RF-BREAKOUT-MVK MAVRK Module
User's Guide
Literature Number: SLAU382
December 2011
2
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Contents
1
.................................................................................................................... 5
......................................................................................................... 5
1.2
Highlighted Products .................................................................................................... 6
1.3
Block Diagram ........................................................................................................... 6
1.4
EVM Wiki ................................................................................................................. 6
1.5
EVM Landing Page ..................................................................................................... 6
Hardware Description .......................................................................................................... 7
2.1
Power Requirements .................................................................................................... 7
2.2
Getting Started: Configuring the EVM ................................................................................ 7
2.3
EVM Connectors, Fuses, and Switches .............................................................................. 7
2.4
EVM Test Points ......................................................................................................... 8
2.5
EVM LEDs ................................................................................................................ 9
2.6
RF Header Definition and Utilization ................................................................................ 10
2.6.1
RF I2S Header Definition .................................................................................. 10
2.6.2
RF SDIO Header Definition ............................................................................... 11
2.6.3
RF GPIO Header Definition ............................................................................... 12
2.6.4
RF SPI Header Definition ................................................................................. 13
2.6.5
RF UART Header Definition .............................................................................. 14
2.6.6
RF I2C Header Definition ................................................................................. 15
2.6.7
RF Audio Header Definition ............................................................................... 16
Software Description ......................................................................................................... 17
3.1
MAVRK Software Minimum Requirements ......................................................................... 17
3.2
How to get the MAVRK Software .................................................................................... 17
3.3
Where do I find the MAVRK Qt Demo Application? ............................................................... 17
3.4
Where do I find the Demo and Test Code? ........................................................................ 17
Software Project ................................................................................................................ 18
4.1
Getting Started ......................................................................................................... 18
4.2
Setting up the Demo Hardware ...................................................................................... 19
4.3
Accessing RF-Breakout-MVK External Signals .................................................................... 20
4.3.1
GPIO Demo Breakdown ................................................................................... 20
4.3.1.1
GPIO Demo ............................................................................................ 21
4.3.1.2
GPIO APIs .............................................................................................. 21
4.3.2
UART Demo ................................................................................................ 26
4.3.3
SPI Demo ................................................................................................... 27
4.3.4
I2C Demo ................................................................................................... 29
Board Files ....................................................................................................................... 31
5.1
Bill of Materials (BOM) ................................................................................................ 31
5.2
Layout (PDF) ........................................................................................................... 31
5.3
Schematics (PDF) ..................................................................................................... 32
5.4
Fabrication Drawings (PDF) .......................................................................................... 32
5.5
Request Gerber and Schematic files ................................................................................ 32
Application Note ................................................................................................................ 32
EVM Overview
1.1
2
3
4
5
6
EVM Description
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7
8
4
.................................................................................................................... 33
7.1
I want more info on MAVRK .......................................................................................... 33
7.2
I have MAVRK Questions ............................................................................................. 33
7.3
I want more Technical Info on MAVRK Hardware ................................................................. 33
7.4
I want more Technical Info on MAVRK Software .................................................................. 33
7.5
I want to get a MAVRK board ........................................................................................ 33
Important Notices .............................................................................................................. 34
8.1
ESD Precautions ....................................................................................................... 34
8.2
Certifications ............................................................................................................ 34
8.3
Evaluation Board/Kit/Module (EVM) Additional Terms ............................................................ 34
8.4
United States FCC and Canada IC Regulatory Compliance Information ...................................... 35
8.5
Evaluation Board/Kit/Module (EVM) Warnings, Restrictions, and Disclaimers ................................ 35
8.5.1
Your Sole Responsibility and Risk ....................................................................... 35
8.5.2
Certain Instructions ........................................................................................ 35
8.5.3
Agreement to Defend, Indemnify and Hold Harmless ................................................. 36
8.5.4
Safety-Critical or Life-Critical Applications .............................................................. 36
MAVRK Links
Contents
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User's Guide
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RF-BREAKOUT-MVK MAVRK Module
This document contains general information pertinent to this module.
