PGA5807
www.ti.com
SBAS617B – MAY 2013 – REVISED JUNE 2013
8-Channel, High-Bandwidth, Analog Front-End
Check for Samples: PGA5807
FEATURES
APPLICATIONS
•
•
•
1
2
•
•
•
•
•
•
•
8-Channel Complete AFE:
– LNA, PGA, and LPF
– Full-Channel Gain: 12 dB to 30 dB
– Input-Referred Noise: 2.1 nV/√Hz
LNA:
– Gain: 12 dB
– Fully Differential
– Wide Input Common-Mode Support:
2.1 ± 200 mV
– Maximum Linear Input Range: 500 mVPP
PGA: Gain 0 dB to 18 dB
– With 3-dB Gain Steps
– Programmable via Either Serial Interface or
External Pins
Maximum Total Channel Gain: 30 dB
Programmable LPF:
– Corner Frequency: 75 MHz, 60 MHz
Power (Full-Chain):
– 60 mW per Channel
Fast and Consistent Overload Recovery
Small Package: 9-mm × 9-mm QFN-64
Data Acquisition Front Ends
Ultrasound Imaging
DESCRIPTION
The PGA5807 is an 8-channel, high-bandwidth,
analog front-end (AFE). The device functions on a
single 3.3-V analog supply. The device supports highbandwidth input frequencies with a total power of 60
mW per channel. The PGA5807 consists of a lownoise amplifier (LNA), a programmable gain amplifier
(PGA), and a programmable low-pass filter (LPF).
The LNA has a fixed 12-dB gain (the differential
amplifier supports both direct and capacitive input
coupling) and supports a maximum linear input range
of 500 mVPP.
The device provides gain options from 0 dB to 18 dB,
in 3-dB gain steps. This 18-dB PGA gain can be
programmed using either the serial interface or
external pins. The PGA5807 integrates an
antialiasing filter in the form of an LPF to reduce
noise. The device is available in a very small, 9-mm ×
9-mm QFN-64 package and is specified for operation
over the –40°C to +85°C temperature range.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
PGA5807
SBAS617B – MAY 2013 – REVISED JUNE 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PGA5807
QFN-64
RGC
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range, unless otherwise noted. (1)
Supply voltage range
AVDD
Voltage at analog input and digital input
Temperature range
Electrostatic discharge (ESD) ratings
(1)
VALUE
UNIT
–0.3 to 3.9
V
–0.3 to minimum (3.6, AVDD + 0.3)
V
Operating, TA
–40 to +85
°C
Storage, Tstg
–55 to +150
°C
1
kV
Human body model (HBM)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
AVDD
Analog voltage supply
3.15
3.6
V
TA
Operating temperature
–40
+85
°C
Input common-mode voltage range
1.9
2.3
V
THERMAL INFORMATION
PGA5807
THERMAL METRIC (1)
RGC (QFN)
UNITS
64 PINS
θJA
Junction-to-ambient thermal resistance
22.8
θJCtop
Junction-to-case (top) thermal resistance
6.9
θJB
Junction-to-board thermal resistance
2.4
ψJT
Junction-to-top characterization parameter
0.1
ψJB
Junction-to-board characterization parameter
2.4
θJCbot
Junction-to-case (bottom) thermal resistance
0.2
(1)
2
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
PGA5807
www.ti.com
SBAS617B – MAY 2013 – REVISED JUNE 2013
ELECTRICAL CHARACTERISTICS
Typical values are at TA = +25°C, AVDD = 3.3 V, input dc-coupled with a 2.1-V common-mode voltage, LNA gain = 12 dB,
PGA gain = 18 dB, total channel gain = 30 dB, bandwidth = high, and VOUT = –1 dBFS, unless otherwise specified.
