REG11172K5G4

REG1117 REG1117A SBVS001D − OCTOBER 1992 − REVISED JULY 2004 800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable FEATURES D FIXED AND ADJUSTABLE VERSIONS D 2.85V MODEL FOR SCSI-2 ACTIVE D D D D D D TERMINATION OUTPUT CURRENT: REG1117: 800mA max REG1117A: 1A max OUTPUT TOLERANCE: +1% max DROPOUT VOLTAGE: REG1117: 1.2V max at IO = 800mA REG1117A: 1.3V max at IO = 1A INTERNAL CURRENT LIMIT THERMAL OVERLOAD PROTECTION SOT-223 AND DDPAK SURFACE-MOUNT PACKAGES DESCRIPTION The REG1117 is a family of easy-to-use three-terminal voltage regulators. The family includes a variety of fixedand adjustable-voltage versions, two currents (800mA and 1A) and two package types (SOT-223 and DDPAK). See the chart below for available options. Output voltage of the adjustable versions is set with two external resistors. The REG1117 low dropout voltage allows its use with as little as 1V input-output voltage differential. Laser trimming assures excellent output voltage accuracy without adjustment. An NPN output stage allows output stage drive to contribute to the load current for maximum efficiency. 800mA VOLTAGE SOT-223 DDPAK 1.8V 2.5V 2.85V 3.3V 5V Adjustable n n n n n n n n n n 1A SOT-223 DDPAK n n APPLICATIONS D D D D D D SCSI-2 ACTIVE TERMINATION HAND-HELD DATA COLLECTION DEVICES HIGH EFFICIENCY LINEAR REGULATORS BATTERY-POWERED INSTRUMENTATION BATTERY MANAGEMENT CIRCUITS FOR NOTEBOOK AND PALMTOP PCs CORE VOLTAGE SUPPLY: FPGA, PLD, DSP, CPU Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright  1992−2004, Texas Instruments Incorporated www.ti.com REG1117 REG1117A www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 ABSOLUTE MAXIMUM RATINGS(1) Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15V Operating Junction Temperature Range . . . . . . . . −40°C to +125°C Storage Temperature Range . . . . . . . . . . . . . . . . . −65°C to +150°C Lead Temperature (soldering, 10s)(2) . . . . . . . . . . . . . . . . . +300°C (1) Stresses above these ratings may cause permanent damage. (2) See Soldering Methods section. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. CONNECTION DIAGRAM Front View Plastic DDPAK Tab is VOUT Tab is VOUT Plastic SOT−223 Ground VOUT (Adj.)(1) VIN Ground VOUT (Adj.)(1) VIN NOTE: (1) Adjustable−Voltage Model. 2 REG1117 REG1117A www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 PACKAGE/ORDERING INFORMATION(1) PRODUCT VO/IO PACKAGE-LEAD PACKAGE DESIGNATOR OPERATING TEMPERATURE RANGE −40°C to +125°C −40°C to +125°C PACKAGE MARKING ORDERING NUMBER REG1117-2.85 BB11172 REG1117-2.85 REG1117-3.3 BB11174 REG1117-3.3 REG1117F-3.3KTTT BB1117F4 REG1117F-3.3/500 REG1117-5 BB11175 REG1117-5 REG1117 BB1117 REG1117 REG1117A-1.8 R111718 REG1117A-1.8 REG1117FA-1.8KTTT REG1117FA1.8 REG1117FA-1.8/500 REG1117A-2.5 R111725 REG1117A-2.5 REG1117FA-2.5KTTT REG1117FA2.5 REG1117FA-2.5/500 REG1117FA-5/KTTT BB1117FA5.0 REG1117FA-5/500 REG1117A BB1117A REG1117A REG1117FA/KTTT REG1117FA REG1117FA/500 TRANSPORT MEDIA, QUANTITY Rails, 80 Tape and Reel, 2500 Rails, 80 Tape and Reel, 2500 Tape and Reel, 50 Tape and Reel, 500 Rails, 80 Tape and Reel, 2500 Rails, 80 Tape and Reel, 2500 Rails, 80 Tape and Reel, 2500 Tape and Reel, 50 Tape and Reel, 500 Rails, 80 Tape and Reel, 2500 Tape and Reel, 50 Tape and Reel, 500 Tape and Reel, 50 Tape and Reel, 500 Rails, 80 Tape and Reel, 2500 