SN65LVDS151
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SLLS444A – DECEMBER 2000
MuxIt™ SERIALIZER-TRANSMITTER
FEATURES
•
•
•
•
•
•
•
•
•
A Member of the MuxIt™
Serializer-Deserializer Building-Block Chip
Family
Supports Serialization of up to 10 Bits of
Parallel Data Input at Rates up to 200 Mbps
PLL Lock/Valid Input Provided to Enable Link
Data Transfers
Cascadable With Additional SN65LVDS151
MuxIt Serializer-Transmitters for Wider
Parallel Input Data Channel Widths
LVDS Compatible Differential Inputs and
Outputs Meet or Exceed the Requirements of
ANSI TIA/EIA-644-A
LVDS Inputs and Outputs ESD Protection
Exceeds 12 kV HBM
LVTTL Compatible Inputs for Lock/Valid,
Enables, and Parallel Data Inputs Are 5-V
Tolerant
Operates With 3.3 V Supply
Packaged in 32-Pin DA Thin Shrink
Small-Outline Package With 26 Mil Terminal
Pitch
SN65LVDS151DA
(Marked as 65LVDS151)
VCC
GND
LCRI+
LCRI–
CI_EN
DI–9
DI–8
DI–7
DI–6
DI–5
DI–4
DI–3
DI–2
DI–1
DI–0
GND
1
32
2
31
3
30
4
29
5
28
6
27
7
26
8
25
9
24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
CI–
CI+
LVI
MCI–
MCI+
GND
VCC
LCO+
LCO–
VCC
EN
LCO_EN
VCC5
GND
DO+
DO–
DESCRIPTION
MuxIt is a family of general-purpose, multiple-chip building blocks for implementing parallel data serializers and
deserializers. The system allows for wide parallel data to be transmitted through a reduced number of
transmission lines over distances greater than can be achieved with a single-ended (e.g., LVTTL or LVCMOS)
data interface. The number of bits multiplexed per transmission line is user-selectable and allows for higher
transmission efficiencies than with existing fixed ratio solutions. MuxIt utilizes the LVDS (TIA/EIA-644-A) low
voltage differential signaling technology for communications between the data source and data destination.
The MuxIt family initially includes three devices supporting simplex communications: the SN65LVDS150 phase
locked loop frequency multiplier, the SN65LVDS151 serializer-transmitter, and the SN65LVDS152
receiver-deserializer.
The SN65LVDS151 consists of a 10-bit parallel-in/serial-out shift register, three LVDS differential transmission
line receivers, a pair of LVDS differential transmission line drivers, plus associated input buffers. It accepts up to
10 bits of user data on parallel data inputs (DI-0 → DI-9) and serializes (multiplexes) the data for transmission
over an LVDS transmission line link. Two or more SN65LVDS151 units may be connected in series (cascaded)
to accommodate wider parallel data paths for higher serialization values. Data is transmitted over the LVDS
serial link at M times the input parallel data clock frequency. The multiplexing ratio M, or number of bits per data
clock cycle, is programmed on the companion SN65LVDS150 MuxIt programmable PLL frequency multiplier with
configuration pins (M1 → M5). The range of multiplexing ratio M supported by the SN65LVDS150 MuxIt
programmable PLL frequency multiplier is between 4 and 40. Table 1 shows some of the combinations of LCRI
and MCI supported by the SN65LVDS150 MuxIt programmable PLL frequency multiplier.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MuxIt is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000, Texas Instruments Incorporated
SN65LVDS151
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SLLS444A – DECEMBER 2000
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
Data is parallel loaded into the SN65LVDS151 input latches on the first rising edge of the M-clock input (MCI)
signal following a rising edge of the link clock reference input (LCRI). The data is read out serially from the
SN65LVDS151 shift registers on the rising edges of the M-clock input (MCI). The lowest order bit of parallel input
data, DI-0, is output from DO on the third rising edge of MCI following the rising edge of LCRI. The remaining bits
of parallel input data, DI-1 → DI-(M-1) are clocked out sequentially, in ascending order, by subsequent MCI rising
edges. The link clock output (LCO) signal rising edge is synchronized to the data output (DO) by an internal
circuit clocked by MCI. The LCO signal rising edge follows the first rising edge of MCI after the rising edge of
LCRI. Examples of operating waveforms for values of M = 4 and M = 10 are provided in Table 1.
