SN65EPT23D

SN65EPT23 SLLS969A – NOVEMBER 2009 – REVISED JANUARY 2011 www.ti.com 3.3V ECL Differential LVPECL/LVDS to LVTTL/LVCMOS Translator Check for Samples: SN65EPT23 FEATURES 1 • • • • • • • Dual 3.3 V Differential LVPECL/LVDS to LVTTL/LVCMOS Buffer Translator 24 mA LVTTL Ouputs Operating Range – VCC = 3.0 V to 3.6 V – GND = 0 V Support for Clock Frequencies > 300 MHz 2.0 ns Typical Propagation Delay Built-in Temperature Compensation Drop in Compatible to MC100EPT23 PINOUT ASSIGNMENT + D0 + 1 8 VCC 7 Q0 6 Q1 5 GND + D0 2 LVPECL + LVTTL 3 D1 + D1 4 APPLICATIONS • • Data and Clock Transmission Over Backplane Signaling Level Conversion for Clock or Data Table 1. Pin Description PIN FUNCTION DESCRIPTION Q0, Q1 LVTTL/LVCMOS Outputs The SN65EPT23 is a low power dual LVPECL/LVDS to LVTTL/LVCMOS translator device. The device includes circuitry to maintain inputs at Vcc/2 when left open. The SN65EPT23 is housed in an industry standard SOIC-8 package and is also available in TSSOP-8 option. D0, D 0, D1, D 1 Differential LVPECL/LVDS/CML Inputs VCC Positive Supply GND Ground spacer ORDERING INFORMATION (1) (1) PART NUMBER PART MARKING PACKAGE LEAD FINISH SN65EPT23D/DR SN65EPT23DGK/DGKR EPT23 SOIC NiPdAu SSTI MSOP NiPdAu Leaded device option not initially available; contact TI sales representative for further information. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. © 2009–2011, Texas Instruments Incorporated SN65EPT23 SLLS969A – NOVEMBER 2009 – REVISED JANUARY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS PARAMETER CONDITION Absolute supply voltage, VCC GND = 0V Absolute input voltage, VI GND = 0 and Vi ≤ VCC Output current VALUE UNIT 3.8 V 0 to 3.8 V Continuous 50 Surge 100 mA Operating temperature range –40 to 85 °C Storage temperature range –65 to 150 °C POWER DISSIPATION RATINGS PACKAGE CIRCUIT BOARD MODEL POWER RATING TA < 25°C (mW) THERMAL RESISTANCE, JUNCTION TO AMBIENT NO AIRFLOW DERATING FACTOR TA > 25°C (mW/°C) POWER RATING TA = 85°C (mW) SOIC Low-K 719 139 7 288 High-K 840 119 8 336 Low-K 469 213 5 188 High-K 527 189 5 211 MSOP THERMAL CHARACTERISTICS PARAMETER qJB Junction-to Board Thermal Resistance qJC Junction-to Case Thermal Resistance PACKAGE VALUE UNIT SOIC 79 °C/W MSOP 120 SOIC 98 MSOP 74 °C/W KEY ATTRIBUTES CHARACTERISTICS VALUE Moisture sensitivity level Level 1 Flammability rating (Oxygen Index: 28 to 34) UL 94 V-0 at 0.125 in ESD-HBM 2 kV ESD-machine model 200 V ESD-charge device model 2 kV Internal pull down resistor 50 kΩ Internal pull up resistor 50 kΩ Meets or exceeds JEDEC Spec EIA/JESD78 latchup test 2 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): SN65EPT23 SN65EPT23 SLLS969A – NOVEMBER 2009 – REVISED JANUARY 2011 www.ti.com LVTTL OUTPUT DC CHARACTERISTICS (1) (VCC = 3.3 V; GND = 0 V, TA = -40C to 85C) (2) PARAMETER Output short circuit current VOH Output high voltage (3) IOH = –3.0 mA VOL Output low voltage IOL = 24 mA (2) (3) MIN 25°C TYP MAX –180 –140 IOS (1) –40°C CONDITION –50 MIN 85°C TYP MAX -180 –144 2.4 –50 MIN TYP MAX –180 –148 –50 2.4 2.4 0.5 UNIT mA V 0.5 0.5 V Device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. All values vary 1:1 with Vcc; Vcc can vary ±0.3V LVTTL output RL = 500 Ω to GND LVPECL INPUT DC CHARACTERISTICS (1) (VCC = 3.3 V; GND = 0.0 V) (2) –40°C PARAMETER MIN 25°C TYP MAX MIN 85°C TYP MAX MIN TYP MAX UNIT ICCH Power supply current (Outputs set to high) 15 25 15 25 15 25 mA ICCL Power supply current (Outputs set to low) 15 25 15 25 15 25 mA VIH Input high voltage 2075 2420 2075 2420 2075 2420 mV VIL Input low voltage 1355 1675 1355 1675 1355 1675 mV VIHCM Input high voltage common mode range (Differential) (3) 1.2 3.3 1.2 3.3 1.2 3.3 V 150 mA R IIH Input high current IIL Input low current 150 D –150 D (1) (2) (3) –150 –40°C PARAMETER MIN 0.5 mA Max switching frequency (4) (Figure 1–Figure 3) tPLH / tPHL Propagation delay low to high; output at 1.5V TSK++ Output to output skew++ 110 TSK- - Output to output skew- - 110 TSKPP Part to part skew tJITTER Random clock jitter (RMS) (6) 300 1.1 VPP Input voltage swing tr/tf Output rise/fall times (0.8 V – 2.0 V) 1.3 150 250 MIN TYP 85°C MAX 300 (5) (7) (3) 25°C TYP MAX fMAX (2) (3) (4) (5) (6) (7) –150 Device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Input and output parameters vary 1:1 with VCC. VCC can vary ±0.3 V. VIHCMR min varies 1:1 with GND, VIHCMR max varies 1:1 with VCC. VIHCMR is referenced to most positive side of differential signal AC CHARACTERISTICS (1) (VCC = 3.0 V to 3.6 V; GND = 0.0 V) (2) (1) 150 560 1.9 1.1 MIN TYP MAX 300 ns 110 110 ps 110 110 ps 400 400 400 ps 10 10 10 ps 1200 mV 800 ps 150 800 250 580 1.9 1.1 MHz 1.9 1200 1.3 UNIT 1200 150 800 250 1.3 600 Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Input parameters vary 1:1 with VCC. VCC can vary ±0.3V . TTL output RL = 500 Ω to GND and CL = 20 pF to GND see Figure 4. Fmax assures for functionality only; VOL and VOH levels are assured at DC only Skews are measured between outputs under identical conditions. Measured with VID = 1.5 VPP at VCM = 2.0 V and 1.2 V 200 mV input assured full logic swing at the output. Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): SN65EPT23 3 SN65EPT23 SLLS969A – NOVEMBER 2009 – REVISED JANUARY 2011 www.ti.com 5 VCC = 3°C Voltage - V 4 VOH @ -40°C 3 VOH @ 25°C 2 VOH @ 85°C VOL @ -40°C VOL @ 25°C 1 VOL @ 85°C 0 0 50 100 150 200 250 300 350 400 450 500 f - Frequency - MHz Figure 1. Maximum Switching Frequency VCC = 3.0 V 5 VCC = 3.3°C 4 Voltage - V VOH @ -40°C VOH @ 25°C 3 VOH @ 85°C 2 VOL @ -40°C VOL @ 25°C 1 0 0 VOL @ 85°C 50 100 150 200 250 300 350 400 450 500 f - Frequency - MHz Figure 2. Maximum Switching Frequency VCC = 3.3 V 4 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): SN65EPT23 SN65EPT23 SLLS969A – NOVEMBER 2009 – REVISED JANUARY 2011 www.ti.com 5 VCC = 3.6°C 4 VOH @ -40°C Voltage - V VOH @ 25°C VOH @ 85°C 3 2 VOL @ -40°C VOL @ 25°C 1 VOL @ 85°C 0 0 50 100 150 200 250 300 350 400 450 500 f - Frequency - MHz Figure 3. Maximum Switching Frequency VCC = 3.6 V Typical Output Loading Used for Device Evaluation Application TTL Receiver Characteristic Test RL *CL *CL Includes Fixture Capacitance AC TEST LOAD GND Figure 4. TTL Output Loading Used for Device Evaluation 2.0 V 0.8 V tr tf Figure 5. Output Rise and Fall Times Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): SN65EPT23 5 SN65EPT23 SLLS969A – NOVEMBER 2009 – REVISED JANUARY 2011 www.ti.com IN IN 1.5 V 1.5 V OUT tPLH tPHL Figure 6. Output Propagation Delay D VPP(min) VPP(max) D Figure 7. Input Voltage Swing 6 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): SN65EPT23 SN65EPT23 SLLS969A – NOVEMBER 2009 – REVISED JANUARY 2011 www.ti.com REVISION HISTORY Changes from Original (November 2009) to Revision A • Page Deleted last row from the Pin Description Table (EP) .......................................................................................................... 1 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): SN65EPT23 7 PACKAGE OPTION ADDENDUM www.ti.com 6-May-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN65EPT23D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 EPT23 Samples SN65EPT23DGK ACTIVE VSSOP DGK 8 80 RoHS & Green Call TI | NIPDAUAG Level-1-260C-UNLIM -40 to 85 SSTI Samples SN65EPT23DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 SSTI Samples SN65EPT23DR ACTIVE SOIC D 8 2500 RoHS & Green Level-1-260C-UNLIM -40 to 85 EPT23 Samples NIPDAU (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of