Tape and Reel, 50 Tape and Reel, 500 REG1117-2.85 2.85/800mA SOT223-3 DCY REG1117-3.3 3.3/800mA SOT223-3 DCY REG1117F-3.3 3.3/800mA DDPAK-3 KTT −40°C to +125°C REG1117-5 5V/800mA SOT223-3 DCY −40°C to +125°C −40°C to +125°C −40°C to +125°C REG1117 Adj./800mA SOT223-3 DCY REG1117A-1.8 1.8V/1A SOT223-3 DCY REG1117FA-1.8 1.8/1A DDPAK-3 KTT −40°C to +125°C REG1117A-2.5 2.5/1A SOT223-3 DCY −40°C to +125°C REG1117FA-2.5 2.5/1A DDPAK-3 KTT −40°C to +125°C REG1117FA-5 5/1A DDPAK-3 KTT −40°C to +125°C REG1117A Adj./1A SOT223-3 DCY −40°C to +125°C REG1117FA Adj./1A DDPAK-3 KTT −40°C to +125°C (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. 3 REG1117 REG1117A www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 ELECTRICAL CHARACTERISTICS At TJ = +25°C, unless otherwise noted. REG1117, REG1117A PARAMETER OUTPUT VOLTAGE REG1117-2.85 See Note 1 REG1117-3.3 See Note 1 REG1117-5 See Note 1 REG1117A-1.8 See Note 1 REG1117A-2.5 See Note 1 REG1117A-5 See Note 1 REFERENCE VOLTAGE REG1117 (Adjustable) See Note 1 REG1117A (Adjustable) See Note 1 LINE REGULATION REG1117-2.85(1) REG1117-3.3(1) REG1117-5(1) REG1117 (Adjustable)(1) REG1117A (Adjustable)(1) REG1117A-1.8(1) REG1117A-2.5(1) REG1117A-5.0(1) LOAD REGULATION REG1117-2.85(1) REG1117-3.3(1) REG1117-5(1) REG1117 (Adjustable)(1)(2) REG1117A (Adjustable)(1)(2) REG1117A-1.8(1) REG1117A-2.5 REG1117A-5 DROPOUT VOLTAGE(3) All Models(1) See Note 1 REG1117 Models(1) REG1117A See Note 1 IO = 10mA, VIN − VO = 2V IO = 10 to 800mA, VIN − VO = 1.4 to 10V IO = 10mA, VIN − VO = 2V IO = 10mA to 1A, VIN − VO = 1.4 to 10V IO = 0, VIN = 4.25 to 10V IO = 0, VIN = 4.8 to 10V IO = 0, VIN = 6.5 to 15V IO = 10mA, VIN − VO = 1.5 to 13.75V IO = 10mA, VIN − VO = 1.5 to 13.75V IO = 0, VIN = 3.8V to 10V IO = 0, VIN = 4.5V to 10V IO = 0, VIN = 7V to 15V IO = 0 to 800mA, VIN = 4.25V IO = 0 to 800mA, VIN = 4.8V IO = 0 to 800mA, VIN = 6.5V IO = 10 to 800mA, VIN − VO = 3V IO = 10mA to 1A, VIN − VO = 3V IO = 0 to 1A, VIN = 3.8V IO = 0 to 1A, VIN = 4.5V IO = 0 to 1A, VIN = 7.0V IO = 100mA IO = 500mA IO = 800mA IO = 1A IO = 1A 1.238 1.225 1.238 1.225 1.250 1.250 1.250 1.250 1 2 3 0.1 0.1 1 1 3 2 3 3 0.1 0.1 2 2 3 1.00 1.05 1.10 1.2 1.2 1.262 1.280 1.262 1.280 7 7 10 0.4 0.4 7 7 10 10 12 15 0.4 0.4 10 10 15 1.10 1.15 1.20 1.30 1.55 V V V V mV mV mV % % mV mV mV mV mV mV % % mV mV mV V V V V V IO = 10mA, VIN = 4.85V IO = 0 to 800mA, VIN = 4.05V to 10V IO = 10mA, VIN = 5.3V IO = 0 to 800mA, VIN = 4.8V to 10V IO = 10mA, VIN = 7V IO = 0 to 800mA, VIN = 6.5V to 10V IO = 10mA, VIN = 3.8V IO = 0 to 1A, VIN = 3.8V to 10V IO = 10mA, VIN = 4.5V IO = 0 to 1A, VIN = 4.5V to 10V IO = 10mA, VIN = 7V IO = 0 to 1A, VIN = 7V to 10V 2.820 2.790 3.270 3.240 4.950 4.900 1.782 1.764 2.475 2.450 4.950 4.900 2.85 2.85 3.30 3.30 5.00 5.00 1.8 1.8 2.5 2.5 5.0 5.0 2.880 2.910 3.330 3.360 5.050 5.100 1.818 1.836 2.525 2.550 5.050 5.100 V V V V V V V V V V V V CONDITION MIN TYP MAX UNIT (1) Specification applies over the full specified junction temperature range, 0°C to +125°C. (2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation. (3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage. (4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN − VO = 1.4V (reading taken 10ms after pulse). 