1
EVM Overview
1.1
EVM Description
The RF-Breakout-MVK module is a special module which is intended to create an easy way for a user to
debug the signals on the RF bus. The breakout modules implements two ways of debugging:
• Visual debugging through the use of the LED arrays
• Manual debugging of the electrical signals using oscilloscopes or logic analyzers.
Figure 1. RF Breakout Module
The main features of the RF-Breakout-MVK board are the expansion headers on the left and the row of
LEDs down the middle of the design.
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EVM Overview
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The RF-Breakout-MVK enables easy debug of the RF bus making all the pins available on standard
100mil pin headers for probing or connecting to an external logic analyzer. Please be aware that the
100mil headers are connected directly to the RF bus and care should be taken when probing it as
un-intentional behavior could result.
Furthermore there is an array of LEDs connected to the RF bus used for simple visual inspection of the
singal levels on the RF bus.
This module connects to the Modular and Versatile Reference Kit (MAVRK) Motherboard's RF port.
For a full list of RF pinouts with description please see the RF Pinout for MAVRK wiki page.
1.2
Highlighted Products
•
•
•
1.3
10-Ohm SPST Analog Switch
Dual-Channel 10-Ohm SPST Analog Switch
Octal Transparent D-Type Latches With 3-State Outputs
Block Diagram
The figure below shows the main functional blocks of the RF-Breakout-MVK. The LED array is located
behind an array of logic latches. Therefore the state of the LEDs only changes when the module has been
selected. However, by keeping the module select high at all times, it will be possible to see the state of all
IO's at all times on the RF bus.
Figure 2. A block diagram of the RF-Breakout-MVK
1.4
EVM Wiki
RF-BREAKOUT-MVK MAVRK Module wiki page
1.5
EVM Landing Page
RF-BREAKOUT-MVK MAVRK Module tool folder
6
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Hardware Description
2.1
Power Requirements
3.3V DC is supplied to the RF-BREAKOUT-MVK through the RF Connector (RF2, pin 9). The
RF-TCA8418-MVK module can operate over the voltage range of 1.65V to 3.65V DC with a typical current
draw of less than 25mA.
2.2
Getting Started: Configuring the EVM
2.3
EVM Connectors, Fuses, and Switches
The RF-BREAKOUT-MVK EVM has two connectors on the back side of the module that connect it to an
RF slot on a motherboard like the MB-PRO-MVK. For a full list of RF pinouts with description please see
the RF Pinout for MAVRK wiki page.
Figure 3. Back side of the RF Breakout Module, showing the RF connectors
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Hardware Description
2.4
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EVM Test Points
Figure 4. Test points on the RF Breakout Module
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2.5
EVM LEDs
Figure 5. LEDs on the RF Breakout Module
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Hardware Description
2.6
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RF Header Definition and Utilization
For a full list of RF pinouts with description please see the RF Pinout for MAVRK wiki page. The table
below describes the mapping of all the IO's coming in the RF-Breakout-MVK from the RF1/RF2
connectors to each of the breakout connectors and various LEDs.
