SN74AHC1GU04DBVR

Sample & Buy Product Folder Technical Documents Support & Community Tools & Software SN74AHC1GU04 SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 SN74AHC1GU04 Single Inverter Gate 1 Features 2 Applications • • • • • • • • • • • • 1 • Operating Range of 2-V to 5.5-V VCC Unbuffered Output ±8-mA Output Drive at 5 V Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model – 200-V Machine Model – 1000-V Charged-Device Model Wireless and Telecom Infrastructure Audio Mixers TVs Set-Top-boxes Audio Servers Cameras: Surveillance Software Defined Radio (SDR) 3 Description The SN74AHC1GU04 device contains a single inverter gate. The device performs the Boolean function Y = A. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) SN74AHC1GU04DBV SOT-23 (5) 2.90 mm x 1.60 mm SN74AHC1GU04DCK SC-70 (5) 2.00 mm x 1.30 mm SN74AHC1GU04DRL 1.65 mm x 1.20 mm SOT (5) (1) For all available packages, see the orderable addendum at the end of the data sheet. Logic Diagram (Positive Logic) A Y Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74AHC1GU04 SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 4 4 4 5 5 5 5 6 6 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics, VCC = 3.3 V ± 0.3 V ........ Switching Characteristics, VCC = 5 V ± 0.5 V ........... Operating Characteristics.......................................... Typical Characteristics .............................................. Parameter Measurement Information .................. 7 Detailed Description .............................................. 8 8.1 Overview ................................................................... 8 8.2 Functional Block Diagram ......................................... 8 8.3 Feature Description................................................... 8 8.4 Device Functional Modes.......................................... 8 9 Application and Implementation .......................... 9 9.1 Application Information.............................................. 9 9.2 Typical Application .................................................... 9 10 Power Supply Recommendations ..................... 10 11 Layout................................................................... 11 11.1 Layout Guidelines ................................................. 11 11.2 Layout Example .................................................... 11 12 Device and Documentation Support ................. 12 12.1 12.2 12.3 12.4 12.5 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 12 12 12 12 12 13 Mechanical, Packaging, and Orderable Information ........................................................... 12 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision R (December 2014) to Revision S Page • Deleted "2-Input" from data sheet title ................................................................................................................................... 1 • Added missing package names.............................................................................................................................................. 1 • Changed "SOT-553" to "SOT" ............................................................................................................................................... 1 • Changed "IOH = 50 µA" to "IOL = 50 µA" for VOL in Electrical Characteristics table ................................................................ 5 • Changed Typical Application Schematic with a more accurate image................................................................................... 9 • Added Receiving Notification of Documentation Updates section and Community Resources section .............................. 12 Changes from Revision Q (June 2005) to Revision R Page • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 • Deleted Ordering Information table. ....................................................................................................................................... 1 • Changed MAX operating temperature in Recommended Operating Conditions table. ......................................................... 