SN65LVDM31
www.ti.com
SLLS417C – MARCH 2000 – REVISED MAY 2001
HIGH-SPEED DIFFERENTIAL LINE DRIVER
FEATURES
•
SN65LVDM31D (Marked as LVDM31)
(TOP VIEW)
Designed for Signaling Rates
NOTE: The signaling rate is the number of voltage transitions that
can be made per second.
•
•
•
•
•
•
•
1A
1Y
1Z
G
2Z
2Y
2A
GND
Up to 150 Mbps
Low-Voltage Differential Signaling With
Typical Output Voltage of 700 mV and a 100-Ω
Load
Propagation Delay Time of 2.3 ns, Typical
Single 3.3-V Supply Operation
One Driver's Power Dissipation at 75 MHz,
50 mW, Typical
High-Impedance Outputs When Disabled or
With VCC < 1.5 V
Bus-Pin ESD Protection Exceeds 12 kV
Low-Voltage CMOS (LVCMOS) Logic Input
Levels Are 5-V Tolerant
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
4A
4Y
4Z
G
3Z
3Y
3A
FUNCTIONAL BLOCK DIAGRAM
G
G
1A
4
12
2
1
3
DESCRIPTION
6
The SN65LVDM31 incorporates four differential line
drivers that implement the electrical characteristics of
low-voltage differential signaling. This product offers a
low-power alternative to 5-V PECL drivers with similar
signal levels. Any of the four current-mode drivers will
deliver a minimum differential output voltage
magnitude of 540 mV into a 100-Ω load when
enabled by either an active-low or active-high enable
input.
The intended application of this device and signaling
technique is for both point-to-point and multiplexed
baseband data transmission over controlled
impedance media of approximately 100 Ω. The
transmission media may be printed-circuit board
traces, backplanes, or cables. The ultimate rate and
distance of data transfer is dependent upon the
attenuation characteristics of the media and the noise
coupling to the environment.
The SN65LVDM31 is characterized for operation from
–40°C to 85°C.
2A
3A
4A
7
5
10
9
11
1Y
1Z
2Y
2Z
3Y
3Z
14 4Y
13
4Z
15
FUNCTION TABLE
INPUT
ENABLES
OUTPUTS
A
G
G
Y
Z
H
H
X
H
L
L
H
X
L
H
H
X
L
H
L
H
L
X
L
L
X
L
H
Z
Z
Open
H
X
L
H
Open
X
L
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2001, Texas Instruments Incorporated
SN65LVDM31
www.ti.com
SLLS417C – MARCH 2000 – REVISED MAY 2001
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
VCC
VCC
G, G or
A Input
50 Ω
50 Ω
10 kΩ
7V
300 kΩ
Y or Z
Output
7V
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
Supply voltage range VCC (2)
–0.5 V to 4 V
Inputs
–0.5 V to 6 V
Input voltage range
Y or Z
–0.5 V to 4 V
Electrostatic discharge (3): Y, Z, and GND
Class 3, A:12 kV, B:600 V
Continuous power dissipation
See Dissipation Rating Table
Storage temperature range
–65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1)
(2)
(3)
260°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
Tested in accordance with MIL-STD-883C Method 3015.7.
DISSIPATION RATING TABLE
(1)
PACKAGE
TA ≤ 25°C
POWER RATING
OPERATING FACTOR (1)
ABOVE TA = 25°C
TA = 85°C
POWER RATING
D
950 mW
7.6 mW/°C
494 mW
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air
flow.
RECOMMENDED OPERATING CONDITIONS
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
TA
Operating free-air temperature
2
MIN
NOM
MAX
3
3.3
3.6
2.0
40
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UNIT
V
V
0.8
V
85
°C
SN65LVDM31
www.ti.com
SLLS417C – MARCH 2000 – REVISED MAY 2001
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
|VOD|
Differential output voltage magnitude
∆|VOD|
Change in differential output voltage magnitude
between logic states
VOC(SS)
Steady-state common-mode output voltage
∆VOC(SS)
Change in steady-state common-mode output
voltage between logic states
VOC(PP)
Peak-to-peak common-mode output voltage
MIN TYP (1)
540
700
860
RL = 50 Ω,
See Figure 2
270
350
430
–25
0
25
mV
1.14
1.2
1.3
V
–30
0
30
70
100
6
10
See Figure 2
See Figure 3
Enabled, RL = 100 Ω
Supply current
UNIT
See Figure 2
Enabled, No load
ICC
MAX
RL = 100 Ω,
VIN = 0 or VCC
Disabled
35
40
0.5
0.7
mV
mV
mA
IIH
High-level input current
VIH = 3 V
–10
3
10
µA
IIL
Low-level input current
VIL = 0 V
–10
µA
0
10
VOY or VOZ = 0 V
7
10
VOD = 0 V
7
10
IOS
Short-circuit output current
IOZ
High-impedance state output current
VO = 0 V or VCC
IO(OFF)
Power-off output current
VCC = 1.5 V,
(1)
VO = 3.6 V
mA
±1
µA
±1
µA
All typical values are at 25°C and with a 3.3-V supply.
SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
MIN
TYP
MAX
tPLH
Propagation delay time, low-to-high-level output
PARAMETER
TEST CONDITIONS
1.8
2.3
2.9
ns
tPHL
Propagation delay time, high-to-low-level output
1.8
2.3
2.9
ns
tr
Differential output signal rise time
0.4
0.6
1.0
ns
tf
Differential output signal fall time
0.4
0.6
1.0
ns
tsk(p)
Pulse skew (|tPHL– tPLH|)
50
350
ps
200
ps
1
ns
6
15
ns
See Figure 4
skew (1)
UNIT
tsk(o)
Channel-to-channel output
tsk(pp)
Part-to-part skew
tPZH
Propagation delay time, high-impedance-to-high-level output
tPZL
Propagation delay time, high-impedance-to-low level output
6
15
ns
tPHz
Propagation delay time, high-level-to-high-impedance output
6
15
ns
tPLZ
Propagation delay time, low-level-to-high-impedance output
6
15
ns
(1)
(2)
(2)
See Figure 5
tsk(o) is the maximum delay time difference between drivers on the same device.
tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
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3
SN65LVDM31
www.ti.com
SLLS417C – MARCH 2000 – REVISED MAY 2001
PARAMETER MEASUREMENT INFORMATION
Y
II
IOY
A
IOZ
VOD
VOY
Z
VI
VOC
(VOY+VOZ)/2
VOZ
Figure 1. Driver Voltage and Current Definitions
3.75 kΩ
Y
RL
VOD
Input
Z
+
_
0 V ≤ Vtest ≤ 2.4 V
3.75 kΩ
Figure 2. VOD Test Circuit
Y
Input
49.9 Ω ± 1%(2 Places)
3V
A
A
0V
Z
VOC(PP)
VOC
CL = 10 pF
(2 Places)
VOC(SS)
VOC
NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 0.5 Mpps, pulse width = 500 ±10 ns. CL includes instrumentation and fixture capacitance within 0,06 mm of
the DUT. The measurement of VOC(PP) is made on test equipment with a –3 dB bandwidth of at least 300 MHz.
Figure 3. Test Circuit and Definitions for the Driver Common-Mode Output Voltage
3V
1.5 V
Input
Y
0V
VOD
Input
100 Ω
tPLH
tPHL
Z
CL = 10 pF
(2 Places)
100%
80%
VOD(H)
Output
0V
VOD(L)
20%
0%
tf
tr
NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 50 Mpps, pulse width = 10 ±0.2 ns. CL includes instrumentation and fixture capacitance within 0,06 mm of
the DUT.
Figure 4. Test Circuit, Timing, and Voltage Definitions for the Differential Output Signal
4
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SN65LVDM31
www.ti.com
SLLS417C – MARCH 2000 – REVISED MAY 2001
PARAMETER MEASUREMENT INFORMATION (continued)
49.9 Ω ± 1%(2 Places)
Y
0 V or 3 V
G
Inputs
G
Z
VOY
G
3V
1.5 V
0V
G
3V
1.5 V
0V
VOY
or
VOZ
tPZH
1.2 V
≤ 1.4 V
1.25 V
1.2 V
A at 3 V, G at VCC and Input to G
or
G at GND and Input to G
1.2 V
1.15 V
≤1V
A at 0 V, G at VCC and Input to G
or
G at GND and Input to G
tPHZ
VOZ
or
VOY
tPZL
VOZ
CL = 10 pF
(2 Places)
tPLZ
NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 0.5 Mpps, pulse width = 500 ±10 ns. CL includes instrumentation and fixture capacitance within 0,06 mm of
the DUT.
Figure 5. Enable and Disable Time Circuit and Definitions
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SN65LVDM31
www.ti.com
SLLS417C – MARCH 2000 – REVISED MAY 2001
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
FREQUENCY
70
60
I CC − Supply Current − mA
VCC = 3.6 V
50
VCC = 3 V
40
VCC = 3.3 V
30
20
10
0
0
50
100
150
200
250
300
f − Frequency − MHz
Figure 6.
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
3.5
VCC = 3.3 V
TA = 25°C,
Single-Ended
No Load
3
V OH− High-Level Output Voltage − V
V OL − Low-Level Output Voltage − V
4
2
1
0
3
2.5
2
1.5
1
VCC = 3.3 V
TA = 25°C,
Single-Ended
No Load
.5
0
0
2
4
6
8
10
12
0
IOL − Low-Level Output Current − mA
Figure 7.
6
−2
−4
Figure 8.
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−6
IOH − High-Level Output Current − mA
−8
SN65LVDM31
www.ti.com
SLLS417C – MARCH 2000 – REVISED MAY 2001
TYPICAL CHARACTERISTICS (continued)
LOW-TO-HIGH LEVEL PROPAGATION DELAY TIME
vs
FREE-AIR TEMPERATURE
HIGH-TO-LOW LEVEL PROPAGATION DELAY TIME
vs
FREE-AIR TEMPERATURE
2.75
2.5
t PLH − High-To-Low Propagation Delay Time − ns
t PLH − Low-To-High Propagation Delay Time − ns
2.75
VCC = 3 V
VCC = 3.3 V
2.25
VCC = 3.6 V
2
1.75
−50
−30
−10
50
30
70
TA − Free-Air Temperature − °C
10
90
VCC = 3 V
2.5
VCC = 3.3 V
2.25
VCC = 3.6 V
2
1.75
−50
Figure 9.
−30
−10
50
30
70
TA − Free-Air Temperature − °C
10
90
Figure 10.
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7
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN65LVDM31D
ACTIVE
SOIC
D
16
40
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVDM31
SN65LVDM31DG4
ACTIVE
SOIC
D
16
40
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVDM31
SN65LVDM31DR
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVDM31
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of