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RC4580
SLOS412D – APRIL 2003 – REVISED NOVEMBER 2014
RC4580 Dual Audio Operational Amplifier
1 Features
3 Description
•
•
•
•
•
•
•
The RC4580 device is a dual operational amplifier
that has been designed optimally for audio
applications, such as improving tone control. It offers
low noise, high gain bandwidth, low harmonic
distortion, and high output current, all of which make
the device ideally suited for audio electronics, such
as preamplifiers, active filters, and industrial
measurement equipment. When high output current is
required, the RC4580 device can be used as a
headphone amplifier. Due to its wide operating supply
voltage, the RC4580 device can also be used in lowvoltage applications.
1
±2-V to ±18-V Operating Voltage
0.8-μVrms Low Noise Voltage
12-MHz Gain Bandwidth Product
0.0005% Total Harmonic Distortion
5-V/μs Slew Rate
Drop-In Replacement for NJM4580
Pin and Function Compatible with LM833,
NE5532, NJM4558/9, and NJM4560/2/5 devices
2 Applications
•
•
•
•
Audio Preamplifiers
Active Filters
Headphone Amplifiers
Industrial Measurement Equipment
Device Information(1)
PART NUMBER
RC4580
PACKAGE
BODY SIZE (NOM)
SOIC (8)
4.90 mm × 3.91 mm
TSSOP (8)
3.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Noninverting Amplifier Schematic
VIN
RIN
RG
+
VOUT
RF
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
RC4580
SLOS412D – APRIL 2003 – REVISED NOVEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
5
5
Absolute Maximum Ratings ......................................
Handling Ratings.......................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Operating Characteristics..........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Mode ........................................... 8
8
Application and Implementation .......................... 9
8.1 Typical Application ................................................... 9
9 Power Supply Recommendations...................... 12
10 Layout................................................................... 13
10.1 Layout Guidelines ................................................. 13
10.2 Layout Example .................................................... 13
11 Device and Documentation Support ................. 14
11.1 Trademarks ........................................................... 14
11.2 Electrostatic Discharge Caution ............................ 14
11.3 Glossary ................................................................ 14
12 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
Changes from Revision C (March 2004) to Revision D
Page
•
Added Applications, Device Information table, Pin Functions table, Handling Ratings table, Feature Description
section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations
section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable
Information section. ................................................................................................................................................................ 1
•
Removed Ordering Information table. .................................................................................................................................... 1
•
Changed TA = 25°C to TA = –40°C to 125°C in condition statement for Electrical Characteristics table and
Operational Characteristics table. .......................................................................................................................................... 5
2
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5 Pin Configuration and Functions
D PACKAGE
SOIC – 8
(TOP VIEW)
–
–
–
PW PACKAGE
TSSOP – 8
(TOP VIEW)
–
–
–
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
1IN+
3
I
Noninverting input
1IN-
2
I
Inverting Input
1OUT
1
O
Output
2IN+
5
I
Noninverting input
2IN-
6
I
Inverting Input
2OUT
7
O
Output
VCC+
8
—
Positive Supply
VCC-
4
—
Negative Supply
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SLOS412D – APRIL 2003 – REVISED NOVEMBER 2014
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MAX
UNIT
VCC
Supply voltage
MIN
±18
V
VI
Input voltage (any input)
±15
V
VID
Differential input voltage
±30
V
IO
Output current
±50
mA
TA
Ambient temperature range
–40
125
°C
Tstg
Storage temperature range
–60
125
