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SN74ABT16600DGGR

SN74ABT16600DGGR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TSSOP56_14X6.1MM

  • 描述:

    IC UNIV BUS TXRX 18BIT 56TSSOP

  • 数据手册
  • 价格&库存
SN74ABT16600DGGR 数据手册
SN54ABT16600, SN74ABT16600 18-BIT UNIVERSAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS209B – JUNE 1992 – REVISED JANUARY 1997 D D D D D D D D SN54ABT16600 . . . WD PACKAGE SN74ABT16600 . . . DGG OR DL PACKAGE (TOP VIEW) Members of the Texas Instruments Widebus Family State-of-the-Art EPIC-ΙΙB  BiCMOS Design Significantly Reduces Power Dissipation UBT  (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, Clocked, or Clock-Enabled Mode ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015 OEAB LEAB A1 GND A2 A3 VCC A4 A5 A6 GND A7 A8 A9 A10 A11 A12 GND A13 A14 A15 VCC A16 A17 GND A18 OEBA LEBA Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 5 V, TA = 25°C Flow-Through Architecture Optimizes PCB Layout Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings description These 18-bit universal bus transceivers combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, clocked, and clock-enabled modes. Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. The clock can be controlled by the clock-enable (CLKENAB and CLKENBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A-bus data is stored in the latch/flip-flop on the high-to-low transition of CLKAB. Output enable OEAB is active low. When OEAB is low, the outputs are active. When OEAB is high, the outputs are in the high-impedance state. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 CLKENAB CLKAB B1 GND B2 B3 VCC B4 B5 B6 GND B7 B8 B9 B10 B11 B12 GND B13 B14 B15 VCC B16 B17 GND B18 CLKBA CLKENBA Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus, EPIC-ΙΙB, and UBT are trademarks of Texas Instruments Incorporated. Copyright  1997, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ABT16600, SN74ABT16600 18-BIT UNIVERSAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS209B – JUNE 1992 – REVISED JANUARY 1997 description (continued) Data flow for B to A is similar to that of A to B, but uses OEBA, LEBA, CLKBA, and CLKENBA. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54ABT16600 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ABT16600 is characterized for operation from –40°C to 85°C. FUNCTION TABLE† INPUTS CLKENAB OEAB LEAB CLKAB A OUTPUT B X H X X X Z X L H X L L X L H X H H H L L X X H L L X X B0‡ B0‡ L L L ↓ L L L L L ↓ H L L L H H B0‡ X B0§ † A-to-B data flow is shown: B-to-A flow is similar but uses OEBA, LEBA, CLKBA, and CLKENBA. ‡ Output level before the indicated steady-state input conditions were established § Output level before the indicated steady-state input conditions were established, provided that CLKAB was low before LEAB went low L 2 L L POST OFFICE BOX 655303 L X • DALLAS, TEXAS 75265 SN54ABT16600, SN74ABT16600 18-BIT UNIVERSAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS209B – JUNE 1992 – REVISED JANUARY 1997 logic diagram (positive logic) OEAB CLKENAB CLKAB LEAB LEBA CLKBA CLKENBA OEBA A1 1 56 55 2 28 30 29 27 CE 3 1D C1 CLK 54 B1 CE 1D C1 CLK To 17 Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT16600 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT16600 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54ABT16600, SN74ABT16600 18-BIT UNIVERSAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS209B – JUNE 1992 – REVISED JANUARY 1997 recommended operating conditions (see Note 3) SN54ABT16600 VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current ∆t/∆v Input transition rise or fall rate High-level input voltage SN74ABT16600 MIN MAX MIN MAX 4.5 5.5 4.5 5.5 2 2 0.8 Input voltage 0 Low-level output current