2.6.1
RF I2S Header Definition
Figure 6. RF I2S Header Pinout
Table 1. RF I2S Header Definition
RF BREAKOUT
10
I2S
Signal Name
Header
Pin #
LED# / color
RF_AUDIO_CLK
J3
5
N/A
RF_AUDIO_FSYNC
J3
3
N/A
RF_AUDIO_DIN
J3
4
N/A
RF_AUDIO_DOUT
J3
2
N/A
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2.6.2
RF SDIO Header Definition
Figure 7. RF SDIO Header Pinout
Table 2. RF SDIO Header Definition
RF BREAKOUT
SDIO
Signal Name
Header
Pin #
LED# / color
RF_SDIO_CLK
J2
7
N/A
RF_SDIO_CMD
J2
6
N/A
RF_SDIO_D0
J2
3
N/A
RF_SDIO_D1
J2
2
N/A
RF_SDIO_D2
J2
5
N/A
RF_SDIO_D3
J2
4
N/A
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RF GPIO Header Definition
Figure 8. RF GPIO Header Pinout
Table 3. RF GPIO Header Definition
RF BREAKOUT
12
I/O
Signal Name
Header
Pin #
LED# / color
RF_SPI_GDO0
U2 - 573 (Latch)
J2-07
Blue
RF_SPI_GDO2
U2 - 573 (Latch)
J2-08
Blue
RF_GPIO2
U3 - 573 (Latch)
J2-09
Green
RF_GPIO3
U3 - 573 (Latch)
J2-10
Green
RF_NSHUTDN
U3 - 573 (Latch)
J2-12
Green
RF_RSTN
U3 - 573 (Latch)
J3-11
Green
RF_SLOW_CLK
U4 - 573 (Latch)
J3-12
Green
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2.6.4
RF SPI Header Definition
Figure 9. RF SPI Header Pinout
Table 4. RF SPI Header Definition
RF BREAKOUT
SPI
Signal Name
Header
Pin #
RF_SPI_CLK
J4
5
N/A
RF_SPI_CS
J4
3
LED9, Blue
RF_SPI_MOSI
J4
2
N/A
RF_SPI_MISO
J4
4
N/A
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LED# / color
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RF UART Header Definition
Figure 10. RF UART Header Pinout
Table 5. RF UART Header Definition
RF BREAKOUT
14
UART
Signal Name
Header
Pin #
LED# / color
RF_UART_RTS
U3 - 573 (Latch)
J3-03
Orange
RF_UART_CTS
U3 - 573 (Latch)
J3-04
Orange
RF_UART_TX
U3 - 573 (Latch)
J3-05
Orange
RF_UART_RX
U3 - 573 (Latch)
J3-06
Orange
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2.6.6
RF I2C Header Definition
Figure 11. RF I2C Header Pinout
Table 6. RF I2C Header Definition
RF BREAKOUT
I2C
Signal Name
Header
Pin #
LED# / color
RF_I2C_SCL
U4 - 573 (Latch)
J3-07
White
RF_I2C_SDA
U4 - 573 (Latch)
J3-08
White
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RF Audio Header Definition
Figure 12. RF Breakout Module Audio Header Pinout
Table 7. RF Audio Header Definition
RF BREAKOUT
16
Audio
RF_AUDIO_DL
U-NA
J1-11
TP8
RF_AUDIO_DR
U-NA
J1-12
TP7
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3
Software Description
3.1
MAVRK Software Minimum Requirements
•
•
•
•
3.2
IAR Embedded Workbench software or TI Code Composer Studio software installed on PC
MSP-FET430UIF - MSP430 USB Debugging Interface
USB Cable(A to Micro AB) to power the MAVRK Pro motherboard
Windows XP SP3 or Windows 7
How to get the MAVRK Software
You will need the MAVRK Software repository installed on your PC. This repository will sync the MAVRK
firmware to your PC.
Please see Software Installation Guide.
3.3
Where do I find the MAVRK Qt Demo Application?
An application to visual packet information from the embedded system can be found in the mavrk_qt_tool
software repository under the Released Version - QT Demo Application directory. Please see Software
Installation Guide for instructions on cloning the QT Tool project.
If you desire to create your own Qt demonstration, please reference the following resources:
• MAVRK Qt GUI SDK Installation Guide
• MAVRK Qt GUI Build Guide
3.4
Where do I find the Demo and Test Code?
From the software library, synchronized from the Gerrit server you will find:
• Driver code related to the specific part can be found in a folder under the
mavrk_embedded\Modular_EVM_Libraries\Components directory.