4 REG1117 REG1117A www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 ELECTRICAL CHARACTERISTICS (continued) At TJ = +25°C, unless otherwise noted. REG1117, REG1117A PARAMETER CURRENT LIMIT REG1117 Models REG1117A MINIMUM LOAD CURRENT Adjustable Models(1)(2) QUIESCENT CURRENT Fixed-Voltage Models(1) ADJUSTABLE PIN CURRENT(1)(2) vs Load Current, REG1117(1) vs Load Current, REG1117A(1) THERMAL REGULATION All Models(4) RIPPLE REJECTION All Models TEMPERATURE DRIFT Fixed-Voltage Models Adjustable Models LONG-TERM STABILITY All Models OUTPUT NOISE rms Noise, All Models THERMAL RESISTANCE Thermal Resistance, qJC 3-Lead SOT-223 Surface-Mount 3-Lead DDPAK Surface-Mount Thermal Resistance, qJA 3-Lead DDPAK Surface-Mount f > 50Hz dc (Junction-to-Case at Tab) No Heatsink 65 °C/W (Junction-to-Case at Tab) 15 2 3 °C/W °C/W °C/W f = 10Hz to 10kHz 0.003 % TA = 125°C, 1000Hr 0.3 % TJ = 0°C to +125°C TJ = 0°C to +125°C 0.5 2 % % f = 120Hz, VIN − VOUT = 3V + 1VPP Ripple 62 dB VIN − VO = 5V VIN − VO = 5V VIN − VO = 13.75V VIN − VO = 5V IO = 10mA, VIN − VO = 1.4 to 10V IO = 10mA to 800mA, VIN − VO = 1.4 to 10V IO = 10mA to 1A, VIN − VO = 1.4 to 10V 30ms Pulse 800 1000 950 1250 1.7 4 50 0.5 0.5 0.01 1200 1600 5 10 120 5 5 0.1 mA mA mA mA µA µA µA %/W CONDITION MIN TYP MAX UNIT (1) Specification applies over the full specified junction temperature range, 0°C to +125°C. (2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation. (3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage. (4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN − VO = 1.4V (reading taken 10ms after pulse). 5 REG1117 REG1117A www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 SIMPLIFIED SCHEMATIC VIN + Current Limit Thermal Limit 10X (Substrate) VOUT Ground (Fixed−voltage Models) Adj. (Adjustable−voltage Model) 6 REG1117 REG1117A www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 TYPICAL CHARACTERISTICS At TA = +25°C, all models, unless otherwise noted. LOAD REGULATION ( ∆I LOAD = 800mA) 1 Output Voltage Deviation (mV) 0 1 REG1117A−1.8 −2 −3 −4 −5 −6 −7 −50 − 25 0 25 50 75 100 REG1117−5 REG1117−2.85 SHORT−CIRCUIT CURRENT vs TEMPERATURE 1400 1300 1200 1100 1000 900 800 − 50 REG1117 Models REG1117A Short− Circuit Current (mA) − 25 0 25 50 75 100 Temperature (_ C) Temperature (_ C) LINE REGULATION vs TEMPERATURE 6 5 Output Voltage Change (mV) 4 3 2 1 0 −1 −2 − 50 − 25 0 25 50 75 100 REG1117A−1.8 VIN = 3.8V to 10V VIN = 6.5V to 15V REG1117−5 100 90 80 Ripple Rejection (dB) 70 60 50 40 30 20 10 0 10 RIPPLE REJECTION vs FREQUENCY IOUT = 100mA VRIPPLE = 1.0VPP 100 1k Frequency (Hz) 10k 100k Temperature (_ C) OUTPUT VOLTAGE vs TEMPERATURE 2.0 IO = 10mA Output Voltage Change (%) Quiescent Current (mA) 1.0 8 7 QUIESCENT CURRENT vs TEMPERATURE Fixed− Voltage Models 6 5 4 3 2 1 0 − 1.0 − 2.0 − 50 − 25 0 25 50 75 100 0 − 50 − 25 0 25 50 75 100 Temperature (_ C) Temperature (_ C) 7 REG1117 REG1117A www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, all models, unless otherwise noted. LOAD TRANSIENT RESPONSE 60 Output Voltage Deviations (V) 0.1 0 −0.1 CIN = 10µF COUT = 10µF Tantalum VIN = 4.25V Preload = 0.1A 0 20 40 60 80 100 Output Voltage Deviation (mV) 40 20 0 −20 Load Current (A) Input Voltage (V) 0.5 0 −0.5 −40 5.25 4.25 3.25 0 20 40 60 80 100 120 140 160 180 200 Time (µs) CIN = 1µF COUT = 10µF Tantalum IOUT = 0.1A LINE TRANSIENT RESPONSE Time (µs) APPLICATIONS INFORMATION Figure 1 shows the basic hookup diagram for fixed-voltage