SM320VC5416PGE16EP

SM320VC5416-EP Fixed-Point Digital Signal Processor Data Manual Literature Number: SGUS048 July 2003
          
             
 !     !    Contents Contents Section Page 1 SM320VC5416-EP Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.1 Terminal Assignments for the GGU Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.2 Pin Assignments for the PGE Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 2 4 5 3 Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.1 Data Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.2 Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.3 Extended Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 On-Chip ROM With Bootloader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 On-Chip RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 On-Chip Memory Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.1 Relocatable Interrupt Vector Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6 On-Chip Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.1 Software-Programmable Wait-State Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.2 Programmable Bank-Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.3 Bus Holders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7 Parallel I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7.1 Enhanced 8-/16-Bit Host-Port Interface (HPI8/16) . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7.2 HPI Nonmultiplexed Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 Multichannel Buffered Serial Ports (McBSPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.9 Hardware Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.10 Clock Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.11 Enhanced External Parallel Interface (XIO2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12 DMA Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.2 DMA External Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.3 DMA Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.4 DMA Priority Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.5 DMA Source/Destination Address Modification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.6 DMA in Autoinitialization Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.7 DMA Transfer Counting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.8 DMA Transfer in Doubleword Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.9 DMA Channel Index Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.10 DMA Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.11 DMA Controller Synchronization Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.13 General-Purpose I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.13.1 McBSP Pins as General-Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.13.2 HPI Data Pins as General-Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10 10 11 11 11 12 12 13 14 15 16 17 19 19 19 20 22 24 24 25 28 29 29 30 31 31 31 32 32 32 33 33 34 34 34 July 2003 SGUS048 i Contents Section 3.14 3.15 3.16 3.17 3.18 Page Device ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory-Mapped Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP Control Registers and Subaddresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DMA Subbank Addressed Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 35 38 39 41 4 Documentation Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Device and Development Tool Support Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 43 5 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Electrical Characteristics Over Recommended Operating Case Temperature Range (Unless Otherwise Noted) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Package Thermal Resistance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 Timing Parameter Symbology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.6 Internal Oscillator With External Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7 Clock Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7.1 Divide-By-Two and Divide-By-Four Clock Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7.2 Multiply-By-N Clock Option (PLL Enabled) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.8 Memory and Parallel I/O Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.8.1 Memory Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.8.2 Memory Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.8.3 I/O Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.8.4 I/O Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.9 Ready Timing for Externally Generated Wait States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.10 HOLD and HOLDA Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.11 Reset, BIO, Interrupt, and MP/MC Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.12 Instruction Acquisition (IAQ) and Interrupt Acknowledge (IACK) Timings . . . . . . . . . . . . . . . . . 5.13 External Flag (XF) and TOUT Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.14 Multichannel Buffered Serial Port (McBSP) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.14.1 McBSP Transmit and Receive Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.14.2 McBSP General-Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.14.3 McBSP as SPI Master or Slave Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.15 Host-Port Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.15.1 HPI8 Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.15.2 HPI16 Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 44 44 45 46 46 46 47 47 49 50 50 52 53 54 55 59 62 64 65 66 66 69 70 74 74 78 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.1 Ball Grid Array Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.2 Low-Profile Quad Flatpack Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 82 83 6 ii SGUS048 July 2003 Figures List of Figures Figure Page 2−1 2−2 144-Ball GGU MicroStar BGA (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144-Pin PGE Low-Profile Quad Flatpack (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 3−1 3−2 3−3 3−4 3−5 3−6 3−7 3−8 3−9 3−10 3−11 3−12 3−13 3−14 3−15 3−16 3−17 3−18 3−19 3−20 3−21 3−22 SM320VC5416-EP Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Program and Data Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Extended Program Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Processor Mode Status (PMST) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Software Wait-State Register (SWWSR) [Memory-Mapped Register (MMR) Address 0028h] . . . Software Wait-State Control Register (SWCR) [MMR Address 002Bh] . . . . . . . . . . . . . . . . . . . . . . . Bank-Switching Control Register (BSCR) [MMR Address 0029h] . . . . . . . . . . . . . . . . . . . . . . . . . . . . Host-Port Interface — Nonmultiplexed Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HPI Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Multichannel Control Registers (MCR1 and MCR2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Control Register (PCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nonconsecutive Memory Read and I/O Read Bus Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Consecutive Memory Read Bus Sequence (n = 3 reads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Write and I/O Write Bus Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DMA Transfer Mode Control Register (DMMCRn) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-Chip DMA Memory Map for Program Space (DLAXS = 0 and SLAXS = 0) . . . . . . . . . . . . . . . . On-Chip DMA Memory Map for Data and IO Space (DLAXS = 0 and SLAXS = 0) . . . . . . . . . . . . . DMPREC Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General-Purpose I/O Control Register (GPIOCR) [MMR Address 003Ch] . . . . . . . . . . . . . . . . . . . . General-Purpose I/O Status Register (GPIOSR) [MMR Address 003Dh] . . . . . . . . . . . . . . . . . . . . . Device ID Register (CSIDR) [MMR Address 003Eh] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IFR and IMR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13 13 14 16 17 17 20 21 23 23 26 27 28 29 30 31 32 34 34 35 41 5−1 5−2 5−3 5−4 5−5 5−6 5−7 5−8 5−9 5−10 5−11 5−12 5−13 3.3-V Test Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal Divide-by-Two Clock Option With External Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Divide-by-Two Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Multiply-by-One Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nonconsecutive Mode Memory Reads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Consecutive Mode Memory Reads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Write (MSTRB = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parallel I/O Port Read (IOSTRB = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parallel I/O Port Write (IOSTRB = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Read With Externally Generated Wait States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Write With Externally Generated Wait States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I/O Read With Externally Generated Wait States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I/O Write With Externally Generated Wait States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 47 48 49 50 51 52 53 54 56 57 58 59 July 2003 SGUS048 iii Figures Figure Page 5−14 5−15 5−16 5−17 5−18 5−19 5−20 5−21 5−22 5−23 5−24 5−25 5−26 5−27 5−28 5−29 5−30 5−31 5−32 5−33 5−34 HOLD and HOLDA Timings (HM = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reset and BIO Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MP/MC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Instruction Acquisition (IAQ) and Interrupt Acknowledge (IACK) Timings . . . . . . . . . . . . . . . . . . . . . External Flag (XF) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TOUT Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP Receive Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP Transmit Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP General-Purpose I/O Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 . . . . . . . . . . . . . . . . . . . . . . . . McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 . . . . . . . . . . . . . . . . . . . . . . . . McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 . . . . . . . . . . . . . . . . . . . . . . . . McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 . . . . . . . . . . . . . . . . . . . . . . . . Using HDS to Control Accesses (HCS Always Low) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Using HCS to Control Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HINT Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPIOx Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nonmultiplexed Read Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nonmultiplexed Write Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HRDY Relative to CLKOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 62 63 63 64 65 65 67 68 69 70 71 72 73 76 77 77 77 80 81 81 6−1 6−2 SM320VC5416 144-Ball MicroStar BGA Plastic Ball Grid Array Package . . . . . . . . . . . . . . . . . . . . . SM320VC5416 144-Pin Low-Profile Quad Flatpack (PGE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 83 iv SGUS048 July 2003 Tables List of Tables Table Page 2−1 2−2 Terminal Assignments for the SM320VC5416GGU (144-Pin BGA Package) . . . . . . . . . . . . . . . . . Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 3−1 3−2 3−3 3−4 3−5 3−6 3−7 3−8 3−9 3−10 3−11 3−12 3−13 3−14 3−15 3−16 3−17 3−18 Standard On-Chip ROM Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Processor Mode Status (PMST) Register Bit Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Software Wait-State Register (SWWSR) Bit Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Software Wait-State Control Register (SWCR) Bit Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bank-Switching Control Register (BSCR) Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bus Holder Control Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Sample Rate Input Clock Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Mode Settings at Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DMD Section of the DMMCRn Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DMA Reload Register Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DMA Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DMA Synchronization Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DMA Channel Interrupt Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CPU Memory-Mapped Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peripheral Memory-Mapped Registers for Each DSP Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP Control Registers and Subaddresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DMA Subbank Addressed Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt Locations and Priorities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 15 16 17 18 19 23 25 30 32 33 33 33 35 37 38 39 41 5−1 5−2 5−3 5−4 5−5 5−6 5−7 5−8 5−9 5−10 5−11 5−12 5−13 5−14 5−15 5−16 5−17 5−18 5−19 5−20 Thermal Resistance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Clock Frequency Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Mode Pin Settings for the Divide-By-2 and By Divide-by-4 Clock Options . . . . . . . . . . . . . . Divide-By-2 and Divide-by-4 Clock Options Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . Divide-By-2 and Divide-by-4 Clock Options Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . Multiply-By-N Clock Option Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Multiply-By-N Clock Option Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Read Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Read Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Write Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I/O Read Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I/O Read Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I/O Write Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ready Timing Requirements for Externally Generated Wait States . . . . . . . . . . . . . . . . . . . . . . . . . Ready Switching Characteristics for Externally Generated Wait States . . . . . . . . . . . . . . . . . . . . . . HOLD and HOLDA Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HOLD and HOLDA Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reset, BIO, Interrupt, and MP/MC Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Instruction Acquisition (IAQ) and Interrupt Acknowledge (IACK) Switching Characteristics . . . . External Flag (XF) and TOUT Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 46 47 48 48 49 49 50 50 52 53 53 54 55 55 60 60 62 64 65 July 2003 SGUS048 v Tables Table 5−21 5−22 5−23 5−24 5−25 5−26 5−27 5−28 5−29 5−30 5−31 5−32 5−33 5−34 5−35 5−36 vi Page McBSP Transmit and Receive Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP Transmit and Receive Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP General-Purpose I/O Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP General-Purpose I/O Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0) . . . . . . . . . . McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0) . . . . . . McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0) . . . . . . . . . . McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0) . . . . . . . McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1) . . . . . . . . . . McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1) . . . . . . McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1) . . . . . . . . . . McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1) . . . . . . . HPI8 Mode Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HPI8 Mode Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HPI16 Mode Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HPI16 Mode Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SGUS048 66 67 69 69 70 70 71 71 72 72 73 73 74 75 78 79 July 2003 Features 1 SM320VC5416-EP Features D Controlled Baseline D D D D D D D D D D D D D D D − One Assembly/Test Site, One Fabrication Site Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Memory Bus 40-Bit Arithmetic Logic Unit (ALU) Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators 17- × 17-Bit Parallel Multiplier Coupled to a 40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs) Data Bus With a Bus Holder Feature Extended Addressing Mode for 8M × 16-Bit Maximum Addressable External Program Space 128K x 16-Bit On-Chip RAM Composed of: − Eight Blocks of 8K × 16-Bit On-Chip Dual-Access Program/Data RAM − Eight Blocks of 8K × 16-Bit On-Chip Single-Access Program RAM 16K × 16-Bit On-Chip ROM Configured for Program Memory Enhanced External Parallel Interface (XIO2) Single-Instruction-Repeat and Block-Repeat Operations for Program Code D Block-Memory-Move Instructions for Better D D D D D D D D D D D D D D Program and Data Management Instructions With a 32-Bit Long Word Operand Instructions With Two- or Three-Operand Reads Arithmetic Instructions With Parallel Store and Parallel Load Conditional Store Instructions Fast Return From Interrupt On-Chip Peripherals − Software-Programmable Wait-State Generator and Programmable Bank-Switching − On-Chip Programmable Phase-Locked Loop (PLL) Clock Generator With External Clock Source − One 16-Bit Timer − Six-Channel Direct Memory Access (DMA) Controller − Three Multichannel Buffered Serial Ports (McBSPs) − 8/16-Bit Enhanced Parallel Host-Port Interface (HPI8/16) Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes CLKOUT Off Control to Disable CLKOUT On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1‡ (JTAG) Boundary Scan Logic 144-Pin Ball Grid Array (BGA) (GGU Suffix) 144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix) 6.25-ns Single-Cycle Fixed-Point Instruction Execution Time (160 MIPS) 3.3-V I/O Supply Voltage 1.6-V Core Supply Voltage All trademarks are the property of their respective owners. † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. ‡ IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture. July 2003 SGUS048 1 Introduction 2 Introduction This section describes the main features of the SM320VC5416, lists the pin assignments, and describes the function of each pin. This data manual also provides a detailed description section, electrical specifications, parameter measurement information, and mechanical data about the available packaging. NOTE: This data manual is designed to be used in conjunction with the TMS320C54x DSP Functional Overview (literature number SPRU307). 2.1 Description The SM320VC5416 fixed-point, digital signal processor (DSP) (hereafter referred to as the 5416 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set. Separate program and data spaces allow simultaneous access to program instructions and data, providing a high degree of parallelism. Two read operations and one write operation can be performed in a single cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. The 5416 also includes the control mechanisms to manage interrupts, repeated operations, and function calls. 