SN65LVEP11
www.ti.com ........................................................................................................................................ SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008
2.5 V/3.3 V PECL/ECL 1:2 Fanout Buffer
FEATURES
1
•
•
•
•
•
•
•
•
•
•
1:2 PECL/ECL Fanout Buffer
Operating Range
– PECL: VCC = 2.375 V to 3.8V With VEE = 0 V
– NECL: VCC = 0 V With VEE = –2.375V to
–3.8 V
Open Input Default State
Support for Clock Frequencies > 3.0 GHz
240 ps Typical Propagation Delay
Deterministic Output Value for Open Input
Conditions
Q Output Will Default Low When Input Open or
at VEE
Built-in Temperature Compensation
Drop in Compatible to MC10LVEP11,
MC100LVEP11
LVDS Input Compatible
DESCRIPTION
PINOUT ASSIGNMENT
+
Q0 1
Q0
2
7 D
+
Q1 3
6 D
Q1 4
5 VEE
Table 1. PIN DESCRIPTION
PIN
FUNCTION
D, D
PECL/ECL data inputs
Q0, Q0, Q1, Q1
PECL/ECL outputs
VCC
Positive supply
VEE
Negative supply
The SN65LVEP11 is a differential 1:2 PECL/ECL
fanout buffer. The device includes circuitry to
maintain known logic levels when the inputs are in an
open condition. Single-ended clock input operation is
limited to VCC ≥ 3 V in PECL mode, or VEE ≤ 3 V in
NECL mode. The device is housed in an
industry-standard SOIC-8 package and is also
available in TSSOP-8 package option.
ORDERING INFORMATION (1)
(1)
8 VCC
PART NUMBER
PART MARKING
PACKAGE
LEAD FINISH
SN65LVEP11D
SN65LVEP11
SOIC
NiPdAu
SN65LVEP11DGK
SN65LVEP11
SOIC-TSSOP
NiPdAu
Leaded device option not initially available; contact TI sales representative for further information.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
SN65LVEP11
SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008 ........................................................................................................................................ www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
CONDITION
VALUE
UNIT
Absolute PECL mode supply voltage VCC
VEE = 0 V
6
V
Absolute NECL mode supply voltage, VEE
VCC = 0 V
–6
V
PECL mode input voltage
VEE = 0 V; VI ≤ VCC
6
V
NECL mode input voltage
VCC = 0 V; VI ≥ VEE
–6
V
Continuous
50
mA
Output current
100
mA
Operating temperature range
Surge
–40 to 85
°C
Storage temperature range
–65 to 150
°C
POWER DISSIPATION RATINGS
PACKAGE
CIRCUIT BOARD
MODEL
POWER RATING
TA < 25°C (mW)
THERMAL RESISTANCE,
JUNCTION TO AMBIENT
NO AIRFLOW
DERATING FACTOR
TA > 25°C
(mW/°C)
POWER RATING
TA = 85°C
(mW)
SOIC
SOIC-TSSOP
Low-K
719
139
7
288
High-K
840
119
8
336
Low-K
469
213
5
188
High-K
527
189
5
211
THERMAL CHARACTERISTICS
PARAMETER
θJB
Junction-to Board Thermal Resistance
θJC
Junction-to Case Thermal Resistance
PACKAGE
VALUE
UNIT
SOIC
79
°C/W
SOIC-TSSOP
120
SOIC
98
SOIC-TSSOP
74
°C/W
KEY ATTRIBUTES
CHARACTERISTICS
VALUE
Internal input pull down resistor
75 kΩ
Internal input pull up resistor
37.5 kΩ
Moisture sensitivity level
Level 1
Flammability rating (Oxygen Index: 28 to 34)
UL 94 V-0 at 0.125 in
ESD-HBM
4 kV
ESD-machine model
200 V
ESD-charged device model
2 kV
Meets or exceeds JEDEC Spec EIA/JESD78 latchup test
2
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Product Folder Link(s): SN65LVEP11
SN65LVEP11
www.ti.com ........................................................................................................................................ SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008
PECL DC CHARACTERISTICS (1) (VCC = 2.5 V; VEE = 0.0 V) (2)
–40°C