Minimum and maximum values are specified across the full temperature range of TMIN = –40°C to TMAX = +85°C with AVDD =
3.3 V.
PARAMETER
TEST CONDITIONS
MIN
f = 25 MHz, total channel gain = 30 dB
2.1
RS = 100 Ω, differential
6.4
dB
Maximum linear input voltage
Total channel gain = 12 dB, differential
500
mVPP
29
Total channel gain = 30 dB
Input resistance
Input capacitance
LPF –3-dB cutoff frequency
Across devices, TA = +25°C
Gain matching
dB
dB
450
µV
5
kΩ
3
pF
75
MHz
1
dB
±0.25
dB
2.3
V
Output offset
–50
50
mV
Output common-mode voltage
950
mV
Second
f = 25 MHz, VOUT = –1 dBFS
–55
dBc
Third
f = 25 MHz, VOUT = –1 dBFS
–50
dBc
Total
f = 25 MHz, VOUT = –1 dBFS
–48
dBc
Intermodulation distortion
f1 = 25 MHz at –7 dBFS, f2 = 25 MHz,
1 MHz at –7 dBFS, for all PGA gains
–45
dBc
Fundamental crosstalk
f = 25 Mz, VOUT = –1 dBFS
–50
dBc
Partial power-down
4.2
Harmonic
distortion
Total, per channel
Power dissipation
Power-down mode
60
Complete power-down
AVDD current (3.3 V)
Settling time for overload recovery
Power-up response time
PSRR
18
1.9
THD
PD
dB
3
–1
Across channels in the same device
dB
31
Input common-mode voltage range
HD2
IMD3
30
0
Total output-referred noise
HD3
VPP
12
Gain step
VOCR
nV/√Hz
2
LNA gain
PGA gain range
VICR
UNIT
Noise figure
Maximum channel gain
Ci
MAX
Input-referred noise
Maximum linear output swing
GLNA
TYP
Power-supply rejection ratio
69
mW/ch
mW/ch
2.5
mW/ch
145
For 12-dB higher signal than linear input
mA
–30
ns
Partial power-down
1
µs
Full power-down
1
ms
f = 10 kHz, gain = 30 dB
–40
dBc
f = 10 kHz, gain = 12 dB
–38
dBc
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
3
PGA5807
SBAS617B – MAY 2013 – REVISED JUNE 2013
www.ti.com
DIGITAL CHARACTERISTICS
Typical values are at TA = +25°C and AVDD = 3.3 V, unless otherwise specified. Minimum and maximum values are specified
across the full temperature range of TMIN = –40°C to TMAX = +85°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUTS/OUTPUTS
VIH
Logic high input voltage
2
VIL
Logic low input voltage
0
V
IIH
Logic high input current
200
µA
IIL
Logic low input current
200
µA
Ci
Input capacitance
5
pF
VOH
Logic high output voltage
SDOUT pin
AVDD
V
VOL
Logic low output voltage
SDOUT pin
0
V
V
PIN CONFIGURATION
49 AVDD
50 AVSS
51 GAIN0
52 GAIN1
53 PDN
54 AVSS
55 SDOUT
56 GAIN2
57 SEN
58 SDATA
59 SCLK
60 RESET
61 AVSS
62 AVDD
63 AVDD
64 AVDD
RGC PACKAGE
QFN-64
(TOP VIEW)
INP1
1
48 OUTP1
INM1
2
47 OUTM1
INP2
3
46 OUTP2
INM2
4
45 OUTM2
INP3
5
44 OUTP3
INM3
6
43 OUTM3
INP4
7
42 OUTP4
INM4
8
41 OUTM4
Thermal Pad
33 OUTM8
AVDD 17
4
Submit Documentation Feedback
NC 32
INM8 16
AVDD 31
34 OUTP8
NC 30
INP8 15
AVSS 29
35 OUTM7
AVDD 28
INM7 14
AVSS 27
36 OUTP7
NC 26
INP7 13
NC 25
37 OUTM6
AVSS 24
INM6 12
NC 23
38 OUTP6
NC 22
INP6 11
NC 21
39 OUTM5
AVSS 20
INM5 10
AVSS 19
40 OUTP5
VBIAS 18
9
INP5
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
PGA5807
www.ti.com
SBAS617B – MAY 2013 – REVISED JUNE 2013
Table 1. PIN FUNCTIONS
NAME
NO.