2.2 Pin Assignments Figure 2−1 illustrates the ball locations for the 144-pin ball grid array (BGA) package and is used in conjunction with Table 2−1 to locate signal names and ball grid numbers. Figure 2−2 provides the pin assignments for the 144-pin low-profile quad flatpack (LQFP) package. 2.2.1 Terminal Assignments for the GGU Package 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N Figure 2−1. 144-Ball GGU MicroStar BGA (Bottom View) Table 2−1 lists each signal name and BGA ball number for the 144-pin SM320VC5416GGU package. Table 2−2 lists each terminal name, terminal function, and operating modes for the SM320VC5416. TMS320C54x and MicroStar BGA are trademarks of Texas Instruments. 2 SGUS048 July 2003 Introduction Table 2−1. Terminal Assignments for the SM320VC5416GGU (144-Pin BGA Package)† SIGNAL QUADRANT 1 BGA BALL # SIGNAL QUADRANT 2 BGA BALL # SIGNAL QUADRANT 4 BGA BALL # CVSS A1 BFSX1 N13 A22 B1 BDX1 M13 CVSS BCLKR1 N1 A19 A13 N2 A20 A12 CVSS DVDD C2 C1 DVDD DVSS L12 HCNTL0 M3 DVSS N3 CVSS DVDD B11 L13 BGA BALL # SIGNAL QUADRANT 3 A11 A10 D4 CLKMD1 K10 BCLKR0 K4 D6 D10 HD7 D3 CLKMD2 K11 BCLKR2 L4 D7 C10 A11 D2 CLKMD3 K12 BFSR0 M4 D8 B10 A12 D1 HPI16 K13 BFSR2 N4 D9 A10 A13 E4 HD2 J10 BDR0 K5 D10 D9 A14 E3 TOUT J11 HCNTL1 L5 D11 C9 A15 E2 EMU0 J12 BDR2 M5 D12 B9 CVDD E1 EMU1/OFF J13 BCLKX0 N5 HD4 A9 HAS F4 TDO H10 BCLKX2 K6 D13 D8 DVSS F3 TDI H11 CVSS L6 D14 C8 CVSS F2 TRST H12 HINT M6 D15 B8 CVDD F1 TCK H13 HD5 A8 G2 TMS G12 CVDD BFSX0 N6 HCS M7 CVDD B7 CVSS CVDD HPIENA G13 BFSX2 N7 CVSS A7 G11 HRDY L7 HDS1 C7 G10 DVDD K7 DVSS D7 F13 DVSS N8 HDS2 A6 F12 HD0 M8 DVDD B6 HR/W G1 READY G3 PS G4 DS H1 IS H2 DVSS CLKOUT R/W H3 HD3 F11 BDX0 L8 A0 C6 MSTRB H4 X1 F10 BDX2 K8 A1 D6 IOSTRB J1 X2/CLKIN E13 IACK N9 A2 A5 MSC J2 RS E12 HBIL M9 A3 B5 XF J3 D0 E11 NMI L9 HD6 C5 HOLDA J4 D1 E10 INT0 K9 A4 D5 IAQ K1 D2 D13 INT1 N10 A5 A4 HOLD K2 D3 D12 INT2 M10 A6 B4 BIO K3 D4 D11 INT3 L10 A7 C4 MP/MC L1 D5 C13 CVDD N11 A8 A3 DVDD L2 A16 C12 HD1 M11 A9 B3 CVSS L3 CVDD C3 B13 CVSS BCLKX1 L11 M1 DVSS A17 C11 BDR1 N12 A21 A2 DVSS B2 BFSR1 M2 A18 B12 DVSS M12 † DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. July 2003 SGUS048 3 Introduction 2.2.2 Pin Assignments for the PGE Package 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 A18 A17 DVSS A16 D5 D4 D3 D2 D1 D0 RS X2/CLKIN X1 HD3 CLKOUT DVSS HPIENA CVDD CVSS TMS TCK TRST TDI TDO EMU1/OFF EMU0 TOUT HD2 HPI16 CLKMD3 CLKMD2 CLKMD1 DVSS DVDD BDX1 BFSX1 CV SS BCLKR1 HCNTL0 DVSS BCLKR0 BCLKR2 BFSR0 BFSR2 BDR0 HCNTL1 BDR2 BCLKX0 BCLKX2 CVSS HINT CVDD BFSX0 BFSX2 HRDY DVDD DVSS HD0 BDX0 BDX2 IACK HBIL NMI INT0 INT1 INT2 INT3 CV DD HD1 CVSS BCLKX1 DVSS CVSS A22 CVSS DVDD A10 HD7 A11 A12 A13 A14 A15 CVDD HAS DVSS CVSS CVDD HCS HR/W READY PS DS IS R/W MSTRB IOSTRB MSC XF HOLDA IAQ HOLD BIO MP/MC DVDD CVSS BDR1 BFSR1 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 DVSS A21 CV DD A9 A8 A7 A6 A5 A4 HD6 A3 A2 A1 A0 DV DD HDS2 DV SS HDS1 CVSS CVDD HD5 D15 D14 D13 HD4 D12 D11 D10 D9 D8 D7 D6 DV DD CV SS A20 A19 The SM320VC5416PGE 144-pin low-profile quad flatpack (LQFP) pin assignments are shown in Figure 2−2. NOTE A: DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and the core CPU. Figure 2−2. 144-Pin PGE Low-Profile Quad Flatpack (Top View) 4 SGUS048 July 2003 Introduction 2.3 Signal Descriptions Table 2−2 lists each signal, function, and operating mode(s) grouped by function. See Section 2.2 for exact pin locations based on package type. Table 2−2. Signal Descriptions TERMINAL NAME I/O† DESCRIPTION DATA SIGNALS A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 (MSB) I/O/Z‡§ Parallel address bus A22 [most significant bit (MSB)] through A0 [least significant bit (LSB)]. The sixteen LSB lines, A0 to A15, are multiplexed to address external memory (program, data) or I/O. The seven MSB lines, A16 to A22, address external program space memory. A22−A0 is placed in the high-impedance state in the hold mode. A22−A0 also goes into the high-impedance state when OFF is low. A17−A0 are inputs in HPI16 mode. These pins can be used to address internal memory via the host-port interface (HPI) when the HPI16 pin is high. These pins also have Schmitt trigger inputs. The address bus has a bus holder feature that eliminates passive components and the power dissipation associated with them. The bus holder keeps the address bus at the previous logic level when the bus goes into a high-impedance state. (LSB) D15 (MSB) I/O/Z‡§ Parallel data bus D15 (MSB) through D0 (LSB). D15−D0 is multiplexed to transfer data between the core CPU D14 and external data/program memory or I/O devices or HPI in HPI16 mode (when HPI16 pin is high). D15−D0 is D13 placed in the high-impedance state when not outputting data or when RS or HOLD is asserted. D15−D0 also goes D12 into the high-impedance state when OFF is low. These pins also have Schmitt trigger inputs. D11 D10 The data bus has a bus holder feature that eliminates passive components and the power dissipation associated D9 with them. The bus holder keeps the data bus at the previous logic level when the bus goes into the D8 high-impedance state. The bus holders on the data bus can be enabled/disabled under software control. D7 D6 D5 D4 D3 D2 D1 D0 (LSB) † I = Input, O = Output, Z = High-impedance, S = Supply ‡ These pins have Schmitt trigger inputs. § This pin has an internal bus holder controlled by way of the BSCR register. ¶ This pin has an internal pullup resistor. # This pin has an internal pulldown resistor. || This pin must be pulled up with a 4.7-kΩ resistor to ensure the device is operable in functional mode or emulation mode. July 2003 SGUS048 5 Introduction Table 2−2. Signal Descriptions (Continued) TERMINAL NAME I/O† DESCRIPTION INITIALIZATION, INTERRUPT AND RESET OPERATIONS IACK O/Z Interrupt acknowledge signal. IACK indicates receipt of an interrupt and that the program counter is fetching the interrupt vector location designated by A15−A0. IACK also goes into the high-impedance state when OFF is low. INT0‡ INT1‡ INT2‡ INT3‡ I External user interrupt inputs. INT0−INT3 are maskable and are prioritized by the interrupt mask register (IMR) and the interrupt mode bit. INT0 −INT3 can be polled and reset by way of the interrupt flag register (IFR). NMI‡ I Nonmaskable interrupt. NMI is an external interrupt that cannot be masked by way of the INTM or the IMR. When NMI is activated, the processor traps to the appropriate vector location. RS‡ I Reset. RS causes the digital signal processor (DSP) to terminate execution and forces the program counter to 0FF80h. When RS is brought to a high level, execution begins at location 0FF80h of program memory. RS affects various registers and status bits. I Microprocessor/microcomputer mode select. If active low at reset, microcomputer mode is selected, and the internal program ROM is mapped into the upper 16K words of program memory space. If the pin is driven high during reset, microprocessor mode is selected, and the on-chip ROM is removed from program space. This pin is only sampled at reset, and the MP/MC bit of the processor mode status (PMST) register can override the mode that is selected at reset. MP/MC MULTIPROCESSING SIGNALS BIO‡ XF I Branch control. A branch can be conditionally executed when BIO is active. If low, the processor executes the conditional instruction. The BIO condition is sampled during the decode phase of the pipeline for the XC instruction, and all other instructions sample BIO during the read phase of the pipeline. O/Z External flag output (latched software-programmable signal). XF is set high by the SSBX XF instruction, set low by RSBX XF instruction or by loading ST1. XF is used for signaling other processors in multiprocessor configurations or used as a general-purpose output pin. XF goes into the high-impedance state when OFF is low, and is set high at reset. MEMORY CONTROL SIGNALS DS PS IS O/Z Data, program, and I/O space select signals. DS, PS, and IS are always high unless driven low for communicating to a particular external space. Active period corresponds to valid address information. DS, PS, and IS are placed into the high-impedance state in the hold mode; these signals also go into the high-impedance state when OFF is low. MSTRB O/Z Memory strobe signal. MSTRB is always high unless low-level asserted to indicate an external bus access to data or program memory. MSTRB is placed in the high-impedance state in the hold mode; it also goes into the high-impedance state when OFF is low. I Data ready. READY indicates that an external device is prepared for a bus transaction to be completed. If the device is not ready (READY is low), the processor waits one cycle and checks READY again. Note that the processor performs ready detection if at least two software wait states are programmed. The READY signal is not sampled until the completion of the software wait states. R/W O/Z Read/write signal. R/W indicates transfer direction during communication to an external device. R/W is normally in the read mode (high), unless it is asserted low when the DSP performs a write operation. R/W is placed in the high-impedance state in the hold mode; and it also goes into the high-impedance state when OFF is low. IOSTRB O/Z I/O strobe signal. IOSTRB is always high unless low-level asserted to indicate an external bus access to an I/O device. IOSTRB is placed in the high-impedance state in the hold mode; it also goes into the high-impedance state when OFF is low. I Hold input. HOLD is asserted to request control of the address, data, and control lines. When acknowledged by the 5416, these lines go into the high-impedance state. READY HOLD † I = Input, O = Output, Z = High-impedance, S = Supply ‡ These pins have Schmitt trigger inputs. § This pin has an internal bus holder controlled by way of the BSCR register. ¶ This pin has an internal pullup resistor. # This pin has an internal pulldown resistor. || This pin must be pulled up with a 4.7-kΩ resistor to ensure the device is operable in functional mode or emulation mode. 6 SGUS048 July 2003 Introduction Table 2−2. Signal Descriptions (Continued) TERMINAL NAME I/O† DESCRIPTION MEMORY CONTROL SIGNALS (CONTINUED) O/Z Hold acknowledge. HOLDA indicates to the external circuitry that the processor is in a hold state and that the address, data, and control lines are in the high-impedance state, allowing them to be available to the external circuitry. HOLDA also goes into the high-impedance state when OFF is low. This pin is driven high during reset. MSC O/Z Microstate complete. MSC indicates completion of all software wait states. When two or more software wait states are enabled, the MSC pin goes active at the beginning of the first software wait state and goes inactive high at the beginning of the last software wait state. If connected to the READY input, MSC forces one external wait state after the last internal wait state is completed. MSC also goes into the high-impedance state when OFF is low. IAQ O/Z Instruction acquisition signal. IAQ is asserted (active low) when there is an instruction address on the address bus and goes into the high-impedance state when OFF is low. O/Z Clock output signal. CLKOUT can represent the machine-cycle rate of the CPU divided by 1, 2, 3, or 4 as configured in the bank-switching control register (BSCR). Following reset, CLKOUT represents the machine-cycle rate divided by 4. CLKMD1‡ CLKMD2‡ CLKMD3‡ I Clock mode select signals. CLKMD1−CLKMD3 allow the selection and configuration of different clock modes such as crystal, external clock, and PLL mode. The external CLKMD1−CLKMD3 pins are sampled to determine the desired clock generation mode while RS is low. Following reset, the clock generation mode can be reconfigured by writing to the internal clock mode register in software. X2/CLKIN‡ I Clock/oscillator input. If the internal oscillator is not being used, X2/CLKIN functions as the clock input. (This is revision-dependent, see Section 3.10 for additional information.) X1 O Output pin from the internal oscillator for the crystal. If the internal oscillator is not used, X1 should be left unconnected. X1 does not go into the high-impedance state when OFF is low. (This is revision-dependent, see Section 3.10 for additional information.) O/Z Timer output. TOUT signals a pulse when the on-chip timer counts down past zero. The pulse is one CLKOUT cycle wide. TOUT also goes into the high-impedance state when OFF is low. HOLDA TIMER SIGNALS CLKOUT TOUT MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP #0), MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP #1), AND MULTICHANNEL BUFFERED SERIAL PORT 2 (McBSP #2) SIGNALS BCLKR0‡ BCLKR1‡ BCLKR2‡ I/O/Z Receive clock input. BCLKR can be configured as an input or an output; it is configured as an input following reset. BCLKR serves as the serial shift clock for the buffered serial port receiver. BDR0 BDR1 BDR2 I BFSR0 BFSR1 BFSR2 I/O/Z Frame synchronization pulse for receive input. BFSR can be configured as an input or an output; it is configured as an input following reset. The BFSR pulse initiates the receive data process over BDR. BCLKX0‡ BCLKX1‡ BCLKX2‡ I/O/Z Transmit clock. BCLKX serves as the serial shift clock for the McBSP transmitter. BCLKX can be configured as an input or an output, and is configured as an input following reset. BCLKX enters the high-impedance state when OFF goes low. BDX0 BDX1 BDX2 O/Z Serial data transmit output. BDX is placed in the high-impedance state when not transmitting, when RS is asserted, or when OFF is low. Serial data receive input BFSX0 Frame synchronization pulse for transmit input/output. The BFSX pulse initiates the data transmit process over BFSX1 BDX. BFSX can be configured as an input or an output, and is configured as an input following reset. BFSX goes I/O/Z BFSX2 into the high-impedance state when OFF is low. † I = Input, O = Output, Z = High-impedance, S = Supply ‡ These pins have Schmitt trigger inputs. § This pin has an internal bus holder controlled by way of the BSCR register. ¶ This pin has an internal pullup resistor. # This pin has an internal pulldown resistor. || This pin must be pulled up with a 4.7-kΩ resistor to ensure the device is operable in functional mode or emulation mode. July 2003 SGUS048 7 Introduction Table 2−2. Signal Descriptions (Continued) TERMINAL NAME I/O† DESCRIPTION HOST-PORT INTERFACE SIGNALS I/O/Z Parallel bidirectional data bus. The HPI data bus is used by a host device bus to exchange information with the HPI registers. These pins can also be used as general-purpose I/O pins. HD0−HD7 is placed in the high-impedance state when not outputting data or when OFF is low. The HPI data bus includes bus holders to reduce the static power dissipation caused by floating, unused pins. When the HPI data bus is not being driven by the 5416, the bus holders keep the pins at the previous logic level. The HPI data bus holders are disabled at reset and can be enabled/disabled via the HBH bit of the BSCR. These pins also have Schmitt trigger inputs. HCNTL0¶ HCNTL1¶ I Control inputs. HCNTL0 and HCNTL1 select a host access to one of the three HPI registers. The control inputs have internal pullups that are only enabled when HPIENA = 0. These pins are not used when HPI16 = 1. HBIL¶ I Byte identification. HBIL identifies the first or second byte of transfer. The HPIL input has an internal pullup resistor that is only enabled when HPIENA = 0. This pin is not used when HPI16 = 1. HCS‡¶ I Chip select. HCS is the select input for the HPI and must be driven low during accesses. The chip select input has an internal pullup resistor that is only enabled when HPIENA = 0. HDS1‡¶ HDS2‡¶ I Data strobe. HDS1 and HDS2 are driven by the host read and write strobes to control the transfer. The strobe inputs have internal pullup resistors that are only enabled when HPIENA = 0. HAS‡¶ I Address strobe. Host with multiplexed address and data pins requires HAS to latch the address in the HPIA register. HAS input has an internal pullup resistor that is only enabled when HPIENA = 0. HR/W¶ I Read/write. HR/W controls the direction of the HPI transfer. HR/W has an internal pullup resistor that is only enabled when HPIENA = 0. HRDY O/Z Ready output. HRDY goes into the high-impedance state when OFF is low. The ready output informs the host when the HPI is ready for the next transfer. This pin is driven high during reset. HINT O/Z Interrupt output. This output is used to interrupt the host. When the DSP is in reset, HINT is driven high. HINT goes into the high-impedance state when OFF is low. This pin is not used when HPI16 = 1. HPIENA# I HPI module select. HPIENA must be tied to DVDD to have HPI selected. If HPIENA is left open or connected to ground, the HPI module is not selected, internal pullup for the HPI input pins are enabled, and the HPI data bus has holders set. HPIENA is provided with an internal pulldown resistor that is always active. HPIENA is sampled when RS goes high and is ignored until RS goes low again. This pin should never be changed while reset is high. HPI16# I HPI16 mode selection CVSS S Ground. Dedicated ground for the core CPU CVDD S DVSS S +VDD. Dedicated power supply for the core CPU Ground. Dedicated ground for I/O pins HD0−HD7‡§ SUPPLY PINS DVDD S +VDD. Dedicated power supply for I/O pins † I = Input, O = Output, Z = High-impedance, S = Supply ‡ These pins have Schmitt trigger inputs. § This pin has an internal bus holder controlled by way of the BSCR register. ¶ This pin has an internal pullup resistor. # This pin has an internal pulldown resistor. || This pin must be pulled up with a 4.7-kΩ resistor to ensure the device is operable in functional mode or emulation mode. 8 SGUS048 July 2003 Introduction Table 2−2. Signal Descriptions (Continued) TERMINAL NAME I/O† DESCRIPTION TEST PINS TCK‡¶ I IEEE standard 1149.1 test clock. TCK is normally a free-running clock signal with a 50% duty cycle. The changes on test access port (TAP) of input signals TMS and TDI are clocked into the TAP controller, instruction register, or selected test data register on the rising edge of TCK. Changes at the TAP output signal (TDO) occur on the falling edge of TCK. TDI¶ I IEEE standard 1149.1 test data input. Pin with internal pullup device. TDI is clocked into the selected register (instruction or data) on a rising edge of TCK. TDO O/Z IEEE standard 1149.1 test data output. The contents of the selected register (instruction or data) are shifted out of TDO on the falling edge of TCK. TDO is in the high-impedance state except when the scanning of data is in progress. TDO also goes into the high-impedance state when OFF is low. TMS¶ I IEEE standard 1149.1 test mode select. Pin with internal pullup device. This serial control input is clocked into the TAP controller on the rising edge of TCK. TRST# I IEEE standard 1149.1 test reset. TRST, when high, gives the IEEE standard 1149.1 scan system control of the operations of the device. If TRST is not connected or driven low, the device operates in its functional mode, and the IEEE standard 1149.1 signals are ignored. Pin with internal pulldown device. EMU0|| I/O/Z Emulator 0 pin. When TRST is driven low, EMU0 must be high for activation of the OFF condition. When TRST is driven high, EMU0 is used as an interrupt to or from the emulator system and is defined as input/output by way of the IEEE standard 1149.1 scan system. I/O/Z Emulator 1 pin/disable all outputs. When TRST is driven high, EMU1/OFF is used as an interrupt to or from the emulator system and is defined as input/output by way of IEEE standard 1149.1 scan system. When TRST is driven low, EMU1/OFF is configured as OFF. The EMU1/OFF signal, when active low, puts all output drivers into the high-impedance state. Note that OFF is used exclusively for testing and emulation purposes (not for multiprocessing applications). Therefore, for the OFF condition, the following apply: TRST = low, EMU0 = high EMU1/OFF = low EMU1/OFF|| † I = Input, O = Output, Z = High-impedance, S = Supply ‡ These pins have Schmitt trigger inputs. § This pin has an internal bus holder controlled by way of the BSCR register. ¶ This pin has an internal pullup resistor. # This pin has an internal pulldown resistor. || This pin must be pulled up with a 4.7-kΩ resistor to ensure the device is operable in functional mode or emulation mode. July 2003 SGUS048 9 Functional Overview 3 Functional Overview The following functional overview is based on the block diagram in Figure 3−1. 