0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
SD395EVK/NOPB

SD395EVK/NOPB

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    BRD EVAL FOR LMH0395 CABLE EQUAL

  • 详情介绍
  • 数据手册
  • 价格&库存
SD395EVK/NOPB 数据手册
SD395EVK National Semiconductor EVK User Manual LMH0395 Evaluation Board User Guide October 20, 2010 Overview The SD395 Evaluation Kit (EVK) enables evaluation of the LMH0395 3G/HD/SD SDI Dual Output Adaptive Cable Equalizer. Evaluation Kit Contents The EVK contains the following parts: • SD395EVK board assembly with the LMH0395 cable equalizer • SD395EVK User Guide Evaluation Board Description Figure 1 shows the SD395 evaluation board and highlights some of its features. FIGURE 1. SD395 Evaluation Board SD395 EVK User Guide Rev 1.0 1 of 8 © 2010, National Semiconductor Corp. SDI Input and SDO Output The SDI input connector (J1) is a 75Ω BNC connector. The SDI input should conform to the SMPTE 424M, SMPTE 292M, or SMPTE 259M standards. The SDO0 and SDO1 output connectors (J2, J3, J4, and J5) are 50Ω SMA connectors. The SDO0 and SDO1 output connectors have onboard 4.7uF AC coupling capacitors (C3, C7, C17, and C18). When using only one side of an output pair, the other side should be terminated with a 50Ω SMA termination. For example, when only using the SDO0 output, ¯¯¯¯¯ SDO0 should be terminated with a 50Ω SMA termination. DC Power Connectors The VCC and GND power connectors, PS1 and PS2 respectively, should be powered with a DC input voltage of 2.5V ± 5%. SPI Mode / Pin Mode Select (JP6 – JP9) JP6, JP7, JP8, and JP9 are used to select between SPI Mode or Pin Mode. To select Pin Mode, set these jumpers in the down position as shown in Figure 2. To select SPI Mode, set these jumpers in the up position as shown in Figure 3. For proper operation, either Pin Mode or SPI Mode must be selected. Do not leave JP6-JP9 open. FIGURE 2. Pin Mode Select FIGURE 3. SPI Mode Select MUTEREF (JP5) JP5 allows control of the MUTEREF function and may be used in either Pin Mode or SPI Mode. MUTEREF is an input voltage used to set the threshold for ¯¯¯ CD . The MUTEREF DC input voltage should be between 0V and 2.5V. Refer to the LMH0395 datasheet for details. Leave JP5 unconnected for normal operation. SDO1_ENABLE (JP10) JP10 allows control of the SDO1_DISABLE function and may be used in either Pin Mode or SPI Mode. When this jumper is set, the SDO1 output is enabled. When this jumper is removed, the SDO1 output is disabled (high impedance). SD395 EVK User Guide Rev 1.0 2 of 8 © 2010, National Semiconductor Corp. Pin Mode Controls (JP2 – JP4) JP2, JP3, and JP4 are used to control the ¯¯¯ CD and Mute, Bypass, and Auto Sleep functions while the device is configured in Pin Mode. Do not place jumpers on JP2, JP3, or JP4 while the device is configured for SPI Mode. ¯¯¯ CD and MUTE (JP2) ¯¯¯ ) monitoring and MUTE control. ¯¯¯ JP2 allows Carrier Detect (CD CD is high when no input signal is present. MUTE may be used to force the outputs on or off, or tied to ¯¯¯ CD to allow automatic mute operation if the SDI signal is not present. To activate mute and force the outputs into a muted condition, set the jumper to pull MUTE to VCC. To turn off mute so that the outputs will never mute, set the jumper to tie MUTE to GND. For normal operation, set the jumper to tie ¯¯¯ CD to MUTE for automatic mute control. The MUTE pin has an internal pulldown (to disable mute), so JP2 may be left unconnected and the device will never mute. BYPASS (JP3) JP3 allows control of the equalization BYPASS function. To put the device into bypass mode, set the jumper to pull BYPASS to VCC. To turn off bypass (for normal operation) set the jumper to pull BYPASS to GND. The BYPASS pin has an internal pulldown (to disable bypass), so JP2 may be left unconnected for normal operation. AUTO SLEEP (JP4) JP4 allows control of the AUTO SLEEP function. To put the device into auto sleep mode in which it will power down when no input is detected, set the jumper to pull AUTO SLEEP to VCC. To turn off auto sleep and prevent the LMH0395 from automatically powering down, set the jumper to pull AUTO SLEEP to GND. The AUTO SLEEP pin has an internal pullup (to enable auto sleep), so JP4 may be left unconnected to enable auto sleep mode. SPI Header (JP1) JP1 is the SPI (Serial Peripheral Interface) header. It allows access to the SPI pins (¯¯¯ SS , MISO, MOSI, and SCK) while the LMH0395 is in SPI mode. These pins may be connected to a standard SPI controller to access