OPA501
SBOS136A – JANUARY 1983 – REVISED DECEMBER 2003
High Current, High Power
OPERATIONAL AMPLIFIER
FEATURES
●
●
●
●
APPLICATIONS
HIGH OUTPUT CURRENT: ±10A Peak
WIDE POWER SUPPLY RANGE: ±10V to ±40V
LOW QUIESCENT CURRENT: 2.6mA
ISOLATED CASE TO-3 PACKAGE
●
●
●
●
●
MOTOR DRIVER
SERVO AMPLIFIER
VALVE ACTUATOR
SYNCRO DRIVER
PROGRAMMABLE POWER SUPPLY
DESCRIPTION
The OPA501 is a high output current operational amplifier. It
can be used in virtually all common op amp circuits, yet is
capable of output currents up to ±10A. Power-supply voltages
up to ±40V allow very high output power for driving motors or
other electromechanical loads.
V+
3
Safe operating area is fully specified, and user-set current
limits provide protection for both the amplifier and load. The
class-B (zero output stage bias) provides low quiescent
current during small-signal conditions.
This rugged hybrid integrated circuit is packaged in a metal
8-pin TO-3 package and is specified over the industrial
temperature range of –40°C to +85°C .
2
+Output
Drive
+
RCL
5
1
Current
Sense
4
Output
–
RCL
8
–Output
Drive
6
V–
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 1983-2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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ABSOLUTE MAXIMUM RATINGS
CONNECTION DIAGRAM
Power Supply Voltage (VS) ................................................................ ±40V
Top View
Power Dissipation at +25°C(1, 2) .......................................................... 79W
Differential Input Voltage .............................................................. ±VS –3V
+
RSC
Common-Mode Input Voltage .............................................................. ±VS
Operating Temperature Range ....................................... –55°C to +125°C
+Output
Drive
Storage Temperature Range .......................................... –65°C to +150°C
V+
Lead Temperature (soldering, 10s) ............................................... +300°C
3
Junction Temperature .................................................................... +200°C
Output Short-Circuit Duration(3) ............................................... Continuous
NOTES: (1) At case temperature of +25°C. Derate at 2.2°C/W above case
temperature of +25°C. (2) Average dissipation. (3) Within safe operating area
and with appropriate derating.
+In
–In
Current
Sense
2
VO
1
4
–
RSC
5
8
6
PACKAGE/ORDERING INFORMATION
V–
7
NC
–Output
Drive
For the most current package and ordering information, see
the Package Option Addendum located at the end of this
data sheet.
2
OPA501
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SBOS136A
ELECTRICAL CHARACTERISTICS
At TC = +25°C, and VS = ±28V, unless otherwise noted.
OPA501AM
PARAMETER
CONDITIONS
MIN
RATED OUTPUT(1, 2)
Output Current
Continuous(3)
Output Voltage(3)
RL = 2Ω
RL = 2.6Ω
IO = 10A peak
±10
±10
±20
Small Signal
VO = 40VPP, RL = 8Ω
RL = 5Ω
RL = 6.5Ω
10
1.35
1.35
DYNAMIC RESPONSE
Bandwidth, Unity Gain
Full Power Bandwidth
Slew Rate
INPUT OFFSET VOLTAGE
Initial Offset
vs Temperature
vs Supply Voltage
INPUT BIAS CURRENT
Initial
vs Temperature
vs Supply Voltage
INPUT DIFFERENCE CURRENT
Initial
vs Temperature
OPEN-LOOP GAIN, DC
INPUT VOLTAGE RANGE
Common-Mode Voltage(4)
Common-Mode Rejection
MAX
UNITS
A
A
V
±23
1
16
MHz
kHz
V/µs
v/µs
±5
±10
±35
±10
±65
mV
µV/°C
µV/V
TCASE = +25°C
15
±0.05
±0.02
40
nA
nA/°C
nA/V
TCASE = +25°C
–25°C < T < +85°C
±5
±0.01
±10
nA
nA/°C
–25°C < T < +85°C
RL = 5Ω
RL = 6.5Ω
94
98
INPUT IMPEDANCE
Differential
Common-mode
INPUT NOISE
Voltage Noise
fn = 10Hz to 10kHz
Current Noise
fn = 10Hz to 10kHz
TYP
fn = 0.3Hz to 10Hz
115
115
dB
dB
10
250
MΩ
MΩ
3
µVPP
µVrms
pAPP
pArms
5
fn = 0.3Hz to 10Hz
20
4.5
Linear Operation
f = DC, VCM = ±(|VS|–6)
POWER SUPPLY
Rated Voltage
Operating Voltage Range
Current, quiescent
±(|VS|–6)
70
case
THERMAL RESISTANCE
Steady State θJC
±28
V
dB
±36
±10
V
V
mA
–25
+85
°C
–55
–65
+125
+150
°C
°C
2.2
°C/W
±10
TEMPERATURE RANGE
Specification
Operating, derated
performance
Storage
±(|VS|–3)
110
±2.6
2.0
NOTES: (1) Package must be derated based on a junction-to-case thermal resistance of 2.2°C/W or a junction-to-ambient thermal resistance of 30°C/W.