Both the LCRI and MCI signals are intended to be sourced from the SN65LVDS150 MuxIt programmable
frequency multiplier. They are carried over LVDS differential connections to minimize skew and jitter. The
SN65LVDS151 includes LVDS differential line drivers for both the serialized data output (DO) stream and the link
clock output (LCO). The cascade input (CI) is also an LVDS connection, and when it is used it is tied to the DO
output of the preceding SN65LVDS151.
An internal power-on reset (POR) and an enable input (EN) control the operation of the SN65LVDS151. When
VCC is below 1.5 V, or when EN is low, the device is in a low-power disabled state, and the DO and LCO
differential outputs are in a high-impedance state. When VCC is above 3 V and EN is high, the device and the two
differential outputs are enabled and operating to specifications. The link clock output enable input (LCO_EN) is
used to turn off the LCO output when it is not being used. Cascade input enable (CI_EN) is used to turn off the
CI input when it is not being used.
Serialized data bits are output from the DO output, starting in ascending order, from parallel input bit DI-0. The
number of serialized data bits output per data clock cycle is determined by the multiplexing ratio M. For values of
M less than or equal to 10, the cascade input (CI±) is not used, and only the first M parallel input bits (DI-0
thought DI-[M-1]) are used. For values of M greater than 10, all ten parallel input bits (DI-0 though DI-9) are
used, and the cascade input is used to shift in the remaining data bits from additional SN65LVDS151 serializers.
Table 2 shows which input data bits are used as a function of the multiplier M.
Table 1. Example Combinations of LCRI and MCI Supported by the
SN65LVDS150 Muxit Programmable PLL Frequency Multiplier
LCRI, MHz
2
MCI, MHz
M
MINIMUM
MAXIMUM
MINIMUM
MAXIMUM
4
5
50
20
200
10
5
20
50
200
20
5
10
100
200
40
5
5
200
200
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Table 2. Input Data Bits Used as a Function of the Multiplier M
M=4
1st
M=5
M=6
M=7
M=8
M=9
M = 10
M >10
bit output
DI-0
DI-0
DI-0
DI-0
DI-0
DI-0
DI-0
DI-0
2nd bit output
DI-1
DI-1
DI-1
DI-1
DI-1
DI-1
DI-1
DI-1
3rd bit output
DI-2
DI-2
DI-2
DI-2
DI-2
DI-2
DI-2
DI-2
4th bit output
DI-3
DI-3
DI-3
DI-3
DI-3
DI-3
DI-3
DI-3
5th
bit output
Invalid
DI-4
DI-4
DI-4
DI-4
DI-4
DI-4
DI-4
6th bit output
Invalid
Invalid
DI-5
DI-5
DI-5
DI-5
DI-5
DI-5
7th bit output
Invalid
Invalid
Invalid
DI-6
DI-6
DI-6
DI-6
DI-6
8th
bit output
Invalid
Invalid
Invalid
Invalid
DI-7
DI-7
DI-7
DI-7
9th bit output
Invalid
Invalid
Invalid
Invalid
Invalid
DI-8
DI-8
DI-8
10th bit output
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
DI-9
DI-9
11th
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
CI bits
+ bits output
BLOCK DIAGRAM
CI
DI–9
DI–8
DI–7
DI–5
DI–4
Shift Register
Input Latches
DI–6
DI–3
DI–2
DI–1
DI–0
Control Logic
LCRI
MCI
EN
LVI
DO
LCO
CI_EN
LCO_EN
NOTE: The CI input includes a 110 Ω termination resistor.
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M=4
DI–n
Current Frame
Next Frame
Data
Clock
LCRI
MCI
LCO
DO
DI(3)
DI(0)
DI(1)
DI(2)
DI(3)
DI(0)
Current Frame
M = 10
DI–n
Current Frame
Next Frame
Data
Clock
LCRI
MCI
LCO
DO
DI(9)
DI(0)
DI(1)
DI(2)
DI(3)
DI(4)
DI(5)
DI(6)
DI(7)
DI(8)
Current Frame
Figure 1. Operating Waveform Examples
4
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DI(9)
DI(0)
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SLLS444A – DECEMBER 2000
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
VCC
VCC
300 kΩ
300 kΩ
LCRI–,
MCI–,
or CI–
Inputs
LCRI+,
MCI+,
or CI+
Inputs
4V
50 Ω
10 kΩ
LCO+,
LCO–,
DO+,
or DO–
Outputs
4V
4V
110 Ω, (CI Input Only)
VCC5
VCC
DI-n
Inputs Only
EN, LVI,
CI_EN,
LCO_EN,
or DI-n
Inputs
400 Ω
6V
300 kΩ
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Terminal Functions
TERMINAL
NAME
CI+, CI–
CI_EN
DO–, DO+
EN
GND
NO.
