SN54AC02VTD2

SN54AC02-DIE www.ti.com SCHS392 – MAY 2013 RAD-TOLERANT SPACE GRADE DIE, QUADRUPLE 2-INPUT POSITIVE-NOR GATES Check for Samples: SN54AC02-DIE FEATURES 1 • • (1) AC Types Feature 1.5-V to 5.5-V Operation Rad-Tolerant: 50 KRad(Si) TID (1) – TID Dose Rate < 2 mRad/sec Radiation tolerance is a typical value based upon initial device qualification. Radiation Lot Acceptance Testing is available contact factory for details. DESCRIPTION The SN54AC02-DIE device contains four independent 2-input NOR gates that perform the Boolean function Y = A • B or Y = A + B in positive logic. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE SN54AC02 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY SN54AC02VTD1 100 SN54AC02VTD2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments space production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated SN54AC02-DIE SCHS392 – MAY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating AlCu(2%) TiW 880.3 nm Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: SN54AC02-DIE SN54AC02-DIE www.ti.com SCHS392 – MAY 2013 Table 1. Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX 1Y 1 134.5 383.5 219.5 468.5 1A 2 92.75 149 178 234.25 1B 3 348.25 149 433.5 234.25 2Y 4 837 134.5 942 239.5 2A 5 1139 149 1224.25 234.25 343.5 2B 6 1358 238.5 1463 GND 7 1358 499 1463 604 3A 8 1358 855.5 1463 960.5 3B 9 1248 1070 1353 1175 3Y 10 837 1030.5 942 1135.5 4A 11 358.25 1035.75 443.5 1121 4B 12 102.75 1035.75 188 1121 4Y 13 135.25 817 220.5 902.25 VCC 14 103.25 604.25 188.5 689.5 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: SN54AC02-DIE 3 PACKAGE OPTION ADDENDUM www.ti.com 19-Aug-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking Samples (4/5) (6) SN54AC02VTD1 ACTIVE 0 100 RoHS & Green Call TI N / A for Pkg Type 25 to 25 Samples SN54AC02VTD2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type 25 to 25 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of