SN65LVCP418
SLLS856A – JUNE 2009 – REVISED NOVEMBER 2011
www.ti.com
8-Channel Gigabit Signal Conditioning Buffer
Check for Samples: SN65LVCP418
FEATURES
DESCRIPTION
•
The SN65LVCP418 is an 8 Channel signal
conditioning buffer in a flow-through pin-out allowing
for ease in PCB layout. VML signaling is used to
achieve a high-speed data throughput while using low
power. Internal signal paths are fully differential to
achieve the high signaling speeds while maintaining
low signal skews. The SN65LVCP418 incorporates
100-Ω termination resistors for those applications
where board space is a premium. Built-in transmit
pre-emphasis and receive equalization for superior
signal integrity performance.
23
•
•
•
•
•
•
•
•
•
•
•
8 Input and 8 Output Signal Conditioning
Buffer
Up to 4.25 Gbps Operation
30 ps of Deterministic Jitter
Selectable Transmit Pre-Emphasis Per Lane
Selectable Receive Equalization
Available Packaging 64 Pin QFP
Propagation Delay Times: 400 ps Typical
Inputs Electrically Compatible With CML
Signal Levels
Operates From a Single 3.3-V Supply
Ability to 3-State Outputs
Integrated Termination Resistors
I2C™ Control Interface
The SN65LVCP418 is characterized for operation
from –40°C to 85°C.
VCC
I2C_EN
NC
GND
0Y
0Z
VCC
1Y
1Z
GND
2Y
2Z
VCC
3Y
3Z
GND
1
APPLICATIONS
•
•
•
•
•
Clock Buffering/Clock MUXing
Wireless Base Stations
High-Speed Network Routing
Telecom/Datacom
XAUI 802.3ae Protocol Backplane Repeaters
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
GND
VCC
RESN
GND
0A
0B
VCC
1A
1B
GND
2A
2B
VCC
3A
3B
VBB
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
ADDR2
ADDR1
SDA
SCL
GND
4Y
4Z
VCC
5Y
5Z
GND
6Y
6Z
VCC
7Y
7Z
GND
4A
4B
VCC
5A
5B
GND
6A
6B
VCC
7A
7B
GND
VCC
EQ
PRE
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
I2C is a trademark of Philips Electronics.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2011, Texas Instruments Incorporated
SN65LVCP418
SLLS856A – JUNE 2009 – REVISED NOVEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
VBB
I2C
IF
Registers
LOGIC DIAGRAM
ADDR1
ADDR2
SCL
SDA
RESN
I2C_EN
EQ_0
RT
PRE
2
0A
RT
0B
0Y
0Z
EQ
3-State_0
VBB
EQ_1
RT
PRE
2
1A
RT
1B
1Y
1Z
EQ
3-State_1
VBB
EQ_2
RT
PRE
2
2A
RT
2B
2Y
2Z
EQ
3-State_2
VBB
EQ_3
RT
PRE
2
3A
3B
RT
3Y
3Z
EQ
3-State_3
VBB
EQ_4
RT
PRE
2
4A
4B
VBB
RT
4Y
4Z
EQ
3-State_4
EQ_5
RT
PRE
2
5A
5B
RT
5Y
5Z
EQ
3-State_5
VBB
EQ_6
RT
PRE
2
6A
6B
RT
6Y
6Z
EQ
3-State_6
VBB
EQ_7
RT
PRE
2
7A
7B
RT
7Y
7Z
EQ
3-State_7
2
A.
VBB: Receiver input internal biasing voltage (allows ac coupling)
B.
RT: Internal 50-Ω receiver termination (100-Ω differential)
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SN65LVCP418
SLLS856A – JUNE 2009 – REVISED NOVEMBER 2011
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PIN FUNCTIONS
PIN
NAME
TYPE
NO.