• Projects utilizing this part are located under the mavrk_embedded\Modular_EVM_Projects folder.
• Specific related projects for this part are:
mavrk_embedded\Modular_EVM_Projects\Component_Demo_Projects\RF_Breakout_Board_De
mo_Project
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Software Project
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Software Project
4.1
Getting Started
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A software project named RF_Breakout_Demo exists in the
mavrk_embedded\Modular_EVM_Projects\Component_Demo_Projects\RF_Breakout_Board_Demo_
Project software repository directory. This project contains demo code for using the UART, SPI, I2C, and
GPIO for the RF Breakout board. MAVRK or other EVM boards may be interconnected via the AFE
breakout boards using the above mentioned busses.
There are actually four different configurations in the RF_Breakout_Board_Demo_Project (one each bus
and the GPIO). Using IAR, to select one of the configurations, click on the drop down box in the
"workspace" window as shown in the figure below:
Figure 13. Changing workspaces in IAR to change what the RF Breakout demo shows
Only one configuration can be used at one time. The four choices are:
• GPIO_Demo
• UART_Demo
• SPI_Demo
• UART_Demo
After selecting one of the configurations, compile it (using "Make" and download it to the board (using
"Debug")
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Figure 14. Making the RF Breakout Module project
Figure 15. Downloading and debugging the RF Breakout Module project
4.2
Setting up the Demo Hardware
The demo expects the RF breakout to be in the MAVRK_RF3 slot.
The preferred method of working with this EVM is through the use of the MAVRK Pro motherboard, the
motherboard will provide the needed power and digital control for this EVM. In the image below, the
RF-Breakout-MVK is shown in the RF Slot3 (upper right hand corner), however it is also possible to insert
the RF-Breakout-MVK into any of the four RF slots and retain full functionality.
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Figure 16. RF Breakout Module on the MAVRK Pro Motherboard
4.3
4.3.1
Accessing RF-Breakout-MVK External Signals
GPIO Demo Breakdown
The RF Breakout board has LEDs that signal the states of the RF slots GPIOs. These GPIOs are
categorized as either shared or exclusive.
Shared GPIOs are:
• RF Ready to Send (RTS)
• RF Clear to Send (CTS)
RTS and CTS can either be an input or an output.
Exclusive GPIOs are:
• RF Shutdown 0
• RF Shutdown 1
• RF GPIO
• RF GPIO 2
• RF GPIO 3
• Chip Enable
RF GPIO can be either an input for an output. Chip Enable, RF Shutdown 0,1 and RF GPIO 2,3 are
outputs.
Note on Chip Enable: Chip Enable is a common pin from the MCU slot, but is made exclusive to each slot
by a Switch controlled by the RF Module Select lines.
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4.3.1.1
GPIO Demo
The GPIO_Demo when run will strobe through all of the GPIOs to light the LEDs. For a more useful
function, refer to the GPIO APIs below.
4.3.1.2
GPIO APIs
The GPIO Demo configuration uses API calls to manipulate the GPIOs. Exclusive GPIOs require the
target MAVRK slot to be passed, Shared GPIOs do not.
• Ready to Send and Clear to Send APIs - These GPIO are shared, so the API does not require
passing the Device Slot
– 'mvk_Set_RF_RTS' and 'mvk_Set_RF_CTS' require the function of the GPIO ('INPUT' or
'OUTPUT') and if an output the direction ('HIGH (ENABLE)' or 'LOW (DISABLE)') - This is used to
control the output level of the GPIO or to set the GPIO as an input (passing 'NULL' for the output
direction.
– 'mvk_Get_RF_RTS' and 'mvk_Get_RF_CTS' are used to read the input of the RTS or CTS line.
The values passed by these APIs are either 'HIGH' or 'LOW' or INVALID_PARAMETER_VALUE if
the line is set as an output.