54X cLEAD 64K RAM Single Access Program Pbus Dbus Ebus Cbus Pbus Ebus Pbus Ebus Cbus Pbus Dbus P, C, D, E Buses and Control Signals 64K RAM Dual Access Program/Data 16K Program ROM MBus GPIO TI BUS RHEA Bus McBSP1 Enhanced XIO 16HPI McBSP2 MBus RHEA bus XIO RHEA Bridge McBSP3 16 HPI xDMA logic RHEAbus TIMER APLL Clocks JTAG Figure 3−1. SM320VC5416 Functional Block Diagram 3.1 Memory The 5416 device provides both on-chip ROM and RAM memories to aid in system performance and integration. 3.1.1 Data Memory The data memory space addresses up to 64K of 16-bit words. The device automatically accesses the on-chip RAM when addressing within its bounds. When an address is generated outside the RAM bounds, the device automatically generates an external access. The advantages of operating from on-chip memory are as follows: • • • • Higher performance because no wait states are required Higher performance because of better flow within the pipeline of the central arithmetic logic unit (CALU) Lower cost than external memory Lower power than external memory The advantage of operating from off-chip memory is the ability to access a larger address space. 10 SGUS048 July 2003 Functional Overview 3.1.2 Program Memory Software can configure their memory cells to reside inside or outside of the program address map. When the cells are mapped into program space, the device automatically accesses them when their addresses are within bounds. When the program-address generation (PAGEN) logic generates an address outside its bounds, the device automatically generates an external access. The advantages of operating from on-chip memory are as follows: • • • Higher performance because no wait states are required Lower cost than external memory Lower power than external memory The advantage of operating from off-chip memory is the ability to access a larger address space. 3.1.3 Extended Program Memory The 5416 uses a paged extended memory scheme in program space to allow access of up to 8192K of program memory. In order to implement this scheme, the 5416 includes several features which are also present on C548/549/5410: • • • Twenty-three address lines, instead of sixteen An extra memory-mapped register, the XPC Six extra instructions for addressing extended program space Program memory in the 5416 is organized into 128 pages that are each 64K in length. The value of the XPC register defines the page selection. This register is memory-mapped into data space to address 001Eh. At a hardware reset, the XPC is initialized to 0. 3.2 On-Chip ROM With Bootloader The 5416 features a 16K-word × 16-bit on-chip maskable ROM that can only be mapped into program memory space. Customers can arrange to have the ROM of the 5416 programmed with contents unique to any particular application. A bootloader is available in the standard 5416 on-chip ROM. This bootloader can be used to automatically transfer user code from an external source to anywhere in the program memory at power up. If MP/MC of the device is sampled low during a hardware reset, execution begins at location FF80h of the on-chip ROM. This location contains a branch instruction to the start of the bootloader program. The standard 5416 devices provide different ways to download the code to accommodate various system requirements: • • • • • July 2003 Parallel from 8-bit or 16-bit-wide EPROM Parallel from I/O space, 8-bit or 16-bit mode Serial boot from serial ports, 8-bit or 16-bit mode Host-port interface boot Warm boot SGUS048 11 Functional Overview The standard on-chip ROM layout is shown in Table 3−1. Table 3−1. Standard On-Chip ROM Layout† ADDRESS RANGE DESCRIPTION C000h−D4FFh ROM tables for the GSM EFR speech codec D500h−F7FFh Reserved F800h−FBFFh Bootloader FC00h−FCFFh µ-Law expansion table FD00h−FDFFh A-Law expansion table FE00h−FEFFh Sine look-up table Reserved† FF00h−FF7Fh FF80h−FFFFh Interrupt vector table † In the 5416 ROM, 128 words are reserved for factory device-testing purposes. Application code to be implemented in on-chip ROM must reserve these 128 words at addresses FF00h−FF7Fh in program space. 3.3 On-Chip RAM The 5416 device contains 64K-word × 16-bit of on-chip dual-access RAM (DARAM) and 64K-word × 16-bit of on-chip single-access RAM (SARAM). The DARAM is composed of eight blocks of 8K words each. Each block in the DARAM can support two reads in one cycle, or a read and a write in one cycle. Four blocks of DARAM are located in the address range 0080h−7FFFh in data space, and can be mapped into program/data space by setting the OVLY bit to one. The other four blocks of DARAM are located in the address range 18000h−1FFFFh in program space. The DARAM located in the address range 18000h−1FFFFh in program space can be mapped into data space by setting the DROM bit to one. The SARAM is composed of eight blocks of 8K words each. Each of these eight blocks is a single-access memory. For example, an instruction word can be fetched from one SARAM block in the same cycle as a data word is written to another SARAM block. The SARAM is located in the address range 28000h−2FFFFh, and 38000h−3FFFFh in program space. 3.4 On-Chip Memory Security The 5416 device has a maskable option to protect the contents of on-chip memories. When the ROM protect bit is set, no externally originating instruction can access the on-chip memory spaces; HPI writes have no restriction, but HPI reads are restricted to 4000h − 5FFFh. 12 SGUS048 July 2003 Functional Overview 3.5 Memory Map Hex Page 0 Program 0000 Reserved (OVLY = 1) External (OVLY = 0) 007F Hex Page 0 Program 0000 Reserved (OVLY = 1) External (OVLY = 0) 007F On-Chip 0080 DARAM0−3 (OVLY = 1) External (OVLY = 0) 7FFF 8000 0080 7FFF 8000 BFFF C000 External FF7F FF80 FEFF FF00 FF7F FF80 FFFF Interrupts (External) FFFF Hex 0000 005F Memory-Mapped Registers 0060 007F 0080 On-Chip DARAM0−3 (OVLY = 1) External (OVLY = 0) Scratch-Pad RAM On-Chip DARAM0−3 (32K x 16-bit) 7FFF 8000 External On-Chip DARAM4−7 (DROM=1) or External (DROM=0) On-Chip ROM (4K x 16-bit) Reserved Interrupts (On-Chip) MP/MC= 0 (Microcomputer Mode) MP/MC= 1 (Microprocessor Mode) Data Address ranges for on-chip DARAM in data memory are: FFFF DARAM0: 0080h−1FFFh; DARAM2: 4000h−5FFFh; DARAM4: 8000h−9FFFh; DARAM6: C000h−DFFFh; DARAM1: 2000h−3FFFh DARAM3: 6000h−7FFFh DARAM5: A000h−BFFFh DARAM7: E000h−FFFFh Figure 3−2. Program and Data Memory Map Hex 010000 Program Hex 020000 Program On-Chip On-Chip DARAM0−3 DARAM0−3 (OVLY=1) (OVLY=1) External External 017FFF (OVLY=0) 027FFF (OVLY=0) 018000 On-Chip DARAM4−7 (MP/MC=0) External (MP/MC=1) 01FFFF 028000 On-Chip SARAM0−3 (MP/MC=0) External (MP/MC=1) 02FFFF Page 1 XPC=1 Hex 030000 Program Hex 040000 On-Chip DARAM0−3 (OVLY=1) External (OVLY=0) 037FFF On-Chip DARAM0−3 (OVLY=1) External (OVLY=0) 047FFF 038000 048000 On-Chip SARAM4−7 (MP/MC=0) External (MP/MC=1) 03FFFF Page 2 XPC=2 Page 3 XPC=3 Address ranges for on-chip DARAM in program memory are: Address ranges for on-chip SARAM in program memory are: Hex 7F0000 Program 7F7FFF ...... Page 4 XPC=4 DARAM4: 018000h−019FFFh; DARAM6: 01C000h−01DFFFh; SARAM0: 028000h−029FFFh; SARAM2: 02C000h−02DFFFh; SARAM4: 038000h−039FFFh; SARAM6: 03C000h−03DFFFh; On-Chip DARAM0−3 (OVLY=1) External (OVLY=0) 7F8000 External External 04FFFF Program 7FFFFF Page 127 XPC=7Fh DARAM5: 01A000h−01BFFFh DARAM7: 01E000h−01FFFFh SARAM1: 02A000h−02BFFFh SARAM3: 02E000h−02FFFFh SARAM5: 03A000h−03BFFFh SARAM7: 03E000h−03FFFFh Figure 3−3. Extended Program Memory Map July 2003 SGUS048 13 Functional Overview 3.5.1 Relocatable Interrupt Vector Table The reset, interrupt, and trap vectors are addressed in program space. These vectors are soft — meaning that the processor, when taking the trap, loads the program counter (PC) with the trap address and executes the code at the vector location. Four words, either two 1-word instructions or one 2-word instruction, are reserved at each vector location to accommodate a delayed branch instruction which allows branching to the appropriate interrupt service routine without the overhead. At device reset, the reset, interrupt, and trap vectors are mapped to address FF80h in program space. However, these vectors can be remapped to the beginning of any 128-word page in program space after device reset. This is done by loading the interrupt vector pointer (IPTR) bits in the PMST register with the appropriate 128-word page boundary address. After loading IPTR, any user interrupt or trap vector is mapped to the new 128-word page. NOTE: The hardware reset (RS) vector cannot be remapped because the hardware reset loads the IPTR with 1s. Therefore, the reset vector is always fetched at location FF80h in program space. 15 7 6 5 4 3 IPTR MP/MC OVLY AVIS DROM R/W-1FF MP/MC R/W-0 R/W-0 R/W-0 2 CLK OFF R/W-0 1 0 SMUL SST R/W-0 R/W-0 Pin LEGEND: R = Read, W = Write Figure 3−4. Processor Mode Status (PMST) Register 14 SGUS048 July 2003 Functional Overview Table 3−2. Processor Mode Status (PMST) Register Bit Fields BIT NO. NAME 15−7 IPTR RESET VALUE FUNCTION 1FFh Interrupt vector pointer. The 9-bit IPTR field points to the 128-word program page where the interrupt vectors reside. The interrupt vectors can be remapped to RAM for boot-loaded operations. At reset, these bits are all set to 1; the reset vector always resides at address FF80h in program memory space. The RESET instruction does not affect this field. Microprocessor/microcomputer mode. MP/MC enables/disables the on-chip ROM to be addressable in program memory space. 6 MP/MC MP/MC - MP/MC = 0: The on-chip ROM is enabled and addressable. pin - MP/MC = 1: The on-chip ROM is not available. MP/MC is set to the value corresponding to the logic level on the MP/MC pin when sampled at reset. This pin is not sampled again until the next reset. The RESET instruction does not affect this bit. This bit can also be set or cleared by software. RAM overlay. OVLY enables on-chip dual-access data RAM blocks to be mapped into program space. The values for the OVLY bit are: 5 OVLY 0 - OVLY = 0: The on-chip RAM is addressable in data space but not in program space. - OVLY = 1: The on-chip RAM is mapped into program space and data space. Data page 0 (addresses 0h to 7Fh), however, is not mapped into program space. Address visibility mode. AVIS enables/disables the internal program address to be visible at the address pins. 4 AVIS - AVIS = 0: The external address lines do not change with the internal program address. Control and data lines are not affected and the address bus is driven with the last address on the bus. - AVIS = 1: This mode allows the internal program address to appear at the pins of the 5416 so that the internal program address can be traced. Also, it allows the interrupt vector to be decoded in conjunction with IACK when the interrupt vectors reside on on-chip memory. 0 DROM enables on-chip DARAM4−7 to be mapped into data space. The DROM bit values are: 3 DROM 0 - DROM = 0: The on-chip DARAM4−7 is not mapped into data space. - DROM = 1: The on-chip DARAM4−7 is mapped into data space. 2 CLKOFF 0 CLOCKOUT off. When the CLKOFF bit is 1, the output of CLKOUT is disabled and remains at a high level. 1 SMUL N/A Saturation on multiplication. When SMUL = 1, saturation of a multiplication result occurs before performing the accumulation in a MAC of MAS instruction. The SMUL bit applies only when OVM = 1 and FRCT = 1. 0 SST N/A Saturation on store. When SST = 1, saturation of the data from the accumulator is enabled before storing in memory. The saturation is performed after the shift operation. 3.6 On-Chip Peripherals The 5416 device has the following peripherals: • • • • • • • • July 2003 Software-programmable wait-state generator Programmable bank-switching A host-port interface (HPI8/16) Three multichannel buffered serial ports (McBSPs) A hardware timer A clock generator with a multiple phase-locked loop (PLL) Enhanced external parallel interface (XIO2) A DMA controller (DMA) SGUS048 15 Functional Overview 3.6.1 Software-Programmable Wait-State Generator The software wait-state generator of the 5416 can extend external bus cycles by up to fourteen machine cycles. Devices that require more than fourteen wait states can be interfaced using the hardware READY line. When all external accesses are configured for zero wait states, the internal clocks to the wait-state generator are automatically disabled. Disabling the wait-state generator clocks reduces the power consumption of the 5416. The software wait-state register (SWWSR) controls the operation of the wait-state generator. The 14 LSBs of the SWWSR specify the number of wait states (0 to 7) to be inserted for external memory accesses to five separate address ranges. This allows a different number of wait states for each of the five address ranges. Additionally, the software wait-state multiplier (SWSM) bit of the software wait-state control register (SWCR) defines a multiplication factor of 1 or 2 for the number of wait states. At reset, the wait-state generator is initialized to provide seven wait states on all external memory accesses. The SWWSR bit fields are shown in Figure 3−5 and described in Table 3−3. 15 14 XPA 12 11 I/O R/W-0 R/W-111 9 8 Data R/W-111 6 Data 5 3 Program R/W-111 R/W-111 2 0 Program R/W-111 LEGEND: R=Read, W=Write, 0=Value after reset Figure 3−5. Software Wait-State Register (SWWSR) [Memory-Mapped Register (MMR) Address 0028h] Table 3−3. Software Wait-State Register (SWWSR) Bit Fields BIT NO. NAME RESET VALUE 15 XPA 0 14−12 I/O 111 I/O space. The field value (0−7) corresponds to the base number of wait states for I/O space accesses within addresses 0000−FFFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states. 11−9 Data 111 Upper data space. The field value (0−7) corresponds to the base number of wait states for external data space accesses within addresses 8000−FFFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states. 8−6 Data 111 Lower data space. The field value (0−7) corresponds to the base number of wait states for external data space accesses within addresses 0000−7FFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states. FUNCTION Extended program address control bit. XPA is used in conjunction with the program space fields (bits 0 through 5) to select the address range for program space wait states. Upper program space. The field value (0−7) corresponds to the base number of wait states for external program space accesses within the following addresses: 5−3 Program 111 - XPA = 0: xx8000 − xxFFFFh - XPA = 1: 400000h − 7FFFFFh The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states. Program space. The field value (0−7) corresponds to the base number of wait states for external program space accesses within the following addresses: 2−0 Program 111 - XPA = 0: xx0000 − xx7FFFh - XPA = 1: 000000 − 3FFFFFh The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states. 16 SGUS048 July 2003 Functional Overview The software wait-state multiplier bit of the software wait-state control register (SWCR) is used to extend the base number of wait states selected by the SWWSR. The SWCR bit fields are shown in Figure 3−6 and described in Table 3−4. 15 1 0 SWSM Reserved R/W-0 R/W-0 LEGEND: R = Read, W = Write Figure 3−6. Software Wait-State Control Register (SWCR) [MMR Address 002Bh] Table 3−4. Software Wait-State Control Register (SWCR) Bit Fields PIN NO. NAME RESET VALUE 15−1 Reserved 0 FUNCTION These bits are reserved and are unaffected by writes. Software wait-state multiplier. Used to multiply the number of wait states defined in the SWWSR by a factor of 1 or 2. 0 SWSM 0 - SWSM = 0: wait-state base values are unchanged (multiplied by 1). - SWSM = 1: wait-state base values are multiplied by 2 for a maximum of 14 wait states. 3.6.2 Programmable Bank-Switching Programmable bank-switching logic allows the 5416 to switch between external memory banks without requiring external wait states for memories that need additional time to turn off. The bank-switching logic automatically inserts one cycle when accesses cross a 32K-word memory-bank boundary inside program or data space. Bank-switching is defined by the bank-switching control register (BSCR), which is memory-mapped at address 0029h. The bit fields of the BSCR are shown in Figure 3−7 and are described in Table 3−5. 15 14 13 12 11 3 CONSEC DIVFCT IACKOFF Rsvd R/W-1 R/W-11 R/W-1 R 2 HBH R/W-0 1 0 BH Rsvd R/W-0 R R = Read, W = Write Figure 3−7. Bank-Switching Control Register (BSCR) [MMR Address 0029h] July 2003 SGUS048 17 Functional Overview Table 3−5. Bank-Switching Control Register (BSCR) Fields BIT NAME RESET VALUE FUNCTION Consecutive bank-switching. Specifies the bank-switching mode. CONSEC† 15 1 CONSEC = 0: Bank-switching on 32K bank boundaries only. This bit is cleared if fast access is desired for continuous memory reads (i.e., no starting and trailing cycles between read cycles). CONSEC = 1: Consecutive bank switches on external memory reads. Each read cycle consists of 3 cycles: starting cycle, read cycle, and trailing cycle. CLKOUT output divide factor. The CLKOUT output is driven by an on-chip source having a frequency equal to 1/(DIVFCT+1) of the DSP clock. 