PGA970QPHPR

Product Folder Order Now Support & Community Tools & Software Technical Documents PGA970 SLDS257 – APRIL 2019 PGA970 LVDT Sensor Signal Conditioner 1 Features • 1 • • • Analog features – Programmable-gain analog front end for LVDT sensors – Excitation waveform generator and amplifier – Dual 24-bit ADC with amplitude and phase demodulators – 24-bit auxilary ADC – On-chip internal temperature sensor – 14-bit output DAC with programmable gain – Built-in diagnostics Digital features – ARM® Cortex®-M0 microcontroller – 16KB ferroelectric RAM (FRAM) program memory – 2KB general-pupose RAM – 512B RAM waveform-generator look-up table – 8-MHz on-chip oscillator Peripheral features – Serial peripheral interface (SPI) – One-wire interface (OWI) – Ratiometric and absolute voltage output General features – Operational supply range: 3.5 V to 30 V – Ambient temperature range: –40°C to +125°C – DMOS gate controller for extended supply range >30 V Further, the device contains a digital signaldemodulation block that interfaces to an integrated ARM-Cortex M0 MCU, allowing implementation of custom sensor-compensation algorithms stored in the device nonvolatile memory. External system communication is achieved by using any of the SPI, OWI, GPIO, or PWM digital interfaces. Analog output is supported through a 14-bit DAC and programmable-gain amplifier offering reference or absolute-voltage output. Sensing-element excitation is achieved by the use of an integrated waveform generator and waveform amplifier. The waveform signal data is user-defined and stored in a designated RAM memory area. Besides the primary functional components, the PGA970 is equipped with additional support circuitry. The device diagnostics, sensor diagnostics, and integrated temperature sensor provide protection and information about the integrity of the overall system and sensing element. The device also includes a gate-controller circuit which when used with an external depletion MOSFET can regulate the device supply voltage in systems where the supply voltage exceeds 30 V. Device Information(1) ORDER NUMBER Position sensor signal conditioning Linear variable differential transformer (LVDT) Rotational variable differential transformer (RVDT) Resolver RLC measurement BODY SIZE (NOM) HTQFP (48) PGA970QPHPT 7.00 mm × 7.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Diagram PI 2 Applications • • • • • PACKAGE PGA970QPHPR Reference PE LVDT Sensor Power Management Software and Data Memory Waveform Generator P2 P1 Wave Gain S1P PGA C o r e PGA970 Internal Oscillator ADC S1N Digital Demodulation 16KB FRAM 2KB RAM 512B RAM OWI VDD (3.3 to 30 V) SPI MISO/MOSI CSN/SCK GPIO1 GPIO2 GPIO S2P PGA S2N ADC Digital Demodulation 14-bit DAC Control and Status Registers OUT Gain COMP AIN1 3 Description The PGA970 is a highly integrated system-on-chip LVDT sensor-signal conditioner with advanced signalprocessing capabilities. It contains a three-channel, low-noise, programmable-gain, analog front end that allows direct connection to the sense element, followed by three independent 24-bit delta-sigma ADCs. External Temperature Sensor M U X FBN PGA ADC Internal Temperature Sensor Diagnostics ARM Cortex M0 (User Programmable) Debugger SWDIO SWDCLK Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. PGA970 SLDS257 – APRIL 2019 www.ti.com 4 Device and Documentation Support 4.1 Documentation Support 4.1.1 Related Documentation For related documentation see the following: • Texas Instruments, PGA970 GUI user's guide • Texas Instruments, PGA970 Software Quick Start Guide user's guide • Texas Instruments, PGA970 Software user's guide • Texas Instruments, PGA970EVM user's guide 4.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 4.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 4.4 Trademarks E2E is a trademark of Texas Instruments. ARM, Cortex are registered trademarks of ARM Limited. All other trademarks are the property of their respective owners. 4.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated device. This data is subject to change without notice and without revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane. 2 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: PGA970 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) PGA970QPHPR ACTIVE HTQFP PHP 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 PGA970Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of