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RI-TRP-DR2B
SCBS842E – SEPTEMBER 2001 – REVISED FEBRUARY 2019
RI-TRP-DR2B 32-mm glass transponder
1 Device Overview
1.1
Features
1
• Best-in-class performance through patented halfduplex (HDX) technology
• Patented transponder tuning provides stable and
high read and write performance
1.2
•
•
•
Applications
Access control
Vehicle identification
Container tracking
1.3
• MPT 1360-bit type
• ISO 11784 and ISO 11785 compliant
• Insensitive to almost all nonmetallic materials
•
•
Asset management
Waste management
Description
TI 32-mm glass transponders provide superior performance and operate at a resonance frequency of
134.2 kHz. Specific products are compliant to ISO 11784 and ISO 11785 global open standards. TI LF
transponders are manufactured with TI's patented tuning process to provide consistent read and write
performance. Before delivery, the transponders undergo complete functional and parametric testing to
provide the high quality that customers have come to expect from TI. The transponder is well suited for
use in a broad range of applications including, but not limited to, access control, vehicle identification,
container tracking, asset management, and waste management applications.
Device Information (1)
PART NUMBER
RI-TRP-DR2B-40
(1)
(2)
PACKAGE (PIN)
BODY SIZE (2)
TRP (0)
3.85 mm × 32.2 mm
For the most current device, package, and ordering information, see the Package Option Addendum in
Section 5, or see the TI website at www.ti.com.
The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 5.
Figure 1-1. RI-TRP-DR2B Transponder
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
RI-TRP-DR2B
SCBS842E – SEPTEMBER 2001 – REVISED FEBRUARY 2019
www.ti.com
Table of Contents
1
2
3
Device Overview ......................................... 1
4
Device and Documentation Support ................. 4
1.1
Features .............................................. 1
4.1
Getting Started and Next Steps ...................... 4
1.2
Applications ........................................... 1
4.2
Device Nomenclature................................. 4
1.3
Description ............................................ 1
4.3
Documentation Support
Revision History ......................................... 2
Specifications ............................................ 3
4.4
Community Resources ............................... 5
4.5
Trademarks ........................................... 5
3.1
Absolute Maximum Ratings .......................... 3
4.6
Electrostatic Discharge Caution ...................... 5
3.2
ESD Ratings .......................................... 3
4.7
Export Control Notice ................................. 5
3.3
Recommended Operating Conditions ................ 3
4.8
Glossary .............................................. 5
3.4
Electrical Characteristics ............................. 3
3.5
Physical Characteristics .............................. 3
5
..............................
4
Mechanical, Packaging, and Orderable
Information ................................................ 6
2 Revision History
Changes from October 20, 2016 to February 28, 2019
•
2
Changed package designator from TGB to TRP
Page
................................................................................
Revision History
1
Copyright © 2001–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: RI-TRP-DR2B
RI-TRP-DR2B
www.ti.com
SCBS842E – SEPTEMBER 2001 – REVISED FEBRUARY 2019
3 Specifications
3.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
TA
Operating temperature
Write (program) temperature
TSTG
(1)
Storage temperature
MIN
MAX
–25
85
UNIT
°C
0
70
°C
–40
125 (1)
°C
MIN
MAX
UNIT
0
70
For a total of 1000 hours
3.2
ESD Ratings
Device is fully encapsulated and protected. No ESD classification applies.
3.3
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Tr
Recommended operating temperature
3.4
°C
Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Functionality
RI-TRP-DR2B
UNIT
MPT
1360
Memory
bits
17 R/W
pages
Operating Frequency
134.2
Modulation
FSK (frequency shift keying), 134.2 kHz and 123.2 kHz
Transmission Principle
HDX (half duplex)
Power Source
Powered from the reader signal (batteryless)
Typical Read Range
≤100 (1)
Typical Programming Range
30% of specified reading range
Typical Read Time
86
ms
Typical Programming Time
293
ms
Typical Programming Cycles
100000
(1)
kHz
cm
Depends on RF regulation in country of use, the reader antenna configuration used, and the environmental conditions.