models. All models require an output capacitor for proper operation, and for improving high-frequency load regulation; a 10µF tantalum capacitor is recommended. Aluminum electrolytic types of 50µF or greater can also be used. A high-quality capacitor should be used to assure that the ESR (Effective Series Resistance) is less than 0.5Ω. Figure 2 shows a hookup diagram for the adjustable voltage model. Resistor values are shown for some commonly-used output voltages. Values for other voltages can be calculated from the equation shown in Figure 2. For best load regulation, connect R1 close to the output pin and R2 close to the ground side of the load as shown. THERMAL CONSIDERATIONS The REG1117 has current limit and thermal shutdown circuits that protect it from overload. The thermal shutdown activates at approximately TJ = 165°C. For continuous operation, however, the junction temperature should not be allowed to exceed 125°C. Any tendency to activate the thermal shutdown in normal use is an indication of an inadequate heat sink or excessive power dissipation. The power dissipation is equal to: VIN 10µF Tantalum + REG1117 VO + 10µF Tantalum PD = (VIN – VOUT) IOUT The junction temperature can be calculated by: TJ = TA + PD (qJA) Figure 1. Fixed-Voltage Model—Basic Connections where TA is the ambient temperature, and qJA is the junction-to-ambient thermal resistance. VIN C1 + 10µ F 3 REG1117 (Adj) 1 C3(1) + 10µF 2 VO + C2 10µF Load R2 VOUT (V ) VO = R1 + R2 R1 x (1.25V) + (50µA) (R2) 1.25 1.5 2.1 2.85 3 3.3 5 10 R1 (Ω)(2) Open 750 158 169 137 115 113 113 R2 (Ω)(2) Short 147 107 215 191 187 340 787 R1 This term is negligible with proper choice of values− see table at right. NOTES: (1) C3 optional. Improves high− frequency line rejection. (2) Resistors are standard 1% values. Figure 2. Adjustable-Voltage Model—Basic Connections 8 REG1117 REG1117A www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 A simple experiment will determine whether the maximum recommended junction temperature is exceeded in an actual circuit board and mounting configuration: Increase the ambient temperature above that expected in normal operation until the device’s thermal shutdown is activated. If this occurs at more than 40°C above the maximum expected ambient temperature, then TJ will be less than 125°C during normal operation. The internal protection circuitry of the REG1117 was designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the REG1117 into thermal shutdown will degrade reliability. LAYOUT CONSIDERATIONS The DDPAK (REG1117F-3.3 and REG1117FA) is a surface-mount power package that has excellent thermal characteristics. For best thermal performance, the mounting tab should be soldered directly to a circuit board copper area, as shown in Figure 3. Increasing the copper area improves heat dissipation. Figure 4 shows typical thermal resistance from junction-to-ambient as a function of the copper area. 3− Lead DDPAK(1) 0.51 0.45 All measurements in inches. 