SCBS027A − FEBRUARY 1989 − REVISED JANUARY 1994
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•
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DW OR N PACKAGE
(TOP VIEW)
State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
3-State Outputs Drive Bus Lines or
Buffer-Memory Address Registers
P-N-P Inputs Reduce DC Loading
High-Impedance State During Power Up
and Power Down
Package Options Include Plastic
Small-Outline (DW) Packages and Standard
Plastic 300-mil DIPs (N)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
description
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
This octal buffer and line driver is designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken
together with the SN64BCT240 and SN64BCT241, these devices provide the choice of selected combinations
of inverting and noninverting outputs, symmetrical active-low output-enable (OE) inputs, and complementary
OE and OE inputs.
The SN64BCT244 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When
OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
The outputs are in a high-impedance state during power up and power down while the supply voltage is less
than approximately 3 V.
The SN64BCT244 is characterized for operation from − 40°C to 85°C.
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
Copyright 1994, Texas Instruments Incorporated
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• DALLAS, TEXAS 75265
• HOUSTON, TEXAS 77251−1443
POST OFFICE BOX 655303
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3−1
SCBS027A − FEBRUARY 1989 − REVISED JANUARY 1994
logic symbol†
1OE
1A1
1A2
1A3
1A4
1
logic diagram (positive logic)
1OE
EN
2
18
4
16
6
14
8
12
1A1
1Y1
2OE
1Y3
1A2
2A2
2A3
2A4
18
4
16
6
14
8
12
1Y1
1Y2
1Y4
1Y3
EN
1A4
2A1
2
1Y2
1A3
19
1
11
9
13
7
15
5
17
3
1Y4
2Y1
2Y2
19
2OE
2Y3
2Y4
2A1
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
2A2
11
9
13
7
15
5
2A3
2A4
2Y1
2Y2
2Y3
17
3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input negative voltage rating may be exceeded if the input clamp current rating is observed.
3−2
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
SCBS027A − FEBRUARY 1989 − REVISED JANUARY 1994
recommended operating conditions
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
IOH
IOL
TA
Operating free-air temperature
High-level input voltage
MIN
NOM
MAX
4.5
5
5.5
2
UNIT
V
V
0.8
V
Input clamp current
−18
mA
High-level output current
−15
mA
64
mA
85
°C
Low-level output current
−40
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
VCC = 4.5 V,
VOH
VCC = 4.5 V
VOL
II
VCC = 4.5 V,
VCC = 5.5 V,
IIH
IIL
VCC = 5.5 V,
VCC = 5.5 V,
IOZ
VCC = 0 to 2.3 V (power up)
VCC = 1.8 V to 0 (power down)
VO = 2.7 V or 0.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
VO = 2.7 V
VO = 0.5 V
VCC = 5.5 V,
VCC = 5.5 V,
VO = 0
Output open
VCC = 5.5 V,
VCC = 5.5 V,
Output open
IOZH
IOZL
IOS†
ICCH
ICCL
TYP†
MIN
II = −18 mA
IOH = − 3 mA
IOH = − 15 mA
IOL = 64 mA
2.4
3.3
2
3.1
0.42
MAX
UNIT
−1.2
V
V
0.55
V
VI = 7 V
VI = 2.7 V
0.1
mA
20
µA
VI = 0.5 V
−1
mA
" 50
OE at 0.8 V
" 50
50
µA
−50
µA
−225
mA
23
40
mA
53
80
mA
4
10
mA
−100
ICCZ
Output open
† All typical values are at VCC = 5 V.
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
µA
A
switching characteristics (see Note 2)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
VCC = 5 V,
CL = 50 pF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = 25°C
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = MIN to MAX§
MIN
TYP
MAX
MIN
MAX
1.2
2.5
4.4
0.9
5.3
1.7
3.2
5
1.4
6
2
5.7
7.8
2
9
2
5.9
8.1
2
9.4
2
5.4
6.7
2
8
2
6.1
7.6
2
9.8
UNIT
ns
ns
ns
§ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 2: Load circuits and voltage waveforms are shown in Section 1.
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
3−3
PACKAGE OPTION ADDENDUM
www.ti.com
6-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN64BCT244DW
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
6BCT244
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