The RTS and CTS pins and LEDs are highlighted in the figure below:
Figure 17. Locations of RTS and CTS pins on the RF Breakout Module
To use the RTS and CTS signals, your circuit will need to use the GND pin which is also highlighted in the
figure.
Setting the RTS or CTS lines ('ENABLE' or 'HIGH') will light the LEDs.
• Shutdown 0 and Shutdown 1 APIs - These GPIO are exclusive, so the API does requires passing
the Device Slot
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– 'mvk_Set_RF_SHUTD_0' and 'mvk_Set_RF_SHUTD_1' require the device slot (MAVRK_RF1 MAVRK_RF4)and the direction ('HIGH (ENABLE)' or 'LOW (DISABLE)') - This is used to control the
output level of the Shutdown Pin.
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The Shutdown Pins and LEDs are highlighted in the figure below:
Figure 18. Locations of Shutdown pins on the RF Breakout Module
To use the Shutdown signals, your circuit will need to use the GND pin which is also highlighted in the
figure.
Setting the Shutdown lines ('ENABLE' or 'HIGH') will light the LEDs.
• RF GPIO APIs - These GPIO are exclusive, so the API does requires passing the Device Slot
– 'mvk_Set_RF_GPIO' requires the function of the GPIO ('INPUT' or 'OUTPUT') and if an output the
direction ('HIGH (ENABLE)' or 'LOW (DISABLE)') - This is used to control the output level of the
GPIO or to set the GPIO as an input (passing 'NULL' for the output direction.
– 'mvk_Get_RF_GPIO' is used to read the input of the GPIO line. The values passed by these APIs
are either 'HIGH' or 'LOW' or INVALID_PARAMETER_VALUE if the line is set as an output.
– 'mvk_Set_RF_GPIO_2' and 'mvk_Set_RF_GPIO_3' require the device slot (MAVRK_RF1 MAVRK_RF4)and the direction ('HIGH (ENABLE)' or 'LOW (DISABLE)') - This is used to control the
output level of the Shutdown Pin.
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The RF GPIO Pins and LEDs are highlighted in the figure below:
Figure 19. Locations of GPIO pins on the RF Breakout Module
To use the GPIO signals, your circuit will need to use the GND pin which is also highlighted in the figure.
Setting the GPIO lines ('ENABLE' or 'HIGH') will light the LEDs.
• Chip Enable APIs - These GPIO are exclusive, so the API does requires passing the Device Slot
– 'mvk_Set_Chip_Enable' and 'mvk_Clear_Chip_Enable' require the device slot (MAVRK_RF1 MAVRK_RF4)- This is used to control the output level of the Chip Enable.
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The Chip Enable Pin and LED are highlighted in the figure below:
Figure 20. Location of Chip Enable pin on the RF Breakout Module
To use the Chip Enable, your circuit will need to use the GND pin which is also highlighted in the figure.
The Chip Enable is used primarily for the SPI bus(SPI Demo) as a signal to the device it is being
communicated to. Clearing the Chip Enable will light the LED.
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4.3.2
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UART Demo
Generally for board to board communications, there would be at least two boards. In this case only one is
used. The way that send and receive is verified in this project is by connecting the RX and TX lines on the
RF breakout board. What the loopback does is any signal that is transmitted will come back to this device.
So when there is a valid receive this proves that the device can transmit and receive successfully. The
signals for the UART bus are located on the J4 header on the RF breakout board. The TX signal is
located on header J4 on the 7th pin. The RX signal is on the same header on the 9th pin. A standard
jumper may be used to interconnect these two signals.
Figure 21. Jumper placement for the UART demo
The UART is set by default in the mvk_Init_MAVRK_Standard_Settings function to a baud rate of 460K
and 8 bits data, no parity and one stop bit.
Before writing to the UART a handle has to be created and registered using this function call:
UartDebugHandle = mvk_Register_UART_Tx (MAVRK_UART_P1P2, RF_BREAKOUT_BOARD_SLOT, 2,
SET, CLEAR); // Priority 2, Fast Print, Do not overwrite
This sets the UartDebugHandle to the device which is in RF_BREAKOUT_BOARD_SLOT. This handle is
later used to communicate with this device.