0.155 0.10 0.05 NOTE: (1) For improved thermal performance increase footprint area. See Figure 4 (Thermal Resistance vs Circuit Board Copper Area). Figure 3. DDPAK Footprint THERMAL RESISTANCE vs CIRCUIT BOARD COPPER AREA 60 Thermal Resistance, qJA (°C/W) REG1117F DDPAK Surface Mount Package 1oz copper 0.2 0.085 Circuit Board Copper Area 50 40 30 20 REG1117F DDPAK Surface− Mount Package 0 1 2 3 4 5 10 Copper Area (inches2) Figure 4. DDPAK Thermal Resistance versus Circuit Board Copper Area 9 REG1117 REG1117A www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 The SOT-223 package derives heat sinking from conduction through its copper leads, especially the large mounting tab. These must be soldered to a circuit board with a substantial amount of copper remaining, as shown in Figure 5. Circuit board traces connecting the tab and the leads should be made as large as practical. The mounting tab of both packages is electrically connected to VOUT. Table 1. SOT-223 qJA for Various Board Configurations SOT-223 THERMAL RESISTANCE JUNCTIONTO-AMBIENT 46°C/W 47°C/W 49°C/W 51°C/W 53°C/W 55°C/W 58°C/W 59°C/W 67°C/W 72°C/W 85°C/W TOTAL PC BOARD AREA 2500mm2 2500mm2 TOPSIDE(1) COPPER AREA 2500mm2 1250mm2 950mm2 2500mm2 1800mm2 600mm2 1250mm2 915mm2 600mm2 340mm2 340mm2 BACKSIDE COPPER AREA 2500mm2 2500mm2 2500mm2 0 0 1600mm2 0 0 0 900mm2 0 Total Area: 50 x 50mm 2500mm2 2500mm2 2500mm2 1600mm2 2500mm2 2500mm2 1600mm2 900mm2 900mm2 35 x 17 mm 16 x 10 mm 16 x 10 mm Without backside copper: q With solid backside copper: q ≈ 59_ C/W JA ≈ 49_ C/W JA (1) Tab is attached to the topside copper. Figure 5. SOT-223 Circuit Board Layout Example SOLDERING METHODS Other nearby circuit traces, including those on the back side of the circuit board, help conduct heat away from the device, even though they may not be electrically connected. Make all nearby copper traces as wide as possible and leave only narrow gaps between traces. Table 1 shows approximate values of qJA for various circuit board and copper areas for the SOT-223 package. Nearby heat dissipating components, circuit board mounting conditions, and ventilation can dramatically affect the actual qJA. Proper heat sinking significantly increases the maximum power dissipation at a given ambient temperature, as shown in Figure 6. Both REG1117 packages are suitable for infrared reflow and vapor-phase reflow soldering techniques. The high rate of temperature change that occurs with wave soldering or hand soldering can damage the REG1117. INSPEC Abstract Number: B91007604, C91012627. Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω Packages.” The Proceedings of SMTCON. Surface Mount Technology Conference and Exposition: Competitive Surface Mount Technology, April 3−6, 1990, Atlantic City, NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago, IL, USA. MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE 6 5 4 3 2 1 0 0 25 50 75 100 125 Ambient Temperature (_ C) qJA = 65_ C/W (no heat sink) qJA = 85_ C/W (340mm2 topside copper, no backside copper) q JA = 27_ C/W (4in2 one oz copper mounting pad) qJA = 46_ C/W (2500mm2 topside and backside copper) Power Dissipation (Watts) PD = (TJ (max) − TA) / q JA TJ (max) = 150_ C DDPAK SOT−223 Figure 6. Maximum Power Dissipation versus Ambient Temperature 10 REG1117 REG1117A www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 TERMPWR 1N5817 REG1117−2.85 10µF 10µ F 2.85V 110Ω 110Ω 2.85V REG1117−2.85 10µF 10µF TERMPWR 1N5817 5V 5V (Up to 27 Lines) 110Ω 110Ω Figure 7. SCSI Active Termination Configuration REG1117−5 VIN > 12V 10µF + In GND Out + 5V to 10V 100µF VIN > 9.0V 10µ F + In REG1117−5 Out GND 2.5VOUT + 7.5V 100µ F 10µ F + 1kΩ REF1004− 2.5 Figure 8. Adjusting