DESCRIPTION
HIGH SPEED I/O
xA
5, 8, 11, 14,
18, 21,
24 ,27
xB
6, 9, 12, 15,
19, 22, 25,
28
xY
34, 37, 40
43, 51, 54,
57, 60
xZ
33, 36, 39,
42, 50, 53,
56, 59
Differential Inputs (with 50-Ω
termination to Vbb) xA=P;
xB=N
Line Side Differential Inputs CML compatible
Differential Output xY=P;
xZ=N
Switch Side Differential Outputs. VML
Inputs
I2C Control Interface (SCL: Clock, SDA: Data, ADDR: Address)
CONTROL SIGNALS
SCL
45
SDA
46
ADDR1
47
ADDR2
48
EQ
31
Input
Equalization setting when I2C is not enabled. EQ=0 13dB and EQ=1 for 9dB
PRE
32
Input
Pre-Emphasis setting when I2C is not enabled. PRE=0 for 0 dB and PRE=1
for 6 dB
I2C_EN
63
Input
Enables I2C control interface I2C_EN=1 for enable; When EN=0 then the
PRE and EQ pins are used to set the Pre-Emphasis and Equalization
settings rather than the I2C register map.
NC
62
Input
No Connect
RESN
3
Input (Active Low)
Configuration Reset. Resets I2C register space; Note upon device startup
the RESN pin must be driven low to reset the device registers.
Power Supply 3.3v±5%
POWER SUPPLY
VCC
2, 7, 13, 20,
26, 30, 35,
41, 52, 58,
64
Power
GND
1,4, 10, 17,
23, 29 , 38,
44, 49, 55,
61
Ground
PowerPAD™
VBB
16
Ground
The ground center pad of the package must be connected to GND plane.
Input
Receiver input biasing voltage
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SN65LVCP418
SLLS856A – JUNE 2009 – REVISED NOVEMBER 2011
www.ti.com
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
VCC
IN+
RT(SE)
= 50 W
Gain
Stage
+ EQ
VCC
RBBDC
RT(SE)
= 50 W
IN−
VBB
ESD
LineEndTermination
Self−Biasing Network
Figure 1. Equivalent Input Circuit Design
OUT+
49.9 W
OUT−
49.9 W
VOCM
1 pF
Figure 2. Common-Mode Output Voltage Test Circuit
AVAILABLE OPTIONS
(1)
(2)
TA
DESCRIPTION
–40°C to 85°C
Multi Channel Gigabit Signal Conditioner
PACKAGED DEVICE (1)
(2)
PAP (64 pin)
SN65LVCP418
The package is available taped and reeled. Add an R suffix to device types (e.g., SN65LVCP418PAP). Temperature range assumes 1
m/s airflow.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
PACKAGE THERMAL CHARACTERISTICS
PACKAGE THERMAL CHARACTERISTICS (1)
NOM
UNIT
θJA (junction-to-ambient)
21.2
°C/W
(1)
4
100LFM airflow is required otherwise a 4x4 thermal via
array must be implemented with 6 layer or greater PCB
See application note SPRA953 for a detailed explaniation of thermal parameters.
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SN65LVCP418
SLLS856A – JUNE 2009 – REVISED NOVEMBER 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
VCC
Supply voltage range
(2)
Voltage range
ESD
TJ
–0.5 V to 4 V
Receiver inputs
Human Body Model (3)
Charged-Device Model
–0.5 V to 6 V
–0.5 V to (VCC + 0.5 V)
Control inputs, all outputs
All pins
(4)
6 kV
All pins
Maximum junction temperature
500 V
See Package Thermal Characteristics Table
Moisture sensitivity level
(1)
(2)
(3)
(4)
2
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
Tested in accordance with JEDEC Standard 22, Test Method A114-A.
Tested in accordance with JEDEC Standard 22, Test Method C101.
RECOMMENDED OPERATING CONDITIONS
MIN
dR
Operating data rate
VCC
Supply voltage
VCC(N)
Supply voltage noise amplitude
TJ
Junction temperature
TA
Operating free-air temperature (1)
3.135
NOM
3.3
MAX
UNIT
4.25
Gbps
3.465
V
10 Hz to 2.125 GHz
20
mV
125
°C
°C
Assumes 4×4 thermal via array is
implemented with 6 layer or greater PCB
otherwise 100LFM airflow is required.
