OPA656-DIE
www.ti.com
SBOS596 – MARCH 2012
WIDEBAND, UNITY-GAIN STABLE, FET-INPUT OPERATIONAL AMPLIFIER
Check for Samples: OPA656-DIE
FEATURES
1
•
•
•
•
•
•
APPLICATIONS
Unity-Gain Bandwidth
Low Input Bias Current
Low Offset and Drift
Low DL
High Output Current
Low Input Voltage Noise
•
•
•
•
•
•
Wideband Photodiode Amplifiers
Sample-and-Hold Buffers
CCD Output Buffers
ADC Input Buffers
Wideband Precision Amplifiers
Test and Measurement Front Ends
DESCRIPTION
The OPA656 combines a very wideband, unity-gain stable, voltage-feedback op amp with a FET-input stage to
offer an ultra high dynamic-range amplifier for ADC (analog-to-digital converter) buffering and transimpedance
applications. Extremely low DC errors give good precision in optical applications.
The high unity-gain stable bandwidth and JFET input allows exceptional performance in high-speed, low-noise
integrators.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE (2)
OPA656
TD
Bare die in waffle pack
ORDERABLE PART NUMBER
PACKAGE QUANTITY
OPA656TDB1
400
OPA656TDB2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
OPA656-DIE
SBOS596 – MARCH 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
15 mils.
Silicon with backgrind
VS-
TiW/AlCu (0.5%)
1100 nm
Table 1. Bond Pad Coordinates in Microns (1)
(1)
2
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
Inverting Input
1
27
623
127
723
NonInverting Input
2
27
53
127
153
N/C
3
181
53
281
153
Output
4
723
27
823
127
VS-
5
723
337
823
439
VS+
6
723
649
823
749
N/C
7
181
623
281
723
Substrate is VS-.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): OPA656-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
OPA656TDB1
ACTIVE
0
400
RoHS & Green
Call TI
N / A for Pkg Type
OPA656TDB2
ACTIVE
0
10
RoHS & Green
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
很抱歉,暂时无法提供与“OPA656TDB1”相匹配的价格&库存,您可以联系我们找货
免费人工找货