SN65HVD179DG4

SN65HVD179DG4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOIC-8

  • 描述:

    SN65HVD179DG4

  • 数据手册
  • 价格&库存
SN65HVD179DG4 数据手册
SN65HVD179 www.ti.com .................................................................................................................................................... SLLS668C – FEBRUARY 2006 – REVISED JULY 2008 5-V FULL-DUPLEX RS-485/RS-422 DRIVER AND BALANCED RECEIVER FEATURES 1 • • • • • • • • DESCRIPTION Designed for INTERBUS Applications Balanced Receiver Thresholds 1/2 Unit-Load (up to 64 nodes on the bus) Bus-Pin ESD Protection 15 kV HBM Bus-Fault Protection of –7V to 12V Thermal Shutdown Protection Power-Up/Down Glitch-free Bus Inputs and Outputs Designed for RS-422 and RS-485 Networks The SN65HVD179 is a differential line driver and differential-input line receiver that operates with a 5-V power supply. Each driver and receiver has separate input and output pins for full-duplex bus communication designs. They are designed for balanced transmission lines and interoperation with ANSI TIA/EIA-485A, TIA/EIA-422-B, ITU-T v.11, and ISO 8482:1993 standard-compliant devices. APPLICATIONS • • • • • • • Digital Motor Control Utility Meters Chassis-to-Chassis Interconnections Electronic Security Stations Industrial, Process, and Building Automation Point-of-Sale (POS) Terminals and Networks DTE/DCE Interfaces The differential bus driver and receiver are monolithic, integrated circuits designed for full-duplex bi-directional data communication on multipoint bus-transmission lines at signaling rates (1) up to 25 Mbps. The SN65HVD179 is fully enabled with no external enabling pins. The 1/2 unit load receiver has a high receiver input resistance. This results in lower bus leakage currents over the common-mode voltage range, and reduces the total amount of current that a 485 driver is forced to source or sink when transmitting. The balanced differential receiver input threshold makes the SN65HVD179 fully compatible with fieldbus requirements that define an external failsafe structure. (1) The signaling rate of a line is the number of voltage transitions that are made per second expressed in the units bps (bits per second). BALANCED RECEIVER INPUT THRESHOLDS SN65HVD179 D PACKAGE (TOP VIEW) VIT –(T Y P ) VIT+ (T Y P ) Recevier Output High VCC R D GND 8 2 7 3 6 4 5 A B Z Y 0.20 V 0.15 V 0.10 V 0.05 V 0V VID -0.05 V -0.10 V -0.15 V -0.20 V Receiver Output Low 1 D R 3 2 5 6 8 7 Y Z A B 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2008, Texas Instruments Incorporated SN65HVD179 SLLS668C – FEBRUARY 2006 – REVISED JULY 2008 .................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS SIGNALING RATE UNIT LOADS BASE PART NUMBER SOIC MARKING 25 Mbps 1/2 SN65HVD179 SN65HVD179 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) UNIT VCC Supply voltage range –0.3 V to 6 V VA, VB, VY, VZ Voltage range at any bus terminal (A, B, Y, Z) –9 V to 14 V VTRANS Voltage input, transient pulse through 100 Ω. See Figure 8 (A, B, Y, Z) VI Voltage input range (D, DE, RE) PCONT Continuous total power dissipation IO Output current (receiver output only, R) (1) (2) (3) (4) (3) –50 to 50 V –0.5 V to 7 V Internally limited (4) 11 mA Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. This tests survivability only and the output state of the receiver is not specified. The Thermal shutdown of this device internally limits the continuous total power dissipation. Thermal shutdown typically occurs when the junction temperature reaches 165°C. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX VCC Supply voltage VI or VIC Voltage at any bus terminal (separately or common mode) 1/tUI Signaling rate RL Differential load resistance VIH High-level input voltage D 2 VCC VIL Low-level input voltage D 0 0.8 VID Differential input voltage –12 12 IOH High-level output current IOL Low-level output current TJ Junction temperature (2) (1) (2) 4.5 5.5 –7 (1) 12 25 54 Driver V Mbps Ω 60 –60 Receiver UNIT V mA –8 Driver 60 Receiver 8 –40 150 mA °C The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet. See thermal characteristics table for information regarding this specification. ELECTROSTATIC DISCHARGE PROTECTION PARAMETER Human body model Bus terminals and GND Human body model (2) Charged-device-model (1) (2) (3) 2 TEST CONDITIONS (3) MIN TYP (1) MAX UNIT ±16 All pins ±4 All pins ±1 kV All typical values at 25°C and with a 5-V supply. Tested in accordance with JEDEC Standard 22, Test Method A114-A. Tested in accordance with JEDEC Standard 22, Test Method C101. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVD179 SN65HVD179 www.ti.com .................................................................................................................................................... SLLS668C – FEBRUARY 2006 – REVISED JULY 2008 DRIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions unless otherwise noted PARAMETER VI(K) MIN TYP (1) TEST CONDITIONS Input clamp voltage II = –18 mA IO = 0 |VOD(SS)| Steady-state differential output voltage 4 1.7 2.6 RL = 100 Ω, See Figure 1 (RS-422) 2.4 3.2 Vtest = –7 V to 12 V, See Figure 2 1.6 Change in magnitude of steady-state differential output voltage between states RL = 54 Ω, See Figure 1 and Figure 2 VOD(RING) Differential Output Voltage overshoot and undershoot RL = 54 Ω, CL = 50 pF, See Figure 5 and Figure 3 for definition VOC(PP) Peak-to-peak common-mode output voltage VOC(SS) Steady-state common-mode output voltage ΔVOC(SS) Change in steady-state common-mode output voltage High-impedance state output current IZ(S) or IY(S) Short Circuit output current (3) II Input current C(OD) Differential output capacitance (1) (2) (3) UNIT VCC RL = 54 Ω, See Figure 1 (RS-485) Δ|VOD(SS)| IZ(Z) or IY(Z) MAX –1.5 –0.2 V 0.2 10% (2) 0.5 See Figure 4 2.2 3.3 –0.1 0.1 VCC = 0 V, VZ or VY = 12 V, Other input at 0 V 90 µA VCC = 0 V, VZ or VY = –7 V, Other input at 0 V VZ or VY = –7 V VZ or VY = 12 V V –10 Other input at 0 V –250 250 –250 250 VI = 0, VI = 2 0 100 16 mA µA pF All typical values are at 25°C and with a 5-V supply. 