FUNCTION
AVDD
17, 28, 31, 49, 62-64
Supply
Analog supply pin, 3.3 V
DESCRIPTION
AVSS
19, 20, 24, 27, 29, 50, 54, 61
Ground
Analog ground
GAIN0
51
Digital input
When RESET is high, this pin is used to program the PGA gain.
Refer to Table 2 for more details. Note: Use 3.3-V logic.
GAIN1
52
Digital input
When RESET is high, this pin is used to program the PGA gain.
Refer to Table 2 for more details. Note: Use 3.3-V logic.
GAIN2
56
Digital input
When RESET is high, this pin is used to program the PGA gain.
Refer to Table 2 for more details. Note: Use 3.3-V logic.
INM1 to
INM8
2, 4, 6, 8, 10, 12, 14, 16
Input
Complimentary analog inputs for channels 1 to 8.
The dc input common-mode can be 2.1 V ± 200 mV.
INP1 to INP8
1, 3, 5, 7, 9, 11, 13, 15
Input
Analog inputs for channels 1 to 8.
The dc input common-mode can be 2.1 V ± 200 mV.
NC
21-23, 25, 26, 30, 32
—
OUTM1 to
OUTM8
33, 35, 37, 39, 41, 43, 45, 47
Output
Complimentary output pins with a 0.95-V common-mode voltage
OUTP1 to
OUTP8
34, 36, 38, 40, 42, 44, 46, 48
Output
Output pins with a 0.95-V common-mode voltage
PDN
53
Digital input
Partial power-down control pin for the entire device with an internal 20-kΩ
pull-down resistor; active high. Note: Use 3.3-V logic.
RESET
60
Digital input
Logic hardware reset pin. Note: Use 3.3-V logic.
SCLK
59
Digital input
Serial interface clock pin with an internal 20-kΩ pull-down resistor. Note: Use
3.3-V logic.
Digital input
Serial interface data input with an internal 20-kΩ pull-down resistor. When
RESET is high, the corner frequency for the antialias filter can be
programmed to a lower frequency (60 MHz) by setting this pin high. Note:
Use 3.3-V logic.
SDATA
58
SDOUT
55
SEN
57
Digital input
VBIAS
18
Decap
Unused pins; do not connect
Digital output Serial interface readout pin
Serial interface enabled for channels 1 to 8 with an internal 20-kΩ pull-up
resistor; active low. Note: Use 3.3-V logic.
Bias voltage; bypass to ground with a 1-μF capacitor or greater
Table 2. PGA Gain Control
GAIN[2:0]
PGA_GAIN (dB)
000
18
001
15
010
12
011
9
100
6
101
3
110
0
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
5
PGA5807
SBAS617B – MAY 2013 – REVISED JUNE 2013
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
GAIN[2:0]
SDATA
SPI IN
Input
SPI Logic
LNA
(12-dB Fixed)
PGA
(0 dB to 18 dB)
Antialias
Low-Pass Filter
Output
PGA5807
(1 of 8 Channels)
6
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
PGA5807
www.ti.com
SBAS617B – MAY 2013 – REVISED JUNE 2013
TYPICAL CHARACTERISTICS
At TA = +25°C, AVDD = 3.3 V, input dc-coupled with 2.1-V input common-mode, LNA gain = 12 dB, PGA gain = 18 dB, total
channel gain = 30 dB, GAIN[2:0] = 000, fIN = 5 MHz, default LPF filter corner, and VOUT = –1 dBFS, unless otherwise noted.
