PGA308TDD1

PGA308-DIE www.ti.com SBOS624 – JUNE 2012 SINGLE-SUPPLY, AUTO-ZERO SENSOR AMPLIFIER WITH PROGRAMMABLE GAIN AND OFFSET Check for Samples: PGA308-DIE FEATURES 1 • • • • • • • • Digital Calibration for Bridge Sensors Offset Select: Coarse and Fine Gain Select: Coarse and Fine Bridge Fault Monitor Input Mux for Lead Swap Over/Under Scale Limits DOUT/ VOUT Clamp Function Seven Banks OTP Memory • • One-Wire Digital UART Interface Operating Voltage: 2.7 V to 5.5 V APPLICATIONS • • • • Bridge Sensors Remote Transmitters Strain, Load, Weigh Scales Automotive Sensors DESCRIPTION The PGA308 is a programmable analog sensor signal conditioner. The analog signal path amplifies the sensor signal and provides digital calibration for offset and gain. Calibration is done via the 1W pin, a digital One-Wire, UART-compatible interface. For three-terminal sensor modules, 1W may be connected to VOUT and the assembly programmed through the VOUT pin. Gain and offset calibration parameters are stored onboard in seven banks of one-time programmable (OTP) memory. The power-on reset (POR) OTP bank may be programmed a total of four times. The all-analog signal path contains a 2×2 input multiplexer (mux) to allow electronic sensor lead swapping, a coarse offset adjust, an auto-zero programmable gain instrumentation amplifier (PGA), a fine gain adjust, a fine offset adjust, and a programmable gain output amplifier. Fault monitor circuitry detects and signals sensor burnout, overload, and system fault conditions. Over/under-scale limits provide additional means for system level diagnostics. The dual-use DOUT/VCLAMP pin can be used as a programmable digital output or as a VOUT overvoltage clamp. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE PGA308 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY PGA308TDD1 100 PGA308TDD2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated PGA308-DIE SBOS624 – JUNE 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 15 mils. Silicon with backgrind Floating Al-Cu (0.5%) 598 nm Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): PGA308-DIE PGA308-DIE www.ti.com SBOS624 – JUNE 2012 Table 1. Bond Pad Coordinates in Microns (1) (1) DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX Dout/Vclamp 1 1649.8 200.1 1725.8 276.1 616 1W 2 1649.8 540 1725.8 GND 3 1639.7 826 1715.7 902 GND 4 1639.7 1055 1715.7 1131 VS 5 1639.7 1275 1715.7 1351 VS 6 1639.7 1550 1715.7 1626 Vin1 7 1649.8 1810.1 1725.8 1886.1 Vin2 8 26.2 1810.1 102.2 1886.1 1216 Vsj 9 26.2 1140 102.2 Vfb 10 44.55 823 120.55 899 Vout 11 26.2 510.85 102.2 586.85 Vref 12 26.2 189.9 102.2 265.9 Substrate N/C. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): PGA308-DIE 3 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) PGA308TDD1 ACTIVE 0 100 RoHS & Green Call TI N / A for Pkg Type 0 to 70 PGA308TDD2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type 0 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of