10% of the peak-to-peak Differential Output voltage swing, per TIA/EIA-485. Under some conditions of short-circuit to negative voltages, output currents exceeding the ANSI TIA/EIA-485-A maximum current of 250 mA may occur. Continuous exposure may affect device reliability. DRIVER SWITCHING CHARACTERISTICS over recommended operating conditions unless otherwise noted PARAMETER TEST CONDITIONS tPLH Propagation delay time, low-to-high-level output tPHL Propagation delay time, high-to-low-level output tr Differential output signal rise time tf Differential output signal fall time tsk(p) tsk(pp) (1) (2) TYP (1) MAX 4 8 12 ns 3 6 12 ns UNIT RL = 54 Ω, CL = 50 pF, See Figure 5 Pulse skew (|tPHL - tPLH|) (2) MIN Part-to-part skew 1.4 ns 1 ns All typical values are at 25°C and with a 5-V supply. tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVD179 3 SN65HVD179 SLLS668C – FEBRUARY 2006 – REVISED JULY 2008 .................................................................................................................................................... www.ti.com RECEIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions unless otherwise noted PARAMETER MIN TYP (1) TEST CONDITIONS VIT+ Positive-going differential input threshold voltage IO = –8 mA VIT– Negative-going differential input threshold voltage IO = 8 mA Vhys Hysteresis voltage (VIT+ – VIT–) VO Output voltage V –0.2 50 mV 4.0 VID = –200 mV, IO = 8 mA, See Figure 6 Bus input current ICC Supply current UNIT 0.2 VID = 200 mV, IO = –8 mA, See Figure 6 IA or IB VA or VB = 12 V 0.20 0.3 VA or VB = 12 V, VCC = 0 V 0.24 0.4 VA or VB = –7 V V 0.3 Other input at 0 V VA or VB = –7 V, VCC = 0 V (1) MAX –0.35 –0.19 –0.25 –0.14 D at 0 V or VCC and No Load mA 2.7 mA All typical values are at 25°C and with a 5-V supply. RECEIVER SWITCHING CHARACTERISTICS over recommended operating conditions unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP (1) MAX 24 40 UNIT tPLH Propagation delay time, low-to-high-level output tPHL Propagation delay time, high-to-low-level output tsk(p) Pulse skew (|tPHL - tPLH|) tsk(pp) (2) Part-to-part skew 5 tr Output signal rise time 2 4 ns tf Output signal fall time 2 4 ns (1) (2) 4 VI = 0 V to 3 V, CL = 15 pF, See Figure 7 ns 5 CL = 15 pF, See Figure 7 ns All typical values are at 25°C and with a 5-V supply tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVD179 SN65HVD179 www.ti.com .................................................................................................................................................... SLLS668C – FEBRUARY 2006 – REVISED JULY 2008 THERMAL CHARACTERISTICS over operating free-air temperature range unless otherwise noted (1) PARAMETER TEST CONDITIONS MIN TYP MAX Low-K board (3), No airflow 230.8 High-K board (4), No airflow 135.1 θJA Junction-to-ambient thermal resistance (2) θJB Junction-to-board thermal resistance High-K board 44.4 θJC Junction-to-case thermal resistance No board 43.5 PD Device power dissipation RL= 60 Ω, CL = 50 pF, Input to D a 50% duty cycle square wave at indicated signaling rate TA Ambient air temperature TJSD Thermal shutdown junction temperature (1) (2) (3) (4) UNIT °C/W °C/W °C/W 420 Low-K board, No airflow –40 55 High-K board, No airflow –40 85 165 mW °C °C See Application Information section for an explanation of these parameters. The intent of θJA specification is solely for a thermal performance comparison of one package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a package in an application-specific environment. In accordance with the Low-K thermal metric definitions of EIA/JESD51-3. In accordance with the High-K thermal metric definitions of EIA/JESD51-7. PARAMETER MEASUREMENT INFORMATION II Y 375 Ω ±1% IY VOD 0 or 3 V Z RL Y D VOD 0 or 3 V IZ 60 Ω ±1% + _ −7 V < V(test) < 12 V Z VI VZ VY 375 Ω ±1% Figure 1. Driver VOD Test Circuit: Voltage and Current Definitions Figure 2. Driver VOD With Common-Mode Loading Test Circuit VOD(RING) is measured at four points on the output waveform, corresponding to overshoot and undershoot from theVOD(H) and VOD(L) steady state values. VOD(SS) VOD(RING) 0 V Differential VOD(RING) -VOD(SS) Figure 3. VOD(RING) Waveform and Definitions Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVD179 5 SN65HVD179 SLLS668C – FEBRUARY 2006 – REVISED JULY 2008 .................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 27 Ω ± 1% D Input Y Y VY Z VZ VOC(PP) Z 27 Ω ± 1% CL = 50 pF ±20% VOC ∆VOC(SS) VOC CL Includes Fixture and Instrumentation Capacitance Input: PRR = 500 kHz, 50% Duty Cycle,t r
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