30
3500
−40 °C
+25 °C
+80 °C
27
3000
2500
Number of Occurrences
24
Gain (dB)
21
18
2000
1500
1000
15
500
12
0
1
2
3
GAIN[2:0]
4
5
31
30.9
30.8
30.7
30.6
30.5
30.4
30.3
30.2
30
30.1
29.9
29.8
29.7
29.6
29.5
29.4
29.3
29.2
29
9
29.1
0
Gain (dB)
6
C002
G001
Figure 2. GAIN-MATCHING HISTOGRAM
(Gain = 30 dB)
2500
5k
2000
4k
Differential Impedance Magnitude (Ω)
Number of Occurrences
Figure 1. GAIN vs GAIN[2:0] ACROSS TEMPERATURE
1500
1000
500
3k
2k
1k
0
-40 -35 -30 -25 -20 -15 -10 -5
0
5
10 15 20 25 30 35 40
Output (mV)
C004
0
5M
25M
45M
65M
Frequency (Hz)
85M
100M
G005
Figure 3. OUTPUT OFFSET HISTOGRAM
(Gain = 30 dB)
Figure 4. INPUT IMPEDANCE MAGNITUDE
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
7
PGA5807
SBAS617B – MAY 2013 – REVISED JUNE 2013
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, AVDD = 3.3 V, input dc-coupled with 2.1-V input common-mode, LNA gain = 12 dB, PGA gain = 18 dB, total
channel gain = 30 dB, GAIN[2:0] = 000, fIN = 5 MHz, default LPF filter corner, and VOUT = –1 dBFS, unless otherwise noted.
35
0
Default
Low BW
−10
25
−30
−40
Gain (dB)
Differential Impedance Phase (Degree)
30
−20
−50
−60
−70
20
15
10
−80
5
−90
−100
5M
25M
45M
65M
Frequency (Hz)
85M
0
1M
100M
10M
Frequency (Hz)
100M
300M
G006
G007
Figure 5. INPUT IMPEDANCE PHASE
Figure 6. LOW-PASS FILTER RESPONSE
6
10
Default setting
Low BW setting
9
5
7
Hz)
4
6
Noise (nV
Input Referred Noise (nV
Hz)
8
5
4
3
2
3
2
1
1
0
12
15
18
21
Gain (dB)
24
27
30
0
1
6
11
16
21
Frequency (MHz)
26
30
G008
Figure 7. INPUT-REFERRED NOISE vs GAIN
8
G009
Figure 8. INPUT-REFERRED NOISE vs FREQUENCY
(Gain = 30 dB)
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
PGA5807
www.ti.com
SBAS617B – MAY 2013 – REVISED JUNE 2013
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, AVDD = 3.3 V, input dc-coupled with 2.1-V input common-mode, LNA gain = 12 dB, PGA gain = 18 dB, total
channel gain = 30 dB, GAIN[2:0] = 000, fIN = 5 MHz, default LPF filter corner, and VOUT = –1 dBFS, unless otherwise noted.
90
70
80
68
70
66
SNR (dBFS)
Noise (nV
Hz)
Default
Low BW
60
50
40
64
62
1
6
11
16
21
Frequency (MHz)
26
60
30
12
15
18
21
Gain (dB)
24
27
30
G010
G011
Figure 9. OUTPUT-REFERRED NOISE vs FREQUENCY (Gain
= 30 dB)
Figure 10. SIGNAL-TO-NOISE RATIO vs
GAIN ACROSS BANDWIDTH MODE
−60
−60
Gain = 12 dB
Gain = 30 dB
−64
−64
−66
−66
−68
−68
−70
−70
−72
−72
−74
−74
−76
−76
−78
−78
−80
2
6
10
14
18
Frequency (MHz)
22
fIN = 5 MHz
fIN = 10 MHz
fIN = 25 MHz
−62
HD2 (dBc)
HD2 (dBc)
−62
25
−80
12
15
18
21
Gain (dB)
24
27
G012
Figure 11. SECOND-HARMONIC DISTORTION vs
FREQUENCY
30
G013
Figure 12. SECOND-HARMONIC DISTORTION vs GAIN
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
9
PGA5807
SBAS617B – MAY 2013 – REVISED JUNE 2013
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, AVDD = 3.3 V, input dc-coupled with 2.1-V input common-mode, LNA gain = 12 dB, PGA gain = 18 dB, total
channel gain = 30 dB, GAIN[2:0] = 000, fIN = 5 MHz, default LPF filter corner, and VOUT = –1 dBFS, unless otherwise noted.