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 Handling Ratings
Tstg
V(ESD)
(1)
(2)
MIN
MAX
UNIT
–60
125
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
0
1000
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2)
0
1000
Storage temperature range
Electrostatic discharge
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
VCC+
Supply voltage
VCC–
VICR
Input common-mode voltage range
TA
Operating free-air temperature
MAX
UNIT
2
16
–2
–16
–13.5
13.5
V
–40
125
°C
V
6.4 Thermal Information
RC4580
THERMAL METRIC (1)
D
PW
8 PINS
8 PINS
163
RθJA
Junction-to-ambient thermal resistance
109
RθJC(top)
Junction-to-case (top) thermal resistance
55.7
38
RθJB
Junction-to-board thermal resistance
49
90.6
ψJT
Junction-to-top characterization parameter
10.6
1.3
ψJB
Junction-to-board characterization parameter
48.6
88.9
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
—
(1)
4
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics
VCC± = ±15 V, TA = –40°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIO
Input offset voltage
IIO
Input offset current
IIB
Input bias current
AVD
Large-signal differential voltage amplification
RL ≥ 2 kΩ, VO = ±10 V
VCM
Output voltage swing
RL ≥ 2 kΩ
VICR
Common-mode input voltage
CMRR
Common-mode rejection ratio
kSVR
Supply-voltage rejection ratio (1)
ICC
Total supply current (all amplifiers)
(1)
MIN
RS = < 10 kΩ
TYP
MAX
UNIT
0.5
3
mV
5
200
nA
100
500
nA
90
110
dB
±12
±13.5
V
±12
±13.5
V
RS ≤ 10 kΩ
80
110
dB
RS ≤ 10 kΩ
80
110
6
dB
9
mA
Measured with VCC± varied simultaneously
6.6 Operating Characteristics
VCC± = ±15 V, TA = –40°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
UNIT
SR
Slew rate at unity gain
RL ≥ 2 kΩ
5
V/μs
GBW
Gain-bandwidth product
f = 10 kHz
12
MHz
THD
Total harmonic distortion
VO = 5 V, RL = 2 kΩ, f = 1 kHz, AVD = 20 dB
Vn
Equivalent input noise voltage
RIAA, RS ≤ 2.2 kΩ, 30-kHz LPF
0.0005%
0.8
μVrms
Maximum Output Voltage Swing, VO (V)
Maximum Output Voltage Swing, VO (V)
6.7 Typical Characteristics
Frequency (kHz)
Load Resistance, RL (Ω)
Output Voltage Swing (V)
Equivalent Input Noise Voltage, Vn (nV/
)
Figure 1. Maximum Output Voltage Swing vs Load
Resistance
Figure 2. Maximum Ouput Voltage Swing vs Frequency
Output Current, IO (mA)
Frequency (Hz)
Figure 3. Output Voltage Swing vs Output Current
Figure 4. Equivalent Input Noise Voltage vs Frequency
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Operating Current, ICC (mA)
Output Voltage Swing, VO (V)
Typical Characteristics (continued)
Ambient Temperature, TA (°C)
Figure 6. Output Voltage Swing vs Temperature
Input Offset Voltage, VIO (V)
Maximum Output Voltage Swing, VO (V)
Ambient Temperature, TA (°C)
Figure 5. Operating Current vs Temperature
–
Operating Current (mA)
Operating Voltage, VCC (V)
Figure 8. Input Bias Current vs Temperature
Maximum Output Voltage Swing, VO (V)
Ambient Temperature, TA (°C)
Figure 7. Input Offset Voltage vs Temperature
–
Operating Voltage, VCC (V)
Operating Voltage, VCC (V)
Figure 9. Maximum Output Voltage Swing vs Operating
Voltage
6
Figure 10. Operating Current vs Operating Voltage
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Phase (deg)
Voltage Gain (dB)
Total Harmonic Distortion, THD (%)
Typical Characteristics (continued)
Output Voltage, VO (V)
Frequency (Hz)
Figure 11. Total Harmonic Distortion vs Output Voltage
Figure 12. Voltage Gain, Phase vs Frequency
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7 Detailed Description
7.1 Overview
The RC4580 device is a dual operational amplifier that has been designed optimally for audio applications, such
as improving tone control. It offers low noise, high gain bandwidth, low harmonic distortion, and high output
current, all of which make the device ideally suited for audio electronics, such as preamplifiers, active filters, and
industrial measurement equipment. When high output current is required, the RC4580 device can be used as a
headphone amplifier. Due to its wide operating supply voltage, the RC4580 device can also be used in lowvoltage applications.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Unity-Gain Bandwidth
The unity-gain bandwidth is the frequency up to which an amplifier with a unity gain may be operated without
greatly distorting the signal. The RC4580 device has a 12-MHz unity-gain bandwidth.
