SM72295EVM User’s Guide
User's Guide
Literature Number: SNVU473
May 2015
Contents
1
2
Introduction ......................................................................................................................... 4
Setup .................................................................................................................................. 5
2.1
Input/Output Connector Description ................................................................................... 5
2.2
PWM Connector Description............................................................................................ 5
2.3
Setup ....................................................................................................................... 6
2.4
Operation .................................................................................................................. 7
3
Board Layout ....................................................................................................................... 9
Appendix A Schematic ................................................................................................................ 11
Appendix B Bill of Materials......................................................................................................... 12
2
Table of Contents
SNVU473 – May 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
www.ti.com
List of Figures
1
Typical Full Bridge Application - Gate Signals ........................................................................... 5
2
Current Sense Amplifier Connections ..................................................................................... 7
3
Sample Measurement of the Current Sense Amplifier’s Output ....................................................... 8
4
Top Assembly Layer......................................................................................................... 9
5
Top Routing Layer
6
7
.........................................................................................................
Bottom Routing Layer......................................................................................................
SM72295EVM Schematic .................................................................................................
10
10
11
List of Tables
1
Device and Package Configurations ...................................................................................... 4
2
SM72295EVM Bill of Materials ........................................................................................... 12
SNVU473 – May 2015
Submit Documentation Feedback
List of Figures
Copyright © 2015, Texas Instruments Incorporated
3
User's Guide
SNVU473 – May 2015
SM72295EVM User’s Guide
1
Introduction
The Texas Instruments SM72295 EVM evaluation module (EVM) helps designers evaluate the operation
and performance of the SM72295 full bridge MOSFET driver in various applications such as Full Bridge
topology based Inverters (both Low Frequency as well as High Frequency), Interleaved Buck, Interleaved
Boost, four Switch Buck Boost, and with any DC bus between 12 V (one 12-V battery) to 48 V (four 12-V
batteries in series). The device offers 3 A (higher number of FETs in parallel for high power) peak-current
drive capability with the following:
1. Integrated ultra-fast 100-V boot strap diodes (Bootstrap Supply voltage range up to 115-V DC).
2. Two high side current sense amplifiers with externally programmable gain and buffered outputs which
can be used for measuring the charge and discharge current(In UPS/Inverter applications) – No need
of additional current sense amplifiers and buffers which is a major differentiating feature from other
parts.
3. Programmable over voltage protection – which can be used for Charge complete detection or for driver
shutdown feature in case of a fault condition.
4. Can be directly interfaced with a micro controller
The EVM contains one full bridge MOSFET driver (See Table 1):
Table 1. Device and Package Configurations
4
CONVERTER
IC
PACKAGE
U3
SM72295
SOIC-28
SM72295EVM User’s Guide
SNVU473 – May 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Setup
www.ti.com
2
Setup
This section describes the jumpers and connectors on the EVM as well and how to properly connect, set
up, and use the SM72295EVM.
2.1
Input/Output Connector Description
J1 – DC Input — The power input terminal for the board. The terminal block provides a power (DC_IN)
and ground (GND) connection for the Board.
J2 – DC Output — The output Terminal for the board. The terminal block provides a power (Vout) and
ground (GND) connection to allow the user to attach the EVM to a Current Source to evaluate the
internal current Sense amplifier of the board.
J3 – SIA — The Jumper connection for an optional external or internal Inverting Input of current sense
amplifier A.
J4 – SOA — The Jumper connection for an optional external or internal Non-Inverting Input of current
sense amplifier A.
J5 – ECA — The Connector for external signals for Current sense amplifier A.
J6 – ECB — The Connector for external signals for Current sense amplifier B.
J7 – SIB — The Jumper connection for an optional external or internal Inverting Input of current sense
amplifier B.
J8 – SOB — The Jumper connection for an optional external or internal Non-Inverting Input of current
sense amplifier B.
2.2
PWM Connector Description
J10 – PWMA— The High Side Driver Output (Gate and Source for both channels A and B).
J11 – PWMB — The Low Side Driver Output (Gate and Source for both channels A and B).
J12 – PWM — The PWM input of the board.
J13 – PG/OVP — The power good and protection indication of the board.
Figure 1. Typical Full Bridge Application - Gate Signals
SNVU473 – May 2015
Submit Documentation Feedback
SM72295EVM User’s Guide
Copyright © 2015, Texas Instruments Incorporated
5
Setup
2.3
www.ti.com
Setup
•
•
•
•
•
•
•
6
The board is designed for any DC Input applications with a Voltage range of 12 V to 48 V. User must
exercise caution while applying the voltage for Polarity and magnitude.