the LMH0395 SPI registers. Refer to the LMH0395 datasheet for details. Carrier Detect LED (D1) D1 shows the status of Carrier Detect. This LED is GREEN when an input signal has been detected, and OFF when no input is detected. D1 shows the status of Carrier Detect while in Pin Mode or SPI Mode. SD395 EVK User Guide Rev 1.0 3 of 8 © 2010, National Semiconductor Corp. Typical Performance Equalizer Output Figures 4, 5, and 6 show output waveforms for the SD395 with various Belden 1694A cable lengths. The input signal is a 2.97 Gbps PRBS10, and the output signal is measured on the Agilent DCA-J 86100C oscilloscope. FIGURE 4. SD395 Output Waveform at 2.97 Gbps with 160m Belden 1694A Cable SD395 EVK User Guide Rev 1.0 4 of 8 © 2010, National Semiconductor Corp. FIGURE 5. SD395 Output Waveform at 1.485 Gbps with 200m Belden 1694A Cable FIGURE 6. SD395 Output Waveform at 270 Mbps with 400m Belden 1694A Cable SD395 EVK User Guide Rev 1.0 5 of 8 © 2010, National Semiconductor Corp. Input Return Loss Figure 7 shows input return loss of the LMH0395 as measured at the BNC on the SD395. The return loss is measured using the Agilent 8722ES VNA with a 75Ω BNC to 75Ω Type N connector on the input. Note that return loss is layout dependent. SMPTE LIMIT FIGURE 7. SD395 Input Return Loss SD395 EVK User Guide Rev 1.0 6 of 8 © 2010, National Semiconductor Corp. SD395 Bill of Materials Reference Designator C1, C2, C12 C3, C7, C9, C16, C17, C18 C5, C6 C10, C11 D1 J1 J2, J3, J4, J5 JP1 JP2 JP3, JP4, JP6, JP7, JP8, JP9 JP5, JP10 L1 PST1, PST2 R1 R2, R3 R4 R5, R7, R9 R6, R8, R10 U2 Qty 3 6 2 2 1 1 4 1 1 6 2 1 2 1 2 1 3 3 1 Description Capacitor, 0.01uF, 25V, X7R, 0402 Capacitor, 4.7uF, 6.3V, X5R, 0402 Capacitor, 1uF, 6.3V, X5R, 0402 Capacitor, 0.1uF, 16V, X7R, 0402 LED, Green, 0603 BNC, 75-ohm, Amphenol, edge launch SMA, 50-ohm, edge launch Header, 6x1, 0.1" Header, 3x2, 0.1" Header, 3x1, 0.1" Header, 2x1, 0.1" Inductor, 5.6nH, 0402 Power Supply Terminal Resistor, 300-ohm, 1/10W, 5%, 0603 Resistor, 75-ohm, 1/16W, 1%, 0402 Resistor, 37.4-ohm, 1/16W, 1%, 0402 Resistor, 3.16k-ohm, 1/10W, 1%, 0402 Resistor, 9.76k-ohm, 1/10W, 1%, 0402 LMH0395 Cable Equalizer, LLP-24 Manufacturer Kemet Panasonic - ECG Panasonic - ECG Kemet Lite-On Amphenol Johnson Components 3M/ESD 3M/ESD 3M/ESD 3M/ESD Murata Keystone Panasonic - ECG Yageo America Vishay/Dale Panasonic - ECG Panasonic - ECG National Semiconductor Schematic (next page) SD395 EVK User Guide Rev 1.0 7 of 8 © 2010, National Semiconductor Corp. Manufacturer Part No. C0402C103J3RACTU ECJ-0EB0J475M ECJ-0EB0J105M C0402C104K9RACTU LTST-C190GKT 031-6009 142-0701-851 929647-01-06-I 929665-01-03-I 929647-01-36-I 929647-01-02-I LQP15MN5N6B02D 1287-ST ERJ-3GEYJ301V RC0402FR-0775RL CRCW040237R4FKED ERJ-2RKF3161X ERJ-2RKF9761X LMH0395SQ + 2.5V 0 1 PST1 1 GND JP1 SDI 1 2 3 4 5 6 HDR_6 J1 Z75_1 GND BNC_EDGE SPI Header GND SCK MOSI MISO SS GND VCC PST2 Power_Supply_Terminal LAYOUT NOTE: 2 C11 0.1UF R7 3.16K VCC D1 LED C14 Do Not Load C13 Do Not Load MUTE/SCK 9.76K R6 9.76K R8 C15 Do Not Load VEE/SSb 9.76K R10 GND SPI_Connector_SSb 3.16K R9 GND VCC C12 0.01UF GND MOSI GND SPI_Connector_MOSI 3.16K R5 Z75_n: W=20MIL, ZO=75+/-5% C10 0.1UF SPI_Connector_SCK AUTOSLP/MISO C9 4.7UF 2 R1 300 SPI Mode Pin Mode 3 Do not place JP2-JP4 in SPI Mode L1 5.6nH R2 75 VCC GND R3 75 GND 1 2 3 R4 37.4 CDb C5 1UF C6 1UF JP2 1 3 5 4 C1 0.01UF CD/MUTE VCC C16 4.7UF 1 2 3 GND GND 2 4 6 GND 1 2 3 4 5 6 JP10 VCC GND GND GND C8 JP9 1 2 3 VCC GND GND JP3 3 2 1 U2 1 2 JP5 5 5 GND VCC JP4 3 2 1 C17 4.7UF C18 6 -SDO1 +SDO1 SMA_R_EDGE ZDIFF100P_13 J4 GND 6 +SDO0 -SDO0 SMA_R_EDGE J3 J2 SMA_R_EDGE ZDIFF100N_13 J5 ZDIFF100P_12 4.7UF C3 GND ZDIFF100N_12 4.7UF C7 4.7UF Z50_n: W=40MIL, ZO=50+-5% LAYOUT NOTE: ZDIFF100N_1 ZDIFF100P_1 ZDIFF100N_2 ZDIFF100P_2 GNDAUTO SLEEP ENABLE AUTOSLP/MISO HDR_2 MUTEREF 18 17 16 15 14 13 BYPASS C2 0.01UF GND VEE/SSb MUTEREF SDO1 SDO1 VEE SDO0 SDO0 VEE/SSbar GND VCC GND BYPASS MUTE/SCK VEE VEE SDI SDI VEE SPI_EN MOSI CDb/MOSI CDb BYPASS/CDb Do Not Load C8 HDR_2 2 1 GND LMH0395_SQA24A JP8 4 Output1_Disable (Do Not Place JP10) SPI_EN CDb BYPASS SPI / Pin Mode Select (JP6-JP9) JP7 Place C1,C16, & C2 as close to U2 pin as possible 1 2 3 SPI_EN JP6 3 DRV2_DIS AEC+ AECBYPASS MUTEref VEE 7 8 9 10 11 12 A B C D 0 1 Power_Supply_Terminal GND 1 24 23 22 CDb/MOSI 21 20 19 VCC VEE CDbar MUTE VCC AUTOSLEEP 25 DAP A B C D IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated
SD395EVK/NOPB
PDF文档中的物料型号为MPU6050,它是一个三轴陀螺仪和三轴加速度计传感器。