7.3.2 Common-Mode Rejection Ratio
The common-mode rejection ratio (CMRR) of an amplifier is a measure of how well the device rejects unwanted
input signals common to both input leads. It is found by taking the ratio of the change in input offset voltage to
the change in the input voltage, then converting to decibels. Ideally the CMRR is infinite, but in practice,
amplifiers are designed to have it as high as possible. The CMRR of the RC4580 device is 110 dB.
7.3.3 Slew Rate
The slew rate is the rate at which an operational amplifier can change its output when there is a change on the
input. The RC4580 device has a 5-V/ms slew rate.
7.4 Device Functional Mode
The RC4580 device is powered on when the supply is connected. Each device can be operated as a singlesupply operational amplifier or dual-supply amplifier depending on the application.
8
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Typical Application
Some applications require differential signals. Figure 13 shows a simple circuit to convert a single-ended input of
2 V to 10 V into differential output of ±8 V on a single 15-V supply. The output range is intentionally limited to
maximize linearity. The circuit is composed of two amplifiers. One amplifier acts as a buffer and creates a
voltage, VOUT+. The second amplifier inverts the input and adds a reference voltage to generate VOUT–. Both
VOUT+ and VOUT– range from 2 V to 10 V. The difference, VDIFF, is the difference between VOUT+ and VOUT–.
R2
15 V
R1
VOUT+
±
R3
VREF
12 V
R4
VDIFF
+
VOUT+
+
VIN
Figure 13. Schematic for Single-Ended Input to Differential Output Conversion
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Typical Application (continued)
8.1.1 Design Requirements
The design requirements are as follows:
• Supply voltage: 15 V
• Reference voltage: 12V
• Input: 2 V to 10 V
• Output differential: ±8 V
8.1.2 Detailed Design Procedure
The circuit in Figure 13 takes a single-ended input signal, VIN, and generates two output signals, VOUT+ and
VOUT– using two amplifiers and a reference voltage, VREF. VOUT+ is the output of the first amplifier and is a
buffered version of the input signal, VIN (see Equation 1). VOUT– is the output of the second amplifier which uses
VREF to add an offset voltage to VIN and feedback to add inverting gain. The transfer function for VOUT– is
Equation 2.
VOUT+ = VIN
(1)
æ R 44 ö æ R22 ö
R2
VOUT
- VINin ´ 2
out - = VREF
ref ´ ç
÷ ´ ç1 +
÷
+ R 44 ø è
R11 ø
R11
è R33+
(2)
The differential output signal, VDIFF, is the difference between the two single-ended output signals, VOUT+ and
VOUT–. Equation 3 shows the transfer function for VDIFF. By applying the conditions that R1 = R2 and R3 = R4, the
transfer function is simplified into Equation 6. Using this configuration, the maximum input signal is equal to the
reference voltage and the maximum output of each amplifier is equal to the VREF. The differential output range is
2×VREF. Furthermore, the common mode voltage will be one half of VREF (see Equation 7).
æ
öæ
æ
R ö
R4
R2 ö
VD IF F = V O U T + - V O U T - = VIN ´ ç 1 + 2 ÷ - VR E F ´ ç
÷ ç1 +
÷
R1 ø
R1 ø
è
è R3 + R4 ø è
VOUT+ = VIN
VOUT– = VREF – VIN
VDIFF = 2×VIN – VREF
(3)
(4)
(5)
(6)
+ VOUT - ö 1
æV
Vcm = ç OUT +
÷ = VREF
2
è
ø 2
(7)
8.1.2.1 Amplifier Selection
Linearity over the input range is key for good dc accuracy. The common mode input range and the output swing
limitations determine the linearity. In general, an amplifier with rail-to-rail input and output swing is required.
Bandwidth is a key concern for this design. Because the RC4580 device has a bandwidth of 12 MHz, this circuit
will only be able to process signals with frequencies of less than 12 MHz.
8.1.2.2 Passive Component Selection
Because the transfer function of VOUT– is heavily reliant on resistors (R1, R2, R3, and R4), use resistors with low
tolerances to maximize performance and minimize error. This design used resistors with resistance values of
36 kΩ with tolerances measured to be within 2%. But, if the noise of the system is a key parameter, the user can
select smaller resistance values (6 kΩ or lower) to keep the overall system noise low. This ensures that the noise
from the resistors is lower than the amplifier noise.
