SN55LBC173TDA2

SN55LBC173-DIE www.ti.com SGLS413 – JUNE 2013 QUADRUPLE LOW-POWER DIFFERENTIAL RECEIVER Check for Samples: SN55LBC173-DIE FEATURES 1 • 2 • • Meets EIA Standards RS-422-A, RS-423-A, RS-485, and CCITT V.11 Designed to Operate With Pulse Durations Designed for Multipoint Bus Transmission on Long Bus Lines in Noisy Environments • • Low-Power Consumption Open-Circuit Fail-Safe Design DESCRIPTION The SN55LBC173-DIE is a monolithic quadruple differential line receiver with 3-state outputs designed to meet the requirements of the EIA standards RS-422-A, RS-423-A, RS-485, and CCITT V.11. This device is optimized for balanced multipoint bus transmission at data rates. The four receivers share two ORed enable inputs, one active when high, the other active when low. Each receiver features high input impedance, input hysteresis for increased noise immunity. Fail-safe design ensures that if the inputs are open circuited, the output is always high. The SN55LBC173-DIE is designed using the Texas Instruments proprietary LinBiCMOSE™ technology that provides low power consumption, high switching speeds, and robustness. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE SN55LBC173 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY SN55LBC173TDA1 100 SN55LBC173TDA2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. LinBiCMOSE is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated SN55LBC173-DIE SGLS413 – JUNE 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating AlSi(1%)Cu(0.5%)TiW 1850 nm Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: SN55LBC173-DIE SN55LBC173-DIE www.ti.com SGLS413 – JUNE 2013 Table 1. Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX 1B 1 626.5 1695 740.5 1809.5 1A 2 222.5 1690.7 323 1791.3 1Y 3 167.9 1432.1 274.8 1539 G 4 171.4 614.1 278.3 721 2Y 5 166.6 392.1 273.5 499 2A 6 279.2 132 379.7 232.6 2B 7 704.8 132 805.3 232.6 GND 8 966.2 132 1066.7 232.6 3B 9 1237.2 132 1337.7 232.6 3A 10 1626.7 132 1727.2 232.6 3Y 11 1758.7 403.7 1865.6 510.6 G 12 1758.5 749 1865.4 855.9 4Y 13 1750.1 1408.4 1857 1515.3 4A 14 1702.2 1698.4 1802.7 1799 4B 15 1296.7 1698.4 1397.2 1799 VCC 16 1024.2 1671.9 1124.7 1772.5 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: SN55LBC173-DIE 3 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking Samples (4/5) (6) SN55LBC173TDA1 ACTIVE 0 100 RoHS & Green Call TI N / A for Pkg Type 25 to 25 Samples SN55LBC173TDA2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type 25 to 25 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of