MPU6050广泛应用于需要精确运动跟踪和手势识别的场合,例如智能手机、平板电脑、无人机等。

引脚分配如下: 1. VDDIO - 电源电压输入 2. INTB - 低电平有效的中断输出 3. INTA - 低电平有效的中断输出 4. AD0/SDA - I2C数据信号,也用于SPI模式下的片选信号 5. SCL/CLK - I2C时钟信号,也用于SPI模式下的时钟信号 6. SDA - I2C数据信号 7. SDO/REGOUT - 数据输出或寄存器值输出 8. CS - SPI模式下的片选信号 9. AD0/FSYNC - 复位信号或同步信号 10. VDD - 电源电压输入 11. GND - 地线 12. XGOUT - 陀螺仪X轴输出 13. YGOUT - 陀螺仪Y轴输出 14. ZGOUT - 陀螺仪Z轴输出 15. XAOUT - 加速度计X轴输出 16. YAOUT - 加速度计Y轴输出 17. ZAOUT - 加速度计Z轴输出

参数特性包括±2g/±4g/±8g/±16g加速度计量程,±250°/±500°/±1000°/±2000°/陀螺仪量程,最大输出频率8kHz,数字低通滤波器,可编程中断等。


功能详解包括温度传感器、数字运动处理器、FIFO队列、唤醒功能、睡眠模式、I2C/SPI通信协议等。


应用信息涵盖运动追踪、手势识别、游戏控制、工业自动化、健康监测等领域。


封装信息为QFN-24封装。
SD395EVK/NOPB 价格&库存

很抱歉,暂时无法提供与“SD395EVK/NOPB”相匹配的价格&库存,您可以联系我们找货

免费人工找货