SN54AC02-DIE
www.ti.com
SCHS392 – MAY 2013
RAD-TOLERANT SPACE GRADE DIE, QUADRUPLE 2-INPUT POSITIVE-NOR GATES
Check for Samples: SN54AC02-DIE
FEATURES
1
•
•
(1)
AC Types Feature 1.5-V to 5.5-V Operation
Rad-Tolerant: 50 KRad(Si) TID (1)
– TID Dose Rate < 2 mRad/sec
Radiation tolerance is a typical value based upon initial device
qualification. Radiation Lot Acceptance Testing is available contact factory for details.
DESCRIPTION
The SN54AC02-DIE device contains four independent 2-input NOR gates that perform the Boolean function
Y = A • B or Y = A + B in positive logic.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
SN54AC02
TD
Bare die in waffle pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
SN54AC02VTD1
100
SN54AC02VTD2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments space production baseline and is in compliance with the Texas Instruments Quality Control
System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature
only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual
Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
SN54AC02-DIE
SCHS392 – MAY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
2
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
10.5 mils.
Silicon with backgrind
Floating
AlCu(2%) TiW
880.3 nm
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: SN54AC02-DIE
SN54AC02-DIE
www.ti.com
SCHS392 – MAY 2013
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
1Y
1
134.5
383.5
219.5
468.5
1A
2
92.75
149
178
234.25
1B
3
348.25
149
433.5
234.25
2Y
4
837
134.5
942
239.5
2A
5
1139
149
1224.25
234.25
343.5
2B
6
1358
238.5
1463
GND
7
1358
499
1463
604
3A
8
1358
855.5
1463
960.5
3B
9
1248
1070
1353
1175
3Y
10
837
1030.5
942
1135.5
4A
11
358.25
1035.75
443.5
1121
4B
12
102.75
1035.75
188
1121
4Y
13
135.25
817
220.5
902.25
VCC
14
103.25
604.25
188.5
689.5
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: SN54AC02-DIE
3
PACKAGE OPTION ADDENDUM
www.ti.com
19-Aug-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
Samples
(4/5)
(6)
SN54AC02VTD1
ACTIVE
0
100
RoHS & Green
Call TI
N / A for Pkg Type
25 to 25
Samples
SN54AC02VTD2
ACTIVE
0
10
RoHS & Green
Call TI
N / A for Pkg Type
25 to 25
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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