13−14 DIVFCT 11 DIVFCT = 00: CLKOUT is not divided. DIVFCT = 01: CLKOUT is divided by 2 from the DSP clock. DIVFCT = 10: CLKOUT is divided by 3 from the DSP clock. DIVFCT = 11: CLKOUT is divided by 4 from the DSP clock (default value following reset). IACK signal output off. Controls the output of the IACK signal. IACKOFF is set to 1 at reset. 12 IACKOFF 11−3 Rsvd 1 − IACKOFF = 0: The IACK signal output off function is disabled. IACKOFF = 1: The IACK signal output off function is enabled. Reserved HPI bus holder. Controls the HPI bus holder. HBH is cleared to 0 at reset. 2 HBH 0 HBH = 0: The bus holder is disabled except when HPI16 = 1. HBH = 1: The bus holder is enabled. When not driven, the HPI data bus, HD[7:0] is held in the previous logic level. Bus holder. Controls the bus holder. BH is cleared to 0 at reset. 1 BH 0 Rsvd 0 − BH = 0: The bus holder is disabled. BH = 1: The bus holder is enabled. When not driven, the data bus, D[15:0] is held in the previous logic level. Reserved † For additional information, see Section 3.11 of this document. The 5416 has an internal register that holds the MSB of the last address used for a read or write operation in program or data space. In the non-consecutive bank switches (CONSEC = 0), if the MSB of the address used for the current read does not match that contained in this internal register, the MSTRB (memory strobe) signal is not asserted for one CLKOUT cycle. During this extra cycle, the address bus switches to the new address. The contents of the internal register are replaced with the MSB for the read of the current address. If the MSB of the address used for the current read matches the bits in the register, a normal read cycle occurs. In non-consecutive bank switches (CONSEC = 0), if repeated reads are performed from the same memory bank, no extra cycles are inserted. When a read is performed from a different memory bank, memory conflicts are avoided by inserting an extra cycle. For more information, see Section 3.11 of this document. The bank-switching mechanism automatically inserts one extra cycle in the following cases: • • • • 18 A memory read followed by another memory read from a different memory bank. A program-memory read followed by a data-memory read. A data-memory read followed by a program-memory read. A program-memory read followed by another program-memory read from a different page. SGUS048 July 2003 Functional Overview 3.6.3 Bus Holders The 5416 has two bus holder control bits, BH (BSCR[1]) and HBH (BSCR[2]), to control the bus keepers of the address bus (A[17−0]), data bus (D[15−0]), and the HPI data bus (HD[7−0]). Bus keeper enabling/disabling is described in Table 3−5. Table 3−6. Bus Holder Control Bits 3.7 HPI16 PIN BH HBH D[15−0] A[17−0] HD[7−0] 0 0 0 OFF OFF OFF 0 0 1 OFF OFF ON 0 1 0 ON OFF OFF 0 1 1 ON OFF ON 1 0 0 OFF OFF ON 1 0 1 OFF ON ON 1 1 0 ON OFF ON 1 1 1 ON ON ON Parallel I/O Ports The 5416 has a total of 64K I/O ports. These ports can be addressed by the PORTR instruction or the PORTW instruction. The IS signal indicates a read/write operation through an I/O port. The 5416 can interface easily with external devices through the I/O ports while requiring minimal off-chip address-decoding circuits. 3.7.1 Enhanced 8-/16-Bit Host-Port Interface (HPI8/16) The 5416 host-port interface, also referred to as the HPI8/16, is an enhanced version of the standard 8-bit HPI found on earlier TMS320C54x DSPs (542, 545, 548, and 549). The 5416 HPI can be used to interface to an 8-bit or 16-bit host. When the address and data buses for external I/O is not used (to interface to external devices in program/data/IO spaces), the 5416 HPI can be configured as an HPI16 to interface to a 16-bit host. This configuration can be accomplished by connecting the HPI16 pin to logic “1”. When the HPI16 pin is connected to a logic “0”, the 5416 HPI is configured as an HPI8. The HPI8 is an 8-bit parallel port for interprocessor communication. The features of the HPI8 include: Standard features: • • • Sequential transfers (with autoincrement) or random-access transfers Host interrupt and C54x interrupt capability Multiple data strobes and control pins for interface flexibility The HPI8 interface consists of an 8-bit bidirectional data bus and various control signals. Sixteen-bit transfers are accomplished in two parts with the HBIL input designating high or low byte. The host communicates with the HPI8 through three dedicated registers — the HPI address register (HPIA), the HPI data register (HPID), and the HPI control register (HPIC). The HPIA and HPID registers are only accessible by the host, and the HPIC register is accessible by both the host and the 5416. Enhanced features: • • Access to entire on-chip RAM through DMA bus Capability to continue transferring during emulation stop TMS320C54x and C54x are trademarks of Texas Instruments. July 2003 SGUS048 19 Functional Overview The HPI16 is an enhanced 16-bit version of the TMS320C54x DSP 8-bit host-port interface (HPI8). The HPI16 is designed to allow a 16-bit host to access the DSP on-chip memory, with the host acting as the master of the interface. Some of the features of the HPI16 include: • • • • • • 16-bit bidirectional data bus Multiple data strobes and control signals to allow glueless interfacing to a variety of hosts Only nonmultiplexed address/data modes are supported 18-bit address bus used in nonmultiplexed mode to allow access to all internal memory (including internal extended address pages) HRDY signal to hold off host accesses due to DMA latency The HPI16 acts as a slave to a 16-bit host processor and allows access to the on-chip memory of the DSP. NOTE: Only the nonmultiplexed mode is supported when the 5416 HPI is configured as a HPI16 (see Figure 3−8). The 5416 HPI functions as a slave and enables the host processor to access the on-chip memory. A major enhancement to the 5416 HPI over previous versions is that it allows host access to the entire on-chip memory range of the DSP. The host and the DSP both have access to the on-chip RAM at all times and host accesses are always synchronized to the DSP clock. If the host and the DSP contend for access to the same location, the host has priority, and the DSP waits for one cycle. Note that since host accesses are always synchronized to the 5416 clock, an active input clock (CLKIN) is required for HPI accesses during IDLE states, and host accesses are not allowed while the 5416 reset pin is asserted. 3.7.2 HPI Nonmultiplexed Mode In nonmultiplexed mode, a host with separate address/data buses can access the HPI16 data register (HPID) via the HD 16-bit bidirectional data bus, and the address register (HPIA) via the 18-bit HA address bus. The host initiates the access with the strobe signals (HDS1, HDS2, HCS) and controls the direction of the access with the HR/W signal. The HPI16 can stall host accesses via the HRDY signal. Note that the HPIC register is not available in nonmultiplexed mode since there are no HCNTL signals available. All host accesses initiate a DMA read or write access. Figure 3−8 shows a block diagram of the HPI16 in nonmultiplexed mode. DATA[15:0] HPI16 PPD[15:0] HINT HPID[15:0] DMA Address[17:0] VCC Internal Memory HOST HCNTL0 HCNTL1 HBIL HAS R/W HR/W Data Strobes READY HRDY HDS1, HDS2, HCS 54xx CPU Figure 3−8. Host-Port Interface — Nonmultiplexed Mode 20 SGUS048 July 2003 Functional Overview Address (Hex) 000 0000 Reserved 000 005F 000 0060 000 007F 000 0080 Scratch-Pad RAM DARAM0 − DARAM3 000 7FFF 000 8000 Reserved 001 7FFF 001 8000 DARAM4 − DARAM7 001 FFFF 002 0000 Reserved 002 7FFF 002 8000 002 FFFF 003 0000 SARAM0 − SARAM3 Reserved 003 7FFF 003 8000 SARAM4 − SARAM7 003 FFFF 004 0000 Reserved 07F FFFF Figure 3−9. HPI Memory Map July 2003 SGUS048 21 Functional Overview 3.8 Multichannel Buffered Serial Ports (McBSPs) The 5416 device provides three high-speed, full-duplex, multichannel buffered serial ports that allow direct interface to other C54x/LC54x devices, codecs, and other devices in a system. The McBSPs are based on the standard serial-port interface found on other 54x devices. Like their predecessors, the McBSPs provide: • • • Full-duplex communication Double-buffer data registers, which allow a continuous data stream Independent framing and clocking for receive and transmit In addition, the McBSPs have the following capabilities: • • • • • • Direct interface to: − T1/E1 framers − MVIP switching compatible and ST-BUS compliant devices − IOM-2 compliant devices − AC97-compliant devices − IIS-compliant devices − Serial peripheral interface Multichannel transmit and receive of up to 128 channels A wide selection of data sizes, including 8, 12, 16, 20, 24, or 32 bits µ-law and A-law companding Programmable polarity for both frame synchronization and data clocks Programmable internal clock and frame generation The McBSP consists of a data path and control path. The six pins, BDX, BDR, BFSX, BFSR, BCLKX, and BCLKR, connect the control and data paths to external devices. The implemented pins can be programmed as general-purpose I/O pins if they are not used for serial communication. The data is communicated to devices interfacing to the McBSP by way of the data transmit (BDX) pin for transmit and the data receive (BDR) pin for receive. The CPU or DMA reads the received data from the data receive register (DRR) and writes the data to be transmitted to the data transmit register (DXR). Data written to the DXR is shifted out to BDX by way of the transmit shift register (XSR). Similarly, receive data on the BDR pin is shifted into the receive shift register (RSR) and copied into the receive buffer register (RBR). RBR is then copied to DRR, which can be read by the CPU or DMA. This allows internal data movement and external data communications simultaneously. Control information in the form of clocking and frame synchronization is communicated by way of BCLKX, BCLKR, BFSX, and BFSR. The device communicates to the McBSP by way of 16-bit-wide control registers accessible via the internal peripheral bus. The control block consists of internal clock generation, frame synchronization signal generation, and their control, and multichannel selection. This control block sends notification of important events to the CPU and DMA by way of two interrupt signals, XINT and RINT, and two event signals, XEVT and REVT. The on-chip companding hardware allows compression and expansion of data in either µ-law or A-law format. When companding is used, transmitted data is encoded according to the specified companding law and received data is decoded to 2s complement format. The sample rate generator provides the McBSP with several means of selecting clocking and framing for both the receiver and transmitter. Both the receiver and transmitter can select clocking and framing independently. The McBSP allows the multiple channels to be independently selected for the transmitter and receiver. When multiple channels are selected, each frame represents a time-division multiplexed (TDM) data stream. In using time-division multiplexed data streams, the CPU may only need to process a few of them. Thus, to save memory and bus bandwidth, multichannel selection allows independent enabling of particular channels for transmission and reception. All 128 channels in a bit stream consisting of a maximum of 128 channels can be enabled. 22 SGUS048 July 2003 Functional Overview 15 14 15 13 14 12 11 10 9 8 7 6 5 4 3 2 1 0 Reserved XMCME XPBBLK XPABLK XCBLK XMCM R R/W R/W R/W R R/W 13 1 0 Reserved 12 11 10 RMCME 9 8 RPBBLK 7 6 RPABLK 5 4 RCBLK 3 2 Resvd RMCM R R/W R/W R/W R R R/W LEGEND: R = Read, W = Write Figure 3−10. Multichannel Control Registers (MCR1 and MCR2) The 5416 McBSP has two working modes: • In the first mode, when (R/X)MCME = 0, it is comparable with the McBSPs used in the 5410 where the normal 32-channel selection is enabled (default). In the second mode, when (R/X)MCME = 1, it has 128-channel selection capability. Multichannel control register Bit 9, (R/X)MCME, is used as the 128-channel selection enable bit. Once (R/X)MCME = 1, twelve new registers ((R/X)CERC − (R/X)CERH) are used to enable the 128-channel selection. • The clock stop mode (CLKSTP) in the McBSP provides compatibility with the serial port interface protocol. Clock stop mode works with only single-phase frames and one word per frame. The word sizes supported by the McBSP are programmable for 8-, 12-, 16-, 20-, 24-, or 32-bit operation. When the McBSP is configured to operate in SPI mode, both the transmitter and the receiver operate together as a master or as a slave. Although the BCLKS pin is not available on the 5416 PGE and GGU packages, the 5416 is capable of synchronization to external clock sources. BCLKX or BCLKR can be used by the sample rate generator for external synchronization. The sample rate clock mode extended (SCLKME) bit field is located in the PCR to accommodate this option. 15 13 12 11 10 9 8 Reserved 14 XIOEN RIOEN FSXM FSRM CLKXM CLKRM RW RW RW RW RW RW RW 7 6 5 4 3 2 1 0 SCLKME CLKS STAT DX STAT DR STAT FSXP FSRP CLKXP CLKRP RW RW RW RW RW RW RW RW Legend: R = Read, W = Write Figure 3−11. Pin Control Register (PCR) The selection of sample rate input clock is made by the combination of the CLKSM (bit 13 in SRGR2) bit value and the SCLKME bit value as shown in Table 3−7. Table 3−7. Sample Rate Input Clock Selection July 2003 SCLKME CLKSM SAMPLE RATE CLOCK MODE 0 0 Reserved (CLKS pin unavailable) 0 1 CPU clock 1 0 BCLKR 1 1 BCLKX SGUS048 23 Functional Overview When the SCLKME bit is cleared to 0, the CLKSM bit is used, as before, to select either the CPU clock or the CLKS pin (not bonded out on the 5416 device package) as the sample rate input clock. Setting the SCLKME bit to 1 enables the CLKSM bit to select between the BCLKR pin or BCLKX pin for the sample rate input clock. When either the BCLKR or CLKX is configured this way, the output buffer for the selected pin is automatically disabled. For example, with SCLKME = 1 and CLKSM = 0, the BCLKR pin is configured as the input of the sample rate generator. Both the transmitter and receiver circuits can be synchronized to the sample rate generator output by setting the CLKXM and CLKRM bits of the pin configuration register (PCR) to 1. Note that the sample rate generator output will only be driven on the BCLKX pin since the BCLKR output buffer is automatically disabled. The McBSP is fully static and operates at arbitrary low clock frequencies. For maximum operating frequency, see Section 5.14. 3.9 Hardware Timer The 5416 device features a 16-bit timing circuit with a 4-bit prescaler. The timer counter is decremented by one every CLKOUT cycle. Each time the counter decrements to 0, a timer interrupt is generated. The timer can be stopped, restarted, reset, or disabled by specific status bits. 3.10 Clock Generator The clock generator provides clocks to the 5416 device, and consists of a phase-locked loop (PLL) circuit. The clock generator requires a reference clock input, which can be provided from an external clock source. The reference clock input is then divided by two (DIV mode) to generate clocks for the 5416 device, or the PLL circuit can be used (PLL mode) to generate the device clock by multiplying the reference clock frequency by a scale factor, allowing use of a clock source with a lower frequency than that of the CPU. The PLL is an adaptive circuit that, once synchronized, locks onto and tracks an input clock signal. When the PLL is initially started, it enters a transitional mode during which the PLL acquires lock with the input signal. Once the PLL is locked, it continues to track and maintain synchronization with the input signal. Then, other internal clock circuitry allows the synthesis of new clock frequencies for use as master clock for the 5416 device. This clock generator allows system designers to select the clock source. The sources that drive the clock generator are: • • A crystal resonator circuit. The crystal resonator circuit is connected across the X1 and X2/CLKIN pins of the 5416 to enable the internal oscillator. An external clock. The external clock source is directly connected to the X2/CLKIN pin, and X1 is left unconnected. NOTE: The crystal oscillator function is not supported by all die revisions of the 5416 device. See the TMS320VC5416 Silicon Errata (literature number SPRZ172) to verify which die revisions support this functionality. The software-programmable PLL features a high level of flexibility, and includes a clock scaler that provides various clock multiplier ratios, capability to directly enable and disable the PLL, and a PLL lock timer that can be used to delay switching to PLL clocking mode of the device until lock is achieved. Devices that have a built-in software-programmable PLL can be configured in one of two clock modes: • • PLL mode. The input clock (X2/CLKIN) is multiplied by 1 of 31 possible ratios. DIV (divider) mode. The input clock is divided by 2 or 4. Note that when DIV mode is used, the PLL can be completely disabled in order to minimize power dissipation. The software-programmable PLL is controlled using the 16-bit memory-mapped (address 0058h) clock mode register (CLKMD). The CLKMD register is used to define the clock configuration of the PLL clock module. Note that upon reset, the CLKMD register is initialized with a predetermined value dependent only upon the state of the CLKMD1 − CLKMD3 pins. For more programming information, see the TMS320C54x DSP Reference Set, Volume 1: CPU and Peripherals (literature number SPRU131). The CLKMD pin configured clock options are shown in Table 3−8. 24 SGUS048 July 2003 Functional Overview Table 3−8. Clock Mode Settings at Reset CLKMD1 CLKMD2 CLKMD3 CLKMD RESET VALUE 0 0 0 0000h 1/2 (PLL disabled) 0 0 1 9007h PLL x 10 0 1 0 4007h PLL x 5 1 0 0 1007h PLL x 2 1 1 0 F007h PLL x 1 1 1 1 0000h 1/2 (PLL disabled) 1 0 1 F000h 1/4 (PLL disabled) 0 1 1 — CLOCK MODE† Reserved (Bypass mode) † The external CLKMD1−CLKMD3 pins are sampled to determine the desired clock generation mode while RS is low. Following reset, the clock generation mode can be reconfigured by writing to the internal clock mode register in software. 