Then it continually makes this function call mvk_UART_Debug_PrintF_Flush (UartDebugHandle, "Hello
from MCU UART", 19); which sends the message out.
The demo continually sends a "Hello from UART". To verify that this transfer is sending and receiving
correctly, a breakpoint may be placed on the mvk_Receive_UART_Data
(RF_BREAKOUT_BOARD_SLOT, (char *)data_in) function call as seen in the figure below:
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Figure 22. Verifying correct UART transmission with a breakpoint in IAR
This function is called when there is an incoming UART character. The character that has arrived is given
in the data parameter. A watch may be placed on this variable and viewed to determine which character
has just arrived.
For more information on using the MAVRK UART APIs please refer to MAVRK UART Functions.
4.3.3
SPI Demo
The SPI demo continually sends a message through the SPI bus. As in the case with UART, a loopback is
used on the MOSI (output) and MISO (input) pins to test the input portion of the SPI bus.
The signals for the SPI bus are located on the J4 header on the AFE breakout board. The SPI clock is on
pin 5, the chip select in on pin 3, MOSI is on pin 2 and MISO in on pin 4.
To set up the loop back of MOSI and MISO jumper pins 2 and 4 as shown in the figure below:
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Figure 23. Jumper placement for the SPI demo
The SPI settings required for the port are set by:
SPI_Device_Parameter_type RF3_SPI_device_settings = {LOW_POLARITY, RETARDED_DATA,
_4MHZ_MAX_CLOCK, NULL};
To setup the SPI port this function call is used:
mvk_Configure_SPI_Device_Working_Settings (MAVRK_RF3, &RF3_SPI_device_settings);
Which configures the SPI bus to the RF3 module device settings.
The project continually sends "Hello from MCU SPI". This sending and receiving may be verified by
placing a breakpoint on the SPI call (mvk_Write_SPI_Payload (MAVRK_RF3, "Hello from MCU SPI", read,
18, 0). After this line is executed the read variable will hold the results of the input (which should be the
message).
The figure below shows the location to place the break point and the watch variable set up:
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Figure 24. Verifying correct SPI transmission with a breakpoint in IAR
For more information on using the MAVRK SPI APIs please refer to MAVRK SPI Functions.
4.3.4
I2C Demo
The I2C demo is different from the previous buses demo in that it does not use a loopback. It however
writes to an EEPROM chip that is located on the RF breakout board. This EEPROM (16Kx8) is used to
store device information for the breakout board. This information is stored on the highest 256 bytes of the
memory. This area should not be overwritten. Any other area is free to be used.
The project writes to the EEPROM chip an 8-bit value and reads that value back to make sure that it was
written properly. The bus that is used to do this transfer is I2C.
The actual I2C write call happens deeper in the program but one example is this:
mvk_Write_I2C (I2C_slave_address, device_slot, EEPROM24xx128_I2C_write_data,
total_number_write_bytes);
The first parameter is the I2C slave address to write to, the second is the device slot to use for the write
(in this case MAVRK_RF3), then the write data, and the amount of data to write. An example of the I2C
read function may be found in the mvk_Read_EEPROM_24xx128 () function which may be found in
EEPROM24xx128.c.
In the demo, we write 18 bytes of code defined by: data_in [18] = {'H','e','l','l','o',' ','f','r','o','m',' ','M','C','U','
','I','2','C'};
We define the address in the EEProm we want to write to with: address = 0x1000;
Note: Avoid writing to any address at or above 0x3F00. This are is used at device test to store board
description information.
