PCI7510
www.ti.com
SLLA249 – JULY 2006
PC Card, Smart Card and Integrated 1394a-2000 OHCI Two-Port PHY/Link-Layer
Controller
FEATURES
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PC Card Standard 8.0 compliant
PCI Bus Power Management Interface
Specification 1.1 compliant
Advanced Configuration and Power Interface
(ACPI) Specification 2.0 compliant
PCI Local Bus Specification Revision 2.3
compliant
PC 98/99 and PC2001 compliant
Compliant with the PCI Bus Interface
Specification for PCI-to-CardBus Bridges
Fully compliant with provisions of IEEE Std
1394-1995 for a high-performance serial bus
and IEEE Std 1394a-2000
Fully compliant with 1394 Open Host
Controller Interface Specification 1.1
1.8-V core logic and 3.3-V I/O cells with
internal voltage regulator to generate 1.8-V
core VCC
Universal PCI interfaces compatible with
3.3-V and 5-V PCI signaling environments
Supports PC Card or CardBus with hot
insertion and removal
Supports 132-MBps burst transfers to
maximize data throughput on both the PCI
bus and the CardBus
Supports serialized IRQ with PCI interrupts
Programmable multifunction terminals
Many interrupt modes supported
Serial ROM interface for loading subsystem
ID and subsystem vendor ID
ExCA-compatible registers are mapped in
memory or I/O space
Intel 82365SL–DF register compatible
Supports ring indicate, SUSPEND, and PCI
CCLKRUN protocol and PCI bus Lock (LOCK)
Provides VGA/palette memory and I/O, and
subtractive decoding options, LED activity
terminals
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Fully interoperable with FireWire™ and
i.LINK™ implementations of IEEE Std 1394
Compliant with Intel Mobile Power Guideline
2000
Full IEEE Std 1394a-2000 support includes:
connection debounce, arbitrated short reset,
multispeed concatenation, arbitration
acceleration, fly-by concatenation, and port
disable/suspend/resume
Power-down features to conserve energy in
battery-powered applications include:
automatic device power down during
suspend, PCI power management for
link-layer, and inactive ports powered down,
ultralow-power sleep mode
Two IEEE Std 1394a-2000 fully compliant
cable ports at 100M bits/s, 200M bits/s, and
400M bits/s
Cable ports monitor line conditions for active
connection to remote node
Cable power presence monitoring
Separate cable bias (TPBIAS) for each port
Physical write posting of up to three
outstanding transactions
PCI burst transfers and deep FIFOs to
tolerate large host latency
External cycle timer control for customized
synchronization
Extended resume signaling for compatibility
with legacy DV components
PHY-Link logic performs system initialization
and arbitration functions
PHY-Link encode and decode functions
included for data-strobe bit level encoding
PHY-Link incoming data resynchronized to
local clock
Low-cost 24.576-MHz crystal provides
transmit and receive data at 100M bits/s,
200M bits/s, and 400M bits/s
Node power class information signaling for
system power management
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
FireWire is a trademark of Apple Computer, Inc..
i.LINK is a trademark of Sony Corporation of America.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
PCI7510
www.ti.com
SLLA249 – JULY 2006
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Register bits give software control of
contender bit, power class bits, link active
control bit, and IEEE Std 1394a-2000 features
Isochronous receive dual-buffer mode
Out-of-order pipelining for asynchronous
transmit requests
Register access fail interrupt when the PHY
SCLK is not active
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PCI power-management D0, D1, D2, and D3
power states
Initial bandwidth available and initial
channels available registers
PME support per 1394 Open Host Controller
Interface Specification
Advanced submicron, low-power CMOS
technology
DESCRIPTION
The Texas Instruments PCI7510 device is an integrated single-socket PC Card controller with an IEEE 1394
open host controller link-layer controller (LLC) and two-port 1394 PHY. The PCI7510 device also includes a
dedicated interface that can be used as a Smart Card socket. This high performance integrated solution
provides the latest in PC Card, IEEE 1394, and Smart Card technology.
The PCI7510 CardBus controller is a four-function, 33-MHz PCI device compliant with the PCI Local Bus
Specification. Function 0 provides a PC Card socket controller compliant with the latest PC Card Standards.
Function 1 provides a dedicated socket for Smart Card. Function 2 of the PCI7510 device is an integrated IEEE
1394 OHCI host controller and two-port PHY. Function 3 is the interface to load the PCI7510 program RAM with
firmware. The PCI7510 device provides features that make it the best choice for bridging between the PCI bus
and PC Cards, and supports any combination of 16-bit and CardBus cards powered at 5 V or 3.3 V as required.