PARAMETER
ICC
Power supply current
VOH
Output HIGH voltage (3)
MIN
25°C
TYP MAX
28
1355
(3)
MIN
45
85°C
TYP MAX
31
MIN
45
TYP MAX
35
45
mA
1605
mV
555
900
mV
1620 1335
1620
mV
1605 1355 1425 1605 1335
VOL
Output LOW voltage
VIH
Input high voltage (Single-Ended)
1335
VIL
Input low voltage (Single-Ended)
555
900
555
900
555
900
mV
VIHCMR
Input HIGH voltage common mode range
(Differential) (4)
1.2
2.5
1.2
2.5
1.2
2.5
V
IIH
Input HIGH current
150
µA
IIL
Input LOW current (D)
0.5
0.5
0.5
nput LOW current (–D)
–150
–150
–150
(1)
(2)
(3)
(4)
555
900
555
759
UNIT
1620 1335
150
900
150
µA
The device will meet the specifications after the thermal balance has been established when mounted in a socket or printed circuit board
with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to – 1.3 V.
All loading with 50 Ω to VCC –2 V.
VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the
differential input signal. Single ended input clock pin operation is limited to VCC ≥ 3.0 V in PECL mode.
PECL DC CHARACTERISTICS (1) (VCC = 3.3 V; VEE = 0.0 V) (2)
–40°C
PARAMETER
MIN
25°C
TYP MAX
28
MIN
TYP MAX
32
MIN
45
TYP MAX
36
UNIT
ICC
Power supply current
45
mA
VOH
Output HIGH voltage (3)
2155
2405 2155 2221 2405 2155
2405
mV
VOL
Output LOW voltage (3)
1355
1700 1355 1543 1700 1355
1700
mV
2135
2420 2135
2420 2135
2420
mV
1355
1700 1355
1700 1355
1700
mV
(4)
45
85°C
VIH
Input high voltage (Single-Ended)
VIL
Input low voltage (Single-Ended) (4)
VIHCMR
Input HIGH voltage common mode range
(Differential) (5)
IIH
Input HIGH current
IIL
Input LOW current (D)
0.5
0.5
0.5
nput LOW current (–D)
–150
–150
–150
(1)
(2)
(3)
(4)
(5)
1.2
3.3
1.2
150
3.3
1.2
150
3.3
V
150
µA
µA
The device will meet the specifications after the thermal balance has been established when mounted in a socket or printed circuit board
with maintained transverse airflow greater than 500 lfpm. Electrical parameters are specified only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously
Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to –0.5 V.
All loading with 50 Ω to VCC – 2 V.
Single Ended input clock pin operation is limited to VCC ≥ 3 V in PECL mode.
VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the
differential input signal.
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3
SN65LVEP11
SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008 ........................................................................................................................................ www.ti.com
NECL DC CHARACTERISTICS (1) (VCC = 0.0 V; VEE = –3.8V to –2.375 V) (2)
–40°C
PARAMETER
MIN
ICC
Power supply current
VOH
Output HIGH voltage (3)
25°C
TYP
MAX
28
(3)
85°C
MIN
TYP
45
MAX
MIN
TYP
MAX
36
UNIT
32
45
45
mA
–1145
–895
–1145
–1065
–895
–1145
–895
mV
VOL
Output LOW voltage
–1945
–1600
–1945
–1777 –1600
–1945
–1600
mV
VIH
Input high voltage
(Single-Ended) (4)
–1165
–880
–1165
–880
–1165
–880
mV
VIL
Input low voltage
(Single-Ended) (4)
–1945
–1600
–1945
–1600
–1945
–1600
mV
VIHCM
Input HIGH voltage common
mode range (Differential) (5)
0.0
VEE+1.2
0.0
VEE+1.2
R
IIH
Input HIGH current
IIL
Input LOW current (D)
0.5
0.5
0.5
nput LOW current (–D)
–150
–150
–150
(1)
(2)
(3)
(4)
(5)
VEE+1.2
VEE+1.2
VEE+1.2
150
VEE+1.2
150
0.0
V
150
µA
µA
The device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board
with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously
Input and output parameters vary 1:1 with VCC.