Outputs enabled TA Operating free-air temperature NOTE 3: Unused pins (input or I/O) must be held high or low to prevent them from floating. –55 0 V V 0.8 VCC –24 UNIT VCC –32 V V mA 48 64 mA 10 10 ns/V 85 °C 125 –40 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = –18 mA IOH = –3 mA VCC = 5 V, VCC = 4 4.5 5V VOL VCC = 4 4.5 5V MIN MIN –1.2 MAX SN74ABT16600 MIN –1.2 Control inputs A or B ports ICEX IO‡ IOZH§ IOZL§ A or B ports –1.2 2.5 2.5 IOH = –3 mA IOH = –24 mA 3 3 3 2 2 IOH = –32 mA IOL = 48 mA 2* IOL = 64 mA VCC = 5 5.5 5V V, VI = VCC or GND VCC = 0, VCC = 5.5 V, VO = 5.5 V VI or VO ≤ 4.5 V VCC = 5.5 V, VCC = 5.5 V, VO = 2.5 V VO = 2.7 V VCC = 5.5 V, VCC = 5.5 V, IO = 0, VI = VCC or GND Ci Control inputs Cio A or B ports V V 0.55 0.55* 0.55 Outputs high ±1 ±1 ±1 ±20 ±20 ±20 50 –100 V mV ±100 –50 UNIT 2 0.55 –180 50 –50 µA 50 µA –180 mA 10 µA VO = 0.5 V Outputs high –10 –10 –10 µA 3 3 3 Outputs low 36 36 36 3 3 3 50 50 50 VI = 2.5 V or 0.5 V VO = 2.5 V or 0.5 V –180 ±100 10 Outputs disabled –50 µA 10 VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND ∆ICC¶ µA pF 9 pF PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 mA 3 * On products compliant to MIL-PRF-38535, this parameter does not apply. † All typical values are at VCC = 5 V. ‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second. § The parameters IOZH and IOZL include the input leakage current. ¶ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. 4 MAX 100 Ioff ICC SN54ABT16600 2.5 Vhys II TA = 25°C TYP† MAX • DALLAS, TEXAS 75265 SN54ABT16600, SN74ABT16600 18-BIT UNIVERSAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS209B – JUNE 1992 – REVISED JANUARY 1997 timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) SN54ABT16600 fclock Clock frequency tw Pulse duration tsu Setup time LEAB or LEBA high CLKAB or CLKBA high or low A before CLKAB↓ or B before CLKBA↓ th Hold time MIN MAX 0 150 SN74ABT16600 MIN MAX 0 150 2.5 2.5 3 3 3 3 A before LEAB↓ or B before LEBA↓ 2.5 2.5 CLKEN before CLK↓ 2.5 2.5 A after CLKAB↓ or B after CLKBA↓ 0 0 A after LEAB↓ or B after LEBA↓ 2 2 CLKEN after CLK↓ 1 1 UNIT MHz ns ns ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER fmax tPLH tPHL tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ FROM (INPUT) TO (OUTPUT) VCC = 5 V, TA = 25°C MIN SN54ABT16600 TYP MAX 1.5 2.5 3.6 1.5 4.2 1.5 4 1.5 3.2 4.5 1.5 5.1 1.5 4.9 2 3.2 4.5 2 5.6 2 5 2 3.4 4.5 2 5.4 2 5 2 3.5 4.7 2 5.4 2 5.3 2 3.5 4.3 2 5.2 2 5 1.5 3.4 4.6 1.5 5.3 1.5 5.1 2 3.8 4.7 2 5.6 2 5.4 2 4.5 5.4 2 6.6 2 6.2 1.5 3.4 4.7 1.5 5.8 1.5 5.4 150 A or B B or A LEAB or LEBA B or A CLKAB or CLKBA B or A OEAB or OEBA B or A OEAB or OEBA B or A MIN MAX SN74ABT16600 150 MIN UNIT MAX 150 MHz ns ns ns ns ns PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN54ABT16600, SN74ABT16600 18-BIT UNIVERSAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS209B – JUNE 1992 – REVISED JANUARY 1997 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V 1.5 V Input 1.5 V 0V Data Input 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V Input 1.5 V 0V VOH 1.5 V Output 1.5 V VOL VOH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPZL tPLZ Output Waveform 1 S1 at 7 V (see Note B) tPLH tPHL Output 3V Output Control tPHL tPLH 1.5 V Output Waveform 2 S1 at Open (see Note B) 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ tPZH 1.5 V VOH – 0.3 V VOH ≈0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 6-Aug-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) SN74ABT16600DL OBSOLETE SSOP DL 56 TBD Call TI Call TI -40 to 85 SN74ABT16600DLG4 OBSOLETE SSOP DL 56 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Aug-2014 Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. 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