SN65LVDT125ADBTR

SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com LVDS 4x4 CROSSPOINT SWITCH Check for Samples: SN65LVDT125A, SN65LVDS125A FEATURES 1 • • • • • • • • • Signaling Rates >1.5 Gbps per Channel Supports Telecom/Datacom and HDTV Video Switching Non-Blocking Architecture Allows Each Output to be Connected to Any Input Compatible With ANSI TIA/EIA-644-A LVDS Standard 25 mV of Input Voltage Threshold Hysteresis Propagation Delay Times, 900 ps Typical Inputs Electrically Compatible With LVPECL, CML and LVDS Signal Levels Operates From a Single 3.3-V Supply Integrated 110-Ω Line Termination Resistors Available With SN65LVDT125A APPLICATIONS • • • • Clock Buffering/Clock Muxing Wireless Base Stations High-Speed Network Routing HDTV Video Switching SN65LVDS125ADBT ( Marked as LVDS125A) SN65LVDT125ADBT ( Marked as LVDT125A) (TOP VIEW) S10 S11 1A 1B S20 S21 2A 2B GND VCC GND 3A 3B S30 S31 4A 4B S40 S41 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 VCC GND 1Y 1Z 1DE 2Y 2Z 2DE GND VCC GND 3Y 3Z 3DE 4Y 4Z 4DE GND VCC Eye Pattern of Two Outputs Operating Simultaneously The SN65LVDS125A and SN65LVDT125A are 4x4 nonblocking crosspoint switches. Low-voltage differential signaling (LVDS) is used to achieve signaling rates of 1.5 Gbps per channel. Each output driver includes a 4:1 multiplexer to allow any input to be routed to any output. Internal signal paths are fully differential to achieve the high signaling speeds while maintaining low signal skews. The SN65LVDT125A incorporates 110-Ω termination resistors for those applications where board space is a premium. Designed to support signaling rates up to 1.5 Gbps for OC-12 clocks (622 MHz). The 1.5-Gbps signaling rate allows use in HDTV systems, including SMPTE 292 video applications requiring signaling rates of 1.485 Gbps. The SN65LVDS125A and SN65LVDT125A characterized for operation from -40°C to 85°C. 175 mV/div DESCRIPTION VIC = 1.2 V SVIDS = 200 mV 1.5 Gbps 223-1 PRBS VCC = 3.3 V 200 - ps/div are 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2011, Texas Instruments Incorporated SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. LOGIC DIAGRAM 8 S10 - S41 1DE 1A 1Y 1B 1Z 2DE 2A 2Y 2B 2Z 4X4 MUX 3DE 3A 3Y 3B 3Z 4DE 4A 4Y 4B 4Z Integrated 110-W Termination on LVDT Only SN65LVDS125A Pin Description Pin Numbers Pin Description S10 - S41 Inputs; Input channel to out output channel selection control pins 1A, 2A, 3A, 4A Inputs; Positive leg of LVDS data input 1B, 2B, 3B, 4B Inputs; Negative leg of LVDS data input 1Y, 2Y, 3Y, 4Y Outputs; Positive leg of LVDS data output 1Z, 2Z, 3Z, 4Z Outputs; Negative leg of LVDS data output 1DE, 2DE, 3DE, 4DE Inputs; Output port disable VCC Input Voltage GND Ground 2 Copyright © 2003–2011, Texas Instruments Incorporated SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS INPUT LVDS125A VCC A VCC B 7V 7V VCC VCC 300 kΩ DE S10, S41 400 Ω 400 Ω 300 kΩ 7V 7V OUTPUT LVDS125A VCC VCC VCC Y 7V Copyright © 2003–2011, Texas Instruments Incorporated Z 7V 3 SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com Table 1. CROSSPOINT LOGIC TABLES OUTPUT CHANNEL 1 CONTROL PINS OUTPUT CHANNEL 2 INPUT SELECTED CONTROL PINS OUTPUT CHANNEL 3 INPUT SELECTED CONTROL PINS INPUT SELECTED OUTPUT CHANNEL 4 CONTROL PINS INPUT SELECTED S10 S11 1Y/1Z S20 S21 2Y/2Z S30 S31 3Y/3Z S40 S41 4Y/4Z 0 