OPA4350TDC2

OPA4350-DIE www.ti.com SBOS603 – AUGUST 2012 HIGH-SPEED, SINGLE-SUPPLY, RAIL-TO-RAIL OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES Check for Samples: OPA4350-DIE FEATURES 1 • • • • • • • 2 APPLICATIONS Rail-to-Rail Input Rail-to-Rail Output Wide Bandwidth High Slew Rate Low Noise Low THD+Noise Unity-Gain Stable • • • • • • • • • Cell Phone PA Control Loops Driving A/D Converters Video Processing Data Acquisition Process Control Audio Processing Communications Active Filters Test Equipment DESCRIPTION The OPA4350 rail-to-rail CMOS operational amplifier is optimized for low voltage, single-supply operation. Railto-rail input/output, low noise, and high speed operation makes it ideal for driving sampling analog-to-digital (A/D) converters. It is also well suited for cell phone PA control loops and video processing (75-Ω drive capability) as well as audio and general purpose applications. The OPA4350 operates on a single supply as low as 2.5 V with an input common-mode voltage range that extends 300 mV below ground and 300 mV above the positive supply. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE OPA4350 TD Bare Die In Waffle Pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY OPA4350TDC1 130 OPA4350TDC2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MicroAmplifier is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated OPA4350-DIE SBOS603 – AUGUST 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating Ti/AlSiCu/TiN 800 nm Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: OPA4350-DIE OPA4350-DIE www.ti.com SBOS603 – AUGUST 2012 Table 1. Bond Pad Coordinates in Microns (1) (1) DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX Out A 1 5 2550.35 107 2652.35 N/C 2 5 2352.5 107 2454.5 -In A 3 7.65 2168.95 105.65 2266.95 +In A 4 7.65 1746.1 105.65 1844.1 V+ 5 38.9 1420.7 136.9 1518.7 +In B 6 7.65 1095.3 105.65 1193.3 -In B 7 7.65 672.45 105.65 770.45 N/C 8 5 484.9 107 586.9 Out B 9 15.85 289.45 113.85 387.45 Out C 10 1218.35 289.45 1316.35 387.45 N/C 11 1217 484.9 1319 586.9 -In C 12 1218.35 672.45 1316.35 770.45 +In C 13 1218.35 1095.3 1316.35 1193.3 V- 14 1217 1418.7 1319 1520.7 +In D 15 1218.35 1746.1 1316.35 1844.1 -In D 16 1218.35 2168.95 1316.35 2266.95 N/C 17 1217 2352.5 1319 2454.5 Out D 18 1218.35 2551.95 1316.35 2649.95 Substrate floating Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: OPA4350-DIE 3 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) OPA4350TDC1 ACTIVE 0 130 RoHS & Green Call TI N / A for Pkg Type OPA4350TDC2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of