SMP-TPS61200-MVK MAVRK Submodule
User's Guide
Literature Number: SLVU662
March 2012
Contents
1
2
3
4
5
6
2
Purpose ............................................................................................................................. 4
EVM Overview .................................................................................................................... 4
......................................................................................................... 4
.................................................................................................................. 5
2.3
Featured Applications ................................................................................................... 5
2.4
Highlighted Products .................................................................................................... 5
2.5
Block Diagram ........................................................................................................... 6
2.6
EVM Wiki ................................................................................................................. 6
2.7
EVM Landing Page ..................................................................................................... 6
Hardware Description .......................................................................................................... 7
3.1
Power Requirements .................................................................................................... 7
3.2
Connector Signal Descriptions ........................................................................................ 8
3.3
Getting Started: Configuring the EVM ................................................................................ 8
Board Files ......................................................................................................................... 9
4.1
Bill of Materials .......................................................................................................... 9
4.2
Layout ................................................................................................................... 10
4.3
Schematics ............................................................................................................. 17
4.4
Fabrication Drawings .................................................................................................. 18
4.5
Request Gerber and Schematic Files ............................................................................... 18
MAVRK Links .................................................................................................................... 19
5.1
Additional Information on on MAVRK ............................................................................... 19
5.2
MAVRK Questions ..................................................................................................... 19
5.3
Additional Technical Information on MAVRK Hardware .......................................................... 19
5.4
Additional Technical Information on MAVRK Software ........................................................... 19
5.5
Obtaining a MAVRK Board ........................................................................................... 19
Precautions and Certifications ............................................................................................ 19
6.1
ESD Precautions ....................................................................................................... 19
6.2
Certifications ............................................................................................................ 19
2.1
EVM Description
2.2
Features
Table of Contents
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List of Figures
1
SMP-TPS61200-MVK Submodule ........................................................................................ 4
2
SMP-TPS61200-MVK Block Diagram .................................................................................... 6
3
TPS6120x Maximum Current.............................................................................................. 7
4
SMP-TPS61200-MVK Board Silkscreen – Top Side
5
SMP-TPS61200-MVK Board Solder Mask – Top Side ............................................................... 11
6
SMP-TPS61200-MVK Board Layer 1 – Top Side ..................................................................... 12
7
SMP-TPS61200-MVK Board Layer 2 – Ground Plane ............................................................... 13
8
SMP-TPS61200-MVK Board Layer 3 – Signal ........................................................................ 14
9
SMP-TPS61200-MVK Board Layer 4 – Bottom Side ................................................................. 15
10
SMP-TPS61200-MVK Board Solder Mask – Bottom Side ........................................................... 16
11
SMP-TPS61200-MVK Board Silkscreen – Bottom Side.............................................................. 17
12
SMP-TPS61200-MVK Schematic ....................................................................................... 18
13
SMP-TPS61200-MVK Fabrication Drawing ............................................................................ 18
.................................................................
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3
User's Guide
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SMP-TPS61200-MVK MAVRK Submodule
1
Purpose
This document discusses the Modular and Versatile Reference Kit (MAVRK) TPS61200 boost converter
submodule. After reading this guide, a developer should understand the features of the SMP-TPS61200MVK. For more information on the MAVRK system, see the MAVRK introduction page.
2
EVM Overview
The SMP-TPS61200-MVK highlights the TPS61200 boost converter with 1.3-A switches and down-mode.
The SMP-TPS61200-MVK boost converter submodule is intended to step up 0.3 to 5.5 V DC to voltages
up to 5.5 V on MAVRK PMU modules, such as the PMU-CARRIER-MVK and PMU-BAT-MVK. The default
output voltage for this module is 5.5 V DC.
2.1
EVM Description
Figure 1. SMP-TPS61200-MVK Submodule
The SMP-TPS61200-MVK contains the TPS61200 integrated circuit and all other onboard components
necessary to generate 5.5 V from a 0.3–5.5 V source. The SMP-TPS61200-MVK can be used with a
MAVRK PMU carrier board to evaluate the TPS61200 performance as part of a power management
system. An onboard I2C temperature sensor can report the temperature of the board to the carrier board.