–40
85
dR(in) ≤ 4.25 Gbps
100
1750
mVPP
1.25 Gbps < dR(in) ≤ 4.25 Gbps
100
1560
mVPP
dR(in) > 4.25 Gbps
100
1000
mVPP
Note: for best jitter performance ac
coupling is recommended.
1.5
DIFFERENTIALINPUTS
Receiver peak-to-peak differential input
voltage (2)
VID
VICM
Receiver common-mode
input voltage
1.6 V
CC *
|V
|
ID
2
V
CONTROL INPUTS
VIH
High-level input voltage
2
VCC + 0.3
V
VIL
Low-level input voltage
–0.3
0.8
V
120
Ω
DIFFERENTIAL OUTPUTS
RL
(1)
(2)
Differential load resistance
80
100
Maximum free-air temperature operation is allowed as long as the device maximum junction temperature is not exceeded.
Differential input voltage VID is defined as | IN+ – IN– |.
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
DIFFERENTIAL INPUTS
VIT+
Positive going differential
input high threshold
VIT–
Negative going differential
input low threshold
A(EQ)
Equalizer gain
RT(D)
Termination resistance,
differential
VBB
Open-circuit Input voltage (input
self-bias voltage)
R(BBDC)
Biasing network dc
impedance
R(BBAC)
Biasing network ac
impedance
50
–50
at 1.875 GHz (EQ=1)
mV
9
80
AC-coupled inputs
mV
100
dB
120
Ω
1.6
V
30
kΩ
375 MHz
42
2.125 GHz
8.4
Ω
DIFFERENTIAL OUTPUTS
VODH
High-level output voltage
VODL
Low-level output voltage
VODB
Output differential voltage without
pre-emphasis (2)
VOCM
Output common mode voltage
ΔVOC(SS)
Change in steady-state
common-mode output voltage
between logic states
RL = 100 Ω ±1%,
Figure 3
1000
V
ODB(PP)
mVPP
mVPP
1300
1500
1.8
See Figure 2
mVPP
V
1
Output preemphasis voltage ratio,
V(PE)
650
–650
mV
0
3
RL = 100 Ω ±1%; x = L or S;
See Figure 3
dB
6
VODPE(PP)
10
t(PRE)
Preemphasis duration measurement
Output preemphasis is set to 10 dB during test
Measured with a 100-MHz clock signal;
RL = 100 Ω ±1%, See Figure 4
175
ps
ro
Output resistance
Differential on-chip termination between OUT+ and OUT–
100
Ω
CONTROL INPUTS
IIH
High-level Input current
VIN = VCC
IIL
Low-level Input current
VIN = GND
R(PU)
Pullup resistance
5
–125
μA
–90
μA
35
kΩ
POWER CONSUMPTION
PD
Device power dissipation
All outputs terminated 100 Ω
1.32
W
PZ
Device power dissipation in 3-State
All outputs in 3-state
684
mW
ICC
Device current consumption
All outputs terminated 100 Ω
380
mA
(1)
(2)
6
PRBS 27-1 pattern
at 4.25 Gbps
All typical values are at TA = 25°C and VCC = 3.3 V supply unless otherwise noted. They are for reference purposes and are not
production tested.
Differential output voltage V(ODB) is defined as | OUT+ – OUT– |.
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SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN TYP (1) MAX
TEST CONDITIONS
UNIT
DIFFERENTIAL OUTPUTS
Low-to-high propagation
delay
tPLH
tPHL
High-to-low propagation
delay
tr
Rise time
tf
Fall time
tsk(p)
Pulse skew, | tPHL – tPLH |
tsk(o)
Output skew (3)
0.4
0.8
ns
0.4
0.8
ns
Propagation delay input to output, See Figure 6
20% to 80% of VO(DB); Test Pattern: 100-MHz clock signal; See
Figure 5 and Figure 8
90
ps
90
ps
All outputs terminated with 100 Ω
25
(2)
tsk(pp) Part-to-part skew (4)
11
ps
75
ps
150
ps
tzd
3-State switch time to Disable
Assumes 50 Ω to Vcm and 150 pF load on each output
30
ns
tze
3-State switch time to Enable
Assumes 50 Ω to Vcm and 150 pF load on each output
20
ns
Device random jitter, rms
See Figure 8 for test circuit. BERT setting 10–15
Alternating 10-pattern.