4 2 Submit Documentation Feedback Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 SN74AHC1GU04 www.ti.com SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 5 Pin Configuration and Functions DBV Package 5-Pin SOT-23 Top View NC 1 A 2 GND 3 DRL Package 5-Pin SOT Top View 5 4 VCC Y NC 1 A 2 GND 3 Not to scale 5 VCC 4 Y Not to scale DCK Package 5-Pin SC70 Top View NC 1 A 2 GND 3 5 VCC 4 Y Not to scale NC – No internal connection See mechanical drawings for dimensions. Pin Functions PIN NO. NAME TYPE DESCRIPTION 1 NC — 2 A I No connection 3 GND — Ground pin Input A 4 Y O Output Y 5 VCC — Power pin Submit Documentation Feedback Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 3 SN74AHC1GU04 SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) VCC Supply voltage (2) MIN MAX UNIT –0.5 7 V –0.5 7 V –0.5 VCC + 0.5 V VI Input voltage VO Output voltage IIK Input clamp current VI < 0 –20 mA IOK Output clamp current VO < 0 or VO > VCC ±20 mA IO Continuous output current VO = 0 to VCC ±25 mA ±50 mA 150 °C 150 °C (2) Continuous current through each VCC or GND TJ Junction temperature Tstg Storage temperature (1) (2) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 2000 Charged device model (CDM), per JEDEC specification JESD22-C101 (2) 1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) VCC VIH Supply voltage High-level input voltage MIN MAX UNIT 2 5.5 V VCC = 2 V 1.7 VCC = 3 V 2.4 VCC = 5.5 V 4.4 V VCC = 2 V 0.3 VCC = 3 V 0.6 VIL Low-level input voltage VIH Input voltage 0 5.5 VO Output voltage 0 VCC V VCC = 2 V –50 µA VCC = 3.3 V ± 0.3 V –4 VCC = 5 V ± 0.5 V –8 VCC = 2 V 50 VCC = 3.3 V ± 0.3 V 4 VCC = 5 V ± 0.5 V 8 VCC = 5.5 V IOH IOL TA (1) 4 High-level output current Low-level output current Operating free-air temperature V 1.1 –40 125 V mA µA mA °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating CMOS Inputs (SCBA004). Submit Documentation Feedback Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 SN74AHC1GU04 www.ti.com SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 6.4 Thermal Information SN74AHC1GU04 THERMAL METRIC DBV (SOT-23) (1) DCK (SC70) DRL (SOT) UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 231.3 287.6 328.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 119.9 97.7 105.1 °C/W RθJB Junction-to-board thermal resistance 60.6 65. 150.3 °C/W ψJT Junction-to-top characterization parameter 17.8 2.0 6.9 °C/W ψJB Junction-to-board characterization parameter 60.1 64.2 148.4 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = –50 µA VOH TA = 25°C 2V 1.8 2 1.8 1.9 3V 2.7 3 2.7 2.7 4 4.5 4 4.4 2.48 2.48 IOH = –4 mA 3V 2.58 IOH = –8 mA 4.5 V 3.94 VOL MAX MIN –40°C to +125°C TYP 4.5 V IOL = 50 µA –40°C to +85°C MIN MAX 3.8 MIN MAX UNIT V 3.8 2V 0.2 0.2 0.1 3V 0.3 0.3 0.1 4.5 V 0.5 0.5 0.1 IOL = 4 mA 3V 0.36 0.44 0.44 IOL = 8 mA 4.5 V 0.36 0.44 0.44 II VI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1 ±1 µA ICC VI = VCC or GND, IO = 0 5.5 V 1 10 10 µA Ci VI = VCC or GND 10 10 10 pF 5V 2 V 6.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER tPLH tPHL tPLH tPHL FROM (INPUT) TO (OUTPUT) OUTPUT CAPACITANCE A Y CL = 15 pF A Y CL = 50 pF –40°C to +85°C TA = 25°C MIN –40°C to +125°C TYP MAX MIN MAX MIN MAX 5 7.1 1 8.5 1 9.5 5 7.1 1 8.5 1 9.5 7.5 10.6 1 12 1 13 7.5 10.6 1 12 1 13 UNIT ns ns 6.7 Switching Characteristics, VCC = 5 V ± 0.5 V over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER tPLH tPHL FROM (INPUT) TO (OUTPUT) OUTPUT CAPACITANCE A Y CL = 15 pF –40°C to +85°C TA = 25°C MIN –40°C to +125°C TYP MAX MIN MAX MIN MAX 3.5 5.5 1 6 1 6.5 3.5 5.5 1 6 1 6.5 Submit Documentation Feedback Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 UNIT ns 5 SN74AHC1GU04 SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 www.ti.com Switching Characteristics, VCC = 5 V ± 0.5 V (continued) over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER FROM (INPUT) TO (OUTPUT) OUTPUT CAPACITANCE A Y CL = 50 pF tPLH tPHL –40°C to +85°C TA = 25°C MIN –40°C to +125°C UNIT TYP MAX MIN MAX MIN MAX 5 7 1 8 1 8.5 5 7 1 8 1 8.5 ns 6.8 Operating Characteristics VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, f = 1 MHz TYP UNIT 7.3 pF 6.9 Typical Characteristics 4.5 7 4 6 3.5 5 TPD (ns) TPD (ns) 3 2.5 2 4 3 1.5 2 1 1 0.5 TPD in ns 0 -100 TPD in ns 0 -50 0 50 Temperature (qC) 100 150 0 1 D001 Figure 1. TPD vs Temperature 6 Submit Documentation Feedback 2 3 VCC 4 5 6 D002 Figure 2. TPD vs VCC at 25°C Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 SN74AHC1GU04 www.ti.com SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 7 Parameter Measurement Information From Output Under Test Test Point From Output Under Test RL = 1 kΩ VCC Open S1 TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC Input 50% VCC 50% VCC 0V th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC 50% VCC Input 50% VCC 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) VOH 50% VCC VOL 50% VCC 50% VCC 0V tPLZ tPZL ≈VCC 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ tPZH tPLH 50% VCC VCC Output Control 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 3. Load Circuit And Voltage Waveforms Submit Documentation Feedback Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 7 SN74AHC1GU04 SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 www.ti.com 8 Detailed Description 8.1 Overview The SN74AHC1GU04 device contains a single inverter gate. The device performs the Boolean function Y = A. Internal circuitry consists of a single-stage inverter that can be used in analog applications, such as crystal oscillators. 