4
SMP-TPS61200-MVK MAVRK Submodule
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EVM Overview
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2.2
Features
2.2.1
•
•
•
•
•
•
•
•
•
•
•
•
TPS61200 Features
Greater than 90% efficiency at
– 300-mA output current at 3.3 V (VIN ≥ 2.4 V)
– 600-mA output current at 5 V (VIN ≥ 3 V)
Automatic transition between boost mode and down-conversion mode
Device quiescent current less than 55 µA
Startup into full load at 0.5-V input voltage
Operating input voltage range from 0.3 to 5.5 V
Programmable undervoltage lockout threshold
Output short-circuit protection under all operating conditions
Adjustable output voltage from 1.8 to 5.5 V
Power save mode for improved efficiency at low output power
Forced fixed frequency operation possible
Load disconnect during shutdown
Overtemperature protection
Small 3 mm x 3 mm QFN-10 package
•
•
•
•
SMP-TPS61200-MVK Features
Default 5.5-V output
Onboard TMP103 I2C temperature sensor
Compatible with MAVRK PMU carrier boards
Breadboard compatible with 0.1-inch headers
•
2.2.2
2.3
Featured Applications
The SMP-TPS61200-MVK MAVRK submodule can be used on the following applications:
• All single-cell, two-cell, and three-cell alkaline battery powered products (NiCd, NiMH, or single-cell Li)
• Fuel Cell And Solar Cell Powered Products
• Personal Medical Products
• White LEDs
2.4
Highlighted Products
The SMP-TPS61200-MVK MAVRK submodule highlights the following devices:
• TPS61200 0.3-V Input Voltage Boost Converter with 1.3-A Switches and Down Mode in 3x3 QFN
• TMP103 Digital Temperature Sensor with I2C/SMBUS Expanded Interface
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EVM Overview
2.5
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Block Diagram
SMP-TPS61200-MVK
CONN_1
CONN_2
VIN
0.7–5.5 V
EN
TPS61200
VOUT
PS
5.5 V (Adj.)
I2C SDA
PMU_3_3V
TMP103
I2C SCL
Figure 2. SMP-TPS61200-MVK Block Diagram
2.6
EVM Wiki
SMP-TPS61200-MVK MAVRK submodule wiki page
2.7
EVM Landing Page
SMP-TPS61200-MVK MAVRK submodule tool folder
6
SMP-TPS61200-MVK MAVRK Submodule
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Hardware Description
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3
Hardware Description
3.1
Power Requirements
The SMP-TPS61200-MVK can accept an input of 0.3 to 5.5 V from the carrier board. By default, the SMPTPS61200-MVK generates 5.5 V on the output. The output voltage can be modified by adjusting the
feedback resistors R3 and R6, as Equation 1 shows.
R 3 = R6
(
VOUT
VFB – 1
)
where VFB = 500 mV
(1)
Resistor R6 must be 500 kΩ or smaller to have a feedback current of approximately 100 times higher than
the current into the feedback pin. TI recommends that R6 is in the 200-kΩ range.
If the TPS61200 input voltage reaches or exceeds the output voltage, the converter automatically changes
to a down-conversion mode. In this mode, the control circuit changes the behavior of the two rectifying
switches. While switching continues, the control circuit sets the voltage drop across the rectifying switches
as high as needed to regulate the output voltage. A high voltage drop causes the power losses in the
converter to increase and the power losses must be taken into account for thermal consideration.
The maximum TPS61200 output current is dependent on the input and output voltages, as Figure 3
shows.
Figure 3. TPS6120x Maximum Current
Due to the small PCB area of the SMP-TPS61200-MVK, do not exceed 0.75 W of power consumption on
the board. The onboard temperature sensor can be used to measure the temperature rise at different
power levels.
The SMP-TPS61200-MVK can be used in a protoboard if pin 4 of CONN_1 (PMU_3_3V) is tied to a pullup voltage within the enable (EN) voltage range of the device. To avoid damage to the onboard
temperature sensor, this voltage must not exceed 3.6 V. See the Hardware Design Guide for MAVRK
PMU DC-DC Submodules for connector pinout information.
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Hardware Description
3.2
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Connector Signal Descriptions
For information about the SMP-TPS61200-MVK connector pinouts, see the Hardware Design Guide for
MAVRK PMU DC-DC Submodules.
3.3
Getting Started: Configuring the EVM
The SMP-TPS61200-MVK is set up by default to enable power save mode at light loads. The power save
mode can be set to disabled by default by removing resistor R7 and installing resistor R4. This feature can
be turned on and off in software by toggling the logic level on the PS pin of connector CONN_2.
The TPS61200 undervoltage lockout (UVLO) input can be used to shut down the main output if the supply
voltage falls below the desired UVLO threshold voltage. The UVLO threshold voltage can be programmed
using resistors R2 and R5, as Equation 2 shows.
R 2 = R5
(
VINMIN
VUVLO – 1
)
where VUVLO = 250 mV
(2)
Resistor R5 must be in the 250-kΩ range to have a resistor-divider current approximately 100 times larger
than the current into the UVLO pin.
To use the SMP-TPS61200-MVK with a MAVRK system, it must be connected to a DC-DC converter slot
on a MAVRK PMU carrier board, such as the PMU-CARRIER-MVK. See the carrier board user's guide for
setup and software information.
