NE5532, NE5532A
SA5532, SA5532A
www.ti.com................................................................................................................................................... SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009
DUAL LOW-NOISE OPERATIONAL AMPLIFIERS
FEATURES
1
•
•
•
•
•
•
NE5532, NE5532A . . . D, P, OR PS PACKAGE
SA5532, SA5532A . . . D OR P PACKAGE
(TOP VIEW)
Equivalent Input Noise Voltage:
5 nV/√Hz Typ at 1 kHz
Unity-Gain Bandwidth: 10 MHz Typ
Common-Mode Rejection Ratio: 100 dB Typ
High DC Voltage Gain: 100 V/mV Typ
Peak-to-Peak Output Voltage Swing 26 V Typ
With VCC± = ±15 V and RL = 600 Ω
High Slew Rate: 9 V/µs Typ
1OUT
1
8
VCC+
1IN–
2
7
2OUT
1IN+
3
6
2IN–
VCC–
4
5
2IN+
DESCRIPTION/ORDERING INFORMATION
The NE5532, NE5532A, SA5532, and SA5532A are high-performance operational amplifiers combining excellent
dc and ac characteristics. They feature very low noise, high output-drive capability, high unity-gain and
maximum-output-swing bandwidths, low distortion, high slew rate, input-protection diodes, and output
short-circuit protection. These operational amplifiers are compensated internally for unity-gain operation. These
devices have specified maximum limits for equivalent input noise voltage.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
PDIP – P
0°C to 70°C
SOIC – D
SOP – PS
PDIP – P
–40°C to 85°C
SOIC – D
(1)
(2)
Tube of 50
ORDERABLE PART NUMBER
NE5532P
NE5532AP
NE5532AP
Tube of 75
NE5532D
Reel of 2500
NE5532DR
Tube of 75
NE5532AD
Reel of 2500
NE5532ADR
Reel of 2000
Tube of 50
TOP-SIDE MARKING
NE5532P
N5532
N5532A
NE5532PSR
N5532
NE5532APSR
N5532A
SA5532P
SA5532P
SA5532AP
SA5532AP
Tube of 75
SA5532D
Reel of 2500
SA5532DR
Tube of 75
SA5532AD
Reel of 2500
SA5532ADR
SA5532
SA5532A
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1979–2009, Texas Instruments Incorporated
NE5532, NE5532A
SA5532, SA5532A
SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009................................................................................................................................................... www.ti.com
SCHEMATIC (EACH AMPLIFIER)
VCC+
36 pF
IN+
37 pF
14 pF
15 W
OUT
7 pF
IN–
15 W
460 W
VCC–
Component values shown are nominal.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage (2)
VCC+
22 V
VCC–
–22 V
Input voltage, either input (2) (3)
VCC±
Input current (4)
±10 mA
Duration of output short circuit (5)
θJA
Package thermal impedance (6) (7)
TJ
Operating virtual-junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
(7)
2
Unlimited
D package
97°C/W
P package
85°C/W
PS package
95°C/W
150°C
–65°C to 150°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–.
The magnitude of the input voltage must never exceed the magnitude of the supply voltage.
Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless
some limiting resistance is used.
The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the
maximum dissipation rating is not exceeded.