To initiate an I2C write to the EEPROM: mvk_Write_EEPROM_24xx128
(address,&data_in[0],data_size,device_slot,RF_I2C_device_address);
To read back the information on the EEPROM: mvk_Read_EEPROM_24xx128
(address,&data_out[0],data_size,device_slot,RF_I2C_device_address);
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Software Project
www.ti.com
The demo writes the data_in to the EEPROM starting at address 0x1000 and reads back the data stored
in data_out. The program then verifies that data_in is equal to data_out.
If the verify fails the code will go into an error trap and the RED LED on the MCU will flash.
If the verify passes the code will pass into a while(1) loop and place the MCU in a sleep condition.
To see the resulting data_out, set a watch window and a break point as shown in the figure below:
Figure 25. Verifying correct I2C transmission with a breakpoint in IAR
For more information on using the MAVRK I2C APIs please refer to MAVRK I2C Bus Functions.
30
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Board Files
www.ti.com
5
Board Files
5.1
Bill of Materials (BOM)
Download a PDF of the bill of materials.
Figure 26. RF-BREAKOUT-MVK Bill of Materials
5.2
Layout (PDF)
Download a PDF of additional board layers.
Figure 27. RF-BREAKOUT-MVK Board Top Silkscreen
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Application Note
5.3
www.ti.com
Schematics (PDF)
Download a PDF of the schematic.
Figure 28. RF-BREAKOUT-MVK Schematic
5.4
Fabrication Drawings (PDF)
Download a PDF of the fabrication drawing.
Figure 29. RF-BREAKOUT-MVK Fabrication Drawing
5.5
Request Gerber and Schematic files
To request Gerber or schematic files for the RF-BREAKOUT-MVK module, please visit the MAVRK
Gerber Request webpage.
6
Application Note
The I2C and SPI circuits are gated by the MODULE SELECT signal. This means that the breakout will not
send through I2C or SPI signals unless the MODULE SELECT line is active. Standard MAVRK software
functions that perform I2C and SPI read/writes manage the MODULE SELECT line for the user.
If the user is using the breakout module to monitor I2C or SPI bus activity, the system will need to enable
the MODULE SELECT line for the device slot that contains the breakout card. In the software, this is done
via the mvk_Set_Module_Select() function.
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MAVRK Links
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7
MAVRK Links
7.1
I want more info on MAVRK
MAVRK Home Page
7.2
I have MAVRK Questions
MAVRK Forum (Recommended):
7.3
I want more Technical Info on MAVRK Hardware
Table 8.
• Hardware Design Guide for MAVRK
MCU Modules
• Hardware Design Guide for MAVRK
Modules
• Hardware Design Guide for MAVRK
PMU Charger Sub-Modules
• Hardware Design Guide for MAVRK
PMU DC/DC Sub-Modules
7.4
• Hardware Design Guide for MAVRK
PMU Gas Gauge Sub-Modules
• Hardware Design Guide for MAVRK
PMU High-Power DC/DC
Sub-Modules
• Hardware Design Guide for MAVRK
SCI Modules
• Hardware Design Guide for MAVRK
SCI Sub-Modules
I want more Technical Info on MAVRK Software
• How to Convert a Project from IAR to CCS
7.5
• Hardware Design Guide for the
uMAVRK Analog Interface
• Hardware Design Guide for the
uMAVRK Power Interface
• Template - Hardware User's Guide
• Software - CC11xx, CC25xx, CC430 Radio API Guide
I want to get a MAVRK board
MAVRK Home Page
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Important Notices
8
Important Notices
8.1
ESD Precautions
www.ti.com
The following guidelines should be followed in order to avoid ESD damage to the board components:
• Any person handling boards must be grounded either with a wrist strap or ESD protective footwear,
used in conjunction with a conductive or static-dissipative floor or floor mat.
• The work surface where boards are placed for handing, processing, testing, etc., must be made of
static-dissipative material and be grounded to ESD ground.
• All insulator materials either must be removed from the work area or they must be neutralized with an
ionizer. Static-generating clothes should be covered with an ESD-protective smock.