8
SMP-TPS61200-MVK MAVRK Submodule
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Board Files
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4
Board Files
4.1
Bill of Materials
Download PDF of the bill of materials (BOM).
Table 1. SMP-TPS61200-MVK Bill of Materials
Item
SMP-TPS61200MVK
Reference
Designator
Value
Part Description
Temp °C
Manufacturer
Manufacturer Part Number
1
1
C1
0.1 µF
Capacitor, ceramic, .10 µF, 10 V, X5R, ±10%,
0402
–55 to 85
Taiyo Yuden
LMK105BJ104KV-F
2
1
C2
10 µF
Capacitor, ceramic, 10 µF, 10 V, X5R, 20%,
0603
–55 to 85
Taiyo Yuden
LMK107BJ106MALTD
3
1
C3
10 µF
Capacitor, ceramic, 10 µF, 25 V, ±10%, X5R,
0805
–55 to 85
Murata Electronics
GRM21BR61E106KA73L
4
1
C4
0.01 µF
Capacitor, ceramic, 0.01 µF, 16 V, X7R,
±10%, 0402
–55 to 125
Taiyo Yuden
EMK105B7103KV-F
5
1
CONN_1
1×6
High Temp .100-inch pitch 1x6 Overall 430L
Post Gold, Single, 230 Post height Pin three
is polarized
–55 to 125
Samtec
HMTSW-106-07-G-S-230-003
6
1
CONN_2
1×6
High Temp .100-inch pitch 1x6 Overall 430L
Post Gold, Single, 230 Post height
–55 to 125
Samtec
HMTSW-106-07-G-S-230
7
1
L1
2.2 µH
Passive_2.2uH_IND_LPS3015
Coilcraft
LPS3015-222MLB
8
1
R1
10 kΩ
Resistor, 10 kΩ, 1/16 W, 5%, 0402, SMD
±100 ppm/°C
Yageo
RC0402JR-0710KL
9
1
R2
0Ω
Resistor, Thick Film, 0 Ω, 0.1 W, –100/+600
ppm/°C, 0402
–100/+600 ppm/°C
Panasonic - ECG
ERJ-2GE0R00X
10
1
R3
2.00 MΩ
Resistor, 2.00 MΩ, 1/16 W, 1%, 0402, SMD
±100 ppm/°C
Vishay/Dale
CRCW04022M00FKED
11
0
R4
10 kΩ
Resistor, 10 kΩ, 1/16 W, 5% 0402, SMD
±100 ppm/°C
Yageo
RC0402JR-0710KL
DNI
12
0
R5
1.0 MΩ
Resistor, Thick Film, 1.0 MΩ, 0.1 W, ±5%,
0402
±200 ppm/°C
Panasonic - ECG
ERJ-2GEJ105X
DNI
13
1
R6
200 kΩ
Resistor, 200 kΩ, 1/10 W, 1%, 0402, SMD
±100 ppm/°C
Panasonic – ECG
ERJ-2RKF2003X
14
1
U1
TPS61200DRC
IC BOOST SYNC ADJ, 0.6 A, 3X3 10SON
–40 to 85
Texas Instruments
TPS61200DRC
15
1
LB1
BOARD LABEL
Line 1 SMP-TPS61200-MVK
Line 2 BOM REV A
Brady
THT-14-423-10
16
1
U2
ADDR = 1110000
IC TEMP SENSOR DGTL SMBUS 4DSBGA ADDR=1110000
–10 to 100
Texas Instruments
TMP103AYFF
17
0
R3
0Ω
Resistor, Thick Film, 0 Ω, 0.1 W, –100/+600
ppm/°C, 0402
–100/+ 600ppm/°C
Panasonic – ECG
ERJ-2GE0R00X
18
1
R7
200K
Resistor, 200 kΩ, 1/10 W, 1%, 0402, SMD
±100 ppm/°C
Panasonic – ECG
ERJ-2RKF2003X
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Note
See Assembly
DWG for Label
Location
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Board Files
4.2
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Layout
Download PDF of additional board layers.
Figure 4. SMP-TPS61200-MVK Board Silkscreen – Top Side
10
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Board Files
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Figure 5. SMP-TPS61200-MVK Board Solder Mask – Top Side
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Board Files
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Figure 6. SMP-TPS61200-MVK Board Layer 1 – Top Side
12
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Figure 7. SMP-TPS61200-MVK Board Layer 2 – Ground Plane
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Board Files
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Figure 8. SMP-TPS61200-MVK Board Layer 3 – Signal
14
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Figure 9. SMP-TPS61200-MVK Board Layer 4 – Bottom Side
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Board Files
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Figure 10. SMP-TPS61200-MVK Board Solder Mask – Bottom Side
16
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Figure 11. SMP-TPS61200-MVK Board Silkscreen – Bottom Side
4.3
Schematics
Download PDF of the schematic.
