RI-I16-114A-01

RI-I16-114A-01 SCBS818B – DECEMBER 2005 – REVISED SEPTEMBER 2011 www.ti.com Tag-it™ HF-I STANDARD TRANSPONDER INLAYS 24.2-mm CIRCULAR Check for Samples: RI-I16-114A-01 FEATURES 1 • 2 • • • • ISO/IEC 15693-2, -3; ISO/IEC 18000-3 Compliant 13.56-MHz Operating Frequency 256-Bit User Memory in 8-Bit × 32-Bit Blocks Application Family Identifier (AFI) Fast Simultaneous Identification (Anti-Collision) APPLICATIONS • • • • • Product Authentication Library Supply-Chain Management Asset Management Ticketing/Stored Value DESCRIPTION Texas Instruments’ Tag-it™ HF-I standard transponder inlays consist of 13.56-MHz high-frequency (HF) transponders that are compliant with the ISO/IEC 15693 and ISO/IEC 18000-3 global open standards. These products offer a user-accessible memory of 256 bits, organized in eight blocks, and an optimized command set available in five different antenna shapes, with frequency offset for integration into paper, PVC, or other substrates. The Tag-it HF-I standard transponder inlays are manufactured with TI’s patented laser tuning process to provide consistent read performance. Prior to delivery, the transponders undergo complete functional and parametric testing, in order to provide the high quality that customers have come to expect from TI. The Tag-it HF-I standard transponder inlays are well suited for a variety of applications including, but not limited to, product authentication, library, supply-chain management, asset management, and ticketing/stored value applications. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Tag-it is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2011, Texas Instruments Incorporated RI-I16-114A-01 SCBS818B – DECEMBER 2005 – REVISED SEPTEMBER 2011 www.ti.com Table 1. Specifications (1) PART NUMBER RI-I16-114A-01 Supported standard ISO/IEC 15693-2, -3; ISO/IEC 18000-3 Recommended operating frequency 13.56 MHz Passive resonance frequency (at 25°C) 13.70 MHz ± 400 kHz (includes frequency offset to compensate further integration into paper or PVC lamination) Typical required activation field strength to read (at 25°C) 113 dBµA/m (2) Typical required activation field strength to write (at 25°C) 116 dBµA/m (2) Factory-programmed read-only number 64 bits Memory (user programmable) 256 bits organized in 8-bit × 32-bit blocks Typical programming cycles (at 25°C) 100,000 Data retention time (at 55°C) >10 years Simultaneous identification of tags Up to 50 tags per second (reader/antenna dependent) Antenna size ∅ 24.2 mm +0.1 mm/–0.2 mm (~0.95 in) Foil width 48 mm ± 0.5 mm (1.89 in ± 0.02 in) Foil pitch 50.8 mm +0.1 mm/–0.4 mm (2 in) Thickness Chip area: 0.34 mm ±0.02 Antenna area (Al both sides): 0.085 mm ±0.01 Antenna area (Al one side): 0.075 mm ±0.008 Base material Substrate: PET (polyethylenetherephtalate); Antenna: aluminum Operating temperature –25°C to 70°C Storage temperature (single inlay) –40°C to 85°C (warpage may occur at upper temperature range) Storage temperature (on reel) –40°C to 40°C Delivery Single-row tape wound on cardboard reel with 500-mm diameter Reel outer width: approximately 60 mm (~2.36 in) Reel inner width: approximately 50 mm (~1.97 in) Hub diameter: 76.2 mm (3 in) Typical quantity of good units per reel 5,000 (1) (2) For highest possible read-out coverage, operate readers at a modulation depth of 20% or higher. After integration into paper or PVC lamination Table 2. Supported Command Set REQUEST REQUEST MODE (1) REQUEST CODE INVENTORY ADDRESSED NON-ADDRESSED AFI OPT. FLAG – ✓ 0 ISO 15693 Mandatory and Optional Commands Inventory 0x01 ✓ – Stay Quiet 0x02 – ✓ – – 0 Read_Single_Block 0x20 – ✓ ✓ – 1 Write_Single_Block 0x21 – ✓ ✓ – 1 Lock_Block 0x22 – ✓ ✓ – 1 (1) 2 ✓ = Implemented, – = Not applicable Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Product Folder Link(s): RI-I16-114A-01 RI-I16-114A-01 SCBS818B – DECEMBER 2005 – REVISED SEPTEMBER 2011 www.ti.com Memory Organization Block Addr 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 32 bits Lock Bits U U = User Lock User data (256 bits) 0x08 0x09 UID Number (64 bits) 0x0A AFI Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Product Folder Link(s): RI-I16-114A-01 3 PACKAGE OPTION ADDENDUM www.ti.com 7-Sep-2011 PACKAGING INFORMATION Orderable Device RI-I16-114A-01 Status (1) ACTIVE Package Type Package Drawing RFIDN TFC Pins Package Qty 0 5000 Eco Plan (2) Pb-Free (RoHS) Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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