I/O
TYPE
DESCRIPTION
31, 32
I
LVDS
Cascade input. This may be used to connect additional SN65LVDS151 units when the
multiplexing ratio M value is greater than 10. This input has an internal 110-Ω nominal
termination resistor.
5
I
LVTTL
Cascade input enable. Used to enable or disable the cascade input differential
receiver. A high-level input enables the CI input, a low-level input disables the CI input.
17, 18
O
LVDS
Data output. This is the data being transmitted to the destination end of the serial link,
or being supplied to another SN65LVDS151 unit in cascade.
22
I
LVTTL
Enable. Controls device operation. A high-level input enables the device; a low-level
input disables and resets the device. When initially enabled, all outputs are in a
low-level condition.
NA
Circuit ground
25, 24
O
LVDS
Link clock output This is the data block synchronization clock being transmitted to the
destination end of the serial link.
LCO_EN
21
I
LVTTL
Link clock output enable. Used to disable the link clock output when it is not being
used. A high-level input enables the LCO output; a low-level input disables the LCO
output.
LCRI+, LCR–
3, 4
I
LVDS
Link clock reference input. This is the clock for latching in the parallel data; it comes
from the PLL frequency multiplier.
LVI
30
I
LVTTL
Lock/valid input. This is a signal required for proper Muxlt system operation. It is
directly connected to the LVO output of a SN65LVDS150. It is used to inhibit the
operation of this device until after the PLL has stabilized. A low level input forces a
reset of the internal latches and shift registers, and forces the DO and LCO outputs to
a low level. A high level input enables operation.
28, 29
I
LVDS
M-clock input. This is the high frequency multiplied clock input from the local PLL
frequency multiplier. It synchronizes the transmission of the link data
6-15
I
LVTTL
Parallel data inputs. Data is latched into the device on the first rising edge of MCI
following a rising edge of LCRI.
1, 23, 26
NA
Supply voltage
20
NA
5-V VCC tolerance bias. Tied to 5 V nominal when the LVTTL inputs are being driven
by a device powered from a 5-V supply, otherwise tied to local VCC
LCO+, LCO–
MCI+, MC–
DI-9–DI-0
VCC
VCC5
2, 16, 19, 27
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
Supply voltage range, VCC (2)
–0.5 V to 4 V
DI-0 through DI-9 inputs
Voltage range
EN, CI_EN, LCO_EN, LVI inputs, VCC5
CI±, LCRI±, or MCI± Inputs, DO±, or LCO± outputs
Electrostatic discharge, human body model (3)
Charged-device
model (4)
±12 kV
±2 kV
All pins
±500 V
See Dissipation Rating Table
–65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
6
–0.5 to 4 V
All pins
Storage temperature range
(2)
(3)
(4)
–0.5 V to 5.5 V
MCI±, LCRI±, CI±, DO±, LCO±, and GND
Continuous power dissipation
(1)
–0.5 V to VCC5 +0.5 V
260°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
Tested in accordance with JEDEC Standard 22, Test Method A114-B.
Tested in accordance with JEDEC Standard 22, Test Method C101.