10
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Typical Application (continued)
8.1.3 Application Curves
16
14
12
12
8
10
VOUT+ (V)
VDIFF (V)
The measured transfer functions in Figure 14, Figure 15, and Figure 16 were generated by sweeping the input
voltage from 0 V to 12 V. However, this design should only be used between 2 V and 10 V for optimum linearity.
4
0
8
6
±4
4
±8
2
±12
0
0
2
4
6
8
10
VIN (V)
12
0
2
4
6
8
10
VIN (V)
C003
Figure 14. Differential Output Voltage vs Input Voltage
12
C001
Figure 15. Positive Output Voltage vs Input Voltage
12
10
VOUTt (V)
8
6
4
2
0
0
2
4
6
8
VIN (V)
10
12
C002
Figure 16. Positive Output Voltage vs Input Voltage
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9 Power Supply Recommendations
The RC4580 device is specified for operation over the range of ±2 to ±16 V; many specifications apply from 40°C to 125°C. The Typical Characteristics section presents parameters that can exhibit significant variance with
regard to operating voltage or temperature.
CAUTION
Supply voltages outside of the ±18 V range can permanently damage the device (see
the Absolute Maximum Ratings).
Place 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high
impedance power supplies. For more detailed information on bypass capacitor placement, refer to the Layout
Guidelines.
12
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SLOS412D – APRIL 2003 – REVISED NOVEMBER 2014
10 Layout
10.1 Layout Guidelines
•
•
•
•
•
•
For best operational performance of the device, use good PCB layout practices, including:
Noise can propagate into analog circuitry through the power pins of the circuit as a whole and the operational
amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance power
sources local to the analog circuitry.
– Connect low-ESR, 0.1-μF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single
supply applications.
Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current. For more detailed information, refer to
Circuit Board Layout Techniques, (SLOA089).
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If
it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as
opposed to in parallel with the noisy trace.
Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Layout Example.
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.
10.2 Layout Example
VIN
RIN
RG
+
VOUT
RF
Figure 17. Operational Amplifier Schematic for Noninverting Configuration
Place components close to
device and to each other to
reduce parasitic errors
Run the input traces as far
away from the supply lines
as possible
VS+
RF
OUT1
VCC+
GND
IN1í
OUT2
VIN
IN1+
IN2í
VCCí
IN2+
RG
GND
RIN
Use low-ESR, ceramic
bypass capacitor
Only needed for
dual-supply
operation
GND
VS(or GND for single supply)
Ground (GND) plane on another layer
Figure 18. Operational Amplifier Board Layout for Noninverting Configuration
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11 Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
14
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PACKAGE OPTION ADDENDUM
www.ti.com
21-Aug-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
75
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TBD
Call TI
Call TI
-40 to 85
Device Marking
(4/5)
RC4580ID
ACTIVE
SOIC
D
8
RC4580IDE4
ACTIVE
SOIC
D
8
RC4580IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
R4580I
RC4580IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
R4580I
RC4580IDRE4
ACTIVE
SOIC
D
8
TBD
Call TI
Call TI
-40 to 85
RC4580IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
R4580I
RC4580IP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
RC4580IP
RC4580IPE4
ACTIVE
PDIP
P
8
TBD
Call TI
Call TI
-40 to 85
RC4580IPW
ACTIVE
TSSOP
PW
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
RC4580IPWE4
ACTIVE
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 85
RC4580IPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
R4580I
RC4580IPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
R4580I
RC4580IPWRE4
ACTIVE
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 85
RC4580IPWRG4
ACTIVE
TSSOP
PW
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
150
2000
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
R4580I
R4580I
R4580I
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
21-Aug-2014
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF RC4580 :
• Automotive: RC4580-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Aug-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
RC4580IDR
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
RC4580IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
RC4580IPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Aug-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
RC4580IDR
SOIC
D
8
2500
340.5
338.1
20.6
RC4580IDR
SOIC
D
8
2500
367.0
367.0
35.0
RC4580IPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
Pack Materials-Page 2
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