SCBS099J − JANUARY 1991 − REVISED APRIL 2005
D
D
D
D
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
description
1A2
2Y3
1A3
2Y2
1A4
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. Together with the SN54ABT240,
SN74ABT240A,
SN54ABT241,
and
SN74ABT241A, these devices provide the choice
of selected combinations of inverting and
noninverting outputs, symmetrical active-low
output-enable (OE) inputs, and complementary
OE and OE inputs.
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
SN54ABT244 . . . FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
VCC
D
Significantly Reduces Power Dissipation
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Typical VOLP (Output Ground Bounce) < 1 V
at VCC = 5 V, TA = 25°C
High-Drive Outputs (−32-mA IOH, 64-mA IOL)
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Plastic (N) and Ceramic (J) DIPs, and
Ceramic Flat (W) Package
SN54ABT244 . . . J OR W PACKAGE
SN74ABT244A . . . DB, DW, N, OR PW PACKAGE
(TOP VIEW)
2OE
D State-of-the-Art EPIC-ΙΙB BiCMOS Design
The SN54ABT244 and SN74ABT244A are organized as two 4-bit buffers/line drivers with separate OE inputs.
When OE is low, the devices pass noninverted data from the A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT244 is characterized for operation over the full military temperature range of −55°C to 125°C. The
SN74ABT244A is characterized for operation from −40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments.
Copyright 2005, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCBS099J − JANUARY 1991 − REVISED APRIL 2005
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
logic symbol†
1OE
1A1
1A2
1A3
1A4
1
19
EN
2OE
18
2
4
16
6
14
12
8
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
EN
11
9
13
7
15
5
17
3
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
2
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
POST OFFICE BOX 655303
19
11
9
13
7
15
5
17
3
• DALLAS, TEXAS 75265
2Y1
2Y2
2Y3
2Y4
2Y1
2Y2
2Y3
2Y4
SCBS099J − JANUARY 1991 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
Current into any output in the low state, IO: SN54ABT244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74ABT244A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages,
which use a trace length of zero.
recommended operating conditions (see Note 3)
SN54ABT244
MAX
MIN
MAX
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
VCC
−24
Low-level output current
48
∆t/∆v
Input transition rise or fall rate
High-level input voltage
SN74ABT244A
MIN
2
2
0.8
Input voltage
0
Outputs enabled
TA
Operating free-air temperature
NOTE 3: Unused inputs must be held high or low to prevent them from floating.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
−55
125
−40
V
V
0.8
0
UNIT
V
VCC
−32
mA
V
64
mA
5
ns/V
85
°C
3
SCBS099J − JANUARY 1991 − REVISED APRIL 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = −18 mA
IOH = −3 mA
VCC = 5 V,
VCC = 4.5 V
VOL
VCC = 4.5 V
Vhys
II
Ioff
ICEX
IO‡
Co
SN54ABT244
MIN
−1.2
MAX
SN74ABT244A
MIN
−1.2
2.5
2.5
IOH = −3 mA
IOH = −24 mA
3
3
3
2
2
IOH = −32 mA
IOL = 48 mA
2*
VCC = 5.5 V,
VCC = 0,
VO = 0.5 V
VI or VO ≤ 5.5 V
VCC = 5.5 V
VCC = 5.5 V,
Outputs high
VO = 2.5 V
Outputs high
0.55
0.55*
0.55
V
mV
±1
±1
±1
µA
10
10
10
µA
−10
−10
−10
µA
±100
µA
50
µA
−180
mA
±100
50
50
−100
−180
1
250
250
250
µA
Outputs low
24
30
30
30
mA
Outputs disabled
0.5
250
250
250
µA
Outputs enabled
1.5
1.5
1.5
Outputs disabled
0.05
0.05
0.05
1.5
1.5
1.5
Data
inputs
VCC = 5.5 V,
One input at 3.4 V,
Other inputs at
VCC or GND
Control
inputs
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
−50
V
2
0.55
IOL = 64 mA
VI = VCC or GND
VO = 2.7 V
UNIT
V
−50
−180
−50
POST OFFICE BOX 655303
mA
3.5
pF
7.5
pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
§ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
4
MAX
−1.2
2.5
VCC = 5.5 V,
VCC = 5.5 V,
VCC = 5.5 V, IO = 0,
VI = VCC or GND
ICC
Ci
TA = 25°C
TYP†
MAX
100
IOZH
IOZL
∆ICC§
MIN
• DALLAS, TEXAS 75265
SCBS099J − JANUARY 1991 − REVISED APRIL 2005
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54ABT244
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
VCC = 5 V,
TA = 25°C
MIN
MAX
MIN
TYP
MAX
1
2.6
4.1
1
5.3
1
2.9
4.2
1
5
1.1
3.1
4.6
0.8
5.7
2.1
4.1
5.6
1.2
7.9
2.1
4.1
5.6
1.2
7.6
1.5
3.7
5.6
1
7.9
UNIT
ns
ns
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN74ABT244A
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VCC = 5 V,
TA = 25°C
MIN
MAX
MIN
TYP
MAX
1
2.6
4.1
1
4.6
1
2.9
4.3
1
4.6
1.1
3.1
4.6
1.1
5.1
2.1
4.1
5.6
2.1
6.1
1.8
4.1
5.6
1.8
6.6
1.4
3.7
5.2
1.4
5.7
UNIT
ns
ns
ns
5
SCBS099J − JANUARY 1991 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
S1
7V
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
3V
th
3V
Input
1.5 V
1.5 V
0V
Data Input
1.5 V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