3.11 Enhanced External Parallel Interface (XIO2) The 5416 external interface has been redesigned to include several improvements, including: simplification of the bus sequence, more immunity to bus contention when transitioning between read and write operations, the ability for external memory access to the DMA controller, and optimization of the power-down modes. The bus sequence on the 5416 still maintains all of the same interface signals as on previous 54x devices, but the signal sequence has been simplified. Most external accesses now require 3 cycles composed of a leading cycle, an active (read or write) cycle, and a trailing cycle. The leading and trailing cycles provide additional immunity against bus contention when switching between read operations and write operations. To maintain high-speed read access, a consecutive read mode that performs single-cycle reads as on previous 54x devices is available. July 2003 SGUS048 25 Functional Overview Figure 3−12 shows the bus sequence for three cases: all I/O reads, memory reads in nonconsecutive mode, or single memory reads in consecutive mode. The accesses shown in Figure 3−12 always require 3 CLKOUT cycles to complete. CLKOUT A[22:0] D[15:0] READ R/W MSTRB or IOSTRB PS/DS/IS Leading Cycle Read Cycle Trailing Cycle Figure 3−12. Nonconsecutive Memory Read and I/O Read Bus Sequence 26 SGUS048 July 2003 Functional Overview Figure 3−13 shows the bus sequence for repeated memory reads in consecutive mode. The accesses shown in Figure 3−13 require (2 + n) CLKOUT cycles to complete, where n is the number of consecutive reads performed. CLKOUT A[22:0] READ D[15:0] READ READ R/W MSTRB PS/DS Leading Cycle Read Cycle Read Cycle Read Cycle Trailing Cycle Figure 3−13. Consecutive Memory Read Bus Sequence (n = 3 reads) July 2003 SGUS048 27 Functional Overview Figure 3−14 shows the bus sequence for all memory writes and I/O writes. The accesses shown in Figure 3−14 always require 3 CLKOUT cycles to complete. CLKOUT A[22:0] WRITE D[15:0] R/W MSTRB or IOSTRB PS/DS/IS Leading Cycle Write Cycle Trailing Cycle Figure 3−14. Memory Write and I/O Write Bus Sequence The enhanced interface also provides the ability for DMA transfers to extend to external memory. For more information on DMA capability, see the DMA sections that follow. The enhanced interface improves the low-power performance already present on the TMS320C5000 DSP platform by switching off the internal clocks to the interface when it is not being used. This power-saving feature is automatic, requires no software setup, and causes no latency in the operation of the interface. Additional features integrated in the enhanced interface are the ability to automatically insert bank-switching cycles when crossing 32K memory boundaries (see Section 3.6.2), the ability to program up to 14 wait states through software (see Section 3.6.1), and the ability to divide down CLKOUT by a factor of 1, 2, 3, or 4. Dividing down CLKOUT provides an alternative to wait states when interfacing to slower external memory or peripheral devices. While inserting wait states extends the bus sequence during read or write accesses, it does not slow down the bus signal sequences at the beginning and the end of the access. Dividing down CLKOUT provides a method of slowing the entire bus sequence when necessary. The CLKOUT divide-down factor is controlled through the DIVFCT field in the bank-switching control register (BSCR) (see Table 3−5). 3.12 DMA Controller The 5416 direct memory access (DMA) controller transfers data between points in the memory map without intervention by the CPU. The DMA allows movements of data to and from internal program/data memory, internal peripherals (such as the McBSPs), or external memory devices to occur in the background of CPU operation. The DMA has six independent programmable channels, allowing six different contexts for DMA operation. TMS320C5000 is a trademark of Texas Instruments. 28 SGUS048 July 2003 Functional Overview 3.12.1 Features The DMA has the following features: • • • • • • • • 3.12.2 The DMA operates independently of the CPU. The DMA has six channels. The DMA can keep track of the contexts of six independent block transfers. The DMA has higher priority than the CPU for both internal and external accesses. Each channel has independently programmable priorities. Each channel’s source and destination address registers can have configurable indexes through memory on each read and write transfer, respectively. The address may remain constant, be post-incremented, be post-decremented, or be adjusted by a programmable value. Each read or write internal transfer may be initialized by selected events. On completion of a half- or entire-block transfer, each DMA channel may send an interrupt to the CPU. The DMA can perform double-word internal transfers (a 32-bit transfer of two 16-bit words). DMA External Access The 5416 DMA supports external accesses to data, I/O, and extended program memory. These overlay pages are only visible to the DMA controller. A maximum of two DMA channels can be used for external memory accesses. The DMA external accesses require a minimum of 8 cycles for external writes and a minimum of 11 cycles for external reads assuming the XIO02 is in consecutive mode (CONSEC = 1), wait state is set to two, and CLKOUT is not divided (DIVFCT = 00). The control of the bus is arbitrated between the CPU and the DMA. While the DMA or CPU is in control of the external bus, the other will be held-off via wait states until the current transfer is complete. The DMA takes precedence over XIO requests. • • • • • • Only two channels are available for external accesses. (One for external reads and one for external writes.) Single-word (16-bit) transfers are supported for external accesses. The DMA does not support transfers from the peripherals to external memory. The DMA does not support transfers from external memory to the peripherals. The DMA does not support external-to-external accesses. The DMA does not support synchronized external accesses. 15 14 13 AUTO INIT DINM IMOD 12 CT MOD 11 10 SLAXS 9 SIND 8 7 6 DMS 5 4 DLAXS 3 DIND 2 1 0 DMD Figure 3−15. DMA Transfer Mode Control Register (DMMCRn) These new bit fields were created to allow the user to define the space-select for the DMA (internal/external). The functions of the DLAXS and SLAXS bits are as follows: DLAXS(DMMCRn[5]) Destination 0 = No external access (default internal) 1 = External access SLAXS(DMMCRn[11]) Source 0 = No external access (default internal) 1 = External access July 2003 SGUS048 29 Functional Overview Table 3−9 lists the DMD bit values and their corresponding destination space. Table 3−9. DMD Section of the DMMCRn Register DMD DESTINATION SPACE 00 PS 01 DS 10 I/O 11 Reserved For the CPU external access, software can configure the memory cells to reside inside or outside the program address map. When the cells are mapped into program space, the device automatically accesses them when their addresses are within bounds. When the address generation logic generates an address outside its bounds, the device automatically generates an external access. 3.12.3 DMA Memory Map The DMA memory map, shown in Figure 3−16, allows the DMA transfer to be unaffected by the status of the MP/MC, DROM, and OVLY bits. Hex 0000 005F 0060 DLAXS = 0 SLAXS = 0 1FFF 2000 3FFF 4000 5FFF 6000 Program Hex 010000 Program Hex 0x0000 Program Reserved Hex xx0000 Program On-Chip DARAM0 8K Words On-Chip DARAM1 8K Words Reserved Reserved On-Chip DARAM2 8K Words On-Chip DARAM3 8K Words 7FFF 8000 017FFF 018000 019FFF 01A000 0x7FFF On-Chip DARAM 4 8K Words On-Chip DARAM 5 8K Words 01BFFF 01C000 On-Chip DARAM 6 8K Words Reserved 01DFFF 01E000 On-Chip DARAM 7 8K Words 01FFFF FFFF Page 0 Page 1 0x8000 0x9FFF 0xA000 Reserved On-Chip SARAM 0/4 8K Words On-Chip SARAM 1/5 8K Words 0xBFFF 0xC000 On-Chip SARAM 2/6 8K Words 0xDFFF 0xE000 On-Chip SARAM 3/7 8K Words 0xFFFF xxFFFF Page 2 − 3 Page 4 − 127 Figure 3−16. On-Chip DMA Memory Map for Program Space (DLAXS = 0 and SLAXS = 0) 30 SGUS048 July 2003 Functional Overview Data Space (0000 − 005F) Hex 0000 Reserved 001F 0020 DRR20 0021 DRR10 DXR20 0022 0023 DXR10 0024 Reserved 002F DRR22 0030 DRR12 0031 DXR22 0032 0033 DXR12 0034 Reserved 0035 RCERA2 0036 0037 XCERA2 0038 Reserved 0039 003A RECRA0 003B XECRA0 003C Reserved 003F DRR21 0040 0041 DRR11 0042 DXR21 0043 DXR11 0044 Reserved 0049 004A RCERA1 004B XCERA1 004C Reserved 005F Data Space I/O Space Hex 0000 0000 Data Space (See Breakout) 005F 0060 007F 0080 1FFF 2000 3FFF 4000 5FFF 6000 7FFF 8000 9FFF A000 BFFF C000 DFFF E000 FFFF Scratch-Pad RAM On-Chip DARAM0 8K Words On-Chip DARAM1 8K Words On-Chip DARAM2 8K Words Reserved On-Chip DARAM3 8K Words On-Chip DARAM4 8K Words On-Chip DARAM5 8K Words On-Chip DARAM6 8K Words On-Chip DARAM7 8K Words FFFF Figure 3−17. On-Chip DMA Memory Map for Data and IO Space (DLAXS = 0 and SLAXS = 0) 3.12.4 DMA Priority Level Each DMA channel can be independently assigned high- or low-priority relative to each other. Multiple DMA channels that are assigned to the same priority level are handled in a round-robin manner. 3.12.5 DMA Source/Destination Address Modification The DMA provides flexible address-indexing modes for easy implementation of data management schemes such as autobuffering and circular buffers. Source and destination addresses can be indexed separately and can be post-incremented, post-decremented, or post-incremented with a specified index offset. 3.12.6 DMA in Autoinitialization Mode The DMA can automatically reinitialize itself after completion of a block transfer. Some of the DMA registers can be preloaded for the next block transfer through the DMA reload registers (DMGSA, DMGDA, DMGCR, and DMGFR). Autoinitialization allows: • • July 2003 Continuous operation: Normally, the CPU would have to reinitialize the DMA immediately after the completion of the current block transfers, but with the reload registers, it can reinitialize these values for the next block transfer any time after the current block transfer begins. Repetitive operation: The CPU does not preload the reload register with new values for each block transfer but only loads them on the first block transfer. SGUS048 31 Functional Overview The 5416 DMA has been enhanced to expand the DMA reload register sets. Each DMA channel now has its own DMA reload register set. For example, the DMA reload register set for channel 0 has DMGSA0, DMGDA0, DMGCR0, and DMGFR0 while DMA channel 1 has DMGSA1, DMGDA1, DMGCR1, and DMGFR1, etc. To utilize the additional DMA reload registers, the AUTOIX bit is added to the DMPREC register as shown in Figure 3−18. 15 14 13 FREE AUTOIX 12 11 10 9 8 DPRC[5:0] 7 6 5 4 IOSEL 3 2 1 0 DE[5:0] Figure 3−18. DMPREC Register Table 3−10. DMA Reload Register Selection AUTOIX 0 (default) 1 3.12.7 DMA RELOAD REGISTER USAGE IN AUTO INIT MODE All DMA channels use DMGSA0, DMGDA0, DMGCR0 and DMGFR0 Each DMA channel uses its own set of reload registers DMA Transfer Counting The DMA channel element count register (DMCTRx) and the frame count register (DMFRCx) contain bit fields that represent the number of frames and the number of elements per frame to be transferred. • • 3.12.8 Frame count. This 8-bit value defines the total number of frames in the block transfer. The maximum number of frames per block transfer is 128 (FRAME COUNT= 0FFh). The counter is decremented upon the last read transfer in a frame transfer. Once the last frame is transferred, the selected 8-bit counter is reloaded with the DMA global frame reload register (DMGFR) if the AUTOINIT bit is set to 1. A frame count of 0 (default value) means the block transfer contains a single frame. Element count. This 16-bit value defines the number of elements per frame. This counter is decremented after the read transfer of each element. The maximum number of elements per frame is 65536 (DMCTRn = 0FFFFh). In autoinitialization mode, once the last frame is transferred, the counter is reloaded with the DMA global count reload register (DMGCR). DMA Transfer in Doubleword Mode Doubleword mode allows the DMA to transfer 32-bit words in any index mode. In doubleword mode, two consecutive 16-bit transfers are initiated and the source and destination addresses are automatically updated following each transfer. In this mode, each 32-bit word is considered to be one element. 3.12.9 DMA Channel Index Registers The particular DMA channel index register is selected by way of the SIND and DIND fields in the DMA transfer mode control register (DMMCRn). Unlike basic address adjustment, in conjunction with the frame index DMFRI0 and DMFRI1, the DMA allows different adjustment amounts depending on whether or not the element transfer is the last in the current frame. The normal adjustment value (element index) is contained in the element index registers DMIDX0 and DMIDX1. The adjustment value (frame index) for the end of the frame, is determined by the selected DMA frame index register, either DMFRI0 or DMFRI1. The element index and the frame index affect address adjustment as follows: • • 32 Element index: For all except the last transfer in the frame, the element index determines the amount to be added to the DMA channel for the source/destination address register (DMSRCx/DMDSTx) as selected by the SIND/DIND bits. Frame index: If the transfer is the last in a frame, frame index is used for address adjustment as selected by the SIND/DIND bits. This occurs in both single-frame and multiframe transfers. SGUS048 July 2003 Functional Overview 3.12.10 DMA Interrupts The ability of the DMA to interrupt the CPU based on the status of the data transfer is configurable and is determined by the IMOD and DINM bits in the DMA transfer mode control register (DMMCRn). The available modes are shown in Table 3−11. Table 3−11. DMA Interrupts MODE DINM IMOD INTERRUPT ABU (non-decrement) 1 0 At full buffer only ABU (non-decrement) 1 1 At half buffer and full buffer Multiframe 1 0 At block transfer complete (DMCTRn = DMSEFCn[7:0] = 0) Multiframe 1 1 At end of frame and end of block (DMCTRn = 0) Either 0 X No interrupt generated Either 0 X No interrupt generated 3.12.11 DMA Controller Synchronization Events The transfers associated with each DMA channel can be synchronized to one of several events. The DSYN bit field of the DMSEFCn register selects the synchronization event for a channel. The list of possible events and the DSYN values are shown in Table 3−12. Table 3−12. DMA Synchronization Events DSYN VALUE DMA SYNCHRONIZATION EVENT 0000b No synchronization used 0001b McBSP0 receive event 0010b McBSP0 transmit event 0011b McBSP2 receive event 0100b McBSP2 transmit event 0101b McBSP1 receive event 0110b McBSP1 transmit event 0111b McBSP0 receive event − ABIS mode 1000b McBSP0 transmit event − ABIS mode 1001b McBSP2 receive event − ABIS mode 1010b McBSP2 transmit event − ABIS mode 1011b McBSP1 receive event − ABIS mode 1100b McBSP1 transmit event − ABIS mode 1101b Timer interrupt event 1110b INT3 goes active 1111b Reserved The DMA controller can generate a CPU interrupt for each of the six channels. However, due to a limit on the number of internal CPU interrupt inputs, channels 0, 1, 2, and 3 are multiplexed with other interrupt sources. DMA channels 0, 1, 2, and 3 share an interrupt line with the receive and transmit portions of the McBSP. When the 5416 is reset, the interrupts from these three DMA channels are deselected. The INTSEL bit field in the DMPREC register can be used to select these interrupts, as shown in Table 3−13. Table 3−13. DMA Channel Interrupt Selection INTSEL Value IMR/IFR[6] IMR/IFR[7] IMR/IFR[10] IMR/IFR[11] 00b (reset) BRINT2 BXINT2 BRINT1 BXINT1 01b BRINT2 BXINT2 DMAC2 DMAC3 10b DMAC0 DMAC1 DMAC2 DMAC3 11b July 2003 Reserved SGUS048 33 Functional Overview 3.13 General-Purpose I/O Pins In addition to the standard BIO and XF pins, the 5416 has pins that can be configured for general-purpose I/O. These pins are: • 18 McBSP pins — BCLKX0/1/2, BCLKR0/1/2, BDR0/1/2, BFSX0/1/2, BFSR0/1/2, BDX0/1/2 • 8 HPI data pins—HD0−HD7 The general-purpose I/O function of these pins is only available when the primary pin function is not required. 3.13.1 McBSP Pins as General-Purpose I/O When the receive or transmit portion of a McBSP is in reset, its pins can be configured as general-purpose inputs or outputs. For more details on this feature, see Section 3.8. 3.13.2 HPI Data Pins as General-Purpose I/O The 8-bit bidirectional data bus of the HPI can be used as general-purpose input/output (GPIO) pins when the HPI is disabled (HPIENA = 0) or when the HPI is used in HPI16 mode (HPI16 = 1). Two memory-mapped registers are used to control the GPIO function of the HPI data pins—the general-purpose I/O control register (GPIOCR) and the general-purpose I/O status register (GPIOSR). The GPIOCR is shown in Figure 3−19. 7 6 5 4 3 2 1 0 Reserved DIR7 DIR6 DIR5 DIR4 DIR3 DIR2 DIR1 DIR0 0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 15 8 Figure 3−19. General-Purpose I/O Control Register (GPIOCR) [MMR Address 003Ch] The direction bits (DIRx) are used to configure HD0−HD7 as inputs or outputs. The status of the GPIO pins can be monitored using the bits of the GPIOSR. The GPIOSR is shown in Figure 3−20. 15 8 Reserved 0 7 6 5 4 3 2 1 0 IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 Figure 3−20. General-Purpose I/O Status Register (GPIOSR) [MMR Address 003Dh] 34 SGUS048 July 2003 Functional Overview 3.14 Device ID Register A read-only memory-mapped register has been added to the 5416 to allow user application software to identify on which device the program is being executed. 