0 1A/1B 0 0 1A/1B 0 0 1A/1B 0 0 1A/1B 0 1 2A/2B 0 1 2A/2B 0 1 2A/2B 0 1 2A/2B 1 0 3A/3B 1 0 3A/3B 1 0 3A/3B 1 0 3A/3B 1 1 4A/4B 1 1 4A/4B 1 1 4A/4B 1 1 4A/4B PACKAGE DISSIPATION RATINGS PACKAGE CIRCUIT BOARD MODEL TA ≤ 25°C POWER RATING DERATING FACTOR (1) ABOVE TA = 25°C TA = 85°C POWER RATING TSSOP (DBT) High-K (2) 1772 mW 15.4 mW/°C 847 mW (1) (2) This is the inverse of the junction-to-ambient thermal resistance when board-mounded and with no air flow. In accordance with the High-K thermal metric definitions of EIA/JESD51-6. THERMAL CHARACTERISTICS PARAMETER TEST CONDITIONS VALUE θJB Junction-to-board thermal resistance 40.3 θJC Junction-to-case thermal resistance 8.5 PD Device power dissipation UNITS °C/W Typical VCC = 3.3 V, TA = 25°C, 750 MHz 356 mW Maximum VCC = 3.6 V, TA = 85°C, 750 MHz 522 mW ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted (1) UNITS Supply voltage range, Vcc Voltage range (2) -0.5 V to 4 V S, DE -0.5 V to 4 V (A, B) -0.5 V to 4 V |VA - VB| (LVDT only) 1V (Y, Z) Electrostatic discharge Continuous power dissipation Storage temperature range (1) (2) (3) (4) 4 -0.5 V to 4 V Human body model (3) All pins ±3 kV Charged-device model (4) All pins ±500 V See Dissipation Rating Table -65°C to 150°C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. Tested in accordance with JEDEC Standard 22, Test Method A114-A. Tested in accordance with JEDEC Standard 22, Test Method C101. Copyright © 2003–2011, Texas Instruments Incorporated SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Supply voltage, VCC 3 High-level input voltage, VIH S10-S41, 1DE-4DE Low-level input voltage, VIL S10-S41, 1DE-4DE Magnitude of differential input voltage |VID| 3.3 V LVDS 0.1 LVDT 0.1 0.8 V V 0 3.3 V 140 °C 85 °C Junction temperature, TJ (1) V V 0.8 Input voltage (any combination of common-mode or input signals) Operating free-air temperature, TA 3.6 2 (1) -40 Maximum free-air temperature operation is allowed as long as the device maximum junction temperature is not exceeded. TIMING SPECIFICATIONS PARAMETER tSET Input to select setup time tHOLD Input to select hold time tSWITCH Select to switch output MIN NOM MAX UNIT 0.6 See Figure 7 ns 0.2 1.2 ns 1.6 ns INPUT ELECTRICAL CHARACTERISTICS over recommended operating conditions unless otherwise noted (1) PARAMETER TEST CONDITIONS VIT+ Positive-going differential input voltage threshold See Figure 1 VIT- Negative-going differential input voltage threshold See Figure 1 VID(HYS) Differential input voltage hysteresis 1DE-4DE MIN TYP (1) MAX UNIT 100 mV -100 mV 25 mV -10 High-level input current IIL Low-level input current II Input current VI = 0 V or 3.3 V, Second input at 1.2 V (other input open for LVDT) -20 20 µA II(OFF) Input current VCC ≤ 1.5 V, VI = 0 V or 3.3 V, Second input at 1.2 V (other input open for LVDT) -20 20 µA IIO Input offset current (|IIA - IIB|) ('LVDS) VIA = VIB, 0 ≤ VIA≤ 3.3 V -6 6 µA Termination resistance ('LVDT) VID = 300 mV, VIC = 0 V to 3.3 V 90 110 132 RT Termination resistance('LVDT with power-off) VID = 300 mV, VIC = 0 V to 3.3 V, VCC= 1.5 V 90 110 132 CT Differential input capacitance (1) S10-S41 1DE-4DE S10-S41 VIH = 2 V µA IIH 20 -10 VIL = 0.8 V 20 0.6 µA Ω pF All typical values are at 25°C and with a 3.3 V supply. Copyright © 2003–2011, Texas Instruments Incorporated 5 SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com