(2) Safe Operating Area and Power Derating Curves must be observed. (3) With ±RSC = 0. Peak output current is typically greater than 10A if duty cycle and pulse width
limitations are observed. Output current greater than 10A is not guaranteed. (4) The absolute maximum voltage is 3V less than supply voltage.
OPA501
SBOS136A
www.ti.com
3
TYPICAL CHARACTERISTICS
Typical at +25°C case and ±VS = 28VDC, unless otherwise noted.
COMMON MODE REJECTION vs FREQUENCY
100
–30
80
–60
Phase
60
–90
40
–120
Amplitude
20
120
–150
–180
0
–20
1
10
100
1k
10k
100k
1M
Common-Mode Rejection (dB)
0
Phase (degree)
Amplitude (dB)
OPEN-LOOP FREQUENCY RESPONSE
120
100
80
60
40
20
0
–210
10M
1
10
100
Frequency (Hz)
2.8
100k
1M
±40
AV = 10
2.4
±35
Output Voltage (Vpk)
Input Bias Current (Normalized)
10k
OUTPUT VOLTAGE SWING
vs POWER SUPPLY VOLTAGE
INPUT BIAS CURRENT vs TEMPERATURE
2.0
1.6
1.2
0.8
IO = 1A
±30
±25
IO = 5A
±20
IO = 10A
±15
0.4
0
–50
±10
–25
100
0
25
50
75
100
125
±10
±35
±40
1.8
Total Harmonic Distortion (%)
Maximum
Output
Maximum “Undistorted”
Sine Wave Output
RL = 8 Ω
AV = +10
TC = +25°C
2
±30
HARMONIC DISTORTION vs FREQUENCY
20
6
4
±25
FULL POWER RESPONSE
+VS = ±28V
10
±20
Power Supply Voltage, VS (V)
+VS = ±34V
40
±15
Case Temperature (°C)
60
Output Voltage Swing (Vp-p)
1k
Frequency (Hz)
VO = 40Vp-p
AV = +10
VS = ±28V
1.6
1.4
1.2
1.0
RL = 4 Ω
0.8
RL = 8 Ω
0.6
RL = 16Ω
0.4
RL = 50Ω
0.2
0
1
2
4
6
10
20
40
60
100
Frequency (kHz)
4
10
102
103
104
Frequency (kHz)
OPA501
www.ti.com
SBOS136A
TYPICAL CHARACTERISTICS (Cont.)
Typical at +25°C case and ±VS = 28VDC, unless otherwise noted.
POWER DERATING CURVE
CURRENT LIMIT RESISTOR vs LIMIT CURRENT
0.28
Current Limit Resistor, RSC (Ω)
Internal Power Dissipation, PD (W)
120
100
80
θJC = 2.2°C/W
60
40
20
0
0.24
TC = +25°C
0.20
0.16
0.12
0.08
0.04
0
25
0
50
75
100
125
150
0
2
4
Case Temperature (°C)
1.2
±6
1.0
Normalized (θ JC)
Short Circuit Current (A)
±7
RSC = 0.12Ω
±4
±3
RSC = 0.28Ω
±2
10
12
14
0.8
0.6
0.4
0.2
±1
0
–50
0
–25
0
25
50
75
100
125
0.1
1
10
100
1k
10k
Frequency (Hz)
Case Temperature (°C)
PULSE RESPONSE, AV = +1
Input/Output Voltage (5V/div)
Input/Output Voltage (5V/div)
PULSE RESPONSE, AV = +1
Time (10µs/div)
Time (100µs/div)
OPA501
SBOS136A
8
NORMALIZED THERMAL RESISTANCE
vs FREQUENCY
CURRENT LIMIT vs TEMPERATURE
±5
6
Limit Current (A)
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5
APPLICATIONS INFORMATION
Grounding techniques can greatly affect the performance of
a power op amp. Figure 1 shows grounds connected so that
load current does not flow through signal ground connections. Power supply and load connections should be physically separated from the amplifier input and signal connections.