Output of Fixed Voltage Models REG1117−5 VIN 10µ F + In GND 50Ω 1kΩ Figure 9. Regulator with Reference Out 5.2V Line 5.0V Battery REG1117−5 In 6.5V 10µ F + GND Out + 100µF Figure 10. Battery Backed-Up Regulated Supply REG1117−5 VIN 10µF + In GND Out + 100µF VOUT = − 5V Floating Input Figure 11. Low Dropout Negative Supply 11 PACKAGE OPTION ADDENDUM www.ti.com 29-Jan-2007 PACKAGING INFORMATION Orderable Device REG1117 REG1117-2.85 REG1117-2.85/2K5 REG1117-2.85/2K5G4 REG1117-3.3 REG1117-3.3/2K5 REG1117-3.3/2K5G4 REG1117-3.3G4 REG1117-5 REG1117-5/2K5 REG1117-5/2K5G4 REG1117-5G4 REG1117/2K5 REG1117/2K5G4 REG1117A REG1117A-1.8 REG1117A-1.8/2K5 REG1117A-1.8/2K5G4 REG1117A-1.8G4 REG1117A-2.5 REG1117A-2.5/2K5 REG1117A-2.5/2K5G4 REG1117A-2.5G4 REG1117A/2K5 REG1117AG4 Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 Package Drawing DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY Pins Package Eco Plan (2) Qty 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 Green (RoHS & no Sb/Br) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 29-Jan-2007 Orderable Device REG1117F-3.3 REG1117F-3.3/500 REG1117F-3.3/500G3 REG1117F-3.3KTTT REG1117F33KTTTG3 REG1117FA REG1117FA-1.8 REG1117FA-1.8/500 REG1117FA-1.8KTTT REG1117FA-18/500G3 REG1117FA-2.5 REG1117FA-2.5/500 REG1117FA-2.5KTTT REG1117FA-25/500G3 REG1117FA-5.0 REG1117FA-5.0/500 REG1117FA-5.0KTTT REG1117FA-5.0KTTTG REG1117FA/500 REG1117FA/500G3 REG1117FA1.8KTTTG3 REG1117FA2.5KTTTG3 REG1117FA5.0/500G3 REG1117FAKTTT REG1117FAKTTTG3 REG1117G4 Status (1) OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 SOT-223 Package Drawing KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT DCY Pins Package Eco Plan (2) Qty 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 4 500 50 50 500 500 50 50 500 50 50 80 500 50 500 500 50 500 500 500 50 50 TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish Call TI CU SN CU SN CU SN CU SN Call TI Call TI CU SN CU SN CU SN Call TI CU SN CU SN CU SN Call TI CU SN CU SN CU SN CU SN CU SN CU SN CU SN CU SN CU SN CU SN CU NIPDAU MSL Peak Temp (3) Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 29-Jan-2007 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 0,10 (0.004) M 4 7,30 (0.287) 6,70 (0.264) 3,70 (0.146) 3,30 (0.130) Gauge Plane 1 2,30 (0.091) 4,60 (0.181) 2 3 0,84 (0.033) 0,66 (0.026) 0,10 (0.004) M 0°–10° 0,25 (0.010) 0,75 (0.030) MIN 1,80 (0.071) MAX 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,10 (0.0040) 0,02 (0.0008) 0,08 (0.003) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. 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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. 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Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2007 PACKAGING INFORMATION Orderable Device REG1117 REG1117-2.85 REG1117-2.85/2K5 REG1117-2.85/2K5G4 REG1117-2.85G4 REG1117-3.3 REG1117-3.3/2K5 REG1117-3.3/2K5G4 REG1117-3.3G4 REG1117-5 REG1117-5/2K5 REG1117-5/2K5G4 REG1117-5G4 REG1117/2K5 REG1117/2K5G4 REG1117A REG1117A-1.8 REG1117A-1.8/2K5 REG1117A-1.8/2K5G4 REG1117A-1.8G4 REG1117A-2.5 REG1117A-2.5/2K5 REG1117A-2.5/2K5G4 REG1117A-2.5G4 REG1117A/2K5 Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 Package Drawing DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY DCY Pins Package Eco Plan (2) Qty 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 