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Board Files
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PMU_3_3V
VOUT
CONN_1
VIN
CONN_2
1
2
3
4
5
6
PG
EN
PS
GPIO
I2C_SDA_MODx
I2C_SCL_MODx
1x6
HMTSW-106-07-G-S-230-003
1
2
3
4
5
6
1x6
HMTSW-106-07-G-S-230
SUB-MODULE CONNECTORS
PMU_3_3V
0.3 V - 5.5 V
L1
VIN
2.2uH
U1
5
R1
10K
1/16W
R2
0
1/10W
6
8
7
EN
PS
9
11
VIN
L
EN
PS
UVLO
VOUT
VAUX
GND
FB
HS_PAD PGND
3
5.5 V
2
1
10
4
C1
0.1uF
10V
TPS61200DRC
C2
10uF
10V
R5
1M
1/10W
DNI
R4
10K
1/16W
DNI
C3
22uF
25V
*Replace R3 with a 0-ohm resistor
and DNI R6 if using the TPS61201
or TPS61202.
U2
I2C_SDA_MODx B1
I2C_SCL_MODx B2
R3
2.00M
1/10W
R6
200K
1/10W
TPS61201*
TPS61202*
R7
200K
1/10W
VOUT
SDA
SCL
PMU_3_3V
V+
GND
A1
A2
C4
0.01uF
16V
ADDR = 1110000
Figure 12. SMP-TPS61200-MVK Schematic
4.4
Fabrication Drawings
Download PDF of the fabrication drawing.
Figure 13. SMP-TPS61200-MVK Fabrication Drawing
4.5
Request Gerber and Schematic Files
To request Gerber or schematic files for the SMP-TPS61200-MVK module, see the MAVRK Gerber
Request webpage.
18
SMP-TPS61200-MVK MAVRK Submodule
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MAVRK Links
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5
MAVRK Links
5.1
Additional Information on on MAVRK
Visit the MAVRK wiki pages to get comprehensive information on MAVRK.
5.2
MAVRK Questions
Post any questions on the MAVRK Forum and get an answer from the MAVRK team.
5.3
Additional Technical Information on MAVRK Hardware
Read through the wiki pages related to designing MAVRK hardware.
5.4
Additional Technical Information on MAVRK Software
Read through the wiki pages related to working with MAVRK software.
5.5
Obtaining a MAVRK Board
See the MAVRK Starter Kit tool folder page to order a MAVRK Starter kit. To order other modules, search
for them by name on the TI Web site to find their tool folder pages.
6
Precautions and Certifications
6.1
ESD Precautions
The following guidelines should be followed in order to avoid ESD damage to the board components:
• Any person handling boards must be grounded either with a wrist strap or ESD protective footwear,
used in conjunction with a conductive or static-dissipative floor or floor mat.
• The work surface where boards are placed for handing, processing, testing, etc., must be made of
static-dissipative material and be grounded to ESD ground.
• All insulator materials either must be removed from the work area or they must be neutralized with an
ionizer. Static-generating clothes should be covered with an ESD-protective smock.
• When boards are being stored, transferred between operations or workstations, or shipped, they must
be maintained in a Faraday-shield container whose inside surface (touching the boards) is static
dissipative.
6.2
Certifications
FCC and ICES standard EMC test report for the SMP-TPS61200-MVK Submodule, aboard the MB-PROMVK motherboard
Eco-Info & Lead-Free Home
RoHS Compliant Solutions
Statement on Registration, Evaluation, Authorization of Chemicals (REACh)
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EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/ kit may be returned within 30 days
from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER
TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY
OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET
FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal
Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will
be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this is strictly prohibited and
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory
authorities, which is responsibility of user including its acceptable authorization.
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
【Important Notice for Users of this Product in Japan】
】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1.
2.
3.
Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
product, or
Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjukku-ku, Tokyo, Japan
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
http://www.tij.co.jp
【ご使用にあたっての注】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
http://www.tij.co.jp
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EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1.
2.
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4.
You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even
if the EVM should fail to perform as described or expected.
You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
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harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
Assurance and Indemnity Agreement.
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Copyright © 2012, Texas Instruments Incorporated
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www.ti.com/audio
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amplifier.ti.com
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dataconverter.ti.com
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www.ti.com/computers
DLP® Products
www.dlp.com
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dsp.ti.com
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www.ti.com/energy
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interface.ti.com
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logic.ti.com
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www.ti.com/security
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power.ti.com
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www.ti.com/space-avionics-defense
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microcontroller.ti.com
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www.ti.com/video
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www.ti-rfid.com
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www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
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