There is no PCMCIA card and socket service software changes required to move systems from the existing
CardBus socket controller to the PCI7510 device. The PCI7510 device is register compatible with the Intel
82365SL–DF ExCA controller and implements the host interface defined in the PC Card Standard. The PCI7510
internal data path logic allows the host to access 8-, 16-, and 32-bit cards using full 32-bit PCI cycles for
maximum performance. Independent buffering and the pipeline architecture provide an unsurpassed
performance level with sustained bursting. The PCI7510 device can be programmed to accept posted writes to
improve bus utilization. All card signals are internally buffered to allow hot insertion and removal without external
buffering.
Function 1 of the PCI7510 device provides a dedicated interface for a Smart Card socket. The PCI7510 device
supports asynchronous Smart Cards with contacts.
Function 2 of the PCI7510 device is an integrated 1394a-2000 OHCI PHY/link-layer controller (LLC) device that
is fully compliant with the PCI Local Bus Specification, the PCI Bus Power Management Interface Specification,
IEEE Std 1394-1995, IEEE Std 1394a-2000, and the 1394 Open Host Controller Interface Specification. It is
capable of transferring data between the 33-MHz PCI bus and the 1394 bus at 100M bits/s, 200M bits/s, and
400M bits/s. The PCI7510 device provides two 1394 ports that have separate cable bias (TPBIAS). The
PCI7510 device also supports the IEEE Std 1394a-2000 power-down features for battery-operated applications
and arbitration enhancements.
As required by the 1394 Open Host Controller Interface Specification (OHCI) and IEEE Std 1394a-2000, internal
control registers are memory-mapped and non-prefetchable. The PCI configuration header is accessed through
configuration cycles specified by PCI, and it provides plug-and-play (PnP) compatibility. Furthermore, the
PCI7510 device is compliant with the PCI Bus Power Management Interface Specification as specified by the
PC 2001 Design Guide requirements. The PCI7510 device supports the D0, D1, D2, and D3 power states.
Function 3 of the PCI7510 device is the interface to load the PCI7510 program RAM with firmware. This function
provides an I/O window that a software driver uses to load the PCI7510 firmware into the internal RAM.
The PCI7510 design provides PCI bus master bursting, and it is capable of transferring a cacheline of data at
132M bytes/s after connection to the memory controller. Because PCI latency can be large, deep FIFOs are
provided to buffer the 1394 data.
The PCI7510 device provides physical write posting buffers and a highly-tuned physical data path for SBP-2
performance. The PCI7510 device also provides multiple isochronous contexts, multiple cacheline burst
transfers, advanced internal arbitration, and bus-holding buffers.
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PCI7510
www.ti.com
SLLA249 – JULY 2006
The PCI7510 PHY-layer provides the digital and analog transceiver functions needed to implement a two-port
node in a cable-based 1394 network. Each cable port incorporates two differential line transceivers. The
transceivers include circuitry to monitor the line conditions as needed for determining connection status, for
initialization and arbitration, and for packet reception and transmission.
The PCI7510 PHY-layer requires only an external 24.576-MHz crystal as a reference for the cable ports. An
external clock may be provided instead of a crystal. An internal oscillator drives an internal phase-locked loop
(PLL), which generates the required 393.216-MHz reference signal. This reference signal is internally divided to
provide the clock signals that control transmission of the outbound encoded strobe and data information. A
49.152-MHz clock signal is supplied to the integrated LLC for synchronization and is used for resynchronization
of the received data. Data bits to be transmitted through the cable ports are received from the integrated LLC
and are latched internally in synchronization with the 49.152-MHz system clock. These bits are combined
serially, encoded, and transmitted at 98.304M, 196.608M, or 393.216M bits/s (referred to as S100, S200, or
S400 speeds, respectively) as the outbound data-strobe information stream. During transmission, the encoded
data information is transmitted differentially on the twisted-pair B (TPB) cable pair(s), and the encoded strobe
information is transmitted differentially on the twisted-pair A (TPA) cable pair(s).
Various implementation specific functions and general-purpose inputs and outputs are provided through several
multifunction terminals. These terminals present a system with options, such as PCI LOCK and parallel IRQs.
ACPI-complaint general-purpose events may be programmed and controlled through the multifunction terminals,
and an ACPI-compliant programming interface is included for the general-purpose inputs and outputs.
The PCI7510 device is compliant with the latest PCI Bus Power Management Specification, and provides
several low-power modes, which enable the host power system to further reduce power consumption. The
PCI7510 device also has a four-pin interface compatible with both the TI TPS2211 and TPS2221 power
switches.
An advanced CMOS process achieves low power consumption and allows the PCI7510 device to operate at PCI
clock rates up to 33 MHz.
NOTE:
This product is for high-volume PC applications only. For a complete datasheet or
more information contact support@ti.com.
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3
PACKAGE OPTION ADDENDUM
www.ti.com
4-Dec-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
PCI7510GHK
OBSOLETE
Package
Type
BGA MI
CROSTA
R
Package
Drawing
GHK
Pins Package Eco Plan (2)
Qty
209
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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