80 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2007 Orderable Device REG1117A/2K5G4 REG1117AG4 REG1117F-3.3 REG1117F-3.3/500 REG1117F-3.3/500G3 REG1117F-3.3KTTT REG1117F33KTTTG3 REG1117FA REG1117FA-1.8 REG1117FA-1.8/500 REG1117FA-1.8KTTT REG1117FA-18/500G3 REG1117FA-2.5 REG1117FA-2.5/500 REG1117FA-2.5KTTT REG1117FA-25/500G3 REG1117FA-5.0 REG1117FA-5.0/500 REG1117FA-5.0KTTT REG1117FA-5.0KTTTG REG1117FA/500 REG1117FA/500G3 REG1117FA1.8KTTTG3 REG1117FA2.5KTTTG3 REG1117FA5.0/500G3 REG1117FAKTTT Status (1) ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOT-223 SOT-223 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 Package Drawing DCY DCY KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT Pins Package Eco Plan (2) Qty 4 4 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 500 50 50 500 500 50 50 500 50 500 50 500 500 50 500 500 500 50 50 2500 Green (RoHS & no Sb/Br) 80 Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU Call TI CU SN CU SN CU SN CU SN Call TI Call TI CU SN CU SN CU SN Call TI CU SN CU SN CU SN Call TI CU SN CU SN CU SN CU SN CU SN CU SN CU SN CU SN CU SN MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2007 Orderable Device REG1117FAKTTTG3 REG1117G4 (1) Status (1) ACTIVE ACTIVE Package Type DDPAK/ TO-263 SOT-223 Package Drawing KTT DCY Pins Package Eco Plan (2) Qty 3 4 50 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU SN CU NIPDAU MSL Peak Temp (3) Level-2-260C-1 YEAR Level-1-260C-UNLIM The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 25-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) 330 330 330 330 330 330 330 330 330 330 Reel Width (mm) 24 24 24 24 24 24 24 24 24 24 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 16 16 16 16 16 16 16 16 16 16 W Pin1 (mm) Quadrant 24 24 24 24 24 24 24 24 24 24 Q2 Q2 Q2 Q2 Q2 Q2 Q2 Q2 Q2 Q2 REG1117F-3.3/500 REG1117F-3.3KTTT REG1117FA-1.8/500 REG1117FA-1.8KTTT REG1117FA-2.5/500 REG1117FA-2.5KTTT REG1117FA-5.0/500 REG1117FA-5.0KTTT REG1117FA/500 REG1117FAKTTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT 3 3 3 3 3 3 3 3 3 3 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 10.6 10.6 10.6 10.6 10.6 10.6 10.6 10.6 10.6 10.6 15.6 15.6 15.6 15.6 15.6 15.6 15.6 15.6 15.6 15.6 4.9 4.9 4.9 4.9 4.9 4.9 4.9 4.9 4.9 4.9 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Oct-2007 Device REG1117F-3.3/500 REG1117F-3.3KTTT REG1117FA-1.8/500 REG1117FA-1.8KTTT REG1117FA-2.5/500 REG1117FA-2.5KTTT REG1117FA-5.0/500 REG1117FA-5.0KTTT REG1117FA/500 REG1117FAKTTT Package KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT Pins 3 3 3 3 3 3 3 3 3 3 Site SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 SITE 41 Length (mm) 346.0 346.0 346.0 346.0 346.0 346.0 346.0 346.0 346.0 346.0 Width (mm) 346.0 346.0 346.0 346.0 346.0 346.0 346.0 346.0 346.0 346.0 Height (mm) 41.0 41.0 41.0 41.0 41.0 41.0 41.0 41.0 41.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 0,10 (0.004) M 4 7,30 (0.287) 6,70 (0.264) 3,70 (0.146) 3,30 (0.130) Gauge Plane 1 2,30 (0.091) 4,60 (0.181) 2 3 0,84 (0.033) 0,66 (0.026) 0,10 (0.004) M 0°–10° 0,25 (0.010) 0,75 (0.030) MIN 1,80 (0.071) MAX 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,10 (0.0040) 0,02 (0.0008) 0,08 (0.003) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. 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