REF1004_08

REF1004_08

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

  • 描述:

    REF1004_08 - 1.2V and 2.5V Micropower VOLTAGE REFERENCE - Burr-Brown Corporation

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REF1004_08 数据手册
REF1004 1.2V and 2.5V Micropower VOLTAGE REFERENCE FEATURES q INITIAL ACCURACY: REF1004-1.2 ±4mV REF1004-2.5 ±20mV q MINIMUM OPERATING CURRENT: REF1004-1.2 10µA REF1004-2.5 20µA q EXCELLENT LONG TERM TEMPERATURE STABILITY q VERY LOW DYNAMIC IMPEDANCE q OPERATES UP TO 20mA q PACKAGE: 8-Lead SOIC DESCRIPTION The REF1004-1.2 and REF1004-2.5 are two terminal bandgap reference diodes designed for high accuracy with outstanding temperature characteristics at low operating currents. Prior to the introduction of the REF1004 Micropower Voltage References, accuracy and stability specifications could only be attained by expensive screening of standard devices. The REF1004 is a cost effective solution when reference voltage accuracy, low power, and long term temperature stability are required. REF1004 is a drop-in replacement for the LT1004 as well as an upgraded replacement of the LM185/385 series references. The REF1004C is characterized for operation from 0°C to 70°C and the REF1004I is characterized for operation from –40°C to +85°C. The REF1004 is offered in an 8-lead Plastic SOIC package and shipped in anti-static rails or tape and reel. APPLICATIONS q BATTERY POWERED TEST EQUIPMENT q PORTABLE MEDICAL INSTRUMENTATION q PORTABLE COMMUNICATIONS DEVICES q A/D AND D/A CONVERTERS q NOTEBOOK AND PALMTOP COMPUTERS Typical Operating Circuit NC NC NC Anode 1 2 3 4 8 7 6 5 Cathode NC Cathode NC (Top View) International Airport Industrial Park • Mailing Address: PO Box 11400 Tel: (520) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP • © • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 1992 Burr-Brown Corporation PDS-1172 Printed in U.S.A. October, 1993 SBVS002 SPECIFICATIONS ELECTRICAL TA = +25°C unless otherwise noted. REF1004-1.2 PARAMETER REFERENCE VOLTAGE REF1004C(1) REF1004I(2) AVERAGE TEMPERATURE COEFFICIENT MINIMUM OPERATION CURRENT(3) REVERSE BREAKDOWN VOLTAGE CHANGE WITH CURRENT IMIN ≤ IR ≤ 1mA 1mA ≤ IR ≤ 20mA CONDITIONS IR = 100µA MIN 1.231 1.229 1.225 TYP 1.235 1.235 1.235 20 MAX 1.239 1.239 1.239 MIN 2.490 2.487 2.480 REF1004-2.5 TYP 2.500 2.500 2.500 20 MAX 2.511 2.511 2.511 UNITS V IMIN ≤ IR ≤ 20mA ppm/°C 20 1 1.5(3) 10 20(3) µA mV 8 10 1 1.5(3) 10 20(3) 12 REVERSE DYNAMIC IMPEDANCE(3) WIDE BAND NOISE (RMS) 10Hz ≤ IR ≤ 10kHz LONG TERM STABILITY TA = 25°C ± 0.1°C IR = 100µA IR = 100µA 0.2 0.6 0.2 0.6 Ω µV ppm/KHr 60 IR = 100µA 20 120 20 NOTES: (1) This specification applies over the full operating temperature range of 0°C ≤ TA ≤ 70°C. (2) This specification applies over the full operating temperature range of 40°C ≤ TA ≤ +85°C. (3) Denotes the specifications which apply over the full operating temperature range. ORDERING INFORMATION MODEL REF1004C-1.2 REF1004C-2.5 REF1004I-1.2 REF1004I-2.5 TA 0°C to +70°C 0°C to +70°C –40°C to +85°C –40°C to +85°C VZ 1.2V 2.5V 1.2V 2.5V PACKAGE 8-Lead 8-Lead 8-Lead 8-Lead SOIC SOIC SOIC SOIC NOTE: Available in Tape and Reel, Add –TR to Model Number. ABSOLUTE MAXIMUM RATINGS Reverse Breakdown Current ........................................................... 