 8 W Pin1 (mm) Quadrant 12 12 12 8 8 8 8 12 12 Q1 Q1 Q1 Q3 Q3 Q3 Q3 Q1 Q1 OPA2376AIDGKR OPA2376AIDGKT OPA2376AIDR OPA376AIDBVR OPA376AIDBVT OPA376AIDCKR OPA376AIDCKT OPA376AIDR OPA4376AIPWR DGK DGK D DBV DBV DCK DCK D PW 8 8 8 5 5 5 5 8 14 SITE 41 SITE 41 SITE 41 SITE 48 SITE 48 SITE 48 SITE 48 SITE 41 SITE 41 5.3 5.3 6.4 3.2 3.2 2.25 2.25 6.4 7.0 3.4 3.4 5.2 3.2 3.2 2.4 2.4 5.2 5.6 1.4 1.4 2.1 1.4 1.4 1.22 1.22 2.1 1.6 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device OPA2376AIDGKR OPA2376AIDGKT OPA2376AIDR OPA376AIDBVR OPA376AIDBVT OPA376AIDCKR OPA376AIDCKT OPA376AIDR OPA4376AIPWR Package DGK DGK D DBV DBV DCK DCK D PW Pins 8 8 8 5 5 5 5 8 14 Site SITE 41 SITE 41 SITE 41 SITE 48 SITE 48 SITE 48 SITE 48 SITE 41 SITE 41 Length (mm) 346.0 190.0 346.0 195.0 195.0 195.0 195.0 346.0 346.0 Width (mm) 346.0 212.7 346.0 200.0 200.0 200.0 200.0 346.0 346.0 Height (mm) 29.0 31.75 29.0 45.0 45.0 45.0 45.0 29.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) 14 PINS SHOWN PLASTIC SMALL-OUTLINE PACKAGE 0,65 14 8 0,30 0,19 0,10 M 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 7 0°– 8° 0,75 0,50 Seating Plane 1,20 MAX 0,15 0,05 0,10 PINS ** DIM A MAX 8 14 16 20 24 28 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers RFID Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated
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OPA376AIDCKR
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  • 1+18.28500
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