OUTPUT ELECTRICAL CHARACTERISTICS over recommended operating conditions unless otherwise noted (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 247 350 454 mV -50 50 mV 1.125 1.375 -50 50 mV 50 150 mV 107 |VOD| Differential output voltage magnitude Δ|VOD| Change in differential output voltage magnitude between logic states VOC(SS) Steady-state common-mode output voltage ΔVOC(SS) Change in steady-state common-mode output voltage between logic states VOC(PP) Peak-to-peak common-mode output voltage ICC Supply current RL = 100 Ω, CL = 1 pF 145 mA IOS Short-circuit output current VOY or VOZ = 0 V -27 27 mA IOSD Differential short circuit output current VOD = 0 V -12 12 mA IOZ High-impedance output current VO = 0 V or VCC -1 ±1 µA CO Differential output capacitance (1) See Figure 2, VID = ±100 mV See Figure 3 1.2 V pF All typical values are at 25°C and with a 3.3 V supply. SWITCHING CHARACTERISTICS over recommended operating conditions unless otherwise noted(1) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low-to-high-level output tPHL Propagation delay time, high-to-low-level output tr Differential output signal rise time (20%-80%) tf Differential output signal fall time (20%-80%) tsk(p) Pulse skew (|tPHL - tPLH|) (1) tsk(o) Channel-to-channel output skew (2) tsk(pp) Part-to-part skew See Figure 4 Period jitter, rms (1 standard deviation) tjit(cc) Cycle-to-cycle jitter (peak) (4) (4) 750 MHz clock input (5) (see Figure 6) 750 MHz clock input (6) (see Figure 6) 23 1.5 Gbps 2 -1 PRBS input (see Figure 6) tjit(det) Deterministic jitter, peak-to-peak (4) 1.5 Gbps 27-1 PRBS input (8) (see Figure 6) tPHZ Propagation delay, high-level-to-high-impedance output tPLZ Propagation delay, low-level-to-high-impedance output tPZH Propagation delay, high-impedance -to-high-level output tPZL Propagation delay, high-impedance-to-low-level output 6 1200 700 900 1200 210 270 210 270 UNIT ps 50 ps 150 ps 300 ps 0.4 3 ps 4.7 13 ps 65 110 ps 56 90 ps (7) Peak-to-peak jitter (4) (5) (6) (7) (8) MAX 900 0 tjit(pp) (4) TYP 700 (3) tjit(per) (1) (2) (3) MIN 6 See Figure 5 6 300 ns 300 tsk(p) is the magnitude of the time difference between the tPLH and tPHL of any output of a single device. tsk(o) is the maximum delay time difference between drivers over temperature, VCC, and process. tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits. Jitter specifications are based on design and characteriztion. Stimulus system jitter of 1.9 ps tjit(per), 16 ps tjit(cc). 17 ps tjit(pp), and 7.2 ps tjit(det) have been subtracted from the values. Input voltage = VID = 200 mV, 50% duty cycle at 750 MHz, tr = tf= 50 ps (20% to 80%), measured over 1000 samples. Input voltage = VID = 200 mV, 50% duty cycle at 750 MHz, tr = tf= 50 ps (20% to 80%). Input voltage = VID = 200 mV, 223-1 PRBS pattern at 1.5 Gbps, tr = tf = 50 ps (20% to 80%), measured over 200k samples. Input voltage = VID = 200 mV, 27-1 PRBS pattern at 1.5 Gbps, tr= tf = 50 ps (20% to 80%). Copyright © 2003–2011, Texas Instruments Incorporated SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION IIA A Y VID VIC VIA+VIB VOD VIA B VIB 2 VOY Z VOY+VOZ VOZ IIB 2 Figure 1. Voltage and Current Definitions 3.75 kΩ Y VOD Z + _ 100 Ω 0 V ≤ V(test) ≤ 2.4 V 3.75 kΩ Figure 2. Differential Output Voltage (VOD) Test Circuit A Y A ≈1.4 V B ≈1 V 49.9 Ω ±1% VID VOC(PP) B Z 1 pF 49.9 Ω ±1% VOC VOC(SS) VOC NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse-repetition rate (PRR) = 0.5 Mpps, pulse width = 500 ±10 ns; RL = 100W; CL includes instrumentation and fixture capacitance within 0,06 mm of the D.U.T.; the measurement of VOC(PP) is made on test equipment with a -3 dB bandwidth of at least 300 MHz. Figure 3. Test Circuit and Definitions fot the Driver Common-Mode Output Voltage A VID VIA B VIB Y 1 pF VOY Z VIA 1.4 V VIB 1V VID 0.4 V 0V -0.4 V 100 Ω VOZ tPHL tPLH 0V Differential 80% VOY - VOZ 20% tf tr NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf≤ .25 ns, pulse-repetition rate (PRR) = 0.5 Mpps, pulse width = 500 ± 10 ns . CL includes instrumentation and fixture capacitance within 0,06 mm of the D.U.T. Figure 4. Timing Test Circuit and Waveforms Copyright © 2003–2011, Texas Instruments Incorporated 7 SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 49.9 Ω ±1% Y 1 V or 1.4 V 1 pF 1.2 V 49.9 Ω ±1% VOY Z DE 1.2 V VOZ 3V 1.5 V 0V DE 1.4 V 1.25 V 1.2 V VOY or VOZ tPZH tPHZ 1.2 V 1.15 V 1V VOZ or VOY tPZL tPLZ NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse-repetition rate (PRR) = 0.5 Mpps, pulse width = 500 ± 10 ns . CL includes instrumentation and fixture capacitance within 0,06 mm of the D.U.T. Figure 5. Enable and Disable Time Circuit and Definitions VA 0V VB Clock Input 0V Ideal Output VY - VZ 1/fo 1/fo Period Jitter Cycle-to-Cycle Jitter Actual Output Actual Output 0V 0V VY - VZ tc(n) VY - VZ tc(n) tc(n +1) tjit(cc) = | tc(n) - tc(n + 1) | tjit(pp) = | tc(n) - 1/fo | Peak-to-Peak Jitter VA PRBS Input 0V VB VY PRBS Output 0V VZ tjit(pp) NOTE: All input pulses are supplied by an Agilent 81250 Stimulus System. The measurement is made on a TEK TDS6604 running TDSJIT3 application software. Figure 6. Driver Jitter Measurement Waveforms 8 Copyright © 2003–2011, Texas Instruments Incorporated SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) A/B A/B S tSET tHOLD OUT Y/Z Y/Z tSWITCH DE A/B A/B S tSET OUT tHOLD Y/Z Y/Z tSWITCH DE NOTE: tSET and tHOLD times specify that data must be in a stable state before and after mux control switches. Figure 7. Input to Select for Both Rising and Falling Edge Setup and Hold Times Copyright © 2003–2011, Texas Instruments Incorporated 9 SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS SUPPLY CURRENT vs FREQUENCY PROPAGATION DELAY TIME vs FREE-AIR TEMPERATURE 105 100 940 tPHL 880 tPLH 820 VCC = 3.3 V VIC = 1.2 V VID = 200 mV f = 1 MHz 760 -45 100 200 300 400 500 600 700 800 f - Frequency - MHz tPLH 820 VCC = 3.3 V TA = 25°C VID = 200 mV f = 1 MHz 760 -25 -5 15 35 55 75 0 95 0.5 1 1.5 2 2.5 3 3.5 VIC - Common-Mode Input Voltage - V Figure 8. Figure 9. Figure 10. PEAK-TO-PEAK JITTER vs FREQUENCY PEAK-TO0PEAK JITTER vs DATA RATE PEAK-TO-PEAK JITTER vs FREQUENCY 20 120 100 VID = 800 m V VID =200 m V 8 4 Peak-To-Peak Jitter - ps 12 VCC = 3.3 V TA = 25°C VIC = 400 mV Input = PRBS 223-1 16 80 VID = 400 m V 60 VCC = 3.3 V TA = 25°C VIC= 1.2 mV Input = Clock VID = 800 m V Peak-To-Peak Jitter - ps VCC = 3.3 V TA = 25°C VIC = 400 mV Input = Clock 40 VID =200 m V 12 VID = 400 m V 8 4 20 VID = 800 m V VID = 400 m V VID =200 m V 0 0 100 0 0 200 300 400 500 600 700 800 0 200 400 600 800 1000 1200 1400 1600 0 Data Rate - Mbps f - Frequency - MHz Figure 