VCC is set to 10 V (using LM317M as regulator) and VDD is set to 3.3 V. VDD acts as an internal
reference for Over Voltage and/or shut down signal threshold and VCC under voltage comparators
(with built-in 5% hysteresis).
Absolute max differential voltage between current sense amplifier inputs is ± 0.8 V and recommended
it to be less than ±0.5 V
Min common mode voltage at current sense comparator inputs is VDD + 1V.
Max input Current (at 10-V input) – 12 A (limited by on board current sense Resistance, However,
there is no practical limit on the current as long as sense signal is less than ±0.25 V.
Gain of the individual current sense amplifier is 20.5 (This gain can be programmed to any value with
the max. output of the amplifier limited to VDD)
Input Over Voltage Shutdown – 14.1 V (a signal asserts at OVP pin), Also, this can be used as a
DRIVER shut down control by applying a signal > VDD. Change Resistance R14 for Higher Input
Voltage Operations.
SM72295EVM User’s Guide
SNVU473 – May 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Setup
www.ti.com
2.4
Operation
For Gate Drive Evaluation of the SM72295, JP10, JP11 and JP12 should be properly configured. Connect
PWM inputs at J12 (Four Independent PWM inputs), High Side Gate Source and Gates at J10 and Low
Side Gates at J11.
The Default Input overvoltage is programmed by resistance R14 and R13 at 14.1 V. When Voltage at OVS
pin equals to VDD, all Outputs are shutdown. R14 can be reduced to operate at Higher Input Voltages.
For Current Sense Amplifier Evaluation of the SM72295, JP3, JP4, JP7 and JP8 should be properly
configured.
Figure 2. Current Sense Amplifier Connections
SNVU473 – May 2015
Submit Documentation Feedback
SM72295EVM User’s Guide
Copyright © 2015, Texas Instruments Incorporated
7
Setup
www.ti.com
Shunt is R1//R2, RD1=R5 and R6, RD2=R15 and similarly for second Amplifier RC1= R7 and R8 and
RC2=R16.
In order to evaluate current sense amplifier, insert Power Source at J1 (12 V) and an electronic load
(Constant Current Load) at J2. Increase the Load current through Electronic load from 0 to 6 A (There is
no Practical limit on the current being sense and is dependent on the current sense resistance value as
long as sense signal is less than ±0.25 V.
Short 1-2 of J3, J4 and 2-3 of J7 and J8 for Current Sensing through Internal Current Sense Resistor R1
parallel to R2.
Measure the Voltage at BIN and BOUT.
Note: Measurement was taken at 12-V Input at J1 and with Electronic Load at J2 at room temperature (21°C)
Figure 3. Sample Measurement of the Current Sense Amplifier’s Output
8
SM72295EVM User’s Guide
SNVU473 – May 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Board Layout
www.ti.com
3
Board Layout
Figure 4, Figure 5, and Figure 6 show the board layout for the SM72295EVM. This board is a basic driver
with a flexibility of connecting external PWMs and current sense signals for the evaluation of SM72295.
The optimum performance of high and low-side gate drivers cannot be achieved without taking due
considerations during circuit board layout. Following points are emphasized.
1. /Low ESR / ESL capacitors must be connected close to the IC, between VDD and VSS pins and
between the HB and HS pins to support the high peak currents being drawn from VDD during turn-on
of the external MOSFET.
2. In order to avoid large negative transients on the switch node (HS pin), the parasitic inductances in the
source of top MOSFET and in the drain of the bottom MOSFET (synchronous rectifier) must be
minimized.
3. Grounding Considerations:
(a) The first priority in designing grounding connections is to confine the high peak currents that charge
and discharge the MOSFET gate into a minimal physical area. This will decrease the loop
inductance and minimize noise issues on the gate terminal of the MOSFET. The MOSFETs should
be placed as close as possible to the gate driver.
(b) The second high current path includes the bootstrap capacitor, the bootstrap diode, the local
ground referenced bypass capacitor and low-side MOSFET body diode. The bootstrap capacitor is
recharged on a cycle-by-cycle basis through the bootstrap diode from the ground referenced VDD
bypass capacitor. The recharging occurs in a short time interval and involves high peak current.
Minimizing this loop length and area on the circuit board is important to ensure reliable operation.