3.5
Physical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
RI-TRP-DR2B
Case Material
Glass
Protection Class
Hermetically sealed
EMC
Programmed code is not affected by normal electromagnetic interference or x-rays
Signal Penetration
Transponder can be read through almost all nonmetallic material
Dimensions
⌀3.85 ±0.05 × 32.2 ±0.6
Weight
0.85
UNIT
mm
g
Specifications
Copyright © 2001–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: RI-TRP-DR2B
3
RI-TRP-DR2B
SCBS842E – SEPTEMBER 2001 – REVISED FEBRUARY 2019
www.ti.com
4 Device and Documentation Support
4.1
Getting Started and Next Steps
RFID products from TI provide the ultimate solution for a wide range of applications. With its patented
HDX technology, TI RFID offers unmatched performance in read range, read rate and robustness. For
more information, see Overview for NFC / RFID.
4.2
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of
devices. Each commercial family member has one of three prefixes: X, P, or no prefix (for example, XRITRP-DR2B).These prefixes represent evolutionary stages of product development from engineering
prototypes (with prefix X) through fully qualified production devices (with no prefix).
Device development evolutionary flow:
X – Experimental device that is not necessarily representative of the electrical specifications of the final
device
P – Final device that conforms to the electrical specifications of the final product but has not completed
quality and reliability verification
null – Fully qualified production device
Devices with a prefix of X or P are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices have a greater failure rate than the standard production devices.
TI recommends that these devices not be used in any production system because their expected end-use
failure rate still is undefined. Only qualified production devices are to be used.
4.3
Documentation Support
The following documents describe the RI-TRP-DR2B device. Copies of these documents are available on
the Internet at www.ti.com.
Receiving Notice of Document Updates
To receive notification of documentation updates—including silicon errata—go to the product folder for
your device on ti.com (for example, RI-TRP-DR2B). In the upper right corner, click the "Alert me" button.
This registers you to receive a weekly digest of product information that has changed (if any). For change
details, check the revision history of any revised document.
User's Guides
32-mm glass-encapsulated multipage transponders reference guide
Describes the use of the 32-mm glass transponders.
32-mm glass encapsulated multipage transponders
The TI 32-mm glass transponder is a key product in low-frequency RFID systems that can
be used for a variety of applications, and is especially useful for those applications requiring
a robust and waterproof transponder.
Multipage, selective-addressable, selective-addressable (secured) transponders
The TIRIS transponder is a key product in low frequency RFID systems that can be used for
a variety of applications. Electromagnetic signals are used to power the passive (batteryless)
device, to transmit the identification number to a reader unit, or to program the device with
new data. The transponder comprises an antenna, a charge capacitor, a resonance
capacitor, and the integrated circuit. The antenna inductance and a capacitor form a highquality resonant circuit.
4
Device and Documentation Support
Copyright © 2001–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: RI-TRP-DR2B
RI-TRP-DR2B
www.ti.com
SCBS842E – SEPTEMBER 2001 – REVISED FEBRUARY 2019
Selection and Solution Guides
RFID systems product specifications
Texas Instruments Radio Frequency Identification Systems is an industry leader in RFID
technology, and the world’s largest integrated manufacturer of TI-RFid™ tags, TI-RFid smart
labels, and TI-RFid reader systems. With more than 1 billion RFID tags manufactured, TIRFid technology is used in a broad range of RFID applications worldwide. TI is an active
member of many standards bodies, including ISO, ISO/IEC, ECMA International, ETSI, and
several national standardization bodies working to drive the adoption of global standards for
RFID technology.
4.4
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ online community
Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
4.5
Trademarks
TI-RFid, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
4.6
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.7
Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
4.8
Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
Device and Documentation Support
Copyright © 2001–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: RI-TRP-DR2B
5
RI-TRP-DR2B
SCBS842E – SEPTEMBER 2001 – REVISED FEBRUARY 2019
www.ti.com
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
6
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: RI-TRP-DR2B
Copyright © 2001–2019, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
19-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
RI-TRP-DR2B-40
ACTIVE
XCEPT
TRP
0
2000
TBD
Call TI
Call TI
-25 to 85
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of