• When boards are being stored, transferred between operations or workstations, or shipped, they must
be maintained in a Faraday-shield container whose inside surface (touching the boards) is static
dissipative.
8.2
Certifications
FCC standard EMC test report for the RF-BREAKOUT-MVK MAVRK Module aboard a MAVRK Pro
Motherboard
ICES standard EMC test report for the RF-BREAKOUT-MVK MAVRK Module aboard a MAVRK Pro
Motherboard
Eco-Info & Lead-Free Home
RoHS Compliant Solutions
Statement on Registration, Evaluation, Authorization of Chemicals (REACh)
8.3
Evaluation Board/Kit/Module (EVM) Additional Terms
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following
conditions: The user assumes all responsibility and liability for proper and safe handling of the goods.
Further, the user indemnifies TI from all claims arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/ kit
may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED
WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL
OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF
THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR
ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide
prior to handling the product. This notice contains important safety information about temperatures and
voltages. For additional information on TI's environmental and/or safety programs, please contact the TI
application engineer or visit www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to
any machine, process, or combination in which such TI products or services might be or are used. TI
currently deals with a variety of customers for products, and therefore our arrangement with the user is not
exclusive. TI assumes no liability for applications assistance, customer product design, software
performance, or infringement of patents or services described herein.
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Important Notices
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8.4
United States FCC and Canada IC Regulatory Compliance Information
This EVM complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation. Changes or modifications not
expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not
expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment. Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsible de la
conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement.
8.5
8.5.1
Evaluation Board/Kit/Module (EVM) Warnings, Restrictions, and Disclaimers
Your Sole Responsibility and Risk
You acknowledge, represent and agree that:
1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but
not limited to Food and Drug Administration regulations, if applicable) which relate to your products and
which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM
for evaluation, testing and other purposes.
2. You have full and exclusive responsibility to assure the safety and compliance of your products with all
such laws and other applicable regulatory requirements, and also to assure the safety of any activities to
be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further,
you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and
any human body are designed with suitable isolation and means to safely limit accessible leakage
currents to minimize the risk of electrical shock hazard.
3. Since the EVM is not a completed product, it may not meet all applicable regulatory and safety
compliance standards which may normally be associated with similar items. You assume full responsibility
to determine and/or assure compliance with any such standards and related certifications as may be
applicable. You will employ reasonable safeguards to ensure that your use of the EVM will not result in
any property damage, injury or death, even if the EVM should fail to perform as described or expected.
8.5.2
Certain Instructions
It is important to operate this EVM within TI’s recommended specifications and environmental
considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to
input and output voltage, current, power, and environmental ranges) may cause property damage,
personal injury or death. If there are questions concerning these ratings please contact a TI field
representative prior to connecting interface electronics including input power and intended loads. Any
loads applied outside of the specified output range may result in unintended and/or inaccurate operation
and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM
User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load
specification, please contact a TI field representative. During normal operation, some circuit components
may have case temperatures greater than 60° C as long as the input and output are maintained at a
normal ambient operating temperature. These components include but are not limited to linear regulators,
switching transistors, pass transistors, and current sense resistors which can be identified using the EVM
schematic located in the EVM User's Guide. When placing measurement probes near these devices
during normal operation, please be aware that these devices may be very warm to the touch. As with all
electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and
diagnostics normally found in development environments should use these EVMs.
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Important Notices
8.5.3
www.ti.com
Agreement to Defend, Indemnify and Hold Harmless
You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and
against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising
out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement.
This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and
even if the EVM fails to perform as described or expected.
8.5.4
Safety-Critical or Life-Critical Applications
If you intend to evaluate the components for possible use in safety critical applications (such as life
support) where a failure of the TI product would reasonably be expected to cause severe personal injury
or death, such as devices which are classified as FDA Class III or similar classification, then you must
specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement.
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IMPORTANT NOTICE
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
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or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
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warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
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