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DISSIPATION RATING TABLE
PACKAGE
TA≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 85°C
POWER RATING
DA
1453 mW
11.6 mW/°C
756 mW
RECOMMENDED OPERATING CONDITIONS
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
|VID|
Magnitude of differential input voltage
VIC
Common-mode input voltage
TA
MIN
NOM
MAX
3
3.3
3.6
2
DI-0 - DI-9, EN, LVI, LCO_EN, CI_EN
|
ID
2
0.8
V
0.6
V
|V
|V
Operating free-air temperature
V
V
0.1
LCRI, MCI, CI
UNIT
2.4
|
ID
2
V
VCC-0.8
V
85
°C
40
TIMING REQUIREMENTS
PARAMETERS
TEST CONDITIONS
tsu(1)
LCRI↑setup time before MCI↑
th(1)
LCRI hold time after MCI↑
tsu(2)
Data setup time, DI-0–DI-9 before MCI↑ after LCRI↑
th(2)
Data hold time, DI-0–DI-9 valid after MCI↑ after LCRI↑
tsu(3)
CI setup time before MCI↑
th(3)
CI hold time after MCI↑
tc
Clock cycle time
tw
High-level clock pulse width duration
See Figure 2
See Figure 3
TA ≤ 25°C
TA = 85°C
MAX
ns
0.3
ns
0
ns
2
ns
0.8
See Figure 4
ns
1.1
0V
ns
LCRI
20
200
MCI
5
50
0.4 tc
0.6 tc
MCI, LCRI
LCRI
UNIT
0.5
2.5
LCRI
ns
ns
0V
th(1)
tsu(1)
MCI
MIN
0V
MCI
0V
Figure 2. Clock Input Timing Requirements
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LCRI
0V
LCRI
0V
tsu(1)
MCI
DI–n
tsu(1)
0V
MCI
th(2)
tsu(2)
1.4 V
0V
DI–n
1.4 V
Figure 3. Data Input Timing Requirements
MCI
0V
MCI
0V
th(3)
tsu(3)
+100 mV
CI
–100 mV
+100 mV
CI
–100 mV
Figure 4. Cascade Input Timing Requirements
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VITH+
Positive-going differential input voltage threshold
VITH-
Negative-going differential input voltage threshold
|VOD(SS)|
Steady-state differential output voltage magnitude
∆|VOD(SS)|
Change in steady-state differential output voltage magnitude
between logic states
VOC(SS)
Steady-stade common-mode output voltage
∆VOC(SS)
Change in steady-state common-mode output voltage between logic
states
VOC(PP)
Peak-to-peak change common-mode output voltage
ICC
Supply current
IID
Differential input current
RL = 100 Ω, VID = ±100 mV,
See Figure 6 and Figure 7
See Figure 8
mV
–100
247
mV
340
454
mV
–50
50
mV
1.125
1.375
–50
50
mV
mV
150
30
Disabled
0.5
1
f(MCI) = 200 MHz, f(LCRI) = 20 MHz,
RL = 100 Ω, DI-n= 1010101010
35
65
(II+ - II-) (LCRI, MCI inputs)
VI = 0 V
VI = 2.4 V
VI = 0 V
VI = 2.4 V
LCRI, MCI inputs
UNIT
100
22
VIC = 0.05 V to 2.35 V,
VID = ±0.1 V
CI input
MAX
50
VID = 0.4 V, VIC = 2.2 V or 0.2 V
Input current
TYP (1)
Enabled, RL = 100 Ω
(II+ - II-) (CI input)
LCRI, MCI inputs
II
See Figure 5
MIN
V
mA
3
4.4
mA
–2
2
µA
–2
–20
–1.2
–4
–40
–2.4
20
µA
II(OFF)
Power-off output current
IIH
High-level input current
EN, LVI, DI-n, LCO_EN
VIH = 2 V
20
µA
IIL
Low-level input current
EN, LVI, DI-n, LCO_EN
VIL = 0.8 V
10
µA
IOS
(1)
8
Short-circuit output current
CI input
DO, LCO
VCC = 0 V , VI = 3.6 V
µA
40
VO+ or VO- = 0 V
–10
10
VOD = 0 V
–10
10
All typical values are at TA = 25°C and with VCC = 3.3 V.
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ELECTRICAL CHARACTERISTICS (continued)
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP (1)
MIN
MAX
UNIT
IOZ
High-impedance output current
VO = 0 V or VCC
–5
5
µA
IO(OFF)
Power-off output current
VCC = 1.5 V , VI = 3.6 V
–5
5
µA
CI
Input capacitance
LCRI, MCI inputs
VID = (0.4sin(4E6πt) + 0.5) V
3
pF
SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
td(1)
Propagation delay time, MCI↑ to DO↑
td(2)
Propagation delay time, MCI↑ to DO↓
td(3)
Propagation delay time, MCI↑ to LCO↑
tr
Differential output signal rise time
tf