Figure 4. Top Assembly Layer
SNVU473 – May 2015
Submit Documentation Feedback
SM72295EVM User’s Guide
Copyright © 2015, Texas Instruments Incorporated
9
Board Layout
www.ti.com
Figure 5. Top Routing Layer
Figure 6. Bottom Routing Layer
10
SM72295EVM User’s Guide
SNVU473 – May 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Appendix A
SNVU473 – May 2015
Schematic
DC_IN
VIN
R1
VIN
U1
VIN
3
VIN
VIN
SIB
0.033
J1
R2
C1
1000µF
1
2
1715721
0.033
SIB
DC Input
GND
AGND
J2
C2
1000µF
C3
2.2µF
2
1
VIN
PEC03SAAN
J3
1
2
3
PEC03SAAN
J4
1
2
3
SIA
C4
10µF
1715721
AGND
AGND
R3
5.60k
VCC
IN
OUT
1
4
LM317MKVURG3
R4
ADJ
1.00k
3
IN
OUT
VDD
5
NC
EN
GND
VDD
2
TPS76333DBV
C6
4.7µF
C5
10µF
AGND
C7
VDD
U2
1
VCC
AGND
SDA
VDD
VCC
4
ADJ
AGND
AGND
AGND
VCC
C8
Input & Output Connectors
VDD
0.1µF
R5
487
1
2
3
4
R6
487
AGND
1µF
VDD
AO
LIB
R9
PWM2
HIB
PWM2
PWM4
GND
GND
PWM3
PWM1
AGND
HIA
PWM3
R17
PWM1
R10
1
LIB
9
HBA
8
HIB
HIA
7
LIA
6
HIB
HOA
HIA
10.0
HSA
LIA
10.0
AGND
LOA
LIA
10
PGND
OVP
BIN
HSB
R11
J13
3
2
1
LOB
15
OVP
PGD
AGND
BOUT
R12
BIN
22-23-2031
BO
BO
4
1.00k
1.00k
C12
1000pF
BOUT 11
3
12
5
OVP
AGND
SIB
SIB
BO
J3, J4 - Current Sense Amp1
Input Selection
J5 - Current Sense Amp1 I/P
and buffered output terminals
22-23-2041
J6 - Current Sense Amp2 I/P
and buffered output terminals
R7
14
1
2
3
487
R8
487 C10
13
26
HBA
27
HOA
28
HSA
J8 PEC03SAAN
AGND
J7, J8 - Current Sense Amp2
J10
1
2
3
4
SOB
0.47µF
HOA
VIN
VIN
HSA
BIN
HOB
BOUT
IIN
IOUT
HBB
AGND
PGND
OVS
SM72295MAX/NOPB
AGND
24
LOA
22
LOB
18
HSB
1
2
3
4
HSB
AGND
19
HOB
20
HBB
16
OVS
PWM Connectors
J9 - PWM Inputs
22-23-2041
(Push-pull/bridge)
J11
J10 - High Side driver
LOA
GND
GND
LOB
22-23-2041
(Gate and Source for
both channels A&B)
J11- Low Side driver
(Gate and GND for
both channels A&B)
C11
HOB
0.47µF
R13
23
33.0k
VIN
VIN
R14
10.0k
AGND
AGND
Input Selection
HOA
HSA
HOB
HSB
LOA
IOUT
IIN
AGND
AGND
C13
1000pF
BO
BP
BN
BO
GND
LOB
PGD
22-23-2061
PGD
GND
OVP
SIB
SOB
LIB
10.0
21
25
1
2
3
4
SIB
SIA
10.0
R18
PWM4
SIA
AGND
SDA
1
2
3
1
2
SDA 2
VCC1
VCC2
AGND
17
AGND
1
2
3
4
5
6
J2 - DC Output (to the Load)
J6
NET00001
J7
PEC03SAAN
U3
AGND
22-23-2041
J9
J1 - DC Input (to the board)
VCC
J5
AP
AN
AO
GND
1µF
C9
J14
PEC02SAAN
G1
AGND
IIN
IOUT
R15
10.0k
SH-J15
SH-J16
SH-J17
SH-J18
C14
1000pF
C15
1000pF
R16
10.0k
SH-J19
AGND
AGND
AGND
AGND
Figure 7. SM72295EVM Schematic
SNVU473 – May 2015
Submit Documentation Feedback
Schematic
Copyright © 2015, Texas Instruments Incorporated
11
Appendix B
SNVU473 – May 2015
Bill of Materials
Table 2. SM72295EVM Bill of Materials
ITEM
12
DESIGNATOR
DESCRIPTION
MANUFACTURER
1
!PCB
Printed Circuit Board
Any
2
BIN, BOUT, DC_IN, HIA,
HIB, HOA, HOB, HSA, HSB,
IIN, IOUT, LIA, LIB, LOA,
LOB, OVP, SDA, SIA, SIB,
SOB, VCC, VDD, VIN
Test Point, Miniature, Red,
TH
3