11. Figure 12. Figure 13. PEAK-TO-PEAK JITTER vs DATA RATE PEAK-TO0PEAK JITTER vs FREQUENCY PEAK-TO-PEAK JITTER vs DATA RATE 120 20 80 VID = 400 m V 60 40 20 VID =200 m V 0 VCC = 3.3 V TA = 25°C VIC = 2.9 V Input = Clock 16 VID =200 m V 12 VID = 800 m V 8 VID = 400 m V 4 200 400 600 800 1000 1200 1400 1600 Data Rate - Mbps Figure 14. VID = 800 m V 80 VID =200 m V 60 40 VID = 400 m V 20 0 0 0 VCC = 3.3 V TA = 25°C VIC = 2.9 V Input = PRBS 223-1 100 Peak-To-Peak Jitter - ps VID = 800 m V Peak-To-Peak Jitter - ps VCC = 3.3 V TA = 25°C VIC = 1.2 V Input = PRBS 223-1 100 100 200 300 400 500 600 700 800 f - Frequency - MHz 120 Peak-To-Peak Jitter - ps 880 TA - Free-Air Temperature - °C 20 16 tPHL 940 700 700 0 10 t pd - Propagation Delay Time - ps 110 95 Peak-To-Peak Jitter - ps 1000 1000 VCC = 3.3 V TA = 25°C VIC = 1.2 V VID = 200 mV t pd - Propagation Delay Time - ps I CC - Supply Current - mA 115 PROPAGATION DELAY TIME vs COMMON-MODE INPUT VOLTAGE 0 100 200 300 400 500 f - Frequency - MHz Figure 15. 600 700 800 0 200 400 600 800 1000 1200 1400 1600 Data Rate - Mbps Figure 16. Copyright © 2003–2011, Texas Instruments Incorporated SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) PEAK-TO-PEAK JITTER vs FREE-AIR TEMPERATURE PEAK-TO-PEAK JITTER vs DATA RATE 140 VCC = 3.3 V VIC = 1.2 V VID = 200 mV Input = 1.5 Gbps PRBS 223-1 72 VCC = 3.3 V VIC = 1.2 V VID = 200 mV TA = 25°C Input = PRBS 223-1 120 Peak-To-Peak Jitter - ps Peak-To-Peak Jitter - ps 80 64 56 100 80 60 40 48 20 0 40 -40 -20 0 20 40 60 80 TA - Free-Air Temperature - °C Figure 17. Copyright © 2003–2011, Texas Instruments Incorporated 100 0 500 1000 1500 2000 2500 Data Rate - Mbps Figure 18. 11 SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com APPLICATION INFORMATION CONFIGURATION EXAMPLES S10 0 S30 1 S11 0 S31 0 S20 0 S40 1 S21 1 S41 1 S10 0 S30 0 S20 0 S40 0 S21 0 S41 0 1A 1Y 1A 1Y 1B 1Z 1B 1Z 2A 2Y 2Y 2B 2Z 2Z 3A 3Y 3Y 3B 3Z 3Z 4A 4Y 4Y 4B 4Z 4Z S10 0 S30 1 S11 0 S31 0 S20 0 S40 1 S21 0 S41 0 S10 1 S30 0 S11 1 S31 0 S20 1 S40 0 S21 1 S41 0 1A 1Y 1A 1Y 1B 1Z 1B 1Z 2Y 2Y 2Z 2Z 12 S11 0 S31 0 3A 3Y 3Y 3B 3Z 3Z 4Y 4A 4Y 4Z 4B 4Z Copyright © 2003–2011, Texas Instruments Incorporated SN65LVDT125A SN65LVDS125A SLLS595C – OCTOBER 2003 – REVISED JUNE 2011 www.ti.com TYPICAL APPLICATION CIRCUITS (ECL, PECL, LVDS, etc.) 50 Ω 3.3 V or 5 V 3.3 V SN65LVDS125A A ECL B 50 Ω 50 Ω 50 Ω VTT = VCC -2 V VTT Figure 20. Low-Voltage Positive Emitter-Coupled Logic (LVPECL) 3.3 V 50 Ω 3.3 V 50 Ω 3.3 V SN65LVDS125A A CML B 50 Ω 50 Ω 3.3 V Figure 21. Current-Mode Logic (CML) 3.3 V 3.3 V 50 Ω SN65LVDS125A A ECL B 50 Ω 1.1 kΩ VTT 1.5 kΩ VTT = VCC -2 V 3.3 V Figure 22. Single-Ended (LVPECL) 3.3 V or 5 V 50 Ω 3.3 V SN65LVDS125A A 100 Ω LVDS B 50 Ω Figure 23. Low-Voltage Differential Signaling (LVDS) See the EVM Users Guide (SLLU064) for example board layout and schematics examples. Copyright © 2003–2011, Texas Instruments Incorporated 13 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN65LVDS125ADBT ACTIVE TSSOP DBT 38 50 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDS125A Samples SN65LVDS125ADBTR ACTIVE TSSOP DBT 38 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDS125A Samples SN65LVDT125ADBT ACTIVE TSSOP DBT 38 50 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDT125A Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of