−40
−40
Gain = 12 dB
Gain = 30 dB
−45
−46
−50
−50
HD3 (dBc)
HD3 (dBc)
fIN = 5 MHz
fIN = 10 MHz
fIN = 25 MHz
−42
−55
−54
−58
−60
−62
−65
2
6
10
14
18
Frequency (MHz)
22
−70
25
12
15
18
21
Gain (dB)
24
27
30
G014
G015
Figure 13. THIRD-HARMONIC DISTORTION vs FREQUENCY
Figure 14. THIRD-HARMONIC DISTORTION vs GAIN
1.2
0.3
1.2
40m
0.2
0.8
0.1
0.4
0
0
−0.1
−0.4
−0.2
−0.8
−0.3
−15
−10
−5
0
5
10
Time (ns)
15
20
25
30
−1.2
Differential Input Voltage (V)
Input
Output
Differential Output Voltage (V)
Differential Input Voltage (V)
Input
Output
30m
0.9
20m
0.6
10m
0.3
0
0
−10m
−0.3
−20m
−0.6
−30m
−0.9
−40m
−15
−10
G016
Figure 15. DIFFERENTIAL OUTPUT RESPONSE FOR AN
INPUT STEP (12-dB Total Channel Gain)
10
−5
0
5
10
Time (ns)
15
20
25
30
Differential Output Voltage (V)
−70
−66
−1.2
G017
Figure 16. DIFFERENTIAL OUTPUT RESPONSE FOR AN
INPUT STEP (30-dB Total Channel Gain)
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
PGA5807
www.ti.com
SBAS617B – MAY 2013 – REVISED JUNE 2013
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, AVDD = 3.3 V, input dc-coupled with 2.1-V input common-mode, LNA gain = 12 dB, PGA gain = 18 dB, total
channel gain = 30 dB, GAIN[2:0] = 000, fIN = 5 MHz, default LPF filter corner, and VOUT = –1 dBFS, unless otherwise noted.
−30
Gain = 30 dB
Gain = 12 dB
−40
PSRR (dB)
−50
−60
−70
−80
−90
1k
10k
100k
Frequency (Hz)
1M
G018
Figure 17. POWER-SUPPLY REJECTION RATIO
(100-mVPP Supply Noise with Different Frequencies)
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
11
PGA5807
SBAS617B – MAY 2013 – REVISED JUNE 2013
www.ti.com
SERIAL REGISTER TIMING
SERIAL REGISTER WRITE DESCRIPTION
Programming different modes can be accomplished through the serial interface formed by the SEN (serial
interface enable), SCLK (serial interface clock), SDATA (serial interface data), and RESET pins. Each of these
pins has a 20-kΩ pull-down resistor to GND. Serially shifting bits into the device is enabled when SEN is low.
SDATA serial data are latched at every SCLK rising edge when SEN is active (low). Serial data are loaded into
the register at every 24th SCLK rising edge when SEN is low. If the word length exceeds a multiple of 24 bits,
the excess bits are ignored. Data can be loaded in multiples of 24-bit words within a single active SEN pulse (an
internal counter counts groups of 24 clocks after the SEN falling edge). The interface can function with SCLK
frequencies from 20 MHz down to low speeds (of a few Hertz) and even with a non-50% duty cycle SCLK. Data
are divided into two main portions to load on the addressed register: a register address (eight bits) and the actual
data (16 bits). When writing to a register with unused bits, these bits should be set to '0'. Figure 18 shows a
timing diagram of the write operation. Table 3 lists the serial interface timing characteristics.
