SN65ELT23
www.ti.com....................................................................................................................................................................................................... SLLS925 – JUNE 2009
5-V Dual Differential PECL Buffer-to-TTL Translator
FEATURES
1
•
•
•
•
•
•
•
•
•
Dual 5-V Differential PECL-to-TTL Buffer
24-mA TTL Ouputs
Operating Range
– PECL VCC = 4.75 V to 5.25 V with
GND = 0 V
Support for Clock Frequencies of 250 MHz
(TYP)
3.5-ns Typical Propagation Delay
Output Default Low with Inputs Left Open or
25°C
(mW/°C)
POWER RATING
TA = 85°C
(mW)
SOIC
Low-K
719
139
7
288
High-K
840
119
8
336
Low-K
469
213
5
188
High-K
527
189
5
211
MSOP
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
θJB
Junction-to-board thermal resistance
θJC
Junction-to-case thermal resistance
MIN
TYP
SOIC
79
MSOP
120
SOIC
98
MSOP
74
MAX
UNIT
°C/W
°C/W
KEY ATTRIBUTES
CHARACTERISTICS
PARAMETER
Moisture sensitivity level
VALUE
Level 1
Flammability rating (oxygen index: 28 to 34)
UL 94 V-0 at 0.125 in
Internal pull down resistor
50 KΩ
Electrostatic discharge
Human body model
2 KV
Charged-device model
1.5 KV
Machine model
200 V
Meets or exceeds JEDEC Spec EIA/JESD78 latchup test
2
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Product Folder Link(s): SN65ELT23
SN65ELT23
www.ti.com....................................................................................................................................................................................................... SLLS925 – JUNE 2009
PECL INPUT DC CHARACTERISTICS
At VCC = 5.0 V, GND = 0.0 V (unless otherwise noted) (1) (2)
TEST
CONDITIONS
PARAMETER
VIH
High-level input voltage, single-ended
VIL
Low-level input voltage, single-ended
VIHCMR
High-level input voltage
common-mode range, differential
IIH
High-level input current
IIL
Low-level input current
(1)
(2)
(3)
(4)
See
(3)
See
(4)
TA = –40°C
MIN
TA = 25°C
TYP MAX
TA = 85°C
TYP MAX
UNIT
MIN
TYP MAX
4120 3835
4120
mV
3190 2280 3525 3190 2280 3525 3190 2280 3525
mV
3835
MIN
4120 3835
2.2
5.0
2.2
5.0
255
0.5
2.2
175
0.5
5.0
V
175
µA
µA
0.5
The device meets the specifications after thermal balance has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature
range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied
individually under normal operating conditions and not valid simultaneously.
Input and output parameters vary 1:1 with VCC. VCC can vary ±0.25 V.
TTL output RL = 500 Ω to GND
VIHCMR(min) varies 1:1 with GND, VIHCMR(max) varies 1:1 with VCC.
TTL OUTPUT DC CHARACTERISTICS
At VCC = 4.75 V to 5.25 V, TA = –40°C to 85°C (unles otherwiase noted) (1)
TYP
MAX
ICCH
Power supply current
PARAMETER
20
25
mA
ICCL
Power supply current
21
27
mA
IOS
Output short circuit current
–150
–50
mA
2.4
VCC – 0.7V
V
0.5
V
VOH
High-level output voltage
VOL
Low-level output voltage
(1)
(2)
TEST CONDITIONS
(2)
MIN
IOH = –3.0 mA
IOL = 24 mA
UNIT
The device meets the specifications after thermal balance has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature
range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied
individually under normal operating conditions and not valid simultaneously.
Max level is assured by design
AC CHARACTERISTICS
At VCC = 5.0 V, GND = 0.0 V (unless otherwise noted) (1) (2) (3)
TEST
CONDITIONS
PARAMETER
TA = –40°C
MIN
fMAX
Max switching frequency
at Vol < 0.5V
and Voh >
2.4V (see
Figure 5)
tPLH/tPHL
Propagation delay times to output
At 1.5 V
tJITTER
Random clock jitter (RMS)
VPP
Input voltage swing
tr/tf
Output rise times (10%–90%)
1.0
Output fall times (10%–90%)
0.5
(1)
(2)
(3)
(4)
(4)
TA = 25°C
TYP MAX
MIN
250
2.0
MIN
250
3.5
5.0
4.1
10
200
TA = 85°C
TYP MAX
2.0
1000
200
1.7
3.0
1.0
1.0
1.6
0.5
TYP MAX
250
3.7
5.0
3.7
10
2.0
UNIT
MHz
3.9
5.0
3.7
10
ps
1000
mV
ns
1000
200
1.8
3.0
1.0
1.9
3.0
1.1
1.6
0.5
1.3
1.6
ns
The device meets the specifications after thermal balance has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature
range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied
individually under normal operating conditions and not valid simultaneously.
VCC can vary ±0.25 V.
TTL output RL = 500 Ω to GND and CL = 20 pF to GND, see Figure 1.
VPP(min) is the minimum input swing for which AC parameters are assured.
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3
SN65ELT23
SLLS925 – JUNE 2009....................................................................................................................................................................................................... www.ti.com
Typical Output Loading Used for Device Evaluation
Application
TTL Receiver
RL
*CL
*Includes fixture
Capacitance
AC TEST LOAD
GND
Figure 1. TTL Output Loading Used for Device Evaluation
90%
10%
tf
tr
Figure 2. Output Rise and Fall Times
IN
IN
1.5 V
1.5 V
OUT
tPLH
tPHL
Figure 3. Output Propagation Delay
D
VPP(min)
VPP(max)
D
Figure 4. Input Voltage Swing
4
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): SN65ELT23
SN65ELT23
www.ti.com....................................................................................................................................................................................................... SLLS925 – JUNE 2009
OUTPUT VOLTAGE
vs
FREQUENCY
5
VCC = 5 V
VOH @ TA = −40°C
VOL @ TA = 25°C
PO − Output Voltage − V
4
VOH @ TA = 85°C
3
VOH @ TA = 25°C
2
VOL @ TA = 85°C
1
VOL @ TA = −40°C
0
0
50
100
150
200
250
300
350
400
450
500
f − Frequency − MHz
G001
Figure 5.
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): SN65ELT23
5
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN65ELT23D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ELT23
SN65ELT23DGK
ACTIVE
VSSOP
DGK
8
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
SIKI
SN65ELT23DGKR
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
SIKI
SN65ELT23DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ELT23
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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