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SN65HVD62
SLLSE94C – SEPTEMBER 2011 – REVISED MARCH 2015
SN65HVD62 AISG On-Off Keying Coax Modem Transceiver
1 Features
3 Description
•
•
•
These transceivers modulate and demodulate signals
between the logic (baseband) and a frequency
suitable for long coaxial media.
1
•
•
•
•
•
•
•
Supply Ranging From 3V to 5.5V
Independent Logic Supply of 1.6V to 5.5V
Wide Input Dynamic Range of –15dBm to +5dBm
for Receiver
Power Delivered by the Driver to the Coax can be
Adjusted From 0dBm to +6dBm
AISG Compliant Output Emission Profile
Low-power Standby Mode
Direction Control Output for RS-485 Bus
Arbitration
Supports up to 115 kbps Signaling
Integrated Active Bandpass Filter with Center
Frequency at 2.176MHz
3mm × 3mm 16-Pin QFN Package
The HVD62 receiver integrates an active bandpass
filter to enable demodulation of signals even in the
presence of spurious frequency components. The
filter has a 2.176 MHz center frequency.
The transmitter supports adjustable output power
levels varying from +0dBm to +6dBm delivered to the
50 Ω coax cable. The HVD62 transmitter is compliant
with the spectrum emission requirement provided by
the AISG standard.
A direction control output is provided which facilitates
bus arbitration for an RS-485 interface. These
devices integrate an oscillator input for a crystal, and
also accept standard clock inputs to the oscillator.
2 Applications
•
•
•
The HVD62 is an integrated AISG transceiver
designed to be compliant with Antenna Interface
Standards Group v2.0 specification.
AISG – Interface for Antenna Line Devices
Tower Mounted Amplifiers (TMA)
General Modem Interfaces
Device Information(1)
PART NUMBER
SN65HVD62
PACKAGE
BODY SIZE (NOM)
VQFN (16)
3.00 mm x 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Block Diagram
Vcc
13
VL
3
1
9
XTAL1
14
XTAL2 15
TXIN
DIRSET1
DIRSET2
DIR
RXOUT
FILTER
OOK
MOD
XTAL
Buffer
OUTPUT
STAGE
PREAMP
12
SYNCOUT
RES
TXOUT
2.176
2
7
6
Control
Logic
5
FILTER
OOK
DEMOD
4
11
Buffer
RXIN
2.176
Buffer
COMP
RECEIVER
THRESHOLD
16
GND
8
GND
10
BIAS
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN65HVD62
SLLSE94C – SEPTEMBER 2011 – REVISED MARCH 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Block Diagram........................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
4
4
4
5
6
7
8
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Thermal Information ..................................................
Recommended Operating Conditions.......................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Typical Characteristics ..............................................
8
9
Parameter Measurement Information ................ 11
Detailed Description ............................................ 14
9.1 Overview ................................................................. 14
9.2 Functional Block Diagram ....................................... 14
9.3 Device Functional Modes........................................ 14
10 Application and Implementation........................ 16
10.1 Application Information.......................................... 16
11 Device and Documentation Support ................. 18
11.1
11.2
11.3
11.4
Documentation Support .......................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (January 2013) to Revision C
Page
•
Added Device Information table,ESD Ratings table, Device Functional Modes, Application and Implementation
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section. .................................................................................................................................................................................. 1
•
Moved the Storage temperature From: Thermal Information To: Absolute Maximum Ratings (1) ......................................... 4
•
Changed TA in the Recommended Operating Conditions From: MAX = 85°C To: MAX = 105°C ......................................... 5
Changes from Revision A (January 2012) to Revision B
Page