8.2 Functional Block Diagram A Y Copyright © 2016, Texas Instruments Incorporated Figure 4. Logic Diagram (Positive Logic) 8.3 Feature Description • • • Wide operating voltage range – Operates from 2 V to 5.5 V Allows down-voltage translation – Inputs accept voltages to 5.5 V The unbuffered output is ideal for use in oscillator circuits 8.4 Device Functional Modes Table 1 lists the functional modes of SN74AHC1GU04. Table 1. Function Table 8 INPUT A OUTPUT Y H L L H Submit Documentation Feedback Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 SN74AHC1GU04 www.ti.com SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information A CMOS inverter is used as a linear amplifier in oscillator applications. Similar to a conventional amplifier, their open-loop gain is a critical characteristic. The bandwidth of an inverter decreases as the operating voltage decreases. The open-loop gain of the AHC1GU04 device is shown in Figure 6. 9.2 Typical Application RF CMOS Inverter C1 Crystal C2 Copyright © 2016, Texas Instruments Incorporated Figure 5. Typical Application Schematic 9.2.1 Design Requirements This device uses CMOS technology and has balanced output drive. Take care to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive will also create fast edges into light loads, so routing and load conditions should be considered to prevent ringing. 9.2.2 Detailed Design Procedure 1. Recommended Input Conditions – For rise time and fall time specifications, see Δt/ΔV in the Recommended Operating Conditions table. – For specified High and low levels, see VIH and VIL in the Recommended Operating Conditions table. – Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC. 2. Recommended Output Conditions – Load currents should not exceed 25 mA per output and 50 mA total for the part. – Outputs should not be pulled above VCC. Submit Documentation Feedback Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 9 SN74AHC1GU04 SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 www.ti.com Typical Application (continued) 9.2.3 Application Curve Figure 6. Open-Loop Gain 10 Power Supply Recommendations The power supply can be any voltage between the MIN and MAX supply voltage rating located in the Recommended Operating Conditions table. Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, 0.1 μF is recommended. If there are multiple VCC pins, 0.01 μF or 0.022 μF is recommended for each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μF and 1 μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possible for best results. 10 Submit Documentation Feedback Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 SN74AHC1GU04 www.ti.com SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 11 Layout 11.1 Layout Guidelines When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used, or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Specified inFigure 7 are rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or VCC, whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the outputs section of the part when asserted. This will not disable the input section of the I/Os so they also cannot float when disabled. 11.2 Layout Example Vcc Unused Input Input Output Unused Input Output Input Figure 7. Layout Diagram Submit Documentation Feedback Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 11 SN74AHC1GU04 SCLS343S – APRIL 1996 – REVISED OCTOBER 2016 www.ti.com 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 12 Submit Documentation Feedback Copyright © 1996–2016, Texas Instruments Incorporated Product Folder Links: SN74AHC1GU04 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) 74AHC1GU04DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AU4G 74AHC1GU04DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AU4G 74AHC1GU04DCKTG4 ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AD3 SN74AHC1GU04DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (AU43, AU4G, AU4J, AU4L, AU4S) SN74AHC1GU04DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (AU43, AU4G, AU4J, AU4L, AU4S) SN74AHC1GU04DCK3 ACTIVE SC70 DCK 5 3000 RoHS & Non-Green SNBI Level-1-260C-UNLIM -40 to 85 ADY SN74AHC1GU04DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (AD3, ADG, ADJ, AD L, ADS) SN74AHC1GU04DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (AD3, ADG, ADJ, AD L, ADS) SN74AHC1GU04DRLR ACTIVE SOT-5X3 DRL 5 4000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 ADS (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of