2
ps-rms
Intrinsic deterministic device jitter
(5)
, peak-to-peak
0 dB preemphasis
See Figure 8 for the test
circuit.
30
ps
RJ
DJ
Absolute deterministic output
jitter (6), peak-to-peak
(1)
(2)
(3)
(4)
(5)
(6)
0 dB preemphasis
See Figure 8 for the test
circuit.
PRBS 27-1
pattern
7-1
PRBS 2
pattern
0.8
4.25 Gbps
1.25Gbps; EQ=13
Over 25-inch FR4 trace
12
4.25 Gbps; EQ=0 Over
FR4 trace 2-inch to 43
inches long
20
ps
All typical values are at 25°C and with 3.3 V supply unless otherwise noted.
tsk(p) is the magnitude of the time difference between the tPLH and tPHL of any output of a single device.
tsk(o) is the magnitude of the time difference between the tPLH and tPHL of any two outputs of a single device.
tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
The SN65LVCP418 built-in passive input equalizer compensates for ISI. For a 25-inch FR4 transmission line with 8-mil trace width, the
LVCP418 typically reduces jitter by 33 ps from the device input to the device output.
Absolute deterministic output jitter reflects the deterministic jitter measured at the SN65LVCP418 output. The value is a real measured
value with a Bit error tester as described in Figure 8. The absolute DJ reflects the sum of all deterministic jitter components accumulated
over the link: DJ(absolute) = DJ(Signal generator) + DJ(transmission line) + DJ(intrinsic(LVCP418)).
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PARAMETER MEASUREMENT INFORMATION
1−bit
1 to N bit
3−dB Preemphasis
VODPE3(pp)
10−dB Preemphasis
VOCM
VODB(PP)
VODPE2(pp)
6−dB Preemphasis
VODPE1(pp)
0−dB Preemphasis
VOH
VOL
Figure 3. Preemphasis and Output Voltage Waveforms and Definitions
1−bit
VODPE3(pp)
10−dB Preemphasis
1 to N bit
VODB(PP)
80%
20%
tPRE
Figure 4. t(PRE) Preemphasis Duration Measurement
80%
80%
VODB
20%
20%
tr
tf
Figure 5. Driver Output Transition Time
8
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PARAMETER MEASUREMENT INFORMATION (continued)
VID = 0 V
IN
t PHLD
t PLHD
VOD = 0 V
OUT
Figure 6. Propagation Delay Input to Output
VA
Clock Input
VID = 0 V
VOD = 0 V
Ideal Output
VB
VY − VZ
1/fo
Period Jitter
1/fo
Cycle-to-Cycle Jitter
Actual Output
Actual Output
VOD = 0 V
VOD = 0 V
VY − VZ
VY − VZ
tc(n)
tc(n)
tc(n +1)
tjit(cc) = | tc(n) − tc(n + 1) |
tjit(pp) = | tc(n) − 1/fo |
Peak-to-Peak Jitter
VA
PRBS Input
VY
PRBS Output
VID = 0 V
VOD = 0 V
VZ
VB
tjit(pp)
A.
All input pulses are supplied by an Agilent 81250 Stimulus System.
B.
The measurement is made with the AgilentParBert measurement software.
Figure 7. Driver Jitter Measurement Waveforms
Pattern
Generator
DC
Block
Coax
DC
Block
Coax
DC
Block
Pre-amp
SMA
SMA
25-inch FR4
(63,5 cm)
Coupled
Transmission Line
400 mVPP
RX
+
EQ