SEN
tSEN_SU
tSCLK_L
Data Latched On
SCLK Rising Edge
tSCLK
tSEN_HO
SCLK
tSCLK_H
tDSU
A7
SDATA
A6
A5
A4
A3
A2
tDH
A1
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
RESET
Figure 18. Serial Interface Timing Diagram
Table 3. Serial Interface Timing Characteristics (1)
PARAMETER
MIN
TYP
MAX
UNIT
tSCLK
SCLK period
50
ns
tSCLK_H
SCLK high time
20
ns
tSCLK_L
SCLK low time
20
ns
tDSU
Data setup time
5
ns
tDHO
Data hold time
5
ns
tSEN_SU
SEN falling edge to SCLK rising edge
8
ns
tSEN_HO
Time between last SCLK rising edge to SEN rising edge
8
ns
tOUT_DV
(1)
(2)
12
(2)
Delay from SCLK falling edge to SDOUT valid
12
20
28
ns
Minimum values are across the full temperature range of TMIN = –40°C to TMAX = +85°C and AVDD = 3.3 V.
See Figure 19.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
PGA5807
www.ti.com
SBAS617B – MAY 2013 – REVISED JUNE 2013
REGISTER READOUT
The device includes an option where the contents of the internal registers can be read back. This readout may
be useful as a diagnostic test to verify the serial interface communication between the external controller and the
AFE. First, the REGISTER READOUT ENABLE bit (bit 1, register 00h) must be set to '1'. Then, initiate a serial
interface cycle specifying the register address (A[7:0]) to be read. The data bits are don’t care. The device
outputs the contents (D[15:0]) of the selected register on the SDOUT pin. SDOUT has a typical 20-ns delay
(tOUT_DV) from the SCLK falling edge. For a lower speed SCLK, SDOUT can be latched on the SCLK rising edge.
For a higher speed SCLK (for example, with an SCLK period less than 60 ns), latching SDOUT at the next SCLK
falling edge is preferable. Figure 19 shows the read operation timing diagram (timing specifications follow the
same information provided in Table 3). In readout mode, REGISTER READOUT ENABLE can still be accessed
through SDATA, SCLK, and SEN. To enable serial register writes, set the REGISTER READOUT ENABLE bit
back to '0'.
SEN
SCLK
tOUT_DV
SDOUT
SDATA
A7
A6
A5
A4
A3
A2
A1
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Figure 19. Serial Interface Register Read Timing Diagram
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
13
PGA5807
SBAS617B – MAY 2013 – REVISED JUNE 2013
www.ti.com
REGISTER MAP
A reset process is required at the device initialization stage. Initialization can be accomplished in one of two ways:
1. Through a hardware reset, by applying a positive pulse on the RESET pin, or
2. Through a software reset (using the serial interface), by setting the SW_RESET bit high. Setting this bit initializes the internal registers to the
respective default values (all '0's) and then self-resets the SW_RESET bit low. In this case, the RESET pin can remain low (inactive).
After reset, all PGA registers are set to ‘0’ (default). During register programming, all reserved or unlisted register bits must be set to ‘0’. Register settings
are maintained when the device is in either partial or complete power-down mode. Table 4 lists the PGA register map.
Table 4. PGA Register Map
REGISTER
(Hex)
DECIMAL
VALUE
Bit 15
BIT 14
BIT
13
BIT
12
BIT
11
BIT
10
00
0
X (1)
X
X
X
X
X
X
X
X
X
X
X
X
35
53
COMPLETE
PDN
PARTIAL
PDN
X
X
X
X
X
X
X
X
X
X
3B
59
X
X
X
X
X
X
X
X
LOW _
FILTER_BW
(1)
(2)
14
BIT 9 BIT 8
BIT 7
BIT 6 BIT 5 BIT 4 BIT 3 BIT 2
PGA_GAIN
BIT 1
BIT 0
X
REGISTER
READOUT
ENABLE (2)
SW_RESET
X
X
X
X
X
X
X
X
X = don't care.
