REF3325-DIE
www.ti.com
SBOS621B – MAY 2012 – REVISED JULY 2012
DRIFT VOLTAGE REFERENCE
Check for Samples: REF3325-DIE
FEATURES
1
•
•
•
•
APPLICATIONS
Low Supply Current
High Output Current
Low Temperature Drift
High Initial Accuracy
•
•
•
•
Portable Equipment
Data Acquisition Systems
Medical Equipment
Test Equipment
DESCRIPTION
The REF3325 is a low-power, precision, low-dropout voltage reference. Small size and low power consumption
make the REF3325 ideal for a wide variety of portable and battery-powered applications.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE (2)
REF3325
TD
Bare die in waffle pack
ORDERABLE PART NUMBER
PACKAGE QUANTITY
REF3325ATDD1
400
REF3325ATDD2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
REF3325-DIE
SBOS621B – MAY 2012 – REVISED JULY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
15 mils.
Silicon with backgrind
Floating
TiW/AlCu (0.5%)
1100 nm
Table 1. Bond Pad Coordinates in Microns (1)
(1)
2
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
IN
1
38
629.6
114
Y MAX
705.6
N/C
2
22
134.5
98.15
210.65
N/C
3
22
22.1
98.15
98.25
N/C
4
199.25
22.1
275.4
98.25
OUT
5
504.15
21.3
580.15
97.3
OUT
6
616.35
21.3
692.35
97.3
GND
7
306.4
625.1
382.55
701.25
GND
8
183.8
630.65
259.95
706.8
Substrate N/C.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): REF3325-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
4-Aug-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
Samples
(4/5)
(6)
REF3325ATDD1
ACTIVE
0
400
RoHS & Green
Call TI
N / A for Pkg Type
0 to 70
Samples
REF3325ATDD2
ACTIVE
0
10
RoHS & Green
Call TI
N / A for Pkg Type
0 to 70
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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