SN74AC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS723B – OCTOBER 2003 – REVISED APRIL 2006
FEATURES
•
•
•
•
•
•
•
•
(1)
DW OR NS PACKAGE
(TOP VIEW)
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance of –55°C
to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree (1)
2-V to 6-V VCC Operation
Inputs Accept Voltages to 6 V
Max tpd of 7.5 ns at 5 V
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION
This octal buffer and line driver is designed specifically to improve the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74AC244-EP device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs.
When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
–55°C to 125°C
(1)
ORDERABLE PART
NUMBER
PACKAGE (1)
TA
TOP-SIDE MARKING
SOIC – DW
Tape and reel
SN74AC244MDWREP
SAC244MEP
SOP – NS
Tape and reel
SN74AC244MNSREP
SAC244MEP
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH BUFFER)
INPUTS
OE
A
L
H
OUTPUT
Y
H
L
L
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2006, Texas Instruments Incorporated
SN74AC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS723B – OCTOBER 2003 – REVISED APRIL 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
12
8
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
7
V
VI
Input voltage range (2)
–0.5
VCC + 0.5
V
–0.5
VCC + 0.5
range (2)
VO
Output voltage
IIK
Input clamp current
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±50
mA
±200
mA
Continuous current through VCC or GND
θJA
Package thermal impedance (3)
Tstg
Storage temperature range (4)
(1)
(2)
(3)
(4)
2
UNIT
DW package
58
NS package
60
–65
150
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
Submit Documentation Feedback
SN74AC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS723B – OCTOBER 2003 – REVISED APRIL 2006
Recommended Operating Conditions
VCC
(1)
Supply voltage
VCC = 3 V
VIH
High-level input voltage
MIN
MAX
2
6
UNIT
V
2.1
VCC = 4.5 V
3.15
VCC = 5.5 V
3.85
VCC = 3 V
V
0.9
VIL
Low-level input voltage
VCC = 4.5 V
1.35
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
VCC = 5.5 V
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
V
1.65
VCC = 3 V
–12
VCC = 4.5 V
–24
VCC = 5.5 V
–24
VCC = 3 V
12
VCC = 4.5 V
24
VCC = 5.5 V
24
8
–55
mA
mA
ns/V
°C
125
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –50 µA
VOH
IOH = –12 mA
IOH = –24 mA
IOL = 50 µA
VOL
IOL = 12 mA
IOL = 24 mA
II
Data inputs
VI = VCC or GND
Control inputs
VI = VCC or GND
VCC
TA = 25°C
MIN
TYP
MAX
MIN
3V
2.9
2.9
4.5 V
4.4
4.4
5.5 V
5.4
5.4
3V
2.56
2.4
4.5 V
3.86
3.7
5.5 V
4.86
MAX
UNIT
V
4.7
3V
0.1
0.1
4.5 V
0.1
0.1
5.5 V
0.1
0.1
3V
0.36
0.5
4.5 V
0.36
0.5
5.5 V
0.36
0.5
±0.1
±1
±0.1
±1
5.5 V
V
µA
IOZ
VO = VCC or GND, VI(OE) = VIL or VIH
5.5 V
±0.25
±5
µA
ICC
VI = VCC or GND,
5.5 V
4
80
µA
Ci
VI = VCC or GND
IO = 0
5V
Submit Documentation Feedback
2.5
pF
3
SN74AC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS723B – OCTOBER 2003 – REVISED APRIL 2006
Switching Characteristics
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
Y
OE
Y
OE
Y
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
TA = 25°C
MIN
MAX
9
1
12.5
6.5
9
1
12
2
6
10.5
1
11.5
2.5
7.5
10
1
13
MIN
TYP
MAX
2
6.5
2
3
7
10
1
12.5
2.5
7.5
10.5
1
13
UNIT
ns
ns
ns
Switching Characteristics
over recommended operating free-air temperature range, VCC = 5.5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
Y
OE
Y
OE
Y
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
TA = 25°C
MIN
MAX
7
1
9.5
7
1
9
5
7
1
9
5.5
8
1
10.5
6.5
9
1
10.5
6.5
9
1
11
MIN
TYP
MAX
1.5
5
1.5
5
1.5
1.5
2.5
2
UNIT
ns
ns
ns
Operating Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance per buffer/driver
Submit Documentation Feedback
CL = 50 pF, f = 1 MHz
TYP
45
UNIT
pF
SN74AC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS723B – OCTOBER 2003 – REVISED APRIL 2006
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
CL = 50 pF
(see Note A)
Open
500 Ω
Output
Control
(low-level
enabling)
LOAD CIRCUIT
Input
VCC
50% VCC
50% VCC
0V
tPLH
tPHL
50% VCC
S1
Open
2 × VCC
Open
VCC
50% VCC
50% VCC
VOL
tPLZ
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
VCC
50% VCC
VOL + 0.3 V
VOL
tPHZ
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
50% VCC
0V
tPZL
tPZH
VOH
Output
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
50% VCC
VOH − 0.3 V
VOH
0 V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
Submit Documentation Feedback
5
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
SN74AC244MDWREP
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
SAC244MEP
SN74AC244MNSREP
ACTIVE
SO
NS
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
SAC244MEP
V62/04622-01XE
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
SAC244MEP
V62/04622-01YE
ACTIVE
SO
NS
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
SAC244MEP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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