Power supply connections to the amplifier should be bypassed with 10µF tantalum capacitors connected close to the
device pins. The capacitors should be connected to load
ground as shown.
(1)
+
RSC
G=1+
R2
R1
OPA501
(1)
VIN
R1
–
RSC
+
Load
NOTE: (1) 10µF Tantalum.
V–
The safe output current decreases as VCE increases. Output
short-circuits are very demanding. A short-circuit to ground
forces the full power supply voltage (positive or negative
side) across the conducting transistor. With VS = ±30V, the
current limit must be set for 2A to be safe for short-circuit
to ground. For further information on SOA and evaluating
signal and load conditions, consult Applications Bulletin
AB-039.
HEAT SINKING
Most applications require a heat sink to assure that the
maximum junction temperature of 200°C is not exceeded.
The size of the heat sink required depends on the power
dissipated by the amplifier and ambient temperature conditions. Application Bulletin AB-039 explains how to find
maximum power dissipation for DC, AC, reactive loads, and
other conditions. Applications Bulletin AB-038 shows how
to determine heat sink requirements.
R2
+
Figure 2, shows the permissible range of voltage and current. SOA is reduced at high operating temperature—see
Figure 3.
V+
The case of the OPA501 is isolated from all circuitry and can
be fastened directly to a heat sink. This eliminates cumbersome insulating hardware that degrades thermal performance. See Applications Bulletin AB-037 for information
on mounting techniques and procedures.
10
8
6
4
FIGURE 1. Basic Circuit Connections.
R SC =
Output Current (A)
CURRENT LIMITS
The OPA501 has independent positive and negative current
limit circuits. Current limits are set by the value of R+SC and
R–SC. The approximate value of these resistors is:
0.65
− 0. 0437Ω
I LIMIT
1ms
0.5ms
Maximum
Specified
Current
2
1.0
0.8
0.6
Power
Dissipation
Limit
Second
Breakdown
Limit
TCASE = +25°C
TJUNCTION = +200°C
θJC = 2.2°C/W
0.4
Maximum RM, AM
Specified
Voltage
SM, BM
0.2
ILIMIT is the desired maximum current at room temperature in
Amperes and RSC is in ohms. The current limit value decreases with increasing temperature—see typical performance curves. The current limit resistors conduct the full
amplifier output current. Power dissipation of the current
limit resistors at maximum current is:
5ms
DC
0.1
1
2
4
6
8 10
20
40
60 80100
Voltage Across Output Transistor (V)
FIGURE 2. Transistor Safe Operating Area at +25°C Case
Temperature.
P MAX = (I LIMIT )2 R SC
10
8
6
4
Output Current (A)
The current limit resistors can be chosen from a variety of
types. Most wire-wound types are satisfactory, although
some physically large resistors may have excessive inductance which can cause instability.
SAFE OPERATING AREA
Stress on the output transistor is determined by the output
current and the voltage across the conducting output transistor. The power dissipated by the output transistor is equal to
the product of the output current and the voltage across the
conducting transistor, VCE. The Safe Operating Area (SOA),
2
0.5ms
5ms
Maximum
Specified
Current
1ms
DC
1.0
0.8
TCASE = +125°C
TJUNCTION = +200°C
0.6 θ = 2.2°C/W
JC
Maximum RM, AM
0.4
Specified
0.2
Voltage
SM, BM
0.1
1
2
4
6 8 10
20
40
60 80100
Voltage Across Output Transistor (V)
FIGURE 3. Transistor Safe Operating Area at +125°C Case
Temperature.
6
OPA501
www.ti.com
SBOS136A
PACKAGE OPTION ADDENDUM
www.ti.com
2-Feb-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
OPA501AM
NRND
TO-3
LMF
Pins Package Eco Plan (2)
Qty
8
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MMBC005 – APRIL 2001
LMF (O–MBCY–W8)
METAL CYLINDRICAL PACKAGE
1.550 (39,37)
1.510 (38,35)
0.770 (19,56)
ø
0.105 (2,67)
0.080 (2,03)
0.745 (18,92)
0.300 (7,62)
0.260 (6,60)
Seating Plane
0.500 (12,70)
0.400 (10,16)
ø
0.042 (1,07)
0.038 (0,97)
1.192 (30,28)
1.182 (30,02)
0.596 (15,14)
0.591 (15,01)
ø
0.161 (4,09)
0.151 (3,84)
40°
2
1
8
3
4
1.020 (25,91)
0.980 (24,89)
5
7
6
ø 0.500 (12,70)
4202491/A 03/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Leads in true position within 0.010 (0,25) R @ MMC at seating plane.
Pin numbers shown for reference only. Numbers may not be marked on package.
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