30mA Forward Current ................................................................................ 10mA Operating Temperature Range REF1004C ........................................................................ 0°C to +70°C REF1004I ...................................................................... –40°C to +85°C Storage Temperature REF1004C .................................................................. –65°C to +150°C REF1004I .................................................................... –65°C to +150°C Lead Temperature (soldering, 10s) ............................................... +300°C ORDERING INFORMATION MODEL REF1004C-1.2 REF1004C-2.5 REF1004I-1.2 REF1004I-2.5 PART MARKING BBREF0412 BBREF0425 BBREF0412 BBREF0425 PACKAGE INFORMATION MODEL REF1004C-1.2 REF1004C-2.5 REF1004I-1.2 REF1004I-2.5 PACKAGE 8-Pin 8-Pin 8-Pin 8-Pin SOIC SOIC SOIC SOIC PACKAGE DRAWING NUMBER(1) 182 182 182 182 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® REF1004 2 TYPICAL PERFORMANCE CURVES 1.2V TA = +25°C unless otherwise noted. REVERSE CHARACTERISTICS 100 –40°C ≤ TA ≤ +85°C Reverse Current (µA) Forward Voltage (V) FORWARD CHARACTERISTICS 1.2 TA = 25°C 10 0.8 1 0.4 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Reverse Voltage (V) 0.0 0.01 0.1 1 Forward Current (mA) 10 100 TEMPERATURE DRIFT 1.245 16 REVERSE VOLTAGE CHANGE –40°C ≤ TA ≤ +85°C 12 Reverse Voltage (V) 1.240 Output Voltage Change (mV) –35 –15 5 25 45 65 Temperature (°C) 85 105 125 1.235 8 4 1.230 0 1.225 –55 –4 0.01 0.1 1 Reverse Current (mA) 10 100 REVERSE DYNAMIC IMPEDANCE 100 f = 25Hz –40°C to +85°C 10 10k REVERSE DYNAMIC IMPEDANCE Reverse Impedance (Ω) Dynamic Impedance (Ω) 1k TA = +25°C IREF = 100µA 100 10 1 1 0.1 0.01 0.1 0.1 1 Reverse Current (mA) 10 100 10 100 1k 10k 100k 1M Frequency (Hz) ® 3 REF1004 TYPICAL PERFORMANCE CURVES 1.2V TA = +25°C unless otherwise noted. (CONT) NOISE VOLTAGE 700 600 Noise (nV/√Hz) FILTERED OUTPUT NOISE 70 60 Integrated Noise (µV) 100µA R IREF = 100µA 500 400 300 200 100 0 10 100 1k Frequency (Hz) IREF = 100µA TA = 25°C 50 40 30 20 10 0 C 10k 100k 100 1k 10k 100k Cutoff Frequency (Hz) RESPONSE TIME 1.5 1.0 0.5 Voltage (V) 0.0 VIN 36kΩ VOUT Output 5 2.5 0 0 100 200 Input 300 Time (µSec) 400 500 600 ® REF1004 4 TYPICAL PERFORMANCE CURVES 2.5V TA = +25°C unless otherwise noted. REVERSE CHARACTERISTICS 100 Output Voltage Change (mV) REVERSE VOLTAGE CHANGE 6 –40°C ≤ TA ≤ +85°C Reverse Current (µA) 5 4 3 2 1 0 –1 –40°C ≤ TA ≤ +85°C 10 1 0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Reverse Voltage (V) –2 0.01 0.1 1 Reverse Current (mA) 10 100 FORWARD CHARACTERISTICS 1.2 TA = +25°C 1.0 0.8 0.6 0.4 0.2 2.480 0.0 0.01 2.475 0.1 1 Forward Current (mA) 10 100 –55 –35 –15 Reference Voltage (V) Forward Voltage (V) TEMPERATURE DRIFT 2.520 2.515 2.510 2.505 2.500 2.495 2.490 2.485 5 25 45 65 Temperature (°C) 85 