PTH03050YAST

PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A – MARCH 2004 – REVISED OCTOBER 2005 6-A NON-ISOLATED DDR/QDR MEMORY BUS TERMINATION MODULES FEATURES • • • • • • • • • VTT Bus Termination Output (Output Tracks the System VREF) 6 A Output Current (8 A Peak) 3.3-V, 5-V or 12-V Input Voltage DDR and QDR Compatible On/Off Inhibit (for VTT Standby) Undervoltage Lockout Operating Temperature: –40°C to 85°C Efficiencies up to 88% Output Overcurrent Protection (Non-Latching, Auto-Reset) • • • 50 W/in3 Power Density Safety Agency Approvals: UL/cUL60950, EN60950, VDE Point-of-Load Alliance (POLA™) Compatible NOMINAL SIZE =0.87 in x 0.5 in (22,1 mm x 12,57 mm) DESCRIPTION The PTHxx050Y are a series of ready-to-use switching regulator modules from Texas Instruments designed specifically for bus termination in DDR and QDR memory applications. Operating from either a 3.3-V, 5-V or 12-V input, the modules generate a VTT output that will source or sink up to 6 A of current (8 A transient) to accurately track their VREF input. VTT is the required bus termination supply voltage, and VREF is the reference voltage for the memory and chipset bus receiver comparators. VREF is usually set to half the VDDQ power supply voltage. Both the PTHxx050Y series employs an actively switched synchronous rectifier output to provide state-of-the-art stepdown switching conversion. The products are small in size (0.87 in × 0.5 in), and are an ideal choice where space, performance, and high efficiency are desired, along with the convenience of a ready-to-use module. Operating features include an on/off inhibit and output over-current protection (source mode only). The on/off inhibit feature allows the VTT bus to be turned off to save power in a standby mode of operation. Package options include both throughhole and surface mount configurations. STANDARD APPLICATION VIN VDDQ VREF 1k 1% 1 2 3 1k 1% 4 Standby Q1 BSS138 (Optional) VTT PTHxx050Y (Top View) Con hf−Ceramic 5 Co1 Low−ESR (Required) Co2 Ceramic (Optional) VTTTermination Island CIN (Required) 6 SSTL−2 Bus GND CIN = Required Electrolytic Capacitor; 220µF (3.3 ± 5 V Input), 560 µF (12 V Input). Co1 = Required Low-ESR Electrolyitic Capacitor; 470 µF (3.3 ± 5 V Input), 940 µF (12 V Input). Co2 = Ceramic Capacitance for Response to a 3 A (+ 1.5 A) Load Transient; 200 µF (3.3 ± 5 V Input), 400 µF (12 V Input). Con = Distributed hf-Ceramic Decoupling Capacitors for VTT bus; as Recommended for DDR Memory Applications. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. POLA is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2005, Texas Instruments Incorporated PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A – MARCH 2004 – REVISED OCTOBER 2005 ORDERING INFORMATION PTHXX050Y (Base Part Number) Input Voltage Part Number 3.3 V 5V 12 V (1) (2) (3) (4) (1) DESCRIPTION Pb – free and RoHS (3) Mechanical Package (2) PTH03050YAH Horizontal T/H Yes PTH03050YAS Standard SMD No (4) EUU EUV EUV PTH03050YAZ Optional SMD Yes (3) PTH05050YAH Horizontal T/H Yes (3) EUU PTH05050YAS Standard SMD No (4) EUV EUV PTH05050YAZ Optional SMD Yes (3) PTH12050YAH Horizontal T/H Yes (3) EUU PTH12050YAS Standard SMD No (4) EUV PTH12050YAZ Optional SMD Yes (3) EUV Add T to end of part number for tape and reel on SMD packages only. Reference the applicable package reference drawing for the dimensions and PC board layout. Lead (Pb) –free option specifies Sn/Ag pin solder material. Standard option specifies 63/37, Sn/Pb pin solder material. ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS voltages are with respect to GND UNIT VREF Control input voltage TA Operating temperature range Over VIN range Twave Wave solder temperature Surface temperature of module body or pins (5 seconds) Treflow Solder reflow temperature Surface temperature of module body or pins Ts Storage temperature –0.3 V to Vi+0.3 V 2 260°C (2) PTHXX050YAS 235°C (2) PTHXX050YAZ 260°C (2) –40°C to 125°C Per Mil-STD-883D, Method 2002.3 1 msec, 1/2 Sine, mounted 500 G Mechanical vibration Mil-STD-883D, Method 2007.2 20-2000 Hz 20 G Flammability (2) PTHXX050YAH Mechanical shock Weight (1) –40°C to 85°C (1) 2.9 grams Meets UL 94V-O For operation below 0°C the external capacitors m ust bave stable characteristics, use either a low ESR tantalum, Os-Con, or ceramic capacitor. During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated maximum. PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A – MARCH 2004 – REVISED OCTOBER 2005 ELECTRICAL SPECIFICATIONS TA = 25°C; nominal VIN; VREF = 1.25 V; CIN, CO1, and CO2 = typical values; and Io = Iomax (unless otherwise stated) PARAMETER IO Output current TEST CONDITIONS Over VREF range Continuous Input voltage range Over IO range ∆VREF Tracking range for VREF |VTT– VREF| Tracking tolerance to VREF Over line, load and temperature η Efficiency Io = 4 A TYP 0 Repetitive pulse PTH03050Y VIN MIN 2.95 MAX UNIT ±6 (1) A ±8 (2) A 3.65 PTH05050Y 4.5 5.5 PTH12050Y 10.8 13.2 0.55 1.8 V –10 10 mV PTH03050Y V 88% PTH05050Y 87% PTH12050Y 84% Vr Vo Ripple (pk-pk) 20 MHz bandwidth 20 Io trip Overcurrent threshold Reset, followed by auto recovery 12 A 80 µsec ttr Load transient response Vtr 15 A/µs load step, from: – 1.5 A to 1.5 A (3) VIN Increasing UVLO Under-voltage lockout VIN Dncreasing Inhibit control (pin 4) Input high voltage VIH Inhibit control (pin 4) Input low voltage IIL inhibit Inhibit control (pin 4) Input low curent Pin to GND IIN inh Input standby current Inhibit control (pin 4) to GND Switching frequency CIN External input capacitance Over VIN and IO ranges Capacitance value: Nonceramic Co1, Co2 External output capacitance VO over/undershoot 25 40 PTH03050Y 2.45 2.8 PTH05050Y 4.3 4.45 PTH12050Y 9.5 10.4 PTH03050Y 2.0 2.40 PTH05050Y 3.4 3.7 PTH12050Y 8.8 9 Referenced to GND VIL fs Recovery time Capacitance value: Ceramic (1) (2) (3) (4) (5) (6) (7) Reliability VIN–0.5 Open (4) –0.2 0.6 10 600 650 PTH12050Y 200 250 300 PTH03050Y/PTH05050Y 220 (5) PTH12050Y 560 (5) PTH03050Y/PTH05050Y 470 (3) 3300 (6) PTH12050Y 940 (3) 3300 (6) V kHz µF PTH03050Y/PTH05050Y 200 (3) 300 PTH12050Y 400 (3) 600 6 V mA 550 4 (7) V µA PTH03050Y/PTH05050Y Per Bellcore TR-332 50 % stress, TA = 40°C, ground benign mV V 130 Equiv. series resistance (non-ceramic) MTBF mVpp µF µF mΩ 106 Hrs Rating is conditional on the module being directly soldered to a 4-layer PCB with 1 oz. copper. See the SOA curves or contact the factory for appropriate derating. The PTH03050Y and PTH05050Y require no derating up to 85°C operating temperature and natural convection airflow. Up to 10 ms pulse period at 10% maximum duty. The minimum value of external output capacitance value ensures that VTT meets the specified transient performance requirements for the memory bus terminations. Lower values of capacitance may be possible when the measured peak change in output current is consistently less than 3 A. This control pin has an internal pull-up to the input voltage VIN. If it is left open-circuit the module will operate when input power is applied. A small low-leakage (6100 10 × 13 1 (3) ≤1 16SEPC470M SVP, Os-con (SMD) 16 330 0.016 4700 11 × 12 2 ≤2 16SVP330M SVPC Os-con (SMD) 4 1200 0.010 4700 8 × 11,9 N/R (2) ≤1 4SVPC1200M AVX, Tantalum TPS (SMD) 10 470 0.045 >1723 7,3 × 5,7 × 4,1 N/R (2) ≤5 TPSE477M019R0045 10 330 0.045 >1723 N/R (2) ≤5 TPSE337M019R0045 6.3 470 0.040 1800 N/R (2) ≤5 T520X477M006ASE040 T530, Tantalum/Organic 4 680 0.010 >5100 N/R (2) ≤1 T530X687M004ASE010 T530, Tantalum/Organic 6.3 470 0.010 5200 N/R (2) ≤1 T530X477M006ASE010 594D, Tantalum (SMD) 10 470 0.100 1440 7,2 × 6 × 4,1 N/R (2) ≤5 595D477X0010R2T 94SVP, Os-con (SMD) 16 330 0.017 >4500 10 × 12,7 2 ≤2 94SVP337X0016F12 94SA, Organic (Radial) 16 1000 0.015 >9700 16 × 25 1 ≤2 94SA108X0016HBP Kemet, Ceramic X5R (SMD) 16 10 0.002 3225 mm 1 (4) ≤5 C1210C106M4PAC 6.3 47 0.002 3225 mm N/R (2) ≤5 C1210C476K9PAC Murata, Ceramic X5R (SMD) 6.3 100 0.002 3225 mm N/R (2) ≤3 GRM32ER60J107M 6.3 47 3225 mm N/R (2) ≤5 GRM32ER60J476M Sanyo Kemet T520, Poly-Tantalum (SMD) 