•
Changed Features From: "Power Delivered by the Driver to the Coax can be Adjusted +3dBm to +6dBm" To:
"Power Delivered by the Driver to the Coax can be Adjusted 0dBm to +6dBm" ................................................................... 1
•
Added Storage temperature to the Thermal Information........................................................................................................ 4
•
Change the MIN value of VRES in the ROC table From: 0.84 To: 0.7 V ................................................................................. 5
•
Change the TYP value of CC in the ROC table From: 270 To: 220 nF.................................................................................. 5
•
Changed the Electrical Characteristics................................................................................................................................... 6
•
Changed the Switching Characteristics.................................................................................................................................. 7
•
Added the Typical Characteristics section.............................................................................................................................. 8
•
Changed the Parameter Measurement Information section................................................................................................. 11
•
Changed the Application Information section ....................................................................................................................... 16
Changes from Original (September 2011) to Revision A
Page
•
Changed Pin 4 label (lower right) in the Pin Configuration and Functions diagram from TXIN to RXOUT ........................... 3
•
Changed the Pin Functions table by merging the DESCRIPTION cells for pins 5, 6, and 7 and deleted the word
DIRSET from the beginning of the second line in that description field. ................................................................................ 3
•
Added rows 162 and 163 to the Electrical Characteristics table, under RECEIVER FILTER section ................................... 6
•
Added rows 210 and 211 to the Switching Characteristics table ........................................................................................... 7
•
Added Table 1 and Table 2 .................................................................................................................................................. 15
•
Added Figure 22 State Transition Diagram .......................................................................................................................... 15
2
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6 Pin Configuration and Functions
RES
BIAS
RXIN
TXOUT
RGT (VQFN) Package
16 Pins
Top View
VCC
GND
XTAL1
DIRSET1
Exposed
text
Pad
GND
DIR
VL
TXIN
RXOUT
DIRSET2
SYNCOUT
XTAL2
Pin Functions
PIN
HVD62 PIN
DESCRIPTION
NAME
1
SYNCOUT
Open drain output to synchronize other devices to the 4x-carrier oscillator at XTAL1,2. (8.704 MHz for HVD62)
2
TXIN
Digital data bit stream to driver.
3
VL
Logic supply voltage for the device.
4
RXOUT
Digital data bit stream from receiver.
5
DIR
6
DIRSET2
7
DIRSET1
DIR: Direction control output signal for bus arbitration.
DIRSET1 and DIRSET2: Bits to set the duration of DIR
DIRSET[2,1]:[L,L]=9.6kbps [L,H]=38.4kbps [H,L]=115kbps [H,H]=Standby Mode
8
GND
Ground
9
RES
Input voltage to adjust driver output power. Set by external resistors from BIAS pin to GND.
10
BIAS
Bias voltage output for setting driver output power by external resistors.
11
RXIN
Modulated input signal to the receiver.
12
TXOUT
Modulated output signal from the driver.
13
VCC
Analog supply voltage for the device.
14
XTAL1
15
XTAL2
Crystal oscillator’s IO pins. Connect a 4 x fC crystal between these pins. Or connect XTAL1 to an 8.704 MHz
clock and connect XTAL2 to GND.
16
GND
Ground
EP
Exposed pad. Recommended to be connected to ground plane for best thermal conduction.
-