105 125 REVERSE DYNAMIC IMPEDANCE 1000 f = 25Hz –40°C to +85°C Reverse Impedance (Ω) REVERSE DYNAMIC IMPEDANCE 10k TA = +25°C IREF = 100µA 100 Dynamic Impedance (Ω) 1k 100 10 10 1 1 0.1 0.01 0.1 0.1 1 Reverse Current (mA) 10 100 10 100 1k 10k 100k 1M Frequency (Hz) ® 5 REF1004 TYPICAL PERFORMANCE CURVES 2.5V TA = +25°C unless otherwise noted. (CONT) NOISE VOLTAGE 1400 1200 Noise (nV/√Hz) 1000 800 600 400 200 0 10 100 1k Frequency (Hz) 10k 100k Integrated Noise (µV) FILTERED OUTPUT NOISE 120 100 80 C 60 40 20 0 100 100µA R IREF = 100µA IREF = 100µA 1k 10k 100k Cutoff Frequency (Hz) RESPONSE TIME 4.0 3.0 2.0 Voltage (V) Output 1.0 VIN 0.0 24kΩ VOUT 5.0 0.0 0 100 200 Input 300 Time (µSec) 400 500 600 ® REF1004 6 1.5V (see Note) VI ≥ 5V 100µA 22Ω Output REF1004-1.2 + 3kΩ 1.235V REF1004-1.2 5µF NOTE: Output regulates to 1.285V for IO = 0. FIGURE 1. Low-Noise Reference. FIGURE 3. 1.2V Reference from 1.5V Battery. 9V 510kΩ 1.235V REF1004-1.2 5V 50kΩ 2.5V REF1004-2.5 FIGURE2. Micropower Reference from 9V Battery. FIGURE 4. 2.5V Reference. Battery Output R1(1) 1% 1MΩ 12V TLC271 133kΩ 1% REF1004-1.2 LO = Battery Low NOTE: (1) R1 sets trip point, 60.4kΩ per cell for 1.8V per cell. FIGURE 5. Lead-Acid Low-Battery-Voltage Detector. ® 7 REF1004 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2008 PACKAGING INFORMATION Orderable Device REF1004C-1.2 REF1004C-1.2/2K5 REF1004C-1.2/2K5E4 REF1004C-1.2E4 REF1004C-2.5 REF1004C-2.5/2K5 REF1004C-2.5/2K5E4 REF1004C-2.5E4 REF1004I-1.2 REF1004I-1.2/2K5 REF1004I-1.2/2K5E4 REF1004I-1.2E4 REF1004I-2.5 REF1004I-2.5/2K5 REF1004I-2.5/2K5E4 REF1004I-2.5E4 (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC Package Drawing D D D D D D D D D D D D D D D D Pins Package Eco Plan (2) Qty 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 75 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 75 75 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 75 75 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 75 75 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 75 Green (RoHS & no Sb/Br) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2008 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SOIC SOIC SOIC SOIC D D D D 8 8 8 8 SPQ Reel Reel Diameter Width (mm) W1 (mm) 330.0 330.0 330.0 330.0 12.4 12.4 12.4 12.4 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 8.0 8.0 8.0 8.0 W Pin1 (mm) Quadrant 12.0 12.0 12.0 12.0 Q1 Q1 Q1 Q1 REF1004C-1.2/2K5 REF1004C-2.5/2K5 REF1004I-1.2/2K5 REF1004I-2.5/2K5 2500 2500 2500 2500 6.4 6.4 6.4 6.4 5.2 5.2 5.2 5.2 2.1 2.1 2.1 2.1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device REF1004C-1.2/2K5 REF1004C-2.5/2K5 REF1004I-1.2/2K5 REF1004I-2.5/2K5 Package Type SOIC SOIC SOIC SOIC Package Drawing D D D D Pins 8 8 8 8 SPQ 2500 2500 2500 2500 Length (mm) 346.0 346.0 346.0 346.0 Width (mm) 346.0 346.0 346.0 346.0 Height (mm) 29.0 29.0 29.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. 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Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated
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