Shaded cells indicate used bits.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
PGA5807
www.ti.com
SBAS617B – MAY 2013 – REVISED JUNE 2013
Register Descriptions
Table 5. Register 00h
15
14
13
12
11
10
9
8
X
X
X
X
X
X
X
X
7
6
5
4
3
2
1
0
X
X
X
X
X
X
REGISTER
READOUT
ENABLE
SW_RESET
Bits 15:2
Don't care
Default = 0.
Bit 1
REGISTER READOUT ENABLE
0 = Readout disabled (default)
1 = Register readout enabled at SDOUT pin
Bit 0
SW_RESET
0 = Normal operation (default)
1 = Resets the device and self-clears the bit to '0'
Table 6. Register 35h
15
14
13
12
11
10
9
8
COMPLETE
PDN
PARTIAL PDN
X
X
X
X
X
X
7
6
5
4
3
2
1
0
X
X
X
X
X
X
X
X
Bit 15
COMPLETE PDN
Bit 14
PARTIAL PDN
0 = Normal operation (default)
1 = LNA and PGA powered down
Bits 13:0
Don't care
Default = 0.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
15
PGA5807
SBAS617B – MAY 2013 – REVISED JUNE 2013
www.ti.com
Table 7. Register 3Bh
15
14
13
12
11
10
9
8
X
X
X
X
X
X
X
X
7
6
5
4
3
2
1
0
X
X
X
X
LOW_FILTER_
BW
Bits 15:8
PGA_GAIN
Don't care
Default = 0.
Bit 7
LOW_FILTER_BW
0 = 75-MHz bandwidth (default)
1 = 60-MHz bandwidth
Bits 6:4
PGA_GAIN
000
001
010
011
100
101
110
Bits 3:0
=
=
=
=
=
=
=
18-dB PGA gain (default)
15-dB PGA gain
12-dB PGA gain
9-dB PGA gain
6-dB PGA gain
3-dB PGA gain
0-dB PGA gain
Don't care
Default = 0.
16
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
PGA5807
www.ti.com
SBAS617B – MAY 2013 – REVISED JUNE 2013
APPLICATION INFORMATION
THEORY OF OPERATION
The PGA5807 is a programmable gain amplifier (PGA) for applications with input frequencies up to 25 MHz. The
device includes a low-noise amplifier (LNA) with a fixed gain, followed by a PGA and an antialiasing filter to
reduce noise. The LNA is a fully-differential amplifier with a 12-dB fixed gain and can support a 500-mVPP
maximum linear differential input swing. The PGA is implemented as an attenuator followed by a fixed-gain
amplifier with 18-dB gain. The attenuator can provide attenuation from 0 dB to –18 dB in 3-dB steps. The
attenuator can be controlled by the GAIN[2:0] pins or by using register 3Bh (bits 6 to 4). The antialiasing filter is
combined with the fixed-gain amplifier. The filter has one active pole and a passive pole for a combined
bandwidth of 75 MHz. For low-frequency applications, bandwidth can be reduced to 60 MHz where better noise
can be achieved. The device can be programmed in this mode either by using the SDATA pin while RESET is
high or by using bit 7 of register 3Bh. This device can directly drive ADCs such as the ADS5296.
Low-Noise Amplifier (LNA)
In most data-acquisition systems, an LNA is required at the front-end to obtain good noise performance. The
PGA5807 has a fully-differential LNA with a 12-dB fixed gain. The LNA input-referred noise is 1.9 nV/√Hz, and
supports a differential 500-mVPP input swing. The LNA input can be applied either directly or through an accoupling capacitor. Internally, the LNA input is connected to a 2.1-V common-mode voltage via a large resistor (8
kΩ). For direct input coupling, the LNA supports an input common-mode range from 1.9 V to 2.3 V. The LNA
input circuits are shown in Figure 20.