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7 Specifications
7.1 Absolute Maximum Ratings (1)
VALUES
UNIT
MIN
MAX
Supply voltage, VCC and VL
–0.5
6
V
Voltage range at coax pins
–0.5
6
V
Voltage range at logic pins
–0.3
VL + 0.3
V
Logic Output Current
–20
20
mA
TXOUT output current
Internally limited
SYNCOUT output current
Internally limited
Junction Temperature, TJ
170
Storage temperature, TSTG
–65
Continuous total power dissipation
(1)
°C
150
See the Thermal Information
°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
VALUE
UNIT
±2000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.3 Thermal Information
SN65HVD62
THERMAL METRIC (1)
RGT (VQFN)
UNIT
(16) PINS
RθJA
Junction-to-ambient thermal resistance
49.4
RθJCtop
Junction-to-case (top) thermal resistance
64.2
RθJB
Junction-to-board thermal resistance
22.9
ψJT
Junction-to-top characterization parameter
1.7
ψJB
Junction-to-board characterization parameter
22.9
RθJCbot
Junction-to-case (bottom) thermal resistance
25.0
(1)
4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.4 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
VCC
Analog supply voltage
VL
Logic supply voltage
VI(pp)
Input signal amplitude at RXIN
VIH
High-level input voltage
VIL
Low-level input voltage
1/tUI
Data signaling rate
FOSC
Oscillator frequency
TA
Operating free-air temperature
–40
105
°C
TJ
Junction Temperature
–40
125
°C
TXIN, DIRSET1, DIRSET2
3
5.5
1.6
5.5
V
1.12
Vpp
70%VL
VL
70%VCC
VCC
TXIN, DIRSET1, DIRSET2
0
30%VL
XTAL1, XTAL2
0
30%VCC
XTAL1, XTAL2
9.6
HVD62
–30 ppm
8.704
V
V
V
115
kbps
30 ppm
MHz
Load impedance between TXOUT to RXIN
50
Load impedance between RXIN and GND at fC (channel)
50
R1
Bias resistor between BIAS and RES
4.1
kΩ
R2
Bias resistor between RES and GND
10
kΩ
RSYNC
Pull-up resistor between SYNCOUT and VCC
1
kΩ
VRES
Voltage at RES pin
CC
Coupling capacitance between RXIN and Coax (channel)
CBIAS
Capacitance between BIAS and GND
RLOAD
0.7
Ω
1.5
nF
1
µF
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220
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7.5 Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
28
33
25
31
27
33
12
17
UNIT
POWER SUPPLY
100
TXIN = L (Active)
101
TXIN = H (Quiescent)
102
ICC
Supply current (VCC)
TXIN = 115 kbps,
50% duty cycle
99
DIRSET1 = L
DIRSET2 = H
(Standby) DIRSET1 = DIRSET2=H
103
IL
Logic supply current
TXIN = H, RXIN = DC input
104
ΔVRXIN/
ΔVCC
Receiver power supply rejection ratio
VTXIN = VL
50
45
60
mA
µA
dB
LOGIC PINS
112
VOH
High-level logic output voltage
(RXOUT, DIR)
IOH = –4 mA for VL > 2.4V,
IOH = –2 mA for VL < 2.4V
113
VOL
Low-level logic output voltage
(RXOUT, DIR)
IOL = 4 mA for VL > 2.4V,
IOL = 2 mA for VL < 2.4V
114
IIH/IIL
Logic input current (DIRSET1/2)
IIH/IIL
Logic input current (TXIN)
90%VL
V
10%VL
V
-1
10
µA
-2
1
µA
COAX DRIVER
130
132
130A
132A
134
134A
VOPP
Peak-to-peak output voltage at device pin
TXOUT (See Figure 19)
VRES = 1.5 V (Maximum setting)
VOPP
Peak-to-peak voltage at coax out (See
Figure 19)
VRES = 1.5 V
VOZ
Off-state output voltage
136
41
fo
Output frequency (HVD62)
∆f
Output frequency variation
143
144
145
2.5
1.17
5
VRES = 0.7 V
At coax out
Coupled to coaxial cable with characteristic
impedance 50 Ohms, as shown in Figure 1. With a
recommended 470 pF capacitor between RXIN
and GND. Measurements above 150 MHz are
determined by setup.
1.3
6
-0.6
At TXOUT
Output emissions
142
2.24
VRES = 0.7 V (Minimum setting)
0.3
VPP
dBm
1
mVpp
-60
dBm
Conforms to AISG
spectrum emissions mask,
3GPP TS 25.461, see
Figure 21
2.176
–100
MHz
100
ppm
At 100 kHz
0.03
Ω
At 10 MHz
3.5
Ω
Short-circuit output current
TXOUT is also protected by a thermal shutdown
circuit during short-circuit faults
300
450
mA
VIT
Input threshold
fIN = 2.176 MHz
ZIN
Input impedance
Zo
Output impedance
| IOS |
COAX RECEIVER
152
152A
154
79
112
158
mVPP
–18
–15
–12
dBm
f = fO
11
21
Passband
VRXIN = 1.12VP_P
1.1
4.17
MHz
Receiver rejection range
2.176MHz carrier amplitude of 112.4 mVPP,
Frequency band of spurious components with 800
mVPP allowed.