Differential output signal fall time
tsk(p)
Pulse skew (|tPHL– tPLH|), DO
MIN
TYP
MAX
TA ≤ 25°C
3
5
5.8
TA = 85°C
3
5
6.1
3
5
5.8
3
5
6.1
TA ≤ 25°C
3
5
5.8
TA = 85°C
3
5
6.1
0.3
0.8
1.5
ns
0.3
0.8
1.5
ns
–250
0
250
ps
0
2.3
ns
0
250
ps
3
20
ns
3
10
ns
4
10
ns
TA ≤ 25°C
TA = 85°C
RL = 100 Ω, CL = 10 pF, See
Figure 9
RL = 100 Ω, CL = 10 pF, See
Figure 10
tsk(pp) Part-to-part output skew, DO
tsk(ω)
Multiple-frequency skew, LCO↑ to DO↑ or DO↓
tPZL
Propagation delay time, high-impedance to low-level
See Figure 11
tPLZ
Propagation delay time, low-level to high-impedance
tPHZ
Propagation delay time, high-level to high-impedance
EN input to DO,
LCO output, See Figure 12
-250
UNIT
ns
ns
ns
PARAMETER MEASUREMENT INFORMATION
+
VID
–
VI+
(VI+ + VI–)/2
VIC
VI–
Figure 5. Receiver Voltage Definitions
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Table 3. Receiver Minimum and Maximum Input Threshold Test Voltages
APPLIED
VOLTAGES
RESULTING DIFFERENTIAL
INPUT VOLTAGE
RESULTING COMMONMODE INPUT VOLTAGE
VI+
VI–
VID
VIC
1.25 V
1.15 V
100 mV
1.2 V
1.15 V
1.25 V
–100 mV
1.2 V
2.4 V
2.3 V
100 mV
2.35 V
2.3 V
2.4 V
–100 mV
2.35 V
0.1 V
0V
100 mV
0.05 V
0V
0.1 V
–100 mV
0.05 V
1.5 V
0.9 V
600 mV
1.2 V
0.9 V
1.5 V
–600 mV
1.2 V
2.4 V
1.8 V
600 mV
2.1 V
1.8 V
2.4 V
–600 mV
2.1 V
0.6 V
0V
600 mV
0.3 V
0V
0.6 V
–600 mV
0.3 V
IO+
+
IO–
VOD
VO+
–
VO–
(VO+ + VO–)/2
VOC
Figure 6. Driver Voltage and Current Definitions
3.74 kΩ
+
VOD
100 Ω
+
_
0 V ≤ Vtest ≤ 2.4 V
–
3.74 kΩ
Figure 7. VOD Test Circuit
49.9 Ω ±1% (2 PLCS)
VOC(PP)
+
VOC(SS)
VOC
–
A.
50 pF
VOC
All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 0.5 Mpps, Pulse width = 500 ± 10 ns. CL includes instrumentation and fixture capacitance within 0,06 m of
the D.U.T. The measurement of VOC(PP) is made on test equipment with a –3 dB bandwidth of at least 5 GHz.
Figure 8. Test Circuit and Definitions for the Driver Common-Mode Output Voltage
10
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0V
MCI
0V
MCI
td(1)
td(2)
DO
0V
DO
0V
td(3)
td(3)
LCO
0V
LCO
0V
Figure 9. Output Timing Waveforms
0.4 V
MCI
0V
–0.4 V
+
DI (0–9)
LCRI
VOD
Logic
tPLH
100 Ω ±1%
tPHL
100%
80%
–
MCI
CL = 10 pF
(2 PLCS)
VOD(H)
DO, LCO
0V
DUT
VOD(L)
20%
0%
tr
A.
tf
All input pulses are supplied by generators having the following characteristics: tr or tf ≤ 1 ns, MCI pulse repetition rate
(PRR) = 50 Mpps, MCI Pulse width = 10 ± 0.2 ns, LCRI pulse repetition rate (PRR) = 5 Mpps, LCRI pulse width = 100
±20 ns. CL includes instrumentation and fixture capacitance within 0,06 m of the D.U.T.
Figure 10. Test Circuit, Timing, and Voltage Definitions for the Differential Output Signal
0V
LCO
tsk(ϖ)
DO
0V
Figure 11. LCO to DO Multiple-Frequency Skew Waveforms
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50 Ω
±1%
+
DI (0–9)
LCRI
VOD
Logic
–
MCI
50 Ω
±1%
+
_
1.2 V
CL = 10 pF
(2 PLCS)
DUT
2V
1.4 V
Input
0.8 V
≅ 0.34 V
0.1 V
0V
VOD
tPHZ
0V
–0.1 V
≅ –0.34 V
VOD
tPLZ
tPZL
Figure 12. Enable/Disable Time Waveforms
TYPICAL CHARACTERISTICS
AVERAGE SUPPLY CURRENT
vs
FREQUENCY
I CC – Average Supply Current – mA
40
VCC = 3.3 V,
TA = 25°C
35
30
25
20
15
10
5
0
0
50
100
150
f – Frequency – Hz
Figure 13.
12
Submit Documentation Feedback
200
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN65LVDS151DA
ACTIVE
TSSOP
DA
32
46
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
65LVDS151
Samples
SN65LVDS151DAR
ACTIVE
TSSOP
DA
32
2000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
65LVDS151
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of