15 8 7 4 Chip ID Chip Revision R R 3 0 SUBSYSID R Bits 15:8: Chip_ID (hex code of 16) Bits 7:4: Chip_Revision ID Bits 3:0: Subsystem_ID (0000b for single core device) Figure 3−21. Device ID Register (CSIDR) [MMR Address 003Eh] 3.15 Memory-Mapped Registers The 5416 has 27 memory-mapped CPU registers, which are mapped in data memory space address 0h to 1Fh. Each 5416 device also has a set of memory-mapped registers associated with peripherals. Table 3−14 gives a list of CPU memory-mapped registers (MMRs) available on 5416. Table 3−15 shows additional peripheral MMRs associated with the 5416. Table 3−14. CPU Memory-Mapped Registers ADDRESS NAME DESCRIPTION DEC HEX IMR 0 0 Interrupt mask register IFR 1 1 Interrupt flag register Reserved for testing — 2−5 2−5 ST0 6 6 Status register 0 ST1 7 7 Status register 1 AL 8 8 Accumulator A low word (15−0) AH 9 9 Accumulator A high word (31−16) AG 10 A Accumulator A guard bits (39−32) BL 11 B Accumulator B low word (15−0) BH 12 C Accumulator B high word (31−16) BG 13 D Accumulator B guard bits (39−32) TREG 14 E Temporary register TRN 15 F Transition register AR0 16 10 Auxiliary register 0 AR1 17 11 Auxiliary register 1 AR2 18 12 Auxiliary register 2 AR3 19 13 Auxiliary register 3 AR4 20 14 Auxiliary register 4 AR5 21 15 Auxiliary register 5 AR6 22 16 Auxiliary register 6 AR7 23 17 Auxiliary register 7 SP 24 18 Stack pointer register BK 25 19 Circular buffer size register BRC 26 1A Block repeat counter July 2003 SGUS048 35 Functional Overview Table 3−14. CPU Memory-Mapped Registers (Continued) ADDRESS NAME DEC DESCRIPTION HEX RSA 27 1B Block repeat start address REA 28 1C Block repeat end address PMST 29 1D Processor mode status (PMST) register XPC 30 1E Extended program page register — 31 1F Reserved 36 SGUS048 July 2003 Functional Overview Table 3−15. Peripheral Memory-Mapped Registers for Each DSP Subsystem NAME ADDRESS DEC HEX DESCRIPTION DRR20 32 20 McBSP 0 Data Receive Register 2 DRR10 33 21 McBSP 0 Data Receive Register 1 DXR20 34 22 McBSP 0 Data Transmit Register 2 DXR10 35 23 McBSP 0 Data Transmit Register 1 TIM 36 24 Timer Register PRD 37 25 Timer Period Register TCR 38 26 Timer Control Register — 39 27 Reserved SWWSR 40 28 Software Wait-State Register BSCR 41 29 Bank-Switching Control Register — 42 2A Reserved SWCR 43 2B Software Wait-State Control Register HPIC 44 2C HPI Control Register (HMODE = 0 only) — 45−47 2D−2F DRR22 48 30 McBSP 2 Data Receive Register 2 DRR12 49 31 McBSP 2 Data Receive Register 1 DXR22 50 32 McBSP 2 Data Transmit Register 2 DXR12 51 33 McBSP 2 Data Transmit Register 1 SPSA2 52 34 McBSP 2 Subbank Address Register† McBSP 2 Subbank Data Register† SPSD2 53 35 54−55 36−37 SPSA0 56 38 SPSD0 57 39 — — Reserved Reserved McBSP 0 Subbank Address Register† McBSP 0 Subbank Data Register† 58−59 3A−3B GPIOCR 60 3C General-Purpose I/O Control Register GPIOSR 61 3D General-Purpose I/O Status Register CSIDR 62 3E Device ID Register — 63 3F Reserved DRR21 64 40 McBSP 1 Data Receive Register 2 DRR11 65 41 McBSP 1 Data Receive Register 1 DXR21 66 42 McBSP 1 Data Transmit Register 2 DXR11 67 43 McBSP 1 Data Transmit Register 1 68−71 44−47 72 48 — SPSA1 SPSD1 Reserved Reserved McBSP 1 Subbank Address Register† McBSP 1 Subbank Data Register† 73 49 74−83 4A−53 DMPREC 84 54 DMSA 85 55 DMSDI 86 56 DMSDN 87 57 DMA Subbank Data Register with Autoincrement‡ DMA Subbank Data Register‡ CLKMD 88 58 Clock Mode Register (CLKMD) 89−95 59−5F — — Reserved DMA Priority and Enable Control Register DMA Subbank Address Register‡ Reserved † See Table 3−16 for a detailed description of the McBSP control registers and their subaddresses. ‡ See Table 3−17 for a detailed description of the DMA subbank addressed registers. July 2003 SGUS048 37 Functional Overview 3.16 McBSP Control Registers and Subaddresses The control registers for the multichannel buffered serial port (McBSP) are accessed using the subbank addressing scheme. This allows a set or subbank of registers to be accessed through a single memory location. The McBSP subbank address register (SPSA) is used as a pointer to select a particular register within the subbank. The McBSP data register (SPSDx) is used to access (read or write) the selected register. Table 3−16 shows the McBSP control registers and their corresponding subaddresses. Table 3−16. 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The main control register (DMPREC) is a standard memory-mapped register. However, the other registers are accessed using the subbank addressing scheme. This allows a set or subbank of registers to be accessed through a single memory location. The DMA subbank address (DMSA) register is used as a pointer to select a particular register within the subbank, while the DMA subbank data (DMSD) register or the DMA subbank data register with autoincrement (DMSDI) is used to access (read or write) the selected register. When the DMSDI register is used to access the subbank, the subbank address is automatically postincremented so that a subsequent access affects the next register within the subbank. This autoincrement feature is intended for efficient, successive accesses to several control registers. If the autoincrement feature is not required, the DMSDN register should be used to access the subbank. Table 3−17 shows the DMA controller subbank addressed registers and their corresponding subaddresses. Table 3−17. DMA Subbank Addressed Registers ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ADDRESS SUBADDRESS DMSRC0 56h/57h 00h DMA channel 0 source address register DMDST0 56h/57h 01h DMA channel 0 destination address register DMCTR0 56h/57h 02h DMA channel 0 element count register DMSFC0 56h/57h 03h DMA channel 0 sync select and frame count register DMMCR0 56h/57h 04h DMA channel 0 transfer mode control register DMSRC1 56h/57h 05h DMA channel 1 source address register DMDST1 56h/57h 06h DMA channel 1 destination address register DMCTR1 56h/57h 07h DMA channel 1 element count register DMSFC1 56h/57h 08h DMA channel 1 sync select and frame count register DMMCR1 56h/57h 09h DMA channel 1 transfer mode control register DMSRC2 56h/57h 0Ah DMA channel 2 source address register DMDST2 56h/57h 0Bh DMA channel 2 destination address register DMCTR2 56h/57h 0Ch DMA channel 2 element count register DMSFC2 56h/57h 0Dh DMA channel 2 sync select and frame count register DMMCR2 56h/57h 0Eh DMA channel 2 transfer mode control register DMSRC3 56h/57h 0Fh DMA channel 3 source address register DMDST3 56h/57h 10h DMA channel 3 destination address register DMCTR3 56h/57h 11h DMA channel 3 element count register DMSFC3 56h/57h 12h DMA channel 3 sync select and frame count register DMMCR3 56h/57h 13h DMA channel 3 transfer mode control register DMSRC4 56h/57h 14h DMA channel 4 source address register DMDST4 56h/57h 15h DMA channel 4 destination address register DMCTR4 56h/57h 16h DMA channel 4 element count register DMSFC4 56h/57h 17h DMA channel 4 sync select and frame count register DMMCR4 56h/57h 18h DMA channel 4 transfer mode control register DMSRC5 56h/57h 19h DMA channel 5 source address register DMDST5 56h/57h 1Ah DMA channel 5 destination address register DMCTR5 56h/57h 1Bh DMA channel 5 element count register DMSFC5 56h/57h 1Ch DMA channel 5 sync select and frame count register DMMCR5 56h/57h 1Dh DMA channel 5 transfer mode control register DMSRCP 56h/57h 1Eh DMA source program page address (common channel) NAME July 2003 DESCRIPTION SGUS048 39 Functional Overview Table 3−17. DMA Subbank Addressed Registers (Continued) ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ADDRESS SUBADDRESS DMDSTP 56h/57h 1Fh DMA destination program page address (common channel) DMIDX0 56h/57h 20h DMA element index address register 0 DMIDX1 56h/57h 21h DMA element index address register 1 DMFRI0 56h/57h 22h DMA frame index register 0 DMFRI1 56h/57h 23h DMA frame index register 1 DMGSA0 56h/57h 24h DMA global source address reload register, channel 0 DMGDA0 56h/57h 25h DMA global destination address reload register, channel 0 DMGCR0 56h/57h 26h DMA global count reload register, channel 0 DMGFR0 56h/57h 27h DMA global frame count reload register, channel 0 XSRCDP 56h/57h 28h DMA extended source data page (currently not supported) XDSTDP 56h/57h 29h DMA extended destination data page (currently not supported) DMGSA1 56h/57h 2Ah DMA global source address reload register, channel 1 DMGDA1 56h/57h 2Bh DMA global destination address reload register, channel 1 DMGCR1 56h/57h 2Ch DMA global count reload register, channel 1 DMGFR1 56h/57h 2Dh DMA global frame count reload register, channel 1 DMGSA2 56h/57h 2Eh DMA global source address reload register, channel 2 DMGDA2 56h/57h 2Fh DMA global destination address reload register, channel 2 DMGCR2 56h/57h 30h DMA global count reload register, channel 2 DMGFR2 56h/57h 31h DMA global frame count reload register, channel 2 DMGSA3 56h/57h 32h DMA global source address reload register, channel 3 DMGDA3 56h/57h 33h DMA global destination address reload register, channel 3 DMGCR3 56h/57h 34h DMA global count reload register, channel 3 DMGFR3 56h/57h 35h DMA global frame count reload register, channel 3 DMGSA4 56h/57h 36h DMA global source address reload register, channel 4 DMGDA4 56h/57h 37h DMA global destination address reload register, channel 4 DMGCR4 56h/57h 38h DMA global count reload register, channel 4 DMGFR4 56h/57h 39h DMA global frame count reload register, channel 4 DMGSA5 56h/57h 3Ah DMA global source address reload register, channel 5 DMGDA5 56h/57h 3Bh DMA global destination address reload register, channel 5 DMGCR5 56h/57h 3Ch DMA global count reload register, channel 5 DMGFR5 56h/57h 3Dh DMA global frame count reload register, channel 5 NAME 40 SGUS048 DESCRIPTION July 2003 Functional Overview 3.18 Interrupts Vector-relative locations and priorities for all internal and external interrupts are shown in Table 3−18. Table 3−18. Interrupt Locations and Priorities LOCATION DECIMAL HEX NAME RS, SINTR 0 00 NMI, SINT16 4 SINT17 8 SINT18 PRIORITY FUNCTION 1 Reset (hardware and software reset) 04 2 Nonmaskable interrupt 08 — Software interrupt #17 12 0C — Software interrupt #18 SINT19 16 10 — Software interrupt #19 SINT20 20 14 — Software interrupt #20 SINT21 24 18 — Software interrupt #21 SINT22 28 1C — Software interrupt #22 SINT23 32 20 — Software interrupt #23 SINT24 36 24 — Software interrupt #24 SINT25 40 28 — Software interrupt #25 SINT26 44 2C — Software interrupt #26 SINT27 48 30 — Software interrupt #27 SINT28 52 34 — Software interrupt #28 SINT29 56 38 — Software interrupt #29 SINT30 60 3C — Software interrupt #30 INT0, SINT0 64 40 3 External user interrupt #0 INT1, SINT1 68 44 4 External user interrupt #1 INT2, SINT2 72 48 5 External user interrupt #2 TINT, SINT3 76 4C 6 Timer interrupt RINT0, SINT4 80 50 7 McBSP #0 receive interrupt (default) XINT0, SINT5 84 54 8 McBSP #0 transmit interrupt (default) RINT2, SINT6 88 58 9 McBSP #2 receive interrupt (default) XINT2, SINT7 92 5C 10 McBSP #2 transmit interrupt (default) INT3, SINT8 96 60 11 External user interrupt #3 HINT, SINT9 100 64 12 HPI interrupt RINT1, SINT10 104 68 13 McBSP #1 receive interrupt (default) XINT1, SINT11 108 6C 14 McBSP #1 transmit interrupt (default) DMAC4,SINT12 112 70 15 DMA channel 4 (default) 116 74 16 DMA channel 5 (default) 120−127 78−7F — Reserved DMAC5,SINT13 Reserved The bit layout of the interrupt flag register (IFR) and the interrupt mask register (IMR) is shown in Figure 3−22. 15−14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Resvd DMAC5 DMAC4 XINT1 RINT1 HINT INT3 XINT2 RINT2 XINT0 RINT0 TINT INT2 INT1 INT0 Figure 3−22. IFR and IMR July 2003 SGUS048 41 Documentation Support 4 Documentation Support Extensive documentation supports all TMS320 DSP family of devices from product announcement through applications development. The following types of documentation are available to support the design and use of the C5000 platform of DSPs: • • • • • TMS320C54x DSP Functional Overview (literature number SPRU307) Device-specific data sheets Complete user’s guides Development support tools Hardware and software application reports The five-volume TMS320C54x DSP Reference Set (literature number SPRU210) consists of: • • • • • Volume 1: CPU and Peripherals (literature number SPRU131) Volume 2: Mnemonic Instruction Set (literature number SPRU172) Volume 3: Algebraic Instruction Set (literature number SPRU179) Volume 4: Applications Guide (literature number SPRU173) Volume 5: Enhanced Peripherals (literature number SPRU302) The reference set describes in detail the TMS320C54x DSP products currently available and the hardware and software applications, including algorithms, for fixed-point TMS320 DSP family of devices. A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal processing research and education. The TMS320 DSP newsletter, Details on Signal Processing, is published quarterly and distributed to update TMS320 DSP customers on product information. Information regarding TI DSP products is also available on the Worldwide Web at http://www.ti.com uniform resource locator (URL). TMS320 and C5000 are trademarks of Texas Instruments. 42 SGUS048 July 2003 Documentation Support 4.1 Device and Development Tool Support Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all 320 DSP devices and support tools. Each SMJ320 DSP member has one of three prefixes: SMX, SM or SMJ. Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (SMX) through fully qualified production devices/tools (SM/SMJ). Device development evolutionary flow: SMX Experimental device that is not necessarily representative of the final device’s electrical specifications TMP Final silicon die that conforms to the device’s electrical specifications but has not completed quality and reliability verification SM/SMJ Fully-qualified production device Support tool development evolutionary flow: TMDX Development support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully qualified development support product SMX and TMP devices and TMDX development−support tools are shipped with appropriate disclaimers describing their limitations and intended uses. Experimental devices (SMX) may not be representative of a final product and Texas Instruments reserves the right to change or discontinue these products without notice. SM/SMJ devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI’s standard warranty applies. Predictions show that prototype devices (SMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. July 2003 SGUS048 43 Electrical Specifications 5 Electrical Specifications This section provides the absolute maximum ratings and the recommended operating conditions for the SM320VC5416-EP DSP. Absolute Maximum Ratings Over Specified Temperature Range†‡ 5.1 Supply voltage I/O range, DVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4.0 V Supply voltage core range, CVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 2.0 V Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4.5 V Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4.5 V Operating case temperature range, TC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 100°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ‡ Long term high−temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See www.ti.com/ep_quality for additional information on enhanced plastic packaging. § All voltage values are with respect to DVSS. 5.2 Recommended Operating Conditions MIN NOM MAX UNIT DVDD Device supply voltage, I/O 2.7 3.3 3.6 V CVDD Device supply voltage, core (VC5416-160) 1.55 1.6 1.65 V CVDD Device supply voltage, core (VC5416-120) 1.42 1.5 1.65 V DVSS, CVSS Supply voltage, GND VIH High-level input voltage, I/O 0 RS, INTn, NMI, X2/CLKIN, CLKMDn, BCLKRn, BCLKXn, HCS, HDS1, HDS2, HAS, TRST, BIO, Dn, An, HDn, TCK DVDD = 2.7 V to 3.6 V All other inputs VIL IOH Low-level input voltage High-level output current† Low-level output current† 2.4 2 −0.3 IOL TC Operating case temperature −40 † Note that maximum output currents are DC values only. Transient currents may exceed these values. 44 SGUS048 V DVDD + 0.3 V DVDD + 0.3 0.8 V −8 mA 8 mA 100 °C July 2003 Electrical Specifications 5.3 Electrical Characteristics Over Recommended Operating Case Temperature Range (Unless Otherwise Noted) PARAMETER VOH High-level output voltage‡ VOL Low-level output voltage‡ TEST CONDITIONS MIN DVDD = 2.7 V to 3 V, IOH = MAX 2.2 DVDD = 3 V to 3.6 V, IOH = MAX 2.4 Input current (VI = DVSS to DVDD) MAX 0.4 V −40 40 µA TRST, HPI16 With internal pulldown −10 800 HPIENA With internal pulldown, RS = 0 −10 400 TMS, TCK, TDI, HPI§ With internal pullups −400 10 A[17:0], D[15:0], HD[7:0] Bus holders enabled, DVDD = MAXk −275 275 All other input-only pins UNIT V IOL = MAX X2/CLKIN II TYP† −5 µA 5 IDDC Supply current, core CPU CVDD = 1.6 V, fx = 160 ,¶ TC = 25°C 60# mA IDDP Supply current, pins DVDD = 3.0 V, fx = 160 MHz,¶ TC = 25°C 40|| mA Supply current, standby IDD IDLE2 PLL × 1 mode, IDLE3 Divide-by-two mode, CLKIN stopped TC = 25°C 1 TC = 100°C 30 20 MHz input 2 mA Ci Input capacitance 5 pF Co Output capacitance 5 pF † All values are typical unless otherwise specified. ‡ All input and output voltage levels except RS, INT0 −INT3, NMI, X2/CLKIN, CLKMD1 −CLKMD3, BCLKRn, BCLKXn, HCS, HAS, HDS1, HDS2, BIO, TCK, TRST, Dn, An, HDn are LVTTL-compatible. § HPI input signals except for HPIENA and HPI16, when HPIENA = 0. ¶ Clock mode: PLL × 1 with external source # This value was obtained with 50% usage of MAC and 50% usage of NOP instructions. Actual operating current varies with program being executed. || This value was obtained with single-cycle external writes, CLKOFF = 0 and load = 15 pF. For more details on how this calculation is performed, refer to the Calculation of TMS320LC54x Power Dissipation application report (literature number SPRA164). k VIL(MIN) ≤ VI ≤ VIL(MAX) or VIH(MIN) ≤ VI ≤ VIH(MAX) IOL Tester Pin Electronics 50 Ω VLoad CT Output Under Test IOH Where: IOL IOH VLoad CT = = = = 1.5 mA (all outputs) 300 µA (all outputs) 1.5 V 20-pF typical load circuit capacitance Figure 5−1. 3.3-V Test Load Circuit July 2003 SGUS048 45 Electrical Specifications 5.4 Package Thermal Resistance Characteristics Table 5−1 provides the estimated thermal resistance characteristics for the recommended package types used on the SM320VC5416 DSP. Table 5−1. Thermal Resistance Characteristics 5.5 PARAMETER GGU PACKAGE PGE PACKAGE UNIT RΘJA 38 56 °C / W RΘJC 5 5 °C / W Timing Parameter Symbology Timing parameter symbols used in the timing requirements and switching characteristics tables are created in accordance with JEDEC Standard 100. To shorten the symbols, some of the pin names and other related terminology have been abbreviated as follows: 5.6 Lowercase subscripts and their meanings: Letters and symbols and their meanings: a access time H High c cycle time (period) L Low d delay time V Valid dis disable time Z High impedance en enable time f fall time h hold time r rise time su setup time t transition time v valid time w pulse duration (width) X Unknown, changing, or don’t care level Internal Oscillator With External Crystal The internal oscillator is enabled by selecting the appropriate clock mode at reset (this is device-dependent; see Section 3.10) and connecting a crystal or ceramic resonator across X1 and X2/CLKIN. The CPU clock frequency is one-half, one-fourth, or a multiple of the oscillator frequency. The multiply ratio is determined by the bit settings in the CLKMD register. The crystal should be in fundamental-mode operation, and parallel resonant, with an effective series resistance of 30 Ω maximum and power dissipation of 1 mW. The connection of the required circuit, consisting of the crystal and two load capacitors, is shown in Figure 5−2. The load capacitors, C1 and C2, should be chosen such that the equation below is satisfied. CL (recommended value of 10 pF) in the equation is the load specified for the crystal. CL + C 1C 2 (C 1 ) C 2) Table 5−2. Input Clock Frequency Characteristics fx Input clock frequency † This device utilizes a fully static design and therefore can operate with tc(CI) approaching ∞. ‡ It is recommended that the PLL multiply by N clocking option be used for maximum frequency operation. 46 SGUS048 MIN 10† MAX 20‡ UNIT MHz July 2003 Electrical Specifications X1 X2/CLKIN Crystal C1 C2 Figure 5−2. Internal Divide-by-Two Clock Option With External Crystal 5.7 Clock Options The frequency of the reference clock provided at the CLKIN pin can be divided by a factor of two or four or multiplied by one of several values to generate the internal machine cycle. 