1.1
4.17
MHz
Receiver noise filter time (slow bit rate)
DIRSET for 9.6kbps
4
Receiver noise filter time (fast bit rate)
DIRSET for > 9.6 kbps
2
Input leakage current
XTAL1, XTAL2, 0V < VIN < VCC
Output low voltage
SYNCOUT, with 1 kΩ resistor from SYNCOUT to
VCC
kΩ
RECEIVER FILTER
160
161
162
163
fPB
fREJ
tnoise
filter
µs
XTAL AND SYNC
171
172
6
II
VOL
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–15
15
µA
0.4
V
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7.6 Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tpAQ, tpQA
Coax driver propagation delay
See Figure 19
202
tr, tf
Coax receiver output rise/fall
time
CL = 15 pF, RL = 1 kΩ, See Figure 19
203
tPHL, tPLH
Receiver propagation delay
See Figure 20
204
Duty Cycle Coax receiver output duty cycle
201
214
206
207
MIN
5.5
Direction control active duration
208
tDIR
210
tDIS
Standby disable delay
211
tEN
Standby enable delay
Skew
µs
20
ns
11
µs
60%
VRXIN(ON) = 200 mVpp, VRXIN(OFF) < 5
mVpp, 50% duty cycle
40%
60%
1667
DIRSET2 = GND, DIRSET1 = VL
417
DIRSET2 = VL, DIRSET1 = VL
137
270
300 mVPP at 2.176 MHz on RXIN
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ns
2
2
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UNIT
5
40%
Direction control skew
(DIR to RXOUT)
209
MAX
VRXIN(ON) = 630 mVpp, VRXIN(OFF) < 5
mVpp, 50% duty cycle
DIRSET2 = DIRSET1 = GND or OPEN
tDIR
TYP
ms
7
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7.7 Typical Characteristics
10
±60
AISG Mask
50% Duty Cycle
CF = 470pF
±70
±10
TRANSMITTER OUTPUT (dBm)
TRANSMITTER OUTPUT (dBm)
0
±20
AISG Mask
±30
±40
±50
50% Duty Cycle
CF = 470pF
±80
±90
±100
±60
±110
±70
±120
±80
0
10M
20M
FREQUENCY (Hz)
30M
30M
130M
230M
FREQUENCY (Hz)
330M
C00
C00
Figure 1. Low Frequency Emissions Spectrum with 9.6 kbps
Signaling Rate
Figure 2. High Frequency Emissions Spectrum with 9.6
kbps Signaling Rate
10
±60
AISG Mask
50% Duty Cycle
cF = 470 pF
0
±70
TRANSMITTER OUTPUT (dBm)
TRANSMITTER OUTPUT (dBm)
±10
±20
AISG Mask
±30
±40
50% Duty Cycle
CF = 470pF
±80
±90
±100
±50
±60
±110
±70
±120
±80
0
10M
20M
FREQUENCY (Hz)
30M
30M
130M
230M
FREQUENCY (Hz)
330M
C00
C00
Figure 3. Low Frequency Emissions Spectrum with 38.4
kbps Signaling Rate
Figure 4. High Frequency Emissions Spectrum with 38.4
kbps Signaling Rate
10
±60
AISG Mask
50% Duty cycle
cF = 470 pF
±70
±10
TRANSMITTER OUTPUT (dBm)
TRANSMITTER OUTPUT (dBm)
0
±20
AISG Mask
±30
±40
±50
50% Duty Cycle
CF = 470pF
±80
±90
±100
±60
±110
±70
±120
±80
0
10M
20M
FREQUENCY (Hz)
30M
30M
Figure 5. Low Frequency Emissions Spectrum with 115.2
kbps Signaling Rate
8
130M
230M
330M
FREQUENCY (Hz)
C00
C00
Figure 6. High Frequency Emissions Spectrum with 115.2
kbps Signaling Rate
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40
6
35
5
30
4
TRANSMITTER OUTPUT (dBm)
TRANSMITTER OUTPUT IMPEDANCE ()
Typical Characteristics (continued)
25
20
15
10
5
3
2
1
0
±1
0
±2
0.1M
1M
10M
FREQUENCY (Hz)
0.7
0.9
1.1
VRES (V)
1.3
1.5
C00
C00
Figure 7. Transmitter Output Impedance
Figure 8. Transmit Power Adjustment
13
27
12.8
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
TXIN = VL
12.9
TXIN = VL
26.5
26
25.5
25
12.7
12.6
12.5
12.4
12.3
12.2
24.5
12.1
24
12
3
3.5
4
4.5
5
3
5.5
3.5
SUPPLY VOLTAGE (V)
4
4.5
5
C00
C00