C1, C2
CAP, AL, 1000 µF, 25 V, +/20%, 0.019 Ω, TH
Nichicon
4
C3
CAP, CERM, 2.2 µF, 100 V,
+/- 20%, X7R, 1812
TDK
5
C4, C5
CAP, AL, 10 µF, 35 V, +/20%, 0.95 Ω, TH
Nichicon
6
C6
CAP, AL, 4.7 µF, 50 V, +/20%, 2.9 Ω, SMD
Panasonic
7
C7
CAP, CERM, 0.1 µF, 16 V,
+/- 10%, X7R, 0603
Kemet
8
C8, C9
CAP, CERM, 1 µF, 25 V, +/10%, X7R, 0805
TDK
9
C10, C11
CAP, CERM, 0.47 µF, 50 V,
+/- 10%, X7R, 0805
MuRata
10
C12, C13, C14, C15
CAP, CERM, 1000 pF, 50 V,
+/- 1%, C0G/NP0, 0603
MuRata
11
G1, GND, PGD
Test Point, Miniature, Black,
TH
Keystone
12
H1, H2, H3, H4
Machine Screw, Round, #440 x 1/4, Nylon, Philips
panhead
B&F Fastener Supply
PART NUMBER
SV601191
5000
Keystone
UHW1E102MPD
C4532X7R2A225M
UPW1V100MDD6
EEE-FK1H4R7R
C0603X104K4RACTU
C2012X7R1E105K
GRM21BR71H474KA88L
GRM1885C1H102FA01J
5001
NY PMS 440 0025 PH
13
H5, H6, H7, H8
Standoff, Hex, 0.5"L #4-40
Nylon
Keystone
14
J1, J2
Conn Term Block, 2POS,
5.08 mm, TH
Phoenix Contact
15
J3, J4, J7, J8
Header, 100mil, 3x1, Tin, TH
Sullins Connector Solutions
16
J5, J6, J10, J11
Header, 2.54 mm, 4x1, Tin,
TH
Molex
17
J9
Header, 2.54 mm, 6x1, Tin,
TH
Molex
18
J13
Header, 2.54 mm, 3x1, Tin,
TH
Molex
19
J14
Header, 100mil, 2x1, Tin, TH
Sullins Connector Solutions
20
LBL1
Thermal Transfer Printable
Labels, 0.650" W x 0.200" H
- 10,000 per roll
Brady
1902C
1715721
PEC03SAAN
22-23-2041
22-23-2061
22-23-2031
PEC02SAAN
THT-14-423-10
21
R1, R2
RES, 0.033, 1%, 0.5 W, 1812 Panasonic
ERJ-L12KF33MU
22
R3
RES, 5.60 k, 1%, 0.1 W,
0603
RC0603FR-075K6L
Yageo America
Bill of Materials
SNVU473 – May 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Appendix B
www.ti.com
Table 2. SM72295EVM Bill of Materials (continued)
ITEM
DESIGNATOR
DESCRIPTION
MANUFACTURER
PART NUMBER
23
R4, R11, R12
RES, 1.00 k, 1%, 0.1 W,
0603
Vishay-Dale
24
R5, R6, R7, R8
RES, 487, 1%, 0.1 W, 0603
Vishay-Dale
CRCW0603487RFKEA
25
R9, R10, R17, R18
RES, 10.0, 1%, 0.1 W, 0603
Vishay-Dale
CRCW060310R0FKEA
26
R13
RES, 33.0 k, 1%, 0.1 W,
0603
Vishay-Dale
27
R14, R15, R16
RES, 10.0 k, 1%, 0.1 W,
0603
Vishay-Dale
28
SH-J15, SH-J16, SH-J17,
SH-J18, SH-J19
Shunt, 100mil, Gold plated,
Black
TE Connectivity
29
U1
3-Terminal Adjustable
Regulator, KVU0003A
Texas Instruments
30
U2
LOW-POWER 150-mA LOWDROPOUT LINEAR
Texas Instruments
REGULATOR, DBV0005A
TPS76333DBV
31
U3
Photovoltaic Full Bridge
Driver, DW0028A
Texas Instruments
SM72295MAX/NOPB
32
FID1, FID2, FID3
Fiducial mark. There is
nothing to buy or mount.
N/A
SNVU473 – May 2015
Submit Documentation Feedback
CRCW06031K00FKEA
CRCW060333K0FKEA
CRCW060310K0FKEA
881545-2
LM317MKVURG3
N/A
Bill of Materials
Copyright © 2015, Texas Instruments Incorporated
13
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
SPACER
SPACER
SPACER
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