5.7.1 Divide-By-Two and Divide-By-Four Clock Options The frequency of the reference clock provided at the X2/CLKIN pin can be divided by a factor of two or four to generate the internal machine cycle. The selection of the clock mode is described in Section 3.10. When an external clock source is used, the frequency injected must conform to specifications listed in Table 5−4. An external frequency source can be used by applying an input clock to X2/CLKIN with X1 left unconnected. Table 5−3 shows the configuration options for the CLKMD pins that generate the external divide-by-2 or divide-by-4 clock option. Table 5−3. Clock Mode Pin Settings for the Divide-By-2 and By Divide-by-4 Clock Options CLKMD1 CLKMD2 CLKMD3 0 0 0 1/2, PLL disabled 1 0 1 1/4, PLL disabled 1 1 1 1/2, PLL disabled July 2003 CLOCK MODE SGUS048 47 Electrical Specifications Table 5−4 and Table 5−5 assume testing over recommended operating conditions and H = 0.5tc(CO) (see Figure 5−3). Table 5−4. Divide-By-2 and Divide-by-4 Clock Options Timing Requirements 5416-160 MIN MAX 20 UNIT tc(CI) tf(CI) Cycle time, X2/CLKIN Fall time, X2/CLKIN 4 ns ns tr(CI) tw(CIL) Rise time, X2/CLKIN 4 ns Pulse duration, X2/CLKIN low 4 ns tw(CIH) Pulse duration, X2/CLKIN high 4 ns Table 5−5. Divide-By-2 and Divide-by-4 Clock Options Switching Characteristics 5416-160 PARAMETER MIN 6.25† TYP MAX ‡ 4 7 11 tc(CO) td(CIH-CO) Cycle time, CLKOUT tf(CO) tr(CO) Fall time, CLKOUT 1 Rise time, CLKOUT 1 Delay time, X2/CLKIN high to CLKOUT high/low tw(COL) Pulse duration, CLKOUT low tw(COH) Pulse duration, CLKOUT high † It is recommended that the PLL clocking option be used for maximum frequency operation. ‡ This device utilizes a fully static design and therefore can operate with tc(CI) approaching ∞. ns ns ns H H+1 ns H−2 H H+1 ns tw(CIL) tc(CI) ns H −2 tr(CI) tw(CIH) UNIT tf(CI) X2/CLKIN tc(CO) td(CIH-CO) tw(COH) tf(CO) tr(CO) tw(COL) CLKOUT NOTE A: The CLKOUT timing in this diagram assumes the CLKOUT divide factor (DIVFCT field in the BSCR) is configured as 00 (CLKOUT not divided). DIVFCT is configured as CLKOUT divided-by-4 mode following reset. Figure 5−3. External Divide-by-Two Clock Timing 48 SGUS048 July 2003 Electrical Specifications 5.7.2 Multiply-By-N Clock Option (PLL Enabled) The frequency of the reference clock provided at the X2/CLKIN pin can be multiplied by a factor of N to generate the internal machine cycle. The selection of the clock mode and the value of N is described in Section 3.10. Following reset, the software PLL can be programmed for the desired multiplication factor. Refer to the TMS320C54x DSP Reference Set, Volume 1: CPU and Peripherals (literature number SPRU131) for detailed information on programming the PLL. When an external clock source is used, the external frequency injected must conform to specifications listed in Table 5−6. Table 5−6 and Table 5−7 assume testing over recommended operating conditions and H = 0.5tc(CO) (see Figure 5−4). Table 5−6. Multiply-By-N Clock Option Timing Requirements 5416-160 tc(CI) Cycle time, X2/CLKIN MIN MAX Integer PLL multiplier N (N = 1−15)† PLL multiplier N = x.5† 20 200 20 100 PLL multiplier N = x.25, x.75† 20 50 UNIT ns tf(CI) tr(CI) Fall time, X2/CLKIN tw(CIL) tw(CIH) Pulse duration, X2/CLKIN low 4 ns Pulse duration, X2/CLKIN high 4 ns Rise time, X2/CLKIN 4 ns 4 ns † N is the multiplication factor. Table 5−7. Multiply-By-N Clock Option Switching Characteristics 5416-160 PARAMETER MIN TYP MAX 7 11 6.25 UNIT tc(CO) td(CI-CO) Cycle time, CLKOUT tf(CO) tr(CO) Fall time, CLKOUT tw(COL) tw(COH) Pulse duration, CLKOUT low H−2 H H+1 ns Pulse duration, CLKOUT high H−2 H H+1 ns tp Transitory phase, PLL lock-up time 30 ms Delay time, X2/CLKIN high/low to CLKOUT high/low ns 4 2 Rise time, CLKOUT ns 2 tw(CIH) tc(CI) tw(CIL) tr(CI) ns ns tf(CI) X2/CLKIN td(CI-CO) tc(CO) tw(COH) tp CLKOUT tf(CO) tw(COL) tr(CO) Unstable NOTE A: The CLKOUT timing in this diagram assumes the CLKOUT divide factor (DIVFCT field in the BSCR) is configured as 00 (CLKOUT not divided). DIVFCT is configured as CLKOUT divided-by-4 mode following reset. Figure 5−4. Multiply-by-One Clock Timing July 2003 SGUS048 49 Electrical Specifications 5.8 Memory and Parallel I/O Interface Timing 5.8.1 Memory Read External memory reads can be performed in consecutive or nonconsecutive mode under control of the CONSEC bit in the BSCR. Table 5−8 and Table 5−9 assume testing over recommended operating conditions with MSTRB = 0 and H = 0.5tc(CO) (see Figure 5−5 and Figure 5−6). Table 5−8. Memory Read Timing Requirements 5416-160 MIN Access time, read data access from address valid, first read access† ta(A)M1 ta(A)M2 Access time, read data access from address valid, consecutive read accesses† tsu(D)R Setup time, read data valid before CLKOUT low th(D)R Hold time, read data valid after CLKOUT low † Address, R/W, PS, DS, and IS timings are all included in timings referenced as address. MAX UNIT 4H−9 ns 2H−9 ns 7 ns 0 ns Table 5−9. Memory Read Switching Characteristics 5416-160 PARAMETER td(CLKL-A) td(CLKL-MSL) UNIT MIN MAX Delay time, CLKOUT low to address valid† −1 4 ns Delay time, CLKOUT low to MSTRB low −1 4 ns 0 4 ns td(CLKL-MSH) Delay time, CLKOUT low to MSTRB high † Address, R/W, PS, DS, and IS timings are all included in timings referenced as address. CLKOUT td(CLKL-A) A[22:0]† td(CLKL-MSL) td(CLKL-MSH) ta(A)M1 D[15:0] tsu(D)R th(D)R MSTRB R/W† PS/DS† † Address, R/W, PS, DS, and IS timings are all included in timings referenced as address. Figure 5−5. Nonconsecutive Mode Memory Reads 50 SGUS048 July 2003 Electrical Specifications CLKOUT td(CLKL-A) td(CLKL-MSL) td(CLKL-A) td(CLKL-A) A[22:0]† td(CLKL-MSH) ta(A)M1 ta(A)M2 D[15:0] tsu(D)R tsu(D)R th(D)R th(D)R MSTRB R/W† PS/DS† † Address, R/W, PS, DS, and IS timings are all included in timings referenced as address. Figure 5−6. Consecutive Mode Memory Reads July 2003 SGUS048 51 Electrical Specifications 5.8.2 Memory Write Table 5−10 assumes testing over recommended operating conditions with MSTRB = 0 and H = 0.5tc(CO) (see Figure 5−7). Table 5−10. Memory Write Switching Characteristics 5416-160 PARAMETER td(CLKL-A) tsu(A)MSL Delay time, CLKOUT low to address valid† td(CLKL-D)W tsu(D)MSH Delay time, CLKOUT low to data valid Setup time, address valid before MSTRB low† MIN MAX −1 4 2H − 3 UNIT ns ns −1 4 ns Setup time, data valid before MSTRB high 2H − 5 2H + 6 ns th(D)MSH td(CLKL-MSL) Hold time, data valid after MSTRB high 2H − 5 2H + 6 ns −1 4 ns tw(SL)MS td(CLKL-MSH) Pulse duration, MSTRB low Delay time, CLKOUT low to MSTRB low 2H − 3.2 Delay time, CLKOUT low to MSTRB high 0 ns 4 ns † Address, R/W, PS, DS, and IS timings are all included in timings referenced as address. CLKOUT td(CLKL-A) td(CLKL-A) td(CLKL-D)W tsu(A)MSL A[22:0]† tsu(D)MSH th(D)MSH D[15:0] td(CLKL-MSL) td(CLKL-MSH) tw(SL)MS MSTRB R/W† PS/DS† † Address, R/W, PS, DS, and IS timings are all included in timings referenced as address. Figure 5−7. Memory Write (MSTRB = 0) 52 SGUS048 July 2003 Electrical Specifications 5.8.3 I/O Read Table 5−11 and Table 5−12 assume testing over recommended operating conditions, IOSTRB = 0, and H = 0.5tc(CO) (see Figure 5−8). Table 5−11. I/O Read Timing Requirements 5416-160 MIN Access time, read data access from address valid, first read access† ta(A)M1 tsu(D)R MAX 4H − 9 Setup time, read data valid before CLKOUT low th(D)R Hold time, read data valid after CLKOUT low † Address, R/W, PS, DS, and IS timings are included in timings referenced as address. UNIT ns 7 ns 0 ns Table 5−12. I/O Read Switching Characteristics 5416-160 PARAMETER td(CLKL-A) td(CLKL-IOSL) MIN MAX UNIT Delay time, CLKOUT low to address valid† −1 4 ns Delay time, CLKOUT low to IOSTRB low −1 4 ns 0 4 ns td(CLKL-IOSH) Delay time, CLKOUT low to IOSTRB high † Address, R/W, PS, DS, and IS timings are included in timings referenced as address. CLKOUT td(CLKL-A) td(CLKL-A) td(CLKL-IOSL) td(CLKL-IOSH) A[22:0]† ta(A)M1 tsu(D)R th(D)R D[15:0] IOSTRB R/W† IS† † Address, R/W, PS, DS, and IS timings are all included in timings referenced as address. Figure 5−8. Parallel I/O Port Read (IOSTRB = 0) July 2003 SGUS048 53 Electrical Specifications 5.8.4 I/O Write Table 5−13 assumes testing over recommended operating conditions, IOSTRB = 0, and H = 0.5tc(CO) (see Figure 5−9). Table 5−13. I/O Write Switching Characteristics 5416-160 PARAMETER td(CLKL-A) tsu(A)IOSL Delay time, CLKOUT low to address valid† td(CLKL-D)W tsu(D)IOSH Delay time, CLKOUT low to write data valid MIN MAX −1 Setup time, address valid before IOSTRB low† 4 2H − 3 UNIT ns ns −1 4 ns Setup time, data valid before IOSTRB high 2H − 5 2H + 6 ns th(D)IOSH td(CLKL-IOSL) Hold time, data valid after IOSTRB high 2H − 5 2H + 6 ns −1 4 ns tw(SL)IOS Pulse duration, IOSTRB low Delay time, CLKOUT low to IOSTRB low 2H − 2 td(CLKL-IOSH) Delay time, CLKOUT low to IOSTRB high † Address, R/W, PS, DS, and IS timings are included in timings referenced as address. 0 ns 4 ns CLKOUT td(CLKL-A) td(CLKL-A) A[22:0]† td(CLKL-D)W td(CLKL-D)W tsu(A)IOSL D[15:0] tsu(D)IOSH td(CLKL-IOSL) td(CLKL-IOSH) th(D)IOSH IOSTRB R/W† tw(SL)IOS IS† † Address, R/W, PS, DS, and IS timings are all included in timings referenced as address. Figure 5−9. Parallel I/O Port Write (IOSTRB = 0) 54 SGUS048 July 2003 Electrical Specifications 5.9 Ready Timing for Externally Generated Wait States Table 5−14 and Table 5−15 assume testing over recommended operating conditions and H = 0.5tc(CO) (see Figure 5−10, Figure 5−11, Figure 5−12, and Figure 5−13). Table 5−14. Ready Timing Requirements for Externally Generated Wait States† 5416-160 MIN tsu(RDY) th(RDY) tv(RDY)MSTRB th(RDY)MSTRB Setup time, READY before CLKOUT low 7 Hold time, READY after CLKOUT low Valid time, READY after MSTRB low‡ 0 Hold time, READY after MSTRB low‡ Valid time, READY after IOSTRB low‡ 4H MAX UNIT ns ns 4H − 6.2 ns ns tv(RDY)IOSTRB 4H − 6 ns th(RDY)IOSTRB Hold time, READY after IOSTRB low‡ 4H ns † The hardware wait states can be used only in conjunction with the software wait states to extend the bus cycles. To generate wait states by READY, at least two software wait states must be programmed. READY is not sampled until the completion of the internal software wait states. ‡ These timings are included for reference only. The critical timings for READY are those referenced to CLKOUT. Table 5−15. Ready Switching Characteristics for Externally Generated Wait States† 5416-160 PARAMETER MIN MAX UNIT td(MSCL) Delay time, CLKOUT low to MSC low 0 4 ns td(MSCH) Delay time, CLKOUT low to MSC high 0 4 ns † The hardware wait states can be used only in conjunction with the software wait states to extend the bus cycles. To generate wait states by READY, at least two software wait states must be programmed. READY is not sampled until the completion of the internal software wait states. July 2003 SGUS048 55 Electrical Specifications CLKOUT A[22:0] D[15:0] tsu(RDY) th(RDY) READY tv(RDY)MSTRB th(RDY)MSTRB MSTRB td(MSCL) td(MSCH) MSC Leading Cycle Wait States Generated Internally Wait States Generated by READY Trailing Cycle Figure 5−10. Memory Read With Externally Generated Wait States 56 SGUS048 July 2003 Electrical Specifications CLKOUT A[22:0] D[15:0] tsu(RDY) th(RDY) READY tv(RDY)MSTRB th(RDY)MSTRB MSTRB td(MSCL) td(MSCH) MSC Leading Cycle Wait States Generated Internally Wait States Generated by READY Trailing Cycle Figure 5−11. Memory Write With Externally Generated Wait States July 2003 SGUS048 57 Electrical Specifications CLKOUT A[22:0] D[15:0] tsu(RDY) th(RDY) READY tv(RDY)IOSTRB th(RDY)IOSTRB IOSTRB td(MSCL) td(MSCH) MSC Leading Cycle Wait States Generated Internally Wait States Generated by READY Trailing Cycle Figure 5−12. I/O Read With Externally Generated Wait States 58 SGUS048 July 2003 Electrical Specifications CLKOUT A[22:0] D[15:0] tsu(RDY) th(RDY) READY tv(RDY)IOSTRB th(RDY)IOSTRB IOSTRB td(MSCL) td(MSCH) MSC Leading Cycle Wait States Generated Internally Wait States Generated by READY Trailing Cycle Figure 5−13. I/O Write With Externally Generated Wait States July 2003 SGUS048 59 Electrical Specifications 5.10 HOLD and HOLDA Timings Table 5−16 and Table 5−17 assume testing over recommended operating conditions and H = 0.5tc(CO) (see Figure 5−14). Table 5−16. HOLD and HOLDA Timing Requirements 5416-160 MIN MAX UNIT tw(HOLD) Pulse duration, HOLD low duration 4H+8 ns tsu(HOLD) Setup time, HOLD before CLKOUT low† 7 ns † This input can be driven from an asynchronous source, therefore, there are no specific timing requirements with respect to CLKOUT, however, if this timing is met, the input will be recognized on the CLKOUT edge referenced. Table 5−17. HOLD and HOLDA Switching Characteristics 5416-160 PARAMETER MIN MAX UNIT tdis(CLKL-A) tdis(CLKL-RW) Disable time, Address, PS, DS, IS high impedance from CLKOUT low 3 ns Disable time, R/W high impedance from CLKOUT low 3 ns tdis(CLKL-S) ten(CLKL-A) Disable time, MSTRB, IOSTRB high impedance from CLKOUT low ten(CLKL-RW) ten(CLKL-S) Enable time, R/W enabled from CLKOUT low Enable time, Address, PS, DS, IS valid from CLKOUT low Enable time, MSTRB, IOSTRB enabled from CLKOUT low Valid time, HOLDA low after CLKOUT low tv(HOLDA) tw(HOLDA) 60 SGUS048 Valid time, HOLDA high after CLKOUT low Pulse duration, HOLDA low duration 3 ns 2H+3 ns 2H+3 ns 2 2H+3 ns −1 4 ns −1 4 ns 2H−3 ns July 2003 Electrical Specifications CLKOUT tsu(HOLD) tw(HOLD) tsu(HOLD) HOLD tv(HOLDA) HOLDA tv(HOLDA) tw(HOLDA) tdis(CLKL−A) ten(CLKL−A) tdis(CLKL−RW) ten(CLKL−RW) tdis(CLKL−S) ten(CLKL−S) tdis(CLKL−S) ten(CLKL−S) A[22:0] PS, DS, IS D[15:0] R/W MSTRB IOSTRB Figure 5−14. HOLD and HOLDA Timings (HM = 1) July 2003 SGUS048 61 Electrical Specifications 5.11 Reset, BIO, Interrupt, and MP/MC Timings Table 5−18 assumes testing over recommended operating conditions and H = 0.5tc(CO) (see Figure 5−15, Figure 5−16, and Figure 5−17). Table 5−18. Reset, BIO, Interrupt, and MP/MC Timing Requirements 5416-160 MIN MAX UNIT th(RS) th(BIO) Hold time, RS after CLKOUT low# Hold time, BIO after CLKOUT low# 2 ns 4 ns th(INT) th(MPMC) Hold time, INTn, NMI, after CLKOUT low†# Hold time, MP/MC after CLKOUT low# 0 ns 4 ns tw(RSL) tw(BIO)S Pulse duration, RS low‡§ 4H+3 ns Pulse duration, BIO low, synchronous 2H+3 ns tw(BIO)A tw(INTH)S Pulse duration, BIO low, asynchronous tw(INTH)A tw(INTL)S Pulse duration, INTn, NMI high (asynchronous) Pulse duration, INTn, NMI low (synchronous) tw(INTL)A tw(INTL)WKP Pulse duration, INTn, NMI low (asynchronous) 4H ns Pulse duration, INTn, NMI low for IDLE2/IDLE3 wakeup Setup time, RS before X2/CLKIN low¶# 7 ns 3 ns Setup time, BIO before CLKOUT low# 7 ns Pulse duration, INTn, NMI high (synchronous) tsu(RS) tsu(BIO) 4H ns 2H+2 ns 4H ns 2H+2 ns Setup time, INTn, NMI, RS before CLKOUT low# Setup time, MP/MC before CLKOUT low# tsu(INT) 7 ns tsu(MPMC) 5 ns † The external interrupts (INT0 −INT3, NMI) are synchronized to the core CPU by way of a two-flip-flop synchronizer that samples these inputs with consecutive falling edges of CLKOUT. The input to the interrupt pins is required to represent a 1−0−0 sequence at the timing that is corresponding to three CLKOUTs sampling sequence. ‡ If the PLL mode is selected, then at power-on sequence, or at wakeup from IDLE3, RS must be held low for at least 50 µs to ensure synchronization and lock-in of the PLL. § Note that RS may cause a change in clock frequency, therefore changing the value of H. ¶ The diagram assumes clock mode is divide-by-2 and the CLKOUT divide factor is set to no-divide mode (DIVFCT=00 field in the BSCR). # These inputs can be driven from an asynchronous source, therefore, there are no specific timing requirements with respect to CLKOUT, however, if setup and hold timings are met, the input will be recognized on the CLKOUT edge referenced. X2/CLKIN tsu(RS) tw(RSL) RS, INTn, NMI tsu(INT) th(RS) CLKOUT tsu(BIO) th(BIO) BIO tw(BIO)S Figure 5−15. Reset and BIO Timings 62 SGUS048 July 2003 Electrical Specifications CLKOUT tsu(INT) tsu(INT) th(INT) INTn, NMI tw(INTH)A tw(INTL)A Figure 5−16. Interrupt Timing CLKOUT RS th(MPMC) tsu(MPMC) MP/MC Figure 5−17. MP/MC Timing July 2003 SGUS048 63 Electrical Specifications 5.12 Instruction Acquisition (IAQ) and Interrupt Acknowledge (IACK) Timings Table 5−19 assumes testing over recommended operating conditions and H = 0.5tc(CO) (see Figure 5−18). Table 5−19. Instruction Acquisition (IAQ) and Interrupt Acknowledge (IACK) Switching Characteristics 5416-160 PARAMETER MIN MAX UNIT td(CLKL-IAQL) td(CLKL-IAQH) Delay time, CLKOUT low to IAQ low −1 4 ns td(CLKL-IACKL) td(CLKL-IACKH) Delay time, CLKOUT low to IAQ high −1 4 ns Delay time, CLKOUT low to IACK low −1.2 4 ns −1 4 ns td(CLKL-A) tw(IAQL) Delay time, CLKOUT low to address valid Pulse duration, IAQ low 2H − 2 −1 4 ns ns tw(IACKL) Pulse duration, IACK low 2H − 3 ns Delay time, CLKOUT low to IACK high CLKOUT td(CLKL−A) td(CLKL−A) A[22:0] td(CLKL −IAQH) td(CLKL −IAQL) IAQ tw(IAQL) td(CLKL −IACKL) IACK td(CLKL −IACKH) tw(IACKL) Figure 5−18. Instruction Acquisition (IAQ) and Interrupt Acknowledge (IACK) Timings 64 SGUS048 July 2003 Electrical Specifications 5.13 External Flag (XF) and TOUT Timings Table 5−20 assumes testing over recommended operating conditions and H = 0.5tc(CO) (see Figure 5−19 and Figure 5−20). Table 5−20. External Flag (XF) and TOUT Switching Characteristics 5416-160 PARAMETER MIN MAX UNIT Delay time, CLKOUT low to XF high −1 4 Delay time, CLKOUT low to XF low −1 4 td(TOUTH) td(TOUTL) Delay time, CLKOUT low to TOUT high −1 4 ns Delay time, CLKOUT low to TOUT low −1 4 ns tw(TOUT) Pulse duration, TOUT td(XF) 2H − 4 ns ns CLKOUT td(XF) XF Figure 5−19. External Flag (XF) Timing CLKOUT td(TOUTH) td(TOUTL) TOUT tw(TOUT) Figure 5−20. TOUT Timing July 2003 SGUS048 65 Electrical Specifications 5.14 Multichannel Buffered Serial Port (McBSP) Timing 5.14.1 McBSP Transmit and Receive Timings Table 5−21 and Table 5−22 assume testing over recommended operating conditions (see Figure 5−21 and Figure 5−22). Table 5−21. McBSP Transmit and Receive Timing Requirements† 5416-160 tc(BCKRX) tw(BCKRX) Cycle time, BCLKR/X‡ BCLKR/X ext MIN 4P§ Pulse duration, BCLKR/X high or BCLKR/X low‡ BCLKR/X ext 2P−1§ tsu(BFRH-BCKRL) Setup time, external BFSR high before BCLKR low th(BCKRL-BFRH) Hold time, external BFSR high after BCLKR low tsu(BDRV-BCKRL) Setup time, BDR valid before BCLKR low th(BCKRL-BDRV) Hold time, BDR valid after BCLKR low tsu(BFXH-BCKXL) Setup time, external BFSX high before BCLKX low th(BCKXL-BFXH) Hold time, external BFSX high after BCLKX low BCLKR int 8 BCLKR ext 1 BCLKR int 1 BCLKR ext 2 BCLKR int 7 BCLKR ext 1 BCLKR int 2 BCLKR ext 3 BCLKX int 8 BCLKX ext 1 BCLKX int 0 BCLKX ext 2 MAX UNIT ns ns ns ns ns ns ns ns tr(BCKRX) Rise time, BCKR/X BCLKR/X ext 6 ns tf(BCKRX) Fall time, BCKR/X BCLKR/X ext 6 ns † CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are also inverted. ‡ Note that in some cases, for example when driving another 54x device McBSP, maximum serial port clocking rates may not be achievable at maximum CPU clock frequency due to transmitted data timings and corresponding receive timing requirements. A separate detailed timing analysis