4,3 × 7,3 × 4 Vishay-Sprague TDK, Ceramic X5R (SMD) (1) (2) (3) (4) 10 16 22 1 (4) ≤5 GRM32ER61C226K 16 10 1 (4) ≤5 GRM32DR61C106K 6.3 100 3225 mm N/R (2) ≤3 C3225X5R0J107MT 6.3 47 3225 mm N/R (2) ≤5 C3225X5R0J476MT 16 22 1 (4) ≤5 C3225X5R1C226MT 16 10 1 (4) ≤5 C3225X5R1C106MT 0.002 Capacitor Supplier Verification Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term consideration for obsolescence. RoHS, Lead-free and Material Details Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements. Component designators or part number deviations can occur when material composition or soldering requirements are updated. N/R – Not recommended. The capacitor voltage rating does not meet the minimum operating limits. A total capacitance of 470 µF is acceptable based on the combined ripple current rating. Ceramic capacitors are recommended to complement electrolytic types at the input and to reduce high-frequency ripple current. www.ti.com PTH03050Y PTH05050Y PTH12050Y SLTS221A – MARCH 2004 – REVISED OCTOBER 2005 Designing for Very Fast Load Transients The transient response of the DC/DC converter has been characterized using a load transient with a di/dt of 1 A/µs. The typical voltage deviation for this load transient is given in the data sheet specification table using the optional value of output capacitance. As the di/dt of a transient is increased, the response of a converter's regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with any DC/DC converter once the speed of the transient exceeds its bandwidth capability. If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional output capacitor decoupling. In these cases special attention must be paid to the type, value and ESR of the capacitors selected. If the transient performance requirements exceed that specified in the data sheet, or the total amount of load capacitance is above 3300 µF, the selection of output capacitors becomes more important. 11 PTH03050Y PTH05050Y PTH12050Y SLTS221A – MARCH 2004 – REVISED OCTOBER 2005 TAPE AND REEL SPECIFICATION 12 www.ti.com PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A – MARCH 2004 – REVISED OCTOBER 2005 TRAY SPECIFICATION 13 PACKAGE OPTION ADDENDUM www.ti.com 4-Apr-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) (4/5) (6) PTH03050YAH ACTIVE ThroughHole Module EUU 6 56 RoHS Exempt & Green SN N / A for Pkg Type -40 to 85 PTH03050YAS ACTIVE Surface Mount Module EUV 6 56 Non-RoHS & Green SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS -40 to 85 PTH03050YAST ACTIVE Surface Mount Module EUV 6 250 Non-RoHS & Green SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS -40 to 85 PTH03050YAZ ACTIVE Surface Mount Module EUV 6 56 RoHS (In Work) & Green SNAGCU Level-3-260C-168 HR -40 to 85 PTH05050YAH ACTIVE ThroughHole Module EUU 6 56 RoHS (In Work) & Green (In Work) SN N / A for Pkg Type -40 to 85 PTH05050YAS ACTIVE Surface Mount Module EUV 6 56 Non-RoHS & Green SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS -40 to 85 PTH05050YAZ ACTIVE Surface Mount Module EUV 6 56 RoHS (In Work) & Green SNAGCU Level-3-260C-168 HR -40 to 85 PTH05050YAZT ACTIVE Surface Mount Module EUV 6 250 RoHS (In Work) & Green SNAGCU Level-3-260C-168 HR -40 to 85 PTH12050YAH ACTIVE ThroughHole Module EUU 6 56 RoHS Exempt & Green (In Work) SN N / A for Pkg Type -40 to 85 PTH12050YAS ACTIVE Surface Mount Module EUV 6 56 Non-RoHS & Green (In Work) SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS -40 to 85 PTH12050YAST ACTIVE Surface Mount Module EUV 6 250 Non-RoHS & Green (In Work) SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS -40 to 85 PTH12050YAZ ACTIVE Surface Mount Module EUV 6 56 RoHS (In Work) & Green (In Work) SNAGCU Level-3-260C-168 HR -40 to 85 PTH12050YAZT ACTIVE Surface Mount Module EUV 6 250 RoHS (In Work) & Green (In Work) SNAGCU Level-3-260C-168 HR -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 Device Marking Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Apr-2022 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of