All loading with 50 Ω to VCC – 2 V.
Single Ended input clock pin operation is limited to VCC ≤ –3 V in NECL mode.
VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the
differential input signal.
AC CHARACTERISTICS (1) (VCC = 2.375 V to 3.8 V; VEE = 0.0 V or VCC = 0.0 V; VEE = –3.8 V to
–2.375 V (2)
PARAMETER
–40°C
MIN
fMAX
Max switching frequency (3) (see Figure 6)
tPLH/tPHL
Propagation delay to output differential (CLK, Q, –Q)
tSKEW
Device skew ( Q, –Q)
Device to Device Skew (Q, –Q)
tJITTER
25°C
TYP MAX
MIN
3.8
200
MIN
3.5
300
200
8
(4)
85°C
TYP MAX
3.1
300
8
TYP MAX
200
15
8
GHz
300
ps
15
ps
25
25
25
Random clock jitter (RMS) ≤ 1.0 GHz
0.3
0.3
0.3
Random Clock Jitter (RMS) ≤ 1.5 GHz
0.2
0.2
0.2
Random Clock Jitter (RMS) ≤ 2.0 GHz
0.2
0.2
0.2
Random Clock Jitter (RMS) ≤ 2.5 GHz
0.2
0.2
0.2
Random Clock Jitter (RMS) ≤ 3.0 GHz
0.2
0.2
UNIT
ps
0.2
VPP
Input swing Differential Config.
150
800 1200
150
1200
150
1200
mV
tr/tf
Output rise/fall times Q, –Q (20%–80%)
100
200
100
200
100
200
ps
(1)
(2)
(3)
(4)
4
The device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 Ω to VCC –2 V.
The maximum switching frequency measured at the output amplitude of 300 mVpp.
Skew is measured between outputs under identical transitions
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Product Folder Link(s): SN65LVEP11
SN65LVEP11
www.ti.com ........................................................................................................................................ SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008
Typical Termination for Output Driver
ZO = 50 W
P
P
Driver
Receiver
ZO = 50 W
N
N
50 W
50 W
VTT
VTT = VCC -2 V
Figure 1. Typical Termination for Output Driver
D
D
Q
Q
tPHL
tPLH
Figure 2. Propagation Delay
D
VPP(min)
VPP(max)
D
Figure 3. Input Voltage Swing
80%
20%
tr
tf
Figure 4. Output Rise and Fall Times
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Product Folder Link(s): SN65LVEP11
5
SN65LVEP11
SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008 ........................................................................................................................................ www.ti.com
D
D
Q0
Q0
tPHL0
tPLH0
Q1
Q1
tPHL1
tPLH1
Device Skew = Higher [(tPLH1 - tPLH0), (tPHL1 - tPHL0)]
Figure 5. Device Skew
1000
VCC = 3.3V
VCC = 0.0V
900
Output Amplitude - mV
800
700
600
-40°C
500
25°C
400
85°C
300
200
100
0
0
1000
2000
3000
4000
4500
Frequency - MHz
Figure 6. Output Amplitude vs Frequency
6
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Product Folder Link(s): SN65LVEP11
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN65LVEP11D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVEP11
SN65LVEP11DGK
ACTIVE
VSSOP
DGK
8
80
RoHS & Green
Call TI | NIPDAU
Level-1-260C-UNLIM
-40 to 85
SIJI
SN65LVEP11DGKR
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
SIJI
SN65LVEP11DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVEP11
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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