Figure 9. Supply Current versus Supply Voltage while
Transmitting
Figure 10. Supply Current versus Supply Voltage in Standby
Mode
13.2
7
13.1
6
TRANSMITTER OUTPUT (dBm)
QUIESCENT CURRENT (mA)
5.5
SUPPLY VOLTAGE (V)
13
12.9
12.8
12.7
12.6
5
4
3
2
1
12.5
0
12.4
-40
-10
20
50
80
3
110
TEMPERATURE (OC)
3.5
4
4.5
5
5.5
SUPPLY VOLTAGE (V)
C00
C00
Figure 11. Supply Current versus Temperature in Standby
Mode
Figure 12. Transmitter Output Power versus Supply Voltage
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Typical Characteristics (continued)
30k
7
25k
RECEIVER INPUT IMPEDANCE ()
TRANSMITTER OUTPUT (dBm)
6
5
4
3
2
20k
15k
10k
5k
1
0
0
-40
-10
20
50
80
TEMPERATURE
100
110
1k
(OC)
10k
100k
1M
5M
FREQUENCY (Hz)
C00
Figure 13. Transmitter Output Power versus Temperature
C00
Figure 14. Receiver Input Impedance versus Frequency
0.16
360
DIR RECEIVER OUTPUT DELAY (nS)
RECEIVER IINPUT THRESHOLD (V)
0.15
0.14
0.13
RTXOUT=STABLE LOW
0.12
0.11
RXOUT=STABLE HIGH
0.1
355
350
345
0.09
0.08
340
-40
-10
20
50
80
110
-40
-10
TEMPERATURE (OC)
20
50
80
110
TEMPERATURE (OC)
C00
Figure 15. Receiver Input Threshold versus Temperature
C00
Figure 16. DIR Output Delay versus Temperature
60
RECEIVER OUTPUT DUTYCYCLE (%)
RECEIVER OUTPUT DUTYCYCLE (%)
60
56
52
48
44
40
50
40
30
20
10
0
-10
-7
-4
-1
2
5
-10
RECEIVER INPUT (dBm)
-4
-1
2
5
RECEIVER INPUT (dBm)
C00
Figure 17. Receiver Duty Cycle with 9.6 kbps Signaling Rate
10
-7
C00
Figure 18. Receiver Duty Cycle with 115.2 kbps Signaling
Rate
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8 Parameter Measurement Information
Signal generator rate is 115 kbps, 50% duty cycle, rise and fall times less than 6 nsec, nominal output levels 0V
and 3V. Coupling capacitor Cc is 220 nF.
Driver Amplitude
Adjust
RAMP
XTAL2
2.176 MHz
Crystal
RES
TXOUT
TXIN
50 W
XTAL2
Signal
generator
Coax
Out
50 W
Cc
RXIN
VL
0.5 VL
TXIN
tpQA
tpAQ
Vpk
0.5 Vpk
TXOUT
Figure 19. Measurement of Modem Driver Output Voltage With 50 Ω Loads
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Parameter Measurement Information (continued)
TXOUT
50
2.176 MHz
Signal
Coax
In
Received
Data Out
Cc
RXIN
Direction
Control
Vpk
0.5 VL
RXIN
VL
0.5 VL
RXOUT
tPHL
tPLH
VL
0.5 VL
DIR
tDIRSKEW
Figure 20. Measurement of Modem Receiver Propagation Delays
12
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Parameter Measurement Information (continued)
Emissions spectrum with 50% duty cycle OOK and VRES=1.5V
conforms to TS 25.461
10
2.076, 5
2.276, 5
0
Emissions (dBm) with OOK and VRES=1.5V
1.976, -5
2.376, -5
-10
-20
1.676, -25
2.676, -25
-30
10, -36
1, -36
20, -36
-40
-50
-60
30, -67
-70
0.1
1
10
100
Frequency (MHz)
Figure 21. AISG Emissions Template
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9 Detailed Description
9.1 Overview
If DIRSET1 and DIRSET2 are in a logic High state, the device will be in STANDBY mode. While in STANDBY
mode, the Receiver functions normally, detecting carrier frequency activity on the RXIN pin and setting the
RXOUT state as discussed below. But the Transmitter circuits are not active in STANDBY, thus the TXOUT pin
is idle regardless of the logic state of TXIN. The supply current in STANDBY mode is significantly reduced,
allowing power savings when the node is not transmitting.