3V
1.5 V
Input
1.5 V
0V
VOH
1.5 V
Output
1.5 V
VOL
VOH
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
1.5 V
0V
tPZL
tPLZ
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLH
tPHL
Output
3V
Output
Control
tPHL
tPLH
1.5 V
Output
Waveform 2
S1 at Open
(see Note B)
1.5 V
3.5 V
VOL + 0.3 V
VOL
tPHZ
tPZH
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9214701M2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9214701MRA
ACTIVE
CDIP
J
20
1
TBD
5962-9214701MSA
ACTIVE
CFP
W
20
1
SN74ABT244ADB
ACTIVE
SSOP
DB
20
70
SN74ABT244ADBE4
ACTIVE
SSOP
DB
20
70
SN74ABT244ADBG4
ACTIVE
SSOP
DB
20
70
SN74ABT244ADBLE
OBSOLETE
SSOP
DB
20
SN74ABT244ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244ADBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244ADWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244ADWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244AN
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT244ANE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT244ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244ANSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244APW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244APWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244APWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244APWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
SN74ABT244APWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244APWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT244APWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
A42
N / A for Pkg Type
TBD
Call TI
N / A for Pkg Type
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
Addendum-Page 1
POST-PLATE N / A for Pkg Type
Call TI
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SNJ54ABT244FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54ABT244J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
SNJ54ABT244W
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ABT244, SN74ABT244A :
SN74ABT244
• Catalog:
• Enhanced Product: SN74ABT244A-EP
NOTE: Qualified Version Definitions:
- TI's standard catalog product
• Catalog
Enhanced
Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ABT244ADBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
SN74ABT244ADWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
SN74ABT244ANSR
SO
NS
20
2000
330.0
24.4
8.2
13.0
2.5
12.0
24.0
Q1
SN74ABT244APWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ABT244ADBR
SN74ABT244ADWR
SSOP
DB
20
2000
346.0
346.0
33.0
SOIC
DW
20
2000
346.0
346.0
41.0
SN74ABT244ANSR
SO
NS
20
2000
346.0
346.0
41.0
SN74ABT244APWR
TSSOP
PW
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
5962-9214701M2A
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
59629214701M2A
SNJ54ABT
244FK
5962-9214701MRA
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-9214701MR
A
SNJ54ABT244J
5962-9214701MSA
ACTIVE
CFP
W
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-9214701MS
A
SNJ54ABT244W
SN74ABT244ADB
ACTIVE
SSOP
DB
20
70
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AB244A
Samples
SN74ABT244ADBR
ACTIVE
SSOP
DB
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AB244A
Samples
SN74ABT244ADBRG4
ACTIVE
SSOP
DB
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
AB244A
Samples
SN74ABT244ADW
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ABT244A
Samples
SN74ABT244ADWE4
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ABT244A
Samples
SN74ABT244ADWR
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ABT244A
Samples
SN74ABT244ADWRG4
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ABT244A
Samples
SN74ABT244AN
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74ABT244AN
Samples
SN74ABT244ANSR
ACTIVE
SO
NS
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ABT244A
Samples
SN74ABT244APW
ACTIVE
TSSOP
PW
20
70
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AB244A
Samples
SN74ABT244APWG4
ACTIVE
TSSOP
PW
20
70
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AB244A
Samples
SN74ABT244APWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AB244A
Samples
SN74ABT244APWRE4
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AB244A
Samples
SN74ABT244APWRG4
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AB244A
Samples
Addendum-Page 1
Samples
Samples
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
14-Oct-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
Samples
(4/5)
(6)
SNJ54ABT244FK
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
59629214701M2A
SNJ54ABT
244FK
SNJ54ABT244J
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-9214701MR
A
SNJ54ABT244J
SNJ54ABT244W
ACTIVE
CFP
W
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-9214701MS
A
SNJ54ABT244W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of