CM
Figure 20. INP and INM Equivalent Circuits of LNA Inputs
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
17
PGA5807
SBAS617B – MAY 2013 – REVISED JUNE 2013
www.ti.com
Programmable Gain Amplifier (PGA) and Filter
The LNA output is transmitted to a PGA with a programmable gain from 0 dB to 18 dB in 3-dB steps. This gain
can either be controlled through a serial interface or through pins, as explained in the Serial Register Write
Description section. The PGA is implemented as a programmable attenuator and as a fixed-gain amplifier with an
18-dB gain. This architecture helps achieve the same bandwidth across different gain settings. The attenuator
provides programmable attenuation from 0 dB to 18 dB.
The attenuator architecture is shown in Figure 21. There are six shunt resistors that can be connected or
disconnected to achieve programmable attenuation. The network provides 0-dB attenuation when no shunt
resistors are connected. When the first shunt resistor (RS1) is turned on, an attenuation of 3 dB is obtained. For
achieving 6-dB attenuation, both RS1 and RS2 are turned on. Similarly, by turning on additional resistors, greater
attenuation can be achieved; by turning on all resistors, an effective 18-dB attenuation is achieved.
RINP
RS1
SW1
RS2
SW2
RS1
RS3
SW3
RS2
RS4
SW4
RS3
RS5
SW5
RS4
RS6
SW6
RS5
RS6
RINM
Figure 21. Programmable Attenuator
18
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
PGA5807
www.ti.com
SBAS617B – MAY 2013 – REVISED JUNE 2013
The attenuator is followed by a 18-dB fixed-gain amplifier. The amplifier is implemented as a voltage-to-current
(V-to-I) converter followed by a current-to-voltage (I-to-V) converter. The I-to-V bandwidth is limited so that it
functions as an LPF and is followed by a passive filter, as shown in Figure 22. Both the active and passive filters
provide an antialiasing filter action, which helps reduce noise when the PGA output is sampled by an ADC. The
architecture of the passive filter is selected to reduce the glitches that can occur when the PGA5807 output is
sampled by an ADC. For example, the PGA5807 can be directly connected to ADC devices (such as the
ADS5295 or ADS5296) without any external components between the ADC and PGA5807. Figure 23 shows an
example of the PGA5807 connected directly to the ADS5296.
I-to-V
Converter
V-to-I
Converter
CF
RF
OUTP
gm
OUTM
RF
CF
Figure 22. Antialias Filter
INPx
OUTPx
INX_p
OUTX_p
ADS5296
PGA5807
INMx
OUTX_n
OUTMx
INX_n
Figure 23. PGA Connected to an ADC
DEVICE CONFIGURATION USING SERIAL INTERFACE OR PARALLEL PINS
Different device modes (such as channel gain and bandwidth) can be programmed by either using the serial
interface or external pins. The device can be configured via the serial interface only when the device RESET pin
is pulsed and remains low. In this configuration, device gain can be programmed through register 3Bh (bits 6 to
4) and bandwidth can be programmed by register 3Bh (bit 7). When the RESET pin is connected to 3.3 V or is
pulled high, the serial interface is unable to control the device. In this configuration, the GAIN[2:0] pins can be
used to control gain and the SDATA pin can be used to control bandwidth.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
19
PGA5807
SBAS617B – MAY 2013 – REVISED JUNE 2013
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (June 2013) to Revision B
•
Deleted Body Scan Imaging bullet from Applications section .............................................................................................. 1
Changes from Original (May 2013) to Revision A
•
20
Page
Page
Moved to Production Data .................................................................................................................................................... 1
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: PGA5807
PACKAGE OPTION ADDENDUM
www.ti.com
14-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
PGA5807RGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
PGA5807
PGA5807RGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
PGA5807
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jun-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
PGA5807RGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
PGA5807RGCT
VQFN
RGC
64
250
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jun-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
PGA5807RGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
PGA5807RGCT
VQFN
RGC
64
250
336.6
336.6
28.6
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