9.2 Functional Block Diagram
Vcc
13
VL
3
1
9
XTAL1
14
XTAL2 15
TXIN
DIRSET1
DIRSET2
DIR
RXOUT
FILTER
OOK
MOD
XTAL
Buffer
OUTPUT
STAGE
PREAMP
12
SYNCOUT
RES
TXOUT
2.176
2
7
6
Control
Logic
5
FILTER
OOK
DEMOD
4
11
Buffer
RXIN
2.176
Buffer
COMP
RECEIVER
THRESHOLD
16
GND
8
GND
10
BIAS
9.3 Device Functional Modes
When not in STANDBY mode, the default power-on state is IDLE. When in IDLE mode, RXOUT is High, and
TXOUT is quiet. The device transitions to RECEIVE mode when a valid modulated signal is detected on the
RXIN line the device transitions to TRANSMIT mode when TXIN goes Low. The device stays in either
RECEIVE or TRANSMIT mode until DIR Timeout (nominal 16 bit times) after the last activity on RXOUT or TXIN.
When in RECEIVE mode:
• RXOUT responds to all valid modulated signals on RXIN, whether from the local transmitter, a remote
transmitter, or long noise burst.
• TXOUT responds to TXIN, generating 2.176 MHz signals on TXOUT when TXIN is Low, and TXOUT is quiet
when TXIN is High. (In normal operation, TXIN is expected to remain High when the device is in RECEIVE
mode).
• The device stays in RECEIVE mode until 16 bit times after the last rising edge on RXOUT, caused by valid
modulated signal on the RXIN line.
When in TRANSMIT mode:
• RXOUT stays High, regardless of the input signal on RXIN.
• TXOUT responds to TXIN, generating 2.176 MHz signals on TXOUT when TXIN is Low, and TXOUT is quiet
when TXIN is High.
• The device stays in TRANSMIT mode until 16 bit times after TXIN goes High.
14
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Device Functional Modes (continued)
Table 1. Driver Function Table (1)
TXIN
[DIRSET1, DIRSET2]
H
[L,L], [L,H] or [H,L]
L
X
(1)
TXOUT
COMMENT
< 1 mVPP at 2.176 MHz
Driver not active
VOPP at 2.176 MHz
[H,H]
Driver active
< 1 mVPP at 2.176 MHz
Standby mode
H = High, L = Low, X = Indeterminate
Table 2. Receiver and DIR Function Table (1)
RXIN
RXOUT
DIR
COMMENT (see Figure 22)
H
L
No outgoing or incoming signal
< VIT at 2.176 MHz for less than tDIR Timeout
H
H
Incoming '1' bit, DIR stays HIGH for DIR Timeout
> VIT at 2.176 MHz for longer than tnoise filter
L
H
Incoming '0' bit, DIR output is HIGH
H
L
Outgoing message, DIR stays LOW for DIR Timeout
IDLE mode (not transmitting or receiving)
< VIT at 2.176 MHz for longer than DIR timeout
RECEIVE mode (not already transmitting)
TRANSMIT mode (not already receiving)
X
(1)
H = High, L = Low
Transmit 0
RXIN 9
TXOUT=Active
DIR = L
Receive 0
RXOUT = L
DIR = H
TXIN ;
IDLE
TXIN 9
RXOUT = H
TXOUT=Idle
DIR = L
TXIN ;
Transmit 1
RXIN 9
RXIN ;
Receive 1
DIR Timeout
TXOUT=Idle
DIR = L
DIR Timeout
RXOUT = H
DIR = H
Figure 22. State Transition Diagram
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
10.1.1 Driver Amplitude Adjust
The SN65HVD62 can provide up to 2.5 V peak-to-peak of output signal at the TXOUT pin to compensate for
potential loss within the external filter, cable, connections, and termination. External resistors are used to set the
amplitude of the modulated driver output signal. Resistors connected across RES and BIAS set the output
amplitude. The maximum peak-to-peak voltage at TXOUT is 2.5 V, corresponding to +6 dBm on the coaxial
cable. The TXOUT voltage level can be adjusted by choice of resistors to set the voltage at the RES pin.