The package thermal impedance is calculated in accordance with JESD 51-7.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) - TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
Submit Documentation Feedback
Copyright © 1979–2009, Texas Instruments Incorporated
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
NE5532, NE5532A
SA5532, SA5532A
www.ti.com................................................................................................................................................... SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009
RECOMMENDED OPERATING CONDITIONS
VCC+
Supply voltage
VCC–
Supply voltage
TA
Operating free-air temperature
MIN
MAX
5
15
V
V
–5
–15
NE5532, NE5532A
0
70
SA5532, SA5532A
–40
85
TYP
MAX
0.5
4
UNIT
°C
ELECTRICAL CHARACTERISTICS
VCC± = ±15 V, TA = 25°C (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
VIO
Input offset voltage
VO = 0
IIO
Input offset current
IIB
Input bias current
VICR
Common-mode input-voltage range
VOPP
Maximum peak-to-peak output-voltage
swing
TA = Full range (2)
5
TA = 25°C
10
TA = Full range (2)
200
TA = Full range (2)
RL ≥ 2 kΩ, VO±10 V
800
1000
UNIT
mV
nA
nA
±12
±13
V
24
26
V
TA = 25°C
15
50
TA = Full range (2)
10
TA = 25°C
25
TA = Full range (2)
15
RL ≥ 600 Ω, VCC± = ±15 V
Large-signal differential-voltage
amplification
150
200
TA = 25°C
RL ≥ 600 Ω, VO = ±10 V
AVD
MIN
TA = 25°C
V/mV
100
Avd
Small-signal differential-voltage
amplification
f = 10 kHz
2.2
BOM
Maximum output-swing bandwidth
RL = 600 Ω, VO = ±10 V
140
kHz
B1
Unity-gain bandwidth
RL = 600 Ω, CL = 100 pF
10
MHz
ri
Input resistance
30
300
kΩ
zo
Output impedance
0.3
Ω
VIC = VICR min
70
100
dB
VCC± = ±9 V to ±15 V, VO = 0
80
100
dB
10
38
60
mA
8
16
mA
AVD = 30 dB, RL = 600 Ω, f = 10 kHz
CMRR Common-mode rejection ratio
kSVR
Supply-voltage rejection ratio
(ΔVCC±/ΔVIO)
IOS
Output short-circuit current
ICC
Total supply curent
VO = 0, No load
Crosstalk attenuation (VO1/VO2)
V01 = 10 V peak, f = 1 kHz
(1)
(2)
V/mV
110
dB
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Full temperature ranges are: –40°C to 85°C for the SA5532 and SA5532A, and 0°C to 70°C for the NE5532 and NE5532A.
Copyright © 1979–2009, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
3
NE5532, NE5532A
SA5532, SA5532A
SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009................................................................................................................................................... www.ti.com
OPERATING CHARACTERISTICS
VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER
SR
TEST CONDITIONS
Slew rate at unity gain
Vn
Equivalent input noise voltage
In
Equivalent input noise current
4
Submit Documentation Feedback
MIN
TYP
MAX
NE5532A, SA5532A
MIN
TYP
MAX
UNIT
9
9
V/µs
10
10
%
f = 30 Hz
8
8
10
f = 1 kHz
5
5
6
f = 30 Hz
2.7
2.7
f = 1 kHz
0.7
0.7
VI = 100 mV, RL = 600 Ω,
AVD = 1, CL = 100 pF
Overshoot factor
NE5532, SA5532
nV/√Hz
pA/√Hz
Copyright © 1979–2009, Texas Instruments Incorporated
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
NE5532AD
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532ADE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532ADG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532ADR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532ADRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532ADRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532AIP
OBSOLETE
PDIP
P
8
TBD
Call TI
NE5532AP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
NE5532APE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
NE5532APSR
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532APSRE4
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532APSRG4
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532DE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532DRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532IP
OBSOLETE
PDIP
P
8
TBD
Call TI
NE5532P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
NE5532PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
NE5532PSR
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532PSRE4
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532PSRG4
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532AD
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532ADE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
4-Feb-2009
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
SA5532ADG4
ACTIVE
SOIC
D
8
SA5532ADR
ACTIVE
SOIC
D
SA5532ADRE4
ACTIVE
SOIC
SA5532ADRG4
ACTIVE
SA5532AP
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SA5532APE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SA5532D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532DE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532DRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SA5532PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2009
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Feb-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadra
NE5532ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
NE5532APSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
NE5532DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
NE5532PSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SA5532ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SA5532DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Feb-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
NE5532ADR
SOIC
D
8
2500
340.5
338.1
20.6
NE5532APSR
SO
PS
8
2000
346.0
346.0
33.0
NE5532DR
SOIC
D
8
2500
340.5
338.1
20.6
NE5532PSR
SO
PS
8
2000
346.0
346.0
33.0
SA5532ADR
SOIC
D
8
2500
340.5
338.1
20.6
SA5532DR
SOIC
D
8
2500
340.5
338.1
20.6
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
This datasheet has been downloaded from:
www.EEworld.com.cn
Free Download
Daily Updated Database
100% Free Datasheet Search Site
100% Free IC Replacement Search Site
Convenient Electronic Dictionary
Fast Search System
www.EEworld.com.cn
All Datasheets Cannot Be Modified Without Permission
Copyright © Each Manufacturing Company
工商网监
湘ICP备2023018690号