should be performed for each specific McBSP interface. § P = 1 / (2 * processor clock) 66 SGUS048 July 2003 Electrical Specifications Table 5−22. McBSP Transmit and Receive Switching Characteristics† 5416-160 PARAMETER MIN MAX UNIT tc(BCKRX) Cycle time, BCLKR/X# BCLKR/X int 4P‡ tw(BCKRXH) Pulse duration, BCLKR/X high# BCLKR/X int D − 1§ D + 1§ ns tw(BCKRXL) Pulse duration, BCLKR/X low# BCLKR/X int C − 1§ C + 1§ ns td(BCKRH-BFRV) Delay time, BCLKR high to internal BFSR valid td(BCKXH-BFXV) Delay time, BCLKX high to internal BFSX valid Disable time, BCLKX high to BDX high impedance following last data tdis(BCKXH-BDXHZ) bit of transfer DXENA = 0 td(BCKXH-BDXV) Delay time, BCLKX high to BDX valid td(BFXH-BDXV) BCLKR int −3 3 ns BCLKR ext 0 11 ns BCLKX int −1 5 BCLKX ext 3 11 BCLKX int 6 BCLKX ext 10 BCLKX int − 1¶ 10 BCLKX ext 3 − 1¶ 20 2.8 −1.2¶ 30 BFSX int BFSX ext 3 11 BCLKX int DXENA = 1 Delay time, BFSX high to BDX valid ONLY applies when in data delay 0 (XDATDLY = 00b) mode ns BCLKX ext 20 ns ns ns 7 ns † CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are also inverted. ‡ P = 1 / (2 * processor clock) § T = BCLKRX period = (1 + CLKGDV) * 2P C = BCLKRX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2P when CLKGDV is even D = BCLKRX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2P when CLKGDV is even ¶ Minimum delay times also represent minimum output hold times. # Note that in some cases, for example when driving another 54x device McBSP, maximum serial port clocking rates may not be achievable at maximum CPU clock frequency due to transmitted data timings and corresponding receive timing requirements. A separate detailed timing analysis should be performed for each specific McBSP interface. tc(BCKRX) tw(BCKRXH) tw(BCKRXL) tr(BCKRX) tf(BCKRX) BCLKR td(BCKRH-BFRV) td(BCKRH-BFRV) BFSR (int) tsu(BFRH-BCKRL) th(BCKRL-BFRH) BFSR (ext) tsu(BDRV-BCKRL) BDR th(BCKRL-BDRV) Bit(n-1) (n-2) (n-3) Figure 5−21. McBSP Receive Timings July 2003 SGUS048 67 Electrical Specifications tc(BCKRX) tw(BCKRXH) tw(BCKRXL) tr(BCKRX) tf(BCKRX) BCLKX td(BCKXH-BFXV) BFSX (int) th(BCKXL-BFXH) tsu(BFXH-BCKXL) BFSX (ext) BFSX (XDATDLY=00b) td(BCKXH-BDXV) td(BFXH-BDXV) tdis(BCKXH-BDXHZ) BDX Bit 0 td(BCKXH-BDXV) Bit(n-1) (n-2) (n-3) Figure 5−22. McBSP Transmit Timings 68 SGUS048 July 2003 Electrical Specifications 5.14.2 McBSP General-Purpose I/O Timing Table 5−23 and Table 5−24 assume testing over recommended operating conditions (see Figure 5−23). Table 5−23. McBSP General-Purpose I/O Timing Requirements 5416-160 MIN tsu(BGPIO-COH) Setup time, BGPIOx input mode before CLKOUT high† th(COH-BGPIO) Hold time, BGPIOx input mode after CLKOUT high† † BGPIOx refers to BCLKRx, BFSRx, BDRx, BCLKXx, or BFSXx when configured as a general-purpose input. MAX UNIT 7 ns 0 ns Table 5−24. McBSP General-Purpose I/O Switching Characteristics 5416-160 PARAMETER td(COH-BGPIO) Delay time, CLKOUT high to BGPIOx output mode‡ ‡ BGPIOx refers to BCLKRx, BFSRx, BCLKXx, BFSXx, or BDXx when configured as a general-purpose output. tsu(BGPIO-COH) MIN MAX −2 4 UNIT ns td(COH-BGPIO) CLKOUT th(COH-BGPIO) BGPIOx Input Mode† BGPIOx Output Mode‡ † BGPIOx refers to BCLKRx, BFSRx, BDRx, BCLKXx, or BFSXx when configured as a general-purpose input. ‡ BGPIOx refers to BCLKRx, BFSRx, BCLKXx, BFSXx, or BDXx when configured as a general-purpose output. Figure 5−23. McBSP General-Purpose I/O Timings July 2003 SGUS048 69 Electrical Specifications 5.14.3 McBSP as SPI Master or Slave Timing Table 5−25 to Table 5−32 assume testing over recommended operating conditions (see Figure 5−24, Figure 5−25, Figure 5−26, and Figure 5−27). Table 5−25. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)† 5416-160 MASTER MIN tsu(BDRV-BCKXL) th(BCKXL-BDRV) Setup time, BDR valid before BCLKX low Hold time, BDR valid after BCLKX low SLAVE MAX 12 MIN 2.2 − 6P‡ 4 5 + 12P‡ UNIT MAX ns ns † For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. ‡ P = 1 / (2 * processor clock) Table 5−26. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)† 5416-160 MASTER§ PARAMETER Hold time, BFSX low after BCLKX low¶ Delay time, BFSX low to BCLKX high# th(BCKXL-BFXL) td(BFXL-BCKXH) td(BCKXH-BDXV) Delay time, BCLKX high to BDX valid tdis(BCKXL-BDXHZ) Disable time, BDX high impedance following last data bit from BCLKX low tdis(BFXH-BDXHZ) Disable time, BDX high impedance following last data bit from BFSX high SLAVE MIN MAX T−3 T+4 C−4 C+3 MAX ns ns 5 6P + 2‡ −4 C−2 MIN UNIT 10P + 17‡ C+3 ns ns 2P− 4‡ 6P + 17‡ ns td(BFXL-BDXV) Delay time, BFSX low to BDX valid 4P+ 2‡ 8P + 17‡ ns † For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. ‡ P = 1 / (2 * processor clock) § T = BCLKX period = (1 + CLKGDV) * 2P C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2P when CLKGDV is even ¶ FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX). MSB LSB BCLKX th(BCKXL-BFXL) td(BFXL-BCKXH) BFSX tdis(BFXH-BDXHZ) tdis(BCKXL-BDXHZ) BDX Bit 0 td(BFXL-BDXV) td(BCKXH-BDXV) Bit(n-1) tsu(BDRV-BCLXL) BDR Bit 0 (n-2) (n-3) (n-4) th(BCKXL-BDRV) Bit(n-1) (n-2) (n-3) (n-4) Figure 5−24. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 70 SGUS048 July 2003 Electrical Specifications Table 5−27. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)† 5416-160 MASTER MIN SLAVE MAX MIN UNIT MAX 2.2 − 6P‡ 5 + 12P‡ tsu(BDRV-BCKXL) Setup time, BDR valid before BCLKX low 12 th(BCKXH-BDRV) Hold time, BDR valid after BCLKX high 4 † For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. ‡ P = 1 / (2 * processor clock) ns ns Table 5−28. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)† 5416-160 MASTER§ PARAMETER Hold time, BFSX low after BCLKX low¶ Delay time, BFSX low to BCLKX high# th(BCKXL-BFXL) td(BFXL-BCKXH) SLAVE MIN MAX C −3 C+4 T−4 T+3 MIN UNIT MAX ns ns td(BCKXL-BDXV) Delay time, BCLKX low to BDX valid −4 5 6P + 2‡ 10P + 17‡ tdis(BCKXL-BDXHZ) Disable time, BDX high impedance following last data bit from BCLKX low ns −2 4 6P − 4‡ 10P + 17‡ ns td(BFXL-BDXV) Delay time, BFSX low to BDX valid D − 2 D + 4 4P + 2‡ 8P + 17‡ ns † For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. ‡ P = 1 / (2 * processor clock) § T = BCLKX period = (1 + CLKGDV) * 2P C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2P when CLKGDV is even D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2P when CLKGDV is even ¶ FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX). MSB LSB BCLKX td(BFXL-BCKXH) th(BCKXL-BFXL) BFSX tdis(BCKXL-BDXHZ) BDX td(BCKXL-BDXV) td(BFXL-BDXV) Bit 0 Bit(n-1) tsu(BDRV-BCKXL) BDR Bit 0 (n-2) (n-3) (n-4) th(BCKXH-BDRV) Bit(n-1) (n-2) (n-3) (n-4) Figure 5−25. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 July 2003 SGUS048 71 Electrical Specifications Table 5−29. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)† 5416-160 MASTER MIN SLAVE MAX MIN UNIT MAX 2 − 6P‡ 5 + 12P‡ tsu(BDRV-BCKXH) Setup time, BDR valid before BCLKX high 12 th(BCKXH-BDRV) Hold time, BDR valid after BCLKX high 4 † For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. ‡ P = 1 / (2 * processor clock) ns ns Table 5−30. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)† 5416-160 MASTER§ PARAMETER MIN Hold time, BFSX low after BCLKX high¶ Delay time, BFSX low to BCLKX low# th(BCKXH-BFXL) td(BFXL-BCKXL) td(BCKXL-BDXV) Delay time, BCLKX low to BDX valid tdis(BCKXH-BDXHZ) Disable time, BDX high impedance following last data bit from BCLKX high tdis(BFXH-BDXHZ) Disable time, BDX high impedance following last data bit from BFSX high SLAVE MAX T−3 T+4 D−4 D+3 UNIT MAX ns ns 5 6P + 2‡ −4 D−2 MIN 10P + 17‡ ns D+3 ns 2P − 4‡ 6P + 17‡ ns td(BFXL-BDXV) Delay time, BFSX low to BDX valid 4P + 2‡ 8P + 17‡ ns † For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. ‡ P = 1 / (2 * processor clock) § T = BCLKX period = (1 + CLKGDV) * 2P D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2P when CLKGDV is even ¶ FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX). LSB MSB BCLKX th(BCKXH-BFXL) td(BFXL-BCKXL) BFSX tdis(BFXH-BDXHZ) tdis(BCKXH-BDXHZ) BDX Bit 0 td(BFXL-BDXV) td(BCKXL-BDXV) Bit(n-1) tsu(BDRV-BCKXH) BDR Bit 0 (n-2) (n-3) (n-4) th(BCKXH-BDRV) Bit(n-1) (n-2) (n-3) (n-4) Figure 5−26. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 72 SGUS048 July 2003 Electrical Specifications Table 5−31. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)† 5416-160 MASTER MIN SLAVE MAX MIN UNIT MAX 2 − 6P‡ 5 + 12P‡ tsu(BDRV-BCKXL) Setup time, BDR valid before BCLKX low 12 th(BCKXL-BDRV) Hold time, BDR valid after BCLKX low 4 † For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. ‡ P = 1 / (2 * processor clock) ns ns Table 5−32. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)† 5416-160 MASTER§ PARAMETER Hold time, BFSX low after BCLKX high¶ Delay time, BFSX low to BCLKX low# th(BCKXH-BFXL) td(BFXL-BCKXL) SLAVE MIN MAX D−3 D+4 T−4 T+3 MIN UNIT MAX ns ns td(BCKXH-BDXV) Delay time, BCLKX high to BDX valid −4 5 6P + 2‡ 10P + 17‡ tdis(BCKXH-BDXHZ) Disable time, BDX high impedance following last data bit from BCLKX high ns −2 4 6P − 4‡ 10P + 17‡ ns td(BFXL-BDXV) Delay time, BFSX low to BDX valid C − 2 C + 4 4P + 2‡ 8P + 17‡ ns † For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. ‡ P = 1 / (2 * processor clock) § T = BCLKX period = (1 + CLKGDV) * 2P C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2P when CLKGDV is even D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2P when CLKGDV is even ¶ FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX). MSB LSB BCLKX th(BCKXH-BFXL) td(BFXL-BCKXL) BFSX tdis(BCKXH-BDXHZ) BDX td(BCKXH-BDXV) td(BFXL-BDXV) Bit 0 Bit(n-1) tsu(BDRV-BCKXL) BDR Bit 0 (n-2) (n-3) (n-4) th(BCKXL-BDRV) Bit(n-1) (n-2) (n-3) (n-4) Figure 5−27. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 July 2003 SGUS048 73 Electrical Specifications 5.15 Host-Port Interface Timing 5.15.1 HPI8 Mode Table 5−33 and Table 5−34 assume testing over recommended operating conditions and P = 1 / (2 * processor clock) (see Figure 5−28 through Figure 5−31). In the following tables, DS refers to the logical OR of HCS, HDS1, and HDS2. HD refers to any of the HPI data bus pins (HD0, HD1, HD2, etc.). HAD stands for HCNTL0, HCNTL1, and HR/W. Table 5−33. HPI8 Mode Timing Requirements 5416-160 MIN MAX UNIT tsu(HBV-DSL) Setup time, HBIL valid before DS low (when HAS is not used), or HBIL valid before HAS low 6 ns th(DSL-HBV) Hold time, HBIL valid after DS low (when HAS is not used), or HBIL valid after HAS low 3 ns tsu(HSL-DSL) tw(DSL) Setup time, HAS low before DS low 8 ns Pulse duration, DS low 13 ns tw(DSH) tsu(HDV-DSH) Pulse duration, DS high 7 ns Setup time, HD valid before DS high, HPI write 3 ns th(DSH-HDV)W Hold time, HD valid after DS high, HPI write 2 ns tsu(GPIO-COH) th(GPIO-COH) Setup time, HDx input valid before CLKOUT high, HDx configured as general-purpose input 6 ns Hold time, HDx input valid before CLKOUT high, HDx configured as general-purpose input 0 ns 74 SGUS048 July 2003 Electrical Specifications Table 5−34. HPI8 Mode Switching Characteristics 5416-160 PARAMETER ten(DSL-HD) Enable time, HD driven from DS low MIN 0 Case 1a: Memory accesses when DMAC is active in 32-bit mode and tw(DSH) < 36P† 18P+10−tw(DSH) Case 1d: Memory accesses when DMAC is active in 16-bit mode and tw(DSH) ≥ I8P† 10 Case 2a: Memory accesses when DMAC is inactive and tw(DSH) < 10P† tv(HYH-HDV) td(DSH-HYL) 10 Case 3: Register accesses 10 td(DSH-HYH) Valid time, HD valid after HRDY high Delay time, DS high to HRDY low‡ Delay time, DS high to HRDY high‡ ns 10P+10−tw(DSH) Case 2b: Memory accesses when DMAC is inactive and tw(DSH) ≥ 10P† td(DSL-HDV2) Delay time, DS low to HD valid for second byte of an HPI read th(DSH-HDV)R Hold time, HD valid after DS high, for a HPI read ns 10 Case 1c: Memory accesses when DMAC is active in 16-bit mode and tw(DSH) < I8P† td(DSL-HDV1) 10 UNIT 36P+10−tw(DSH) Case 1b: Memory accesses when DMAC is active in 32-bit mode and tw(DSH) ≥ 36P† Delay time, DS low to HD valid for first byte of an HPI read MAX 10 0 ns ns 2 ns 8 ns Case 1a: Memory accesses when DMAC is active in 16-bit mode† 18P+6 Case 1b: Memory accesses when DMAC is active in 32-bit mode† 36P+6 Case 2: Memory accesses when DMAC is inactive† 10P+6 Case 3: Write accesses to HPIC register§ 6P+6 ns td(HCS-HRDY) Delay time, HCS low/high to HRDY low/high 6 ns td(COH-HYH) td(COH-HTX) Delay time, CLKOUT high to HRDY high 9 ns Delay time, CLKOUT high to HINT change 6 ns 5 ns Delay time, CLKOUT high to HDx output change. HDx is configured as a td(COH-GPIO) general-purpose output † DMAC stands for direct memory access controller (DMAC). The HPI8 shares the internal DMA bus with the DMAC, thus HPI8 access times are affected by DMAC activity. ‡ The HRDY output is always high when the HCS input is high, regardless of DS timings. § This timing applies when writing a one to the DSPINT bit or HINT bit of the HPIC register. All other writes to the HPIC occur asynchronously, and do not cause HRDY to be deasserted. July 2003 SGUS048 75 Electrical Specifications Second Byte First Byte Second Byte HAS tsu(HBV-DSL) tsu(HSL-DSL) th(DSL-HBV) HAD† Valid Valid tsu(HBV-DSL)‡ th(DSL-HBV)‡ HBIL HCS tw(DSH) tw(DSL) HDS td(DSH-HYH) td(DSH-HYL) HRDY ten(DSL-HD) td(DSL-HDV2) th(DSH-HDV)R HD READ Valid td(DSL-HDV1) Valid tsu(HDV-DSH) Valid tv(HYH-HDV) th(DSH-HDV)W HD WRITE Valid Valid Valid td(COH-HYH) Processor CLK † HAD refers to HCNTL0, HCNTL1, and HR/W. ‡ When HAS is not used (HAS always high) Figure 5−28. Using HDS to Control Accesses (HCS Always Low) 76 SGUS048 July 2003 Electrical Specifications Second Byte First Byte Second Byte HCS HDS td(HCS-HRDY) HRDY Figure 5−29. Using HCS to Control Accesses CLKOUT td(COH-HTX) HINT Figure 5−30. HINT Timing CLKOUT tsu(GPIO-COH) th(GPIO-COH) GPIOx Input Mode† td(COH-GPIO) GPIOx Output Mode† † GPIOx refers to HD0, HD1, HD2, ...HD7, when the HD bus is configured for general-purpose input/output (I/O). Figure 5−31. GPIOx† Timings July 2003 SGUS048 77 Electrical Specifications 5.15.2 HPI16 Mode Table 5−35 and Table 5−36 assume testing over recommended operating conditions and P = 1 / (2 * processor clock) (see Figure 5−32 through Figure 5−34). In the following tables, DS refers to the logical OR of HCS, HDS1, and HDS2, and HD refers to any of the HPI data bus pins (HD0, HD1, HD2, etc.). These timings are shown assuming that HDS is the signal controlling the transfer. See the TMS320C54x DSP Reference Set, Volume 5: Enhanced Peripherals (literature number SPRU302) for addition information. Table 5−35. HPI16 Mode Timing Requirements 5416-160 MIN MAX UNIT tsu(HBV-DSL) th(DSL-HBV) Setup time, HR/W valid before DS falling edge 6 ns Hold time, HR/W valid after DS falling edge 5 ns tsu(HAV-DSH) tsu(HAV-DSL) Setup time, address valid before DS rising edge (write) 5 ns th(DSH-HAV) tw(DSL) Hold time, address valid after DS rising edge 1 ns Pulse duration, DS low 30 ns tw(DSH) Pulse duration, DS high 10 ns Setup time, address valid before DS falling edge (read) Memory accesses with no DMA activity. tc(DSH-DSH) Cycle time, DS rising edge to Memory accesses with 16-bit DMA activity. next DS rising edge Memory accesses with 32-bit DMA activity. tsu(HDV-DSH)W th(DSH-HDV)W 78 SGUS048 −(4P − 6) Reads 10P + 30 Writes 10P + 10 Reads 16P + 30 Writes 16P + 10 Reads 24P + 30 Writes 24P + 10 ns ns Setup time, HD valid before DS rising edge 8 ns Hold time, HD valid after DS rising edge, write 2 ns July 2003 Electrical Specifications Table 5−36. HPI16 Mode Switching Characteristics 5416-160 PARAMETER td(DSL-HDD) Delay time, DS low to HD driven Case 1a: Memory accesses initiated immediately following a write when DMAC is active in 32-bit mode and tw(DSH) was < 26P MIN 0 24P + 20 Case 1c: Memory accesses initiated immediately following a write when DMAC is active in 16-bit mode and tw(DSH) was < 18P 32P + 20 − tw(DSH) Case 1d: Memory accesses not immediately following a write when DMAC is active in 16-bit mode 16P + 20 Case 2a: Memory accesses initiated immediately following a write when DMAC is inactive and tw(DSH) was < 10P Delay time, td(DSH-HYH) DS high to HRDY high Case 2b: Memory accesses not immediately following a write when DMAC is inactive 10P + 20 Memory writes when no DMA is active 10P + 5 Memory writes with one or more 16-bit DMA channels active 16P + 5 Memory writes with one or more 32-bit DMA channels active 24P + 5 th(DSH-HDV)R Hold time, HD valid after DS rising edge, read td(COH-HYH) Delay time, CLKOUT rising edge to HRDY high td(DSL-HYL) Delay time, DS low to HRDY low td(DSH−HYL) Delay time, DS high to HRDY low ns 20P + 20 − tw(DSH) tv(HYH-HDV) Valid time, HD valid after HRDY high July 2003 10 48P + 20 − tw(DSH) Case 1b: Memory access not immediately following a write when DMAC is active in 32-bit mode Delay time, DS low to HD td(DSL-HDV1) valid for first word of an HPI read UNIT MAX 1 ns 7 ns 6 ns 5 ns 12 ns 12 ns SGUS048 79 Electrical Specifications HCS tw(DSH) tc(DSH−DSH) HDS tsu(HBV−DSL) tsu(HBV−DSL) th(DSL−HBV) tw(DSL) th(DSL−HBV) HR/W tsu(HAV−DSL) th(DSH−HAV) HA[17:0] Valid Address Valid Address th(DSH−HDV)R td(DSL−HDV1) td(DSL−HDV1) th(DSH−HDV)R Data HD[15:0] td(DSL−HDD) tv(HYH−HDV) Data td(DSL−HDD) tv(HYH−HDV) HRDY td(DSL−HYL) td(DSL−HYL) Figure 5−32. Nonmultiplexed Read Timings 80 SGUS048 July 2003 Electrical Specifications HCS tw(DSH) tc(DSH−DSH) HDS tsu(HBV−DSL) tsu(HBV−DSL) th(DSL−HBV) th(DSL−HBV) HR/W tsu(HAV−DSH) tw(DSL) th(DSH−HAV) Valid Address HA[17:0] Valid Address tsu(HDV−DSH)W tsu(HDV−DSH)W th(DSH−HDV)W th(DSH−HDV)W Data Valid HD[15:0] Data Valid td(DSH−HYH) HRDY td(DSH−HYL) Figure 5−33. Nonmultiplexed Write Timings HRDY td(COH−HYH) CLKOUT Figure 5−34. HRDY Relative to CLKOUT July 2003 SGUS048 81 Mechanical Data 6 Mechanical Data 6.1 Ball Grid Array Mechanical Data GGU (S-PBGA-N144) PLASTIC BALL GRID ARRAY 12,10 SQ 11,90 9,60 TYP 0,80 A1 Corner 0,80 N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 Bottom View 0,95 0,85 1,40 MAX Seating Plane 0,55 0,45 0,08 0,45 0,35 0,10 4073221-2/C 12/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice C. MicroStar BGAt configuration Figure 6−1. SM320VC5416 144-Ball MicroStar BGA Plastic Ball Grid Array Package MicroStar BGA is a trademark of Texas Instruments. 82 SGUS048 July 2003 Mechanical Data 6.2 Low-Profile Quad Flatpack Mechanical Data PGE (S-PQFP-G144) PLASTIC QUAD FLATPACK 108 73 109 72 0,27 0,17 0,08 M 0,50 144 0,13 NOM 37 1 36 Gage Plane 17,50 TYP 20,20 SQ 19,80 22,20 SQ 21,80 0,25 0,05 MIN 0°−ā 7° 0,75 0,45 1,45 1,35 Seating Plane 0,08 1,60 MAX 4040147 / C 10/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MO-136 Figure 6−2. SM320VC5416 144-Pin Low-Profile Quad Flatpack (PGE) July 2003 SGUS048 83 PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) SM320VC5416PGE16EP ACTIVE LQFP PGE 144 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 100 SM320VC5416 PGE16EP V62/04610-01YE ACTIVE LQFP PGE 144 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 100 SM320VC5416 PGE16EP (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of