according to the following equation:
VTXOUT (VP-P) = (2.5 VP-P x VRES (V))/1.5 V VRES (V) = 1.5 V x R2/(R1 + R2) VTXOUT (VP-P) = 2.5 VP-P x R2/(R1 + R2). (1)
The voltage at the RES pin should be between 0.7 V and 1.5 V. Connect RES directly to the BIAS (R1 = 0 Ω) for
maximum output level of 2.5 V peak-to-peak. This gives a minimum voltage level at TXOUT of 1.2 V peak-topeak, corresponding to about 0 dBm at the coaxial cable. A 1 μF capacitor should be connected between the
BIAS pin and GND. To obtain a nominal power level of +3 dBm at the feeder cable as the AISG standard
requires, use R1 = 4.1k Ω and R2 = 10k Ω that provide 1.78 VP-P at TXOUT.
10.1.2 Direction Control
In many applications the mast-top modem which receives data from the base will then distribute the received
data through an RS-485 network to several mast-top devices. When the mast-top modem receives the first logic
0 bit (active modulated signal) it will take control of the mast-top RS-485 network by asserting the Direction
Control signal. The duration of the Direction Control assertion should be optimized to pass a complete message
of length B bits at the known signaling rate (1/tBIT) before relinquishing control of the mast-top RS-485 network.
For example, if the messages are 10 bits in length (B=10) and the signaling rate is 9600 bits per second (tBIT =
0.104 msec) then a positive pulse of duration 1.7 msec is sufficient (with margin to allow for network propagation
delays) to enable the mast-top RS-485 drivers to distribute each received message.
Coax In
Data Out
Direction
10.1.3 Direction Control Time Constant
The time constant for the Direction Control function can be set by the Control Mode pins, DIRSET1/DIRSET2.
These pins should be set to correspond to the desired data rate. With no external connections to the Control
Mode pins, the internal time constant is set to the maximum value, corresponding to the minimum data rate.
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Application Information (continued)
10.1.4 Conversion Between dBm and Peak-to-peak Voltage
dBm = 20 × LOG10 [Volts-pp / SQRT(0.008 × Zo)] = 20 × LOG10 [Volts-pp / 0.63] for Zo = 50 Ω
Volts-pp = SQRT(0.008 × Zo) × 10(dBm/20) = 0.63 × 10(dBm/20) for Zo = 50 Ω
(2)
(3)
The following table shows conversions between dBm and peak-to-peak voltage with 50 Ω load, for various levels
of interest including reference levels from the 3GPP TS 25.461 Technical Specification.
SIGNAL ON COAX (Iuant Layer 1)
dBm
Vpp (V)
Maximum Driver ON Signal
5
1.12
Nominal Driver ON Signal
3
0.89
Minimum Driver ON Signal
1
0.71
AISG Maximum Receiver Threshold
–12
0.16
Nominal Receiver Threshold
–15
0.11
Minimum Receiver Threshold
–18
0.08
Maximum Driver OFF Signal
–40
0.006
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11 Device and Documentation Support
11.1 Documentation Support
11.2 Trademarks
All trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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14-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN65HVD62RGTR
ACTIVE
VQFN
RGT
16
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 105
HVD62
SN65HVD